Top-speed dual-mode refrigeration water cup with integrated cup cover

Abstract

The utility model relates to a cup lid integrated type top-speed dual-mode refrigeration cup, which comprises a cup body, a cup lid and a refrigeration module, the refrigeration module comprises a hot end heat pipe fin, an axial flow fan, a heat conduction block, a semiconductor refrigeration sheet and an immersion type annular cold conduction device, the semiconductor refrigeration sheet is fixed on a bottom plate of the cup lid, and the immersion type annular cold conduction device is fixed on the bottom plate of the cup lid. The heat conduction block is arranged above the semiconductor chilling plate and connected with the hot end of the semiconductor chilling plate, the immersion type annular cold conduction device is arranged below the semiconductor chilling plate and connected with the cold end of the semiconductor chilling plate, the axial flow fan is arranged above the heat conduction block, and the hot end heat pipe fins are arranged in the circumferential direction of the axial flow fan. According to the utility model, the semiconductor chilling plate is innovatively and directly integrated on the cup cover, and by utilizing the layout that the cold end is immersed into liquid and the hot end is externally arranged for heat dissipation, the cold transfer path is shortened, and the refrigeration speed and the energy efficiency ratio are obviously improved.

Description

Technical Field

[0001] This utility model relates to the field of cooling water cup technology, specifically to a cup cup with an integrated lid and a high-speed dual-mode cooling system. Background Technology

[0002] Traditional cooling water cups typically mount the cooling module at the bottom or side of the cup. This forces the cooling energy generated by the semiconductor to be conducted through the cup wall, resulting in inefficiency and excessive space occupation. Furthermore, the bottom heat dissipation design is easily obstructed by tabletops, affecting heat dissipation efficiency and further reducing the cooling rate. Additionally, the separate design of the cup body and cooling module leads to bulkiness and poor portability. Existing patent CN202411866729.7 proposes a heated and cooled insulated cup that places the semiconductor heating and cooling module in the lower cup base and incorporates modules such as a lithium battery, increasing the overall weight and reducing portability. Its cooling path is: cooling element → wall → water, resulting in reduced cooling efficiency and a significant increase in cooling / heating time. Existing patent CN202322288419.9 proposes a portable cooling water cup that reduces the overall weight of the cup by creating a cavity between the inner liner and the insulation layer. This weight reduction leads to a decrease in capacity and an increase in height. The cooling capacity of the cooling element is transferred to the cavity between the cup and the insulation layer through air cooling conduction. The heat transfer path is: cooling element → cooling fins → air → wall → water. This method has the disadvantages of a long cooling path and large cooling loss. Utility Model Content

[0003] The purpose of this invention is to overcome the above-mentioned technical problems and provide an immersion-type cooling water cup that is small in size, easy to carry, and has a fast cooling speed.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a cup-lid integrated high-speed dual-mode cooling water cup, comprising a cup body, a cup lid, and a cooling module. The cooling module includes a hot-end heat pipe fin, an axial fan, a heat-conducting block, a semiconductor cooling chip, and an immersion-type annular cooler. The semiconductor cooling chip is fixed on the bottom plate of the cup lid. The heat-conducting block is disposed above the semiconductor cooling chip and connected to its hot end. The immersion-type annular cooler is disposed below the semiconductor cooling chip and connected to its cold end. The axial fan is disposed above the heat-conducting block, and the hot-end heat pipe fin is arranged along the circumference of the axial fan.

[0005] Furthermore, the cup lid has an air inlet on the top and an air outlet on the side wall. The air inlet is located above the axial fan, and the air outlet is located outside the heat pipe fins at the hot end.

[0006] Furthermore, the immersion-type annular cooler has multiple layers, which are nested sequentially from the inside to the outside.

[0007] Furthermore, a temperature sensor is also provided at the bottom of the cup lid, and the temperature sensor extends into the cup body.

[0008] Furthermore, a control board is provided inside the cup lid, and a temperature display is provided on the top of the cup lid. The cooling module, the temperature display, and the temperature sensor are all electrically connected to the control board.

[0009] Furthermore, the top of the side wall of the cup lid is also provided with a Type-C interface.

[0010] The beneficial effects of this utility model are as follows: This utility model innovatively integrates a semiconductor cooling chip directly into the cup lid, and uses a layout in which the cold end is immersed in the liquid and the hot end is externally placed for heat dissipation to shorten the cold energy transfer path and significantly improve the cooling speed and energy efficiency ratio. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the longitudinal section of an integrated cup lid type high-speed dual-mode cooling water cup according to the present invention;

[0012] Figure 2 This is a schematic diagram of the structure of a cup cup with an integrated lid and a high-speed dual-mode cooling system according to this utility model.

[0013] Figure 3 This is a schematic diagram of an immersion-type annular cooler.

[0014] Figure 4 This is a comparison diagram of the cooling effect of the immersion annular cooler and the immersion aluminum cylindrical fin type (sandblasted) cooler of the present invention.

[0015] 1. Cup lid; 2. Control board; 3. Temperature display; 4. Type-C interface; 5. Hot end heat pipe fins; 6. Axial fan; 7. Heat conduction block; 8. Semiconductor cooling chip; 9. Temperature sensor; 10. Immersion ring cooler; 11. Cup body; 12. Air inlet; 13. Air outlet. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model are within the protection scope of the present utility model.

[0017] Embodiments of this utility model: such as Figure 1 , 2As shown, a cup-lid integrated high-speed dual-mode cooling water cup includes a cup body 11, a cup lid 1, and a cooling module. The cooling module includes a hot-end heat pipe fin 5, an axial fan 6, a heat-conducting block 7, a semiconductor cooling chip 8, and an immersion-type annular cooler 10. The semiconductor cooling chip 8 is fixed to the bottom plate of the cup lid 1. The heat-conducting block 7 is disposed above the semiconductor cooling chip 8 and connected to its hot end. The immersion-type annular cooler 10 is disposed below the semiconductor cooling chip 8 and connected to its cold end. The axial fan 6 is disposed above the heat-conducting block 7, and the hot-end heat pipe fin 5 is arranged along the circumference of the axial fan 6.

[0018] like Figure 2 As shown, the top of the cup lid 1 is provided with an air inlet 12 and the side wall is provided with an air outlet 13. The air inlet 12 is located above the axial fan 6 and the air outlet 13 is located outside the heat pipe fins 5 at the hot end.

[0019] like Figure 3 As shown, the immersion annular cooler 10 has multiple layers, which are nested from the inside to the outside.

[0020] It is worth noting that the dimensions of the immersion-type annular cooler 10 are determined based on a comprehensive consideration of ease of processing and lightweight design. The following dynamic matching model for the parameters is given: wall thickness formula, t = 3 - 0.0125 × h (h is the fin height, in mm); spacing formula, s = 3.2 × e (-0.03(D-P)) (D is the outer diameter of the annular immersion fin, P is the power of the semiconductor cooling chip); Height formula, H = c × H 杯 (The value of c ranges from 0.3 to 0.45, and H is the internal height of the cup). Since the refrigeration module of this utility model is integrated into the cup lid 1, the overall mass of the cup lid 1 is limited. At the same time, the number of annular layers of the immersion annular cooler 10 is determined by its mass. Therefore, it is recommended that the mass of the immersion annular cooler 10 not exceed 80g.

[0021] like Figure 1 As shown, a temperature sensor 9 is also provided at the bottom of the cup lid 1, and the temperature sensor 9 extends into the cup body 11.

[0022] like Figure 1 As shown, the cup lid 1 has a control board 2 inside and a temperature display 3 on the top of the cup lid 1. The refrigeration module, the temperature display 3, and the temperature sensor 9 are all electrically connected to the control board 2.

[0023] like Figure 1 , 2 As shown, the top of the side wall of the cup lid 1 is also provided with a Type-C interface 4.

[0024] The cooling module is powered via Type-C interface 4. It is worth noting that a battery can be installed inside the cup lid 1 and charged via Type-C interface 4.

[0025] In this embodiment, the cold end of the semiconductor cooling chip 8 is connected to the immersion annular cooler 10, which transfers the cooling energy generated during operation to the liquid inside the cup body 11, thereby lowering the temperature of the contents of the cup. The hot end transfers heat to the heat pipe fins 5 via the heat-conducting block 7, and then air is introduced from the air inlet 12 of the cup lid by the axial fan 6. The air then undergoes thermal convection with the heat pipe fins 5 to carry away the heat, and the air is blown out from the air outlet 13. When the temperature sensor 9 detects that the temperature has dropped to the set temperature, the cooling power is reduced in stages to prevent overcooling.

[0026] The immersion-type annular cooler 10 of this invention directly contacts the liquid surface, exchanging heat directly with the liquid, thus improving the efficiency by more than 40% compared to traditional semiconductor cold water wall-based cooling. In a measured test, a traditional bottom-wall-based cold water cup required 60 minutes to cool 350ml of water from 30℃ to 10℃, while the present invention required only 27 minutes to cool 400ml of water from 30℃ to 10℃.

[0027] like Figure 4 As shown, the immersion-type annular cooler 10 of this utility model is compared with an immersion-type aluminum cylindrical finned (sandblasted) cooler. Test conditions: water temperature 34.5℃, ambient temperature 26℃. The time required for this utility model to cool down by 10℃: 16 minutes; the time required for the existing aluminum cylindrical finned (sandblasted) cooler to cool down by 10℃: 18 minutes and 20 seconds. Cooling efficiency is improved by 11%. The refrigeration unit and control system are all integrated into the cup lid, and the cup body only serves as a container, compatible with various materials (glass / stainless steel).

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

[0030] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A cup cup with integrated lid and rapid dual-mode cooling, comprising a cup body (11), a lid (1), and a cooling module, characterized in that: The cooling module includes a hot-end heat pipe fin (5), an axial fan (6), a heat-conducting block (7), a semiconductor cooling chip (8), and an immersion annular cooler (10). The semiconductor cooling chip (8) is fixed on the bottom plate of the cup lid (1). The heat-conducting block (7) is positioned above the semiconductor cooling chip (8) and connected to its hot end. The immersion annular cooler (10) is positioned below the semiconductor cooling chip (8) and connected to its cold end. The axial fan (6) is positioned above the heat-conducting block (7), and the hot-end heat pipe fin (5) is arranged along the circumference of the axial fan (6).

2. The integrated lid-type rapid dual-mode cooling water cup according to claim 1, characterized in that: The cup lid (1) has an air inlet (12) on the top and an air outlet (13) on the side wall. The air inlet (12) is located above the axial fan (6), and the air outlet (13) is located outside the heat pipe fins (5) at the hot end.

3. The integrated lid-type rapid dual-mode cooling water cup according to claim 1, characterized in that: The immersion annular cooler (10) has multiple layers, which are nested from the inside to the outside.

4. The integrated lid-type rapid dual-mode cooling water cup according to claim 1, characterized in that: The bottom of the cup lid (1) is also provided with a temperature sensor (9), which extends into the cup body (11).

5. The integrated lid-type rapid dual-mode cooling water cup according to claim 4, characterized in that: The cup lid (1) is equipped with a control board (2) inside, and a temperature display (3) is provided on the top of the cup lid (1). The refrigeration module, the temperature display (3), and the temperature sensor (9) are all electrically connected to the control board (2).

6. The integrated lid-type rapid dual-mode cooling water cup according to claim 1, characterized in that: The cup lid (1) is also provided with a Type-C interface (4) on the top of its side wall.

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