Wafer measuring jig and wafer measuring equipment

Abstract

The utility model discloses a wafer measuring jig and wafer measuring equipment, and relates to the technical field of semiconductor equipment. The wafer measuring jig comprises a base and a cover body, the base is covered with the cover body, so that the base and the cover body jointly form a containing cavity used for containing a wafer, at least one measuring hole is formed in the cover body, and light emitted by a light source can irradiate the surface of the wafer located in the containing cavity through the measuring hole. The wafer measuring jig can solve the problems that the wafer is polluted and damaged when the wafer is manually placed on measuring equipment for measurement.

Description

Wafer measurement fixtures and wafer measurement equipment Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a wafer measurement fixture and wafer measurement equipment. Background Technology

[0002] With the rapid development of the semiconductor industry, wafer-level packaging, as a core process for improving chip integration and performance, encompasses multiple manufacturing steps such as exposure, development, and electroplating. However, in current quality control processes, the measurement of wafer surface thickness after each manufacturing step still relies on manual operation, requiring operators to place each wafer individually onto the measurement equipment platform. This traditional measurement method has the following drawbacks: Firstly, wafers exposed to the open environment are highly susceptible to attracting dust particles, causing surface contamination and directly interfering with the accuracy of measurement data; secondly, factors such as collisions and static electricity during manual handling significantly increase the risk of wafer breakage, severely impacting production yield. Summary of the Invention

[0003] The purpose of this application is to provide a wafer measurement fixture and wafer measurement equipment that can solve the problems of wafer contamination and wafer breakage that occur when manually placing wafers on the measurement equipment for measurement.

[0004] The embodiments of this application are implemented as follows:

[0005] A first aspect of this application provides a wafer measurement fixture, including a base and a cover. The cover is fitted onto the base so that the base and the cover together form a cavity for accommodating a wafer. The cover has at least one measurement hole through which light emitted from a light source can illuminate the surface of the wafer located within the cavity. This wafer measurement fixture solves the problems of wafer contamination and wafer breakage that occur when manually placing the wafer on a measurement device for measurement.

[0006] In one possible implementation, the base is provided with a first receiving groove, and the wafer is positioned and received within the first receiving groove.

[0007] As one possible implementation, the cover is provided with a second receiving groove, and the first receiving groove and the second receiving groove together form the receiving cavity.

[0008] In one possible implementation, the inner diameter of the first receiving groove and the second receiving groove is greater than or equal to the outer diameter of the wafer, and the sum of the depths of the first receiving groove and the second receiving groove is greater than or equal to the thickness of the wafer.

[0009] As one possible implementation, a notch is provided on the side wall of the first receiving groove for the gripping device to grip the wafer through the notch.

[0010] In one possible implementation, there are two notches, and the two notches are arranged symmetrically about the center of the first receiving groove.

[0011] In one possible implementation, the base has a first mounting portion on its edge, and the cover has a second mounting portion on its edge. The first mounting portion and the second mounting portion cooperate with each other to fix the base and the cover together.

[0012] In one possible implementation, the first mounting portion is a groove, and the second mounting portion is a protrusion that mates with the groove; or, the first mounting portion is a protrusion, and the second mounting portion is a groove that mates with the protrusion.

[0013] As one possible implementation, the number of measuring holes includes a plurality of holes, which are radially distributed about the center of the cover.

[0014] A second aspect of this application provides a wafer measurement apparatus, including the wafer measurement fixture described above. This wafer measurement fixture can solve the problems of wafer contamination and wafer breakage that occur when manually placing wafers onto the measurement apparatus for measurement.

[0015] The beneficial effects of the embodiments of this application include:

[0016] This wafer measurement fixture includes a base and a cover, with the cover fitting over the base to form a cavity for housing the wafer. The cover has at least one measurement hole, through which light emitted from a light source can illuminate the surface of the wafer within the cavity. The wafer measurement fixture provided in this application offers a relatively enclosed and clean placement space (i.e., a cavity) for the wafer. Placing the wafer within the cavity, the base and cover protect it, preventing external contaminants from entering. Furthermore, operators do not need to directly contact the wafer, significantly reducing the risk of contamination and ensuring the wafer remains clean throughout the measurement process, laying the foundation for accurate measurement using the moiré method. Simultaneously, the base and cover provide reliable positioning for the wafer, restricting its movement and maintaining stability during measurement. Moreover, the light source illuminates the wafer through the measurement hole, avoiding physical damage caused by manual wafer positioning. This invention effectively reduces the probability of wafer breakage and minimizes cost losses due to wafer damage during production. Furthermore, it provides a stable and uniform operating platform for the shadow moiré method measurement, ensuring that the wafer's position and state within the accommodating cavity remain consistent each time the wafer surface thickness is measured, thus avoiding measurement errors caused by differences in wafer placement. Additionally, the measurement apertures designed according to actual process requirements guarantee uniform and stable light illumination of the wafer surface, making the shadow moiré method measurement process more standardized and accurate, significantly improving the reliability of the measurement results. Moreover, the wafer measurement fixture provided in this application simplifies the cumbersome process of traditional manual measurement, reducing manual intervention and effectively improving the measurement efficiency of wafer surface thickness. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 is a schematic diagram of one of the wafer measurement fixtures provided in an embodiment of this application;

[0019] Figure 2 is a second schematic diagram of the structure of the wafer measurement fixture provided in the embodiment of this application;

[0020] Figure 3 is a third schematic diagram of the structure of the wafer measurement fixture provided in the embodiments of this application.

[0021] Icons: 100-Wafer measurement fixture; 10-Base; 11-First receiving groove; 111-Notch; 12-First mounting part; 20-Cover; 21-Second receiving groove; 22-Second mounting part; 23-Measuring hole; 200-Wafer. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0023] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. These terms are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "horizontal," "vertical," etc., do not indicate that the component must be absolutely horizontal or suspended, but can be slightly tilted. The terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0024] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] Referring to Figures 1 to 3, this application provides a wafer measurement fixture 100, including a base 10 and a cover 20. The cover 20 covers the base 10, so that the base 10 and the cover 20 together form a cavity for accommodating a wafer 200. The cover 20 is provided with at least one measurement hole 23, through which light emitted from a light source can illuminate the surface of the wafer 200 located in the cavity. This wafer measurement fixture 100 can solve the problems of wafer contamination and wafer damage that occur when manually placing the wafer 200 on a measurement device for measurement.

[0026] It should be noted that the wafer measurement fixture 100 includes a base 10 and a cover 20. The cover 20 can tightly cover the base 10, and the base 10 and the cover 20 cooperate to form a cavity for placing the wafer 200. At least one measurement hole 23 is provided on the cover 20. Light emitted from a light source can be irradiated onto the surface of the wafer 200 in the cavity through the measurement hole 23. Thus, the surface thickness of the wafer 200, such as the thickness of the electroplated circuit layer or the coating adhesive layer, can be accurately measured using the shading method.

[0027] When it is necessary to measure the surface thickness of wafer 200, simply place wafer 200 stably on base 10, and then tightly cover it with cover 20. Base 10 and cover 20 together form a closed cavity. In the subsequent actual measurement process, the light emitted by the light source can accurately illuminate the surface of wafer 200 located in the cavity through the measurement hole 23 on cover 20, so that the surface thickness of wafer 200 can be measured by using the shadow pattern method.

[0028] In traditional measurement processes, manual operation easily leads to contamination of the wafer 200 surface. When operators handle and place the wafer 200, dust, grease, microorganisms, and other impurities carried on their hands adhere to the wafer 200 surface, affecting the accuracy of measurement results and the subsequent performance of the wafer 200. The wafer measurement fixture 100 provided in this application offers a relatively enclosed and clean placement space (i.e., a receiving cavity) for the wafer 200. Placing the wafer 200 within the receiving cavity, the base 10 and cover 20 protect it, making it difficult for external contaminants to enter. Furthermore, operators do not need to directly contact the wafer 200, greatly reducing the risk of contamination and ensuring that the wafer 200 remains clean throughout the measurement process, laying the foundation for accurate measurement using the moiré method.

[0029] During manual placement of the wafer 200, damage due to collisions and friction between the wafer 200 and the measuring equipment is common because the force and angle of operation are difficult to control precisely. The wafer measuring fixture 100 provided in this application can reliably limit the movement of the wafer 200 through the base 10 and the cover 20. The base 10 and the cover 20 work together to restrict the movement of the wafer 200, thus keeping it stable during measurement. Furthermore, the light source illuminates the wafer 200 through the measuring hole 23, avoiding physical damage caused by manual adjustment of the wafer 200's position, effectively reducing the probability of wafer 200 breakage and minimizing production costs due to wafer 200 damage.

[0030] The wafer measurement fixture 100 provided in this application also provides a stable and uniform operating platform for the shadow moiré method measurement. Each time the surface thickness of the wafer 200 is measured, the position and state of the wafer 200 in the accommodating cavity are basically consistent, avoiding measurement errors caused by differences in the placement position of the wafer 200. In addition, the measurement hole 23 designed according to actual process requirements can ensure that light is uniformly and stably irradiated onto the surface of the wafer 200, making the measurement process of the shadow moiré method more standardized and accurate, and greatly improving the reliability of the measurement results. Furthermore, the wafer measurement fixture 100 provided in this application simplifies the cumbersome process of traditional manual measurement, reduces the manual intervention links, and thus effectively improves the measurement efficiency of the surface thickness of the wafer 200.

[0031] As one possible implementation, as shown in Figure 2, a first receiving groove 11 is provided on the base 10, and the wafer 200 is limited and received in the first receiving groove 11.

[0032] It should be noted that the base 10, as the basic component of the wafer measurement fixture 100, is provided with a first receiving groove 11, which is used for precise positioning and fixing of the wafer 200. When the wafer 200 is placed in the first receiving groove 11, it is constrained by the groove structure, achieving a limiting effect. This means that the position of the wafer 200 in the first receiving groove 11 is relatively fixed, and it will not randomly undergo lateral or longitudinal displacement, thereby ensuring that the wafer 200 is in a stable state during the measurement process, providing a reliable basis for measuring the surface thickness of the wafer 200 using the moiré method.

[0033] The first receiving groove 11 limits the position of the wafer 200, ensuring the consistency and accuracy of its position during measurement. In the moiré method of measurement, light must illuminate the surface of the wafer 200 at a specific angle and along a specific path. If the wafer 200's position shifts, it will cause deviations in the measurement data. By stably limiting the wafer 200 with the first receiving groove 11, the relative position of the wafer 200 with the light source and measurement equipment remains constant during each measurement, reducing measurement interference caused by positional errors, significantly improving the accuracy of the measurement results, and providing more reliable data support for quality control of the wafer 200 manufacturing process.

[0034] The wafer 200 is brittle and has a fine surface. If it shakes or shifts during measurement, it will not only affect the measurement results but may also cause damage to the wafer 200. The shape and size of the first receiving groove 11 are adapted to the wafer 200, providing support and fixation for the wafer 200 circumferentially. After the cover 20 closes the base 10, the receiving cavity further restricts the movement space of the wafer 200. Even under equipment operation or slight external vibrations, the wafer 200 can remain stably in place, effectively reducing the risk of damage due to instability.

[0035] The design of the first receiving slot 11 makes the placement of the wafer 200 simpler and more intuitive. Operators only need to align the wafer 200 with the opening of the first receiving slot 11 to complete the positioning, eliminating the need for repeated adjustments and shortening preparation time before measurement. Simultaneously, the standardized limiting structure facilitates automated operation. In automated production lines, the robotic arm of the gripping device can quickly and accurately place the wafer 200 into the first receiving slot 11, improving production efficiency and reducing the time cost and labor intensity of manual operations.

[0036] In the quality inspection stage of the wafer 200 process, it is often necessary to repeatedly measure multiple wafers 200. The limiting function of the first receiving slot 11 ensures the consistency of the placement state of each wafer 200, making each measurement process highly repeatable. This helps to establish a standardized measurement process, facilitates the comparative analysis of measurement data from different batches of wafers 200, promptly identifies problems in the process, and improves the stability and reliability of overall production quality.

[0037] As one possible implementation, as shown in Figure 3, a second receiving groove 21 is provided on the cover 20, and the first receiving groove 11 and the second receiving groove 21 together form a receiving cavity.

[0038] It should be noted that the cover 20, as an important component of the wafer measurement fixture 100, is provided with a second receiving groove 21. When the cover 20 is closed on the base 10, the second receiving groove 21 of the cover 20 precisely aligns and cooperates with the first receiving groove 11 of the base 10, together forming a complete receiving cavity. This receiving cavity is specifically designed to accommodate the wafer 200, tightly enclosing it. It not only provides a stable placement space for the wafer 200 but also creates a stable environment for light to illuminate the wafer 200 through the measurement aperture 23 during measurement, ensuring the smooth progress of the measurement work.

[0039] The accommodating cavity formed by the first accommodating groove 11 and the second accommodating groove 21 encloses and fixes the wafer 200 from both top and bottom directions. Compared with a single accommodating groove, this structure can more effectively restrict the movement of the wafer 200 in the vertical and horizontal directions, preventing damage to the wafer 200 due to shaking or collision during measurement. At the same time, the enclosed accommodating cavity reduces the chance of contact between the wafer 200 and external contaminants such as dust, impurities, and moisture, providing more stringent protection for the wafer 200 and ensuring that it remains in good condition during measurement, protecting its accuracy and performance from being affected.

[0040] The formation of the accommodating cavity creates a relatively independent and stable measurement space. When measuring the surface thickness of wafer 200 using the moiré method, a stable environment is crucial for the accuracy of the measurement results. The accommodating cavity reduces interference from external factors such as airflow and vibration on wafer 200, ensuring that light passing through the measurement aperture 23 does not scatter or deflect due to environmental fluctuations. This guarantees that the measurement light is accurately projected onto the surface of wafer 200, thereby obtaining more accurate and reliable measurement data and improving the credibility of the measurement results.

[0041] As one possible implementation, as shown in Figures 2 and 3, the inner diameter of the first receiving groove 11 and the second receiving groove 21 is greater than or equal to the outer diameter of the wafer 200, providing sufficient space for the placement and removal of the wafer 200. Operators or gripping devices can easily place the wafer 200 into the receiving groove without worrying about it getting stuck or its edges being bumped due to the narrow inner diameter of the receiving groove. After measurement, the wafer 200 can also be easily removed, reducing the risk of damage to the wafer 200 due to inconvenient operation and improving the smoothness and safety of the operation.

[0042] Meanwhile, the sum of the depths of the first receiving groove 11 and the second receiving groove 21 is greater than or equal to the thickness of the wafer 200, ensuring that after the cover 20 is closed, the wafer 200 is tightly clamped within the receiving cavity in the vertical direction, preventing any vertical movement. Combined with the matching inner diameter, the wafer 200 is also confined within the receiving groove range in the horizontal direction, thus maintaining a fixed position throughout the measurement process. This comprehensive limiting effect effectively avoids measurement errors caused by changes in the wafer 200's position, ensuring that light is accurately projected onto a fixed area on the surface of the wafer 200 during the shading method measurement, significantly improving the accuracy and reliability of the measurement data.

[0043] As one possible implementation, as shown in Figures 2 and 3, a notch 111 is provided on the side wall of the first receiving groove 11, allowing the gripping device to grip the wafer 200 via the notch 111. This allows the gripping device to extend into the first receiving groove 11 through the notch 111, thereby achieving the gripping action of the wafer 200. For example, on an automated production line for wafer 200 measurement, the gripping device can quickly complete the loading and unloading of the wafer 200 through the notch 111, greatly shortening the measurement preparation time for a single wafer 200, significantly improving overall production efficiency, and meeting the needs of large-scale, high-efficiency wafer 200 measurement.

[0044] As one possible implementation, as shown in Figures 2 and 3, there are two notches 111, which are symmetrically arranged about the center of the first receiving groove 11. This symmetrical layout allows the gripping device to apply force evenly from both sides of the wafer 200 (i.e., where the two notches 111 are located) when gripping the wafer 200, ensuring that the wafer 200 is stably gripped and placed, and will not shift or be damaged due to uneven force. Compared with unilateral gripping, this symmetrical gripping method can effectively avoid the wafer 200 tilting, rotating or falling during the gripping process, ensuring the positional accuracy of the wafer 200 during the transfer process. Especially for the thin and brittle wafer 200, the stable gripping method can greatly reduce the risk of wafer 200 breakage, protecting the integrity of the wafer 200 and the validity of the measurement data.

[0045] As one possible implementation, as shown in Figures 2 and 3, a first mounting portion 12 is provided on the edge of the base 10, and a second mounting portion 22 is provided on the edge of the cover 20. The first mounting portion 12 and the second mounting portion 22 cooperate with each other to fix the base 10 and the cover 20 together. For example, there are two first mounting portions 12 and two mounting portions 22. The two first mounting portions 12 are arranged symmetrically about the center of the base 10, and the two second mounting portions 22 are arranged symmetrically about the center of the cover 20.

[0046] It should be noted that the base 10 and the cover 20 are respectively provided with a first mounting part 12 and a second mounting part 22 on their edges. The first mounting part 12 is located on the edge of the base 10, and the second mounting part 22 is located on the edge of the cover 20. The two are matched in shape, size, and position. When the cover 20 needs to be closed onto the base 10, the first mounting part 12 and the second mounting part 22 cooperate, such as by snap-fit, bolt and nut connection, magnetic adsorption, etc., to make the base 10 and the cover 20 tightly fixed together, thereby forming a complete and stable accommodating cavity. This provides reliable space guarantee for wafer 200 measurement, and at the same time makes the disassembly and assembly of the base 10 and the cover 20 simple and convenient.

[0047] As one possible implementation, as shown in Figures 2 and 3, the first mounting part 12 is a groove, and the second mounting part 22 is a protrusion that mates with the groove; or, the first mounting part 12 is a protrusion, and the second mounting part 22 is a groove that mates with the protrusion.

[0048] It should be noted that the fit between the groove and the protrusion provides precise positioning for the base 10 and the cover 20. During the closing process, the operator only needs to align the protrusion with the groove to quickly and accurately place the cover 20 in the appropriate position on the base 10, ensuring the correct formation of the receiving cavity. Moreover, once the protrusion is embedded in the groove, a tight contact is formed between the two, enhancing the stability of the connection between the base 10 and the cover 20. This effectively prevents the cover 20 from shifting due to equipment vibration or slight external forces during measurement, ensuring that the wafer 200 is always in a stable measurement environment and improving the accuracy of the measurement results.

[0049] The tightly fitted grooves and protrusions enhance the sealing of the cavity. When the protrusions are embedded in the grooves, the gap between them is significantly reduced, effectively preventing external dust, moisture, and other contaminants from entering the cavity and avoiding contamination of the wafer 200. Simultaneously, it prevents any gas that may be generated within the cavity from leaking to the outside, maintaining the stability of the cavity environment and creating favorable conditions for the moiré method of measurement, reducing interference from environmental factors on the measurement results.

[0050] The groove and protrusion design makes the disassembly and installation of the base 10 and cover 20 simple and convenient. When cleaning the accommodating cavity, replacing the wafer 200, or maintaining the fixture, operators do not need complicated tools; they only need to apply a certain amount of external force to separate the protrusion from the groove, thus separating the cover 20 from the base 10. Similarly, during installation, the protrusion is easily aligned with the groove and inserted. This convenient disassembly and assembly method saves operation time, improves work efficiency, and also reduces the risk of damage to the fixture caused by frequent disassembly and assembly.

[0051] As one possible implementation, as shown in Figures 1 and 2, the number of measuring holes 23 includes multiple holes, which are radially distributed about the center of the cover 20.

[0052] It should be noted that the multiple radially distributed measurement apertures 23 allow measurement light to be projected onto the surface of wafer 200 from multiple directions, avoiding measurement blind spots. Whether in the central area or at the edges of wafer 200, the light can cover the entire surface, ensuring comprehensive and thorough measurement of the wafer 200 surface thickness (such as electroplated circuit layers and coated adhesive layers). This is crucial for ensuring the integrity of wafer 200 quality inspection, effectively avoiding quality misjudgments due to missing local measurements, and providing more comprehensive and accurate data support for wafer 200 process optimization.

[0053] This application also provides a wafer 200 measurement device, including a gripping device and the aforementioned wafer measurement fixture 100. The gripping device is used to grip the wafer 200 to place the wafer 200 into a receiving cavity or to remove the wafer 200 from the receiving cavity. Since the structure and beneficial effects of the wafer measurement fixture 100 have been described in detail in the foregoing embodiments, they will not be repeated here.

[0054] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0055] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.

Claims

1. A wafer measurement gauge, comprising: The device includes a base and a cover, the cover being fitted onto the base so that the base and the cover together form a cavity for accommodating a wafer. The cover is provided with at least one measurement hole, through which light emitted from a light source can illuminate the surface of the wafer located in the cavity.

2. The wafer measurement gauge of claim 1, wherein The base is provided with a first receiving groove, and the wafer is positioned and received in the first receiving groove.

3. The wafer measurement gauge of claim 2, wherein, The cover is provided with a second receiving groove, and the first receiving groove and the second receiving groove together form the receiving cavity.

4. The wafer measurement gauge of claim 3, wherein, The inner diameter of the first receiving groove and the second receiving groove is greater than or equal to the outer diameter of the wafer, and the sum of the depths of the first receiving groove and the second receiving groove is greater than or equal to the thickness of the wafer.

5. The wafer measurement gauge of claim 2, wherein, The first receiving groove has a notch on its side wall for the gripping device to grip the wafer through the notch.

6. The wafer measurement fixture according to claim 5, characterized in that, There are two notches, and the two notches are arranged symmetrically about the center of the first receiving groove.

7. The wafer measurement gauge of claim 1, wherein, The base has a first mounting portion on its edge, and the cover has a second mounting portion on its edge. The first mounting portion and the second mounting portion cooperate with each other to fix the base and the cover together.

8. The wafer measurement gauge of claim 7, wherein, The first mounting portion is a groove, and the second mounting portion is a protrusion that mates with the groove; or, the first mounting portion is a protrusion, and the second mounting portion is a groove that mates with the protrusion.

9. The wafer measurement gauge of claim 1, wherein, The number of measuring holes includes multiple holes, which are radially distributed about the center of the cover.

10. A wafer measuring apparatus characterized by comprising: Includes the wafer measurement fixture as described in any one of claims 1 to 9.

Images