Combined heat conduction and heat dissipation silica gel

By using a combined thermally conductive silicone design, the problem of insufficient strength and toughness of existing thermally conductive silicone sheets is solved, enhancing hardness and functionality, providing insulation and cushioning performance, improving thermal conductivity and simplifying the replacement process.

CN224192277UActive Publication Date: 2026-05-01CHENGDU NIKEYUAN ELECTRONIC TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
CHENGDU NIKEYUAN ELECTRONIC TECH CO LTD
Filing Date
2025-04-24
Publication Date
2026-05-01

AI Technical Summary

Technical Problem

Existing thermal conductive silicone pads cannot be filled with composite materials during use, resulting in insufficient strength and toughness, inability to effectively enhance them, lack of insulation and cushioning properties, easy to cause short circuits due to external force puncture, poor applicability and inconvenient replacement.

Method used

A combined thermally conductive and heat-dissipating silicone material was designed, comprising an assembly silicone plate, a locking component, and an unlocking component. The locking component enables the filling of the composite material, enhancing its hardness and functionality, while the unlocking component facilitates easy disassembly. Combined with composite plate layers, reinforcing plate layers, and shock-absorbing plate layers, it improves structural stability and thermal conductivity.

Benefits of technology

It achieves enhanced hardness and functionality through composite material filling, provides insulation and cushioning properties, prevents external puncture, improves thermal conductivity, and simplifies the replacement process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of heat dissipation silica gel, and discloses combined heat conduction and heat dissipation silica gel which comprises a first assembled silica gel plate, a second assembled silica gel plate is installed at the bottom of the first assembled silica gel plate in a limiting mode, and an unlocking assembly is installed on one side of the first assembled silica gel plate in a limiting mode. A locking assembly is installed in the middle of one side of the first assembled silica gel plate in a limiting mode, and a composite plate layer is installed between the second assembled silica gel plate and the first assembled silica gel plate in a limiting mode. According to the utility model, the locking assembly is mounted on the device, so that when the device is used, the inside of the device can be filled with a plurality of composite materials through the arranged locking assembly, and the hardness and the functional effect can be improved through the materials added inside.
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Description

Technical Field

[0001] This utility model relates to the technical field of thermally conductive silicone, specifically a combined thermally conductive silicone. Background Technology

[0002] With the development of industrial society, the fields of electronic equipment and new energy have seen rapid technological advancements, among which heat dissipation technology has become a key factor restricting the development of related technologies. In the structural fields of electronics, electrical appliances, and new energy batteries, thermally conductive silicone pads are commonly used for heat conduction and dissipation to ensure the normal operation of internal components. However, existing thermally conductive silicone pads generally only possess a single function of heat conduction and have high thermal resistance, resulting in low heat conduction and dissipation efficiency. Furthermore, they lack insulation and cushioning properties; external shocks and impacts can easily puncture the material, causing short circuits and damaging components, thus failing to provide adequate protection for electronic components or parts to be cooled. In addition, existing thermally conductive silicone pads often require custom cutting based on different adhesive areas, making them unsuitable for combination use, resulting in high costs and limited applicability to specific electronic components or parts to be cooled. Moreover, once the thermally conductive silicone pad is attached to electronic components or parts to be cooled, subsequent removal during replacement is extremely inconvenient.

[0003] Application number CN202222828691.7 discloses a combined multifunctional thermally conductive silicone pad. This combined multifunctional thermally conductive silicone pad includes a thermally conductive silicone pad and a protective shell assembly. One side of the protective shell assembly is fixedly connected to an upward-curving handle, and one end is fixedly connected to a downward-curving handle. The thermally conductive silicone pad is attached to the inside of the protective shell assembly. An assembly frame is fixedly connected to the side of the thermally conductive silicone pad. A protective plate is fixedly connected to the top surface of the thermally conductive silicone pad, and an adhesive layer is fixedly connected to the bottom surface of the thermally conductive silicone pad. An adhesive film is attached to the bottom surface of the adhesive layer. Through the protective plate, the adhesive layer is fixedly connected to the bottom surface of the thermally conductive silicone pad, and the adhesive film is attached to the bottom surface of the adhesive layer, thus the protective plate is fixedly connected to the top surface of the thermally conductive silicone pad. This achieves the effect of preventing dangerous objects from puncturing the combined multifunctional thermally conductive silicone pad and damaging the equipment requiring heat dissipation. However, a drawback is that the device cannot be filled with composite materials during use, which limits its strength and toughness. Utility Model Content

[0004] The purpose of this invention is to provide a combined thermally conductive and heat-dissipating silicone to solve the problem that the device cannot be filled with composite materials during use, which limits the device and makes it impossible to enhance its strength or toughness through filling.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0006] This utility model is a combined thermally conductive and heat-dissipating silicone, including an assembled silicone plate one, an assembled silicone plate two installed at the bottom limit of the assembled silicone plate one, an unlocking component installed at one side limit of the assembled silicone plate one, and a locking component installed at the middle limit of one side limit of the assembled silicone plate one. A composite plate layer is installed between the assembled silicone plate two and the assembled silicone plate one.

[0007] The locking assembly includes a tension plate, a blocking plate fixedly installed at the bottom of the tension plate, compression plates fixedly installed on the outer walls of both sides of the blocking plate, and a tough spring fixedly installed at the top of the compression plate. The tough spring and the compression plate are limited and installed inside the braking cavity.

[0008] Furthermore, the assembly silicone plate includes a top plate surface, the top of which is provided with an anti-slip silicone surface, and assembly grooves are provided on the inner walls of both sides of the top plate surface.

[0009] Furthermore, an adjustment groove is provided on one side of the top plate, and a locking lifting groove is provided at the top end of the top plate, with braking cavities provided on both sides of the locking lifting groove.

[0010] Furthermore, the unlocking assembly includes a tension ball, a limiting plate one is fixedly installed on the inner side of the tension ball, a telescopic rod is fixedly installed on the inner wall of the limiting plate one, a limiting plate two is fixedly installed at the end of the telescopic rod, and a return spring is correspondingly provided on the outer side of the telescopic rod. A limiting rod is fixedly installed on the other side of the limiting plate two, and the return spring and the limiting plate two are limited and installed inside the adjusting groove.

[0011] Furthermore, the second assembly silicone plate includes a bottom plate surface, on which assembly slides are fixedly installed on both outer walls, and an installation groove is provided in the middle of the top of the bottom plate surface, and the assembly slides are slidably installed inside the assembly slide groove.

[0012] Furthermore, the inner walls on both sides of the mounting groove are provided with limiting grooves, and the outer wall on one side of the mounting groove is provided with a locking slot, and a limiting rod is installed inside the locking slot.

[0013] Furthermore, the composite plate layer includes a reinforcing plate layer, a shock-absorbing plate layer is installed at the bottom of the reinforcing plate layer, a heat dissipation plate layer is fixedly installed at the bottom of the shock-absorbing plate layer, mounting strips are fixedly installed on the outer walls of both sides of the heat dissipation plate layer and the reinforcing plate layer, and a silicone layer is fixedly installed on the top surface of the heat dissipation plate layer. The mounting strips are limited and installed inside the limiting groove.

[0014] Furthermore, a heat dissipation perforated plate is fixedly installed on the bottom of the anti-slip silicone surface, a heat dissipation plate is fixedly installed on the bottom of the heat dissipation perforated plate, and a heat-conducting sheet is fixedly installed on the bottom of the heat dissipation plate.

[0015] This utility model has the following beneficial effects:

[0016] (1) The present invention provides a combination thermal conductive and heat dissipation silicone. By installing a locking component on the device, multiple composite materials can be filled inside the device when it is used. This can improve the hardness and functionality of the device by adding materials inside.

[0017] (2) The present invention provides a combined thermal conductive and heat dissipation silicone device with an unlocking component installed on the device. When using the device, when it is necessary to disassemble and separate the internal materials, the unlocking component can be used to perform the disassembly work conveniently.

[0018] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of a combined thermally conductive and heat-dissipating silicone according to the present invention.

[0021] Figure 2 This is a schematic diagram of a modular thermally conductive and heat-dissipating silicone detachable structure according to the present invention.

[0022] Figure 3 This is a schematic diagram of a combined thermally conductive and heat-dissipating silicone locking assembly according to the present invention.

[0023] Figure 4 This is a schematic diagram of a combined thermally conductive and heat-dissipating silicone unlocking component according to the present invention.

[0024] Figure 5 This is a schematic diagram of the internal structure of a combined thermally conductive and heat-dissipating silicone anti-slip silicone surface according to the present invention.

[0025] The attached diagram lists the components represented by each number as follows:

[0026] In the diagram: 1. Assemble silicone plate one; 2. Unlock component; 3. Assemble silicone plate two; 4. Composite plate layer; 5. Locking component; 101. Top plate surface; 102. Anti-slip silicone surface; 103. Assemble slide groove; 201. Tension ball; 202. Limiting plate one; 203. Telescopic rod; 204. Return spring; 205. Limiting plate two; 206. Limiting rod; 301. Bottom plate surface; 302. Assemble slide bar; 303. Mounting groove; 40 1. Reinforcing plate layer; 402. Shock-absorbing plate layer; 403. Heat dissipation plate layer; 404. Mounting strip; 501. Tension plate; 502. Blocking plate; 503. Extrusion plate; 504. Tough spring; 1011. Adjustment groove; 1012. Locking lifting groove; 1013. Braking cavity; 1021. Heat-conducting sheet; 1022. Heat dissipation plate; 1023. Heat dissipation perforated plate; 3031. Limiting groove; 3032. Locking slot; 4031. Silicone layer. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figures 1-4 As shown, this utility model is a combined thermally conductive and heat-dissipating silicone, including an assembled silicone plate 1, an assembled silicone plate 2 3 installed at the bottom of the assembled silicone plate 1, an unlocking component 2 installed at one side of the assembled silicone plate 1, a locking component 5 installed at the middle of one side of the assembled silicone plate 1, and a composite plate layer 4 installed between the assembled silicone plate 2 3 and the assembled silicone plate 1.

[0029] The locking assembly 5 includes a tension plate 501, a blocking plate 502 fixedly installed at the bottom of the tension plate 501, compression plates 503 fixedly installed on the outer walls of both sides of the blocking plate 502, and a toughness spring 504 fixedly installed at the top of the compression plate 503. The toughness spring 504 and the compression plate 503 are limited and installed inside the braking cavity 1013. The blocking plate 502 in the locking assembly 5 rises and falls under the drive of the tension plate 501, and the compression plate 503 cooperates with the braking cavity 1013 under the action of the toughness spring 504, further enhancing the stability of the locking and ensuring that the entire silicone structure will not easily separate during use.

[0030] By installing a locking component 5 on the device, multiple composite materials can be filled inside when using the device, thereby increasing the hardness and functionality of the internal materials.

[0031] The assembly silicone plate 1 includes a top plate 101, the top of which is provided with an anti-slip silicone surface 102, and assembly grooves 103 are provided on the inner walls of both sides of the top plate 101.

[0032] An adjustment groove 1011 is provided on one side of the top plate 101, and a locking lifting groove 1012 is provided at the top of the end of the top plate 101. Braking chambers 1013 are provided on both sides of the locking lifting groove 1012.

[0033] The unlocking assembly 2 includes a tension ball 201. A first limiting plate 202 is fixedly installed on the inner side of the tension ball 201. A telescopic rod 203 is fixedly installed on the inner wall of the first limiting plate 202. A second limiting plate 205 is fixedly installed at the end of the telescopic rod 203. A return spring 204 is correspondingly provided on the outer side of the telescopic rod 203. A limiting rod 206 is fixedly installed on the other side of the second limiting plate 205. The return spring 204 and the second limiting plate 205 are limited and installed inside the adjusting groove 1011.

[0034] The assembly silicone plate 2 3 includes a bottom plate 301, and assembly slides 302 are fixedly installed on the outer walls of both sides of the bottom plate 301. An installation groove 303 is opened in the middle of the top of the bottom plate 301, and the assembly slides 302 are slidably installed inside the assembly groove 103.

[0035] Limiting grooves 3031 are provided on both sides of the inner wall of the mounting groove 303, and a locking groove 3032 is provided on one side of the outer wall of the mounting groove 303. A limiting rod 206 is installed inside the locking groove 3032.

[0036] The composite plate layer 4 includes a reinforcing plate layer 401, a damping plate layer 402 installed at the bottom of the reinforcing plate layer 401, a heat dissipation plate layer 403 fixedly installed at the bottom of the damping plate layer 402, mounting strips 404 fixedly installed on both outer walls of the heat dissipation plate layer 403 and the reinforcing plate layer 401, and a silicone layer 4031 fixedly installed on the top surface of the heat dissipation plate layer 403. The mounting strips 404 are limited and installed inside the limiting groove 3031. The heat dissipation plate layer 403 and the silicone layer 4031 on top of the composite plate layer 4 can also help absorb and conduct heat. The reinforcing plate layer 401 and the damping plate layer 402 reduce heat loss and vibration during the heat transfer process while ensuring structural stability, thus achieving efficient heat conduction and heat dissipation.

[0037] A heat dissipation perforated plate 1023 is fixedly installed on the bottom of the anti-slip silicone surface 102. A heat dissipation plate 1022 is fixedly installed on the bottom of the heat dissipation perforated plate 1023. A heat conduction sheet 1021 is fixedly installed on the bottom of the heat dissipation plate 1022. The heat conduction sheet 1021 on the bottom of the anti-slip silicone surface 102 directly contacts the heat source and quickly conducts the heat to the heat dissipation plate 1022. The heat dissipation plate 1022 then dissipates the heat to the outside through the heat dissipation perforated plate 1023.

[0038] The combined thermally conductive and heat-dissipating silicone achieves thermal conductivity and heat dissipation through a multi-layered structure. The thermally conductive sheet 1021 at the bottom of the anti-slip silicone surface 102 directly contacts the heat source, rapidly transferring heat to the heat sink 1022. The heat sink 1022 then dissipates the heat to the outside through the heat dissipation perforation plate 1023. The heat sink layer 403 in the composite plate layer 4 and its top silicone layer 4031 also assist in absorbing and conducting heat. The reinforcing plate layer 401 and the shock-absorbing plate layer 402 ensure structural stability while reducing heat loss and vibration during heat transfer, jointly achieving efficient thermal conductivity and heat dissipation. The assembly grooves 103 on both sides of the inner wall of the assembly silicone plate 1 cooperate with the assembly strips 302 on both sides of the outer wall of the assembly silicone plate 2 to achieve sliding assembly of the two. The limiting rod 206 in the unlocking component 2 is inserted... The locking slot 3032 of the assembled silicone plate 23 is locked and held in a locked state by the return spring 204; the blocking plate 502 in the locking assembly 5 rises and falls under the action of the tension plate 501, and the extrusion plate 503 cooperates with the braking cavity 1013 under the action of the toughness spring 504, further enhancing the stability of the lock and ensuring that the entire silicone structure will not easily separate during use. In the working process, the mounting strip 404 of the composite plate layer 4 is aligned with the limiting grooves 3031 on both sides of the mounting slot 303 of the assembled silicone plate 23, inserted and fixed, so that the composite plate layer 4 is installed in the mounting slot 303 of the assembled silicone plate 23. The assembly slides 302 on both sides of the assembled silicone plate 23 are aligned with the assembly slide grooves on both sides of the inner wall of the assembled silicone plate 1. 103. Slide along the slide groove to initially assemble the second silicone plate 3 with the first silicone plate 1. Push the tension ball 201 of the unlocking component 2 to drive the limit rod 206 into the locking slot 3032 of the second silicone plate 3. Release the tension ball 201. The return spring 204 keeps the limit rod 206 locked. Pull the tension plate 501 of the locking component 5 to lower the blocking plate 502. The compression plate 503, under the action of the toughness spring 504, tightly cooperates with the braking cavity 1013, completing the assembly of the entire combined heat-conducting and heat-dissipating silicone. When the equipment generates heat, the heat-conducting sheet 1021 quickly absorbs the heat and conducts it to the heat dissipation plate 1022. The heat dissipation plate 1022 dissipates the heat to the surrounding area through the heat dissipation perforated plate 1023. The heat dissipation plate 403 and its silicone layer 4031 of the composite plate layer 4 also absorb the heat of the equipment and assist in the conduction. The reinforcement plate layer 401 and the shock-absorbing plate layer 402 ensure the stability of the structure, reduce heat transfer interference, and achieve continuous heat conduction and heat dissipation. Pulling the tension plate 501 of the locking component 5 causes the blocking plate 502 to rise, releasing the further locking of the structure. Pulling the tension ball 201 of the unlocking component 2 causes the limit rod 206 to be pulled out from the locking slot 3032 of the assembly silicone plate 2 3. The return spring 204 is compressed, and the assembly silicone plate 2 3 slides along the assembly slide 103 to separate it from the assembly silicone plate 1. Then, the composite plate layer 4 is taken out from the mounting slot 303 of the assembly silicone plate 2 3, completing the disassembly.

[0039] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A composite thermally conductive and heat-dissipating silicone, comprising an assembled silicone plate (1), characterized in that: The bottom of the assembled silicone plate 1 (1) is fitted with an assembled silicone plate 2 (3), and a locking release component (2) is fitted on one side of the assembled silicone plate 1 (1). A locking component (5) is fitted in the middle of one side of the assembled silicone plate 1 (1). A composite plate layer (4) is fitted between the assembled silicone plate 2 (3) and the assembled silicone plate 1 (1). The locking assembly (5) includes a tension plate (501), a blocking plate (502) is fixedly installed at the bottom of the tension plate (501), a compression plate (503) is fixedly installed on the outer walls of both sides of the blocking plate (502), a toughness spring (504) is fixedly installed at the top of the compression plate (503), and the toughness spring (504) and the compression plate (503) are limited and installed inside the braking cavity (1013).

2. The combined heat-conducting and heat-dissipating silica gel according to claim 1, characterized in that: The assembly silicone plate (1) includes a top plate (101), the top of which is provided with an anti-slip silicone surface (102), and assembly grooves (103) are provided on the inner walls on both sides of the top plate (101).

3. The combined heat-conducting and heat-dissipating silica gel according to claim 2, characterized in that: An adjustment groove (1011) is provided on one side of the top plate (101), and a locking lifting groove (1012) is provided at the top of the end of the top plate (101). Braking chambers (1013) are provided on both sides of the locking lifting groove (1012).

4. The combined thermally conductive and heat-dissipating silicone according to claim 1, characterized in that: The unlocking assembly (2) includes a tension ball (201), a limiting plate one (202) is fixedly installed on the inner side of the tension ball (201), a telescopic rod (203) is fixedly installed on the inner wall of the limiting plate one (202), a limiting plate two (205) is fixedly installed at the end of the telescopic rod (203), and a return spring (204) is correspondingly provided on the outer side of the telescopic rod (203). A limiting rod (206) is fixedly installed on the other side of the limiting plate two (205), and the return spring (204) and the limiting plate two (205) are limited and installed inside the adjusting groove (1011).

5. The combined heat-conducting and heat-dissipating silica gel according to claim 1, characterized in that: The assembly silicone plate 2 (3) includes a bottom plate (301), and assembly slides (302) are fixedly installed on the outer walls of both sides of the bottom plate (301). An installation groove (303) is opened in the middle of the top of the bottom plate (301), and the assembly slides (302) are slidably installed inside the assembly groove (103).

6. The combined thermally conductive and heat-dissipating silicone according to claim 5, characterized in that: The mounting groove (303) has limit grooves (3031) on both sides of its inner wall, and a locking groove (3032) is provided on one side of its outer wall. A limit rod (206) is installed inside the locking groove (3032).

7. The combined thermally conductive and heat-dissipating silicone according to claim 1, characterized in that: The composite plate layer (4) includes a reinforcing plate layer (401), a shock-absorbing plate layer (402) is installed at the bottom of the reinforcing plate layer (401), a heat dissipation plate layer (403) is fixedly installed at the bottom of the shock-absorbing plate layer (402), an installation strip (404) is fixedly installed on the outer walls of both sides of the heat dissipation plate layer (403) and the reinforcing plate layer (401), and a silicone layer (4031) is fixedly installed on the top surface of the heat dissipation plate layer (403). The installation strip (404) is limited and installed inside the limiting groove (3031).

8. The combined thermally conductive and heat-dissipating silicone according to claim 2, characterized in that: A heat dissipation perforated plate (1023) is fixedly installed on the bottom of the anti-slip silicone surface (102), a heat dissipation plate (1022) is fixedly installed on the bottom of the heat dissipation perforated plate (1023), and a heat-conducting sheet (1021) is fixedly installed on the bottom of the heat dissipation plate (1022).

Citation Information

Patent Citations

  • Combined multifunctional heat-conducting silica gel sheet

    CN218570766U