Forming device with cooling structure

Abstract

The utility model relates to the technical field of forming processing components, and discloses a forming device with a cooling structure, which comprises a base, a support frame arranged on the back of the top of the base, a forming component arranged on the top of the support frame, a temperature conducting mold component arranged on the top of the base, and a surface cooling structure arranged on the top of the base. The surface cooling structure comprises a spiral cooling coil and a water tank, the water tank is fixedly connected to the top of the base, and a water level displayer is fixedly connected to the front face of the water tank. According to the forming device with the cooling structure, the surface cooling structure is arranged, a water pump is started to pump out water in a water tank, then the water is conveyed into spiral cooling coils through connecting pipe fittings, the spiral cooling coils can be communicated through middle connecting pieces for water circulation, and heat is taken away in the circulation process; the cooling device can be provided with a cooling structure capable of helping to cool the spiral coil pipe and the cooling structure on the surface of the machining mold, and can be continuously used.

Description

Technical Field

[0001] This utility model relates to the field of molding processing component technology, specifically a molding device with a built-in cooling structure. Background Technology

[0002] In the context of the booming development of modern manufacturing, molding technology, as a key link in product manufacturing, is widely used in the processing of many materials such as plastics, metals, and glass. With the continuous improvement of requirements for product quality, production efficiency, and production cost control, the performance and technological level of molding equipment have become key factors determining the competitiveness of enterprises.

[0003] The prior art discloses a soap rapid molding device with a self-cooling system, with announcement number CN213141957U. It includes a first device shell and a hydraulic pump. Fixing blocks are installed at the four corners of the bottom of the first device shell, and spring telescopic rods are evenly installed on the top of the fixing blocks. A second device shell is installed on the top of the spring telescopic rods, penetrating the first device shell. A through hole is opened at one end of the second device shell. A hydraulic cylinder is evenly installed on one side of the bottom of the second device shell, and a fifth device shell is installed on the top of the hydraulic cylinder. A heating shell is horizontally installed on the top of the second device shell at the end away from the through hole.

[0004] The aforementioned molding device with its own cooling structure delivers the condenser to the copper tube inside the outer shell of the fifth device via a compressor, rapidly cooling the soap that has been molded inside the outer shell of the fifth device and improving the efficiency of the device. However, the aforementioned cooling device does not have a spiral coil or cooling structure on the surface of the processing mold to help cool it, resulting in poor cooling effect and poor performance during use. This needs to be improved. Utility Model Content

[0005] The purpose of this invention is to provide a molding device with a built-in cooling structure to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a molding device with a built-in cooling structure, including a base, a support frame provided on the top back of the base, a molding component provided on the top of the support frame, a temperature-conducting mold component provided on the top of the base, and a surface cooling structure provided on the top of the base.

[0007] The surface cooling structure includes a spiral cooling coil and a water tank. The water tank is fixedly connected to the top of the base. A water level indicator is fixedly connected to the front of the water tank. A connecting plate is fixedly connected to the top of the base. The connecting plate is connected to the front of the spiral cooling coil. An intermediate connector is connected between adjacent spiral cooling coils. A connecting pipe is fixedly connected to the right side of the topmost spiral cooling coil. A hollow connecting box is fixedly connected to the top left of the water tank. A water pump is fixedly connected to the top of the hollow connecting box. A water supply pipe is fixedly connected to the top right of the water tank. A connecting seat is fixedly connected to the top of the water supply pipe. A sealing cover is connected to the top of the connecting seat.

[0008] Preferably, the temperature-conducting mold assembly includes a mold box, a connecting strip, aluminum heat dissipation fins, a magnetic strip, a magnetic plate, and a connecting rod. The mold box is connected to the top of the base, the connecting strip is inserted into the back of the mold box, the aluminum heat dissipation fins are fixedly connected to the back of the connecting strip, the magnetic strip is fixedly connected to the top of the back of the mold box, the magnetic plate is fixedly connected to the top of the connecting strip, and the connecting rod is fixedly connected to the top of the magnetic plate.

[0009] Preferably, the magnet plate is magnetically connected to the magnet strip, and the magnet plate is slidably connected to the top of the magnet strip.

[0010] Preferably, the top of the connecting seat is provided with an internal thread groove, the depth of which is less than the thickness of the connecting seat, and the spiral cooling coil is connected to the surface of the mold box.

[0011] Preferably, the surface of the sealing cover is fixedly connected with a threaded connection section, which is threaded to the top of the connecting seat. The sealing cover can be sealed after water is added to prevent water vapor from escaping and dust and impurities from entering.

[0012] Preferably, a handle is fixedly connected to the top of the sealing cover, and an anti-slip pad is fixedly connected to the surface of the handle.

[0013] Preferably, the back of the mold box is fixedly connected with a groove, the width of the connecting strip is adapted to the width of the groove, and the groove is set as a reserved space for the insertion of the connecting strip and the aluminum heat dissipation fins, which is closer to the internal processing part and can better dissipate heat and cool down.

[0014] Preferably, the end of the connecting pipe that is away from the right side of the spiral cooling coil is fixedly connected to the left side of the water pump.

[0015] Preferably, the water tank is equipped with a float plate inside, which is connected to the back of the water level display.

[0016] Preferably, the top of the mold box is provided with a phase change material placement groove. When phase change material is added into the phase change material placement groove inside the mold box, the phase change material can absorb heat at high temperature and release it at low temperature, thereby maintaining temperature stability.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] 1. This molding device with its own cooling structure has a surface cooling structure. The water pump is started to draw water from the water tank and then transports it to the inside of the spiral cooling coil through connecting pipes. The spiral cooling coils can be connected through intermediate connectors to circulate water. During the circulation, heat is carried away. The cooling device can be set on the surface of the processing mold to help cool the spiral coil and the cooling structure, and can be used continuously.

[0019] 2. This molding device with its own cooling structure is equipped with a temperature-conducting mold assembly. The back of the mold box is equipped with a connecting strip and aluminum heat dissipation fins, etc. During processing, the magnet plate can be aligned and inserted into the top of the magnet strip, and fixed by magnetic connection. With the help of the aluminum heat dissipation fins, it can be cooled. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model;

[0021] Figure 2 This is a three-dimensional structural diagram of the surface cooling structure of this utility model;

[0022] Figure 3 This is a three-dimensional structural diagram of the temperature-conducting mold assembly of this utility model;

[0023] Figure 4 This utility model Figure 3 Enlarged structural diagram at point A in the middle.

[0024] In the diagram: 1. Base; 2. Support frame; 3. Molding component; 4. Temperature-conducting mold component; 401. Mold box; 402. Connecting strip; 403. Aluminum heat dissipation fins; 404. Magnet strip; 405. Magnet plate; 406. Connecting rod; 5. Surface cooling structure; 501. Spiral cooling coil; 502. Connecting vertical plate; 503. Intermediate connector; 504. Water tank; 505. Water level indicator; 506. Connecting pipe fittings; 507. Hollow connecting box; 508. Water pump; 509. Water supply pipe; 510. Connecting seat; 511. Sealing cover. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Please see Figure 1-4 The present invention provides the following technical solution:

[0027] The molding device with a built-in cooling structure includes a base 1, a support frame 2 on the top back of the base 1, a molding component 3 on the top of the support frame 2, a temperature-conducting mold component 4 on the top of the base 1, and a surface cooling structure 5 on the top of the base 1.

[0028] The surface cooling structure 5 includes a spiral cooling coil 501 and a water tank 504. The water tank 504 is fixedly connected to the top of the base 1. A water level indicator 505 is fixedly connected to the front of the water tank 504. A connecting plate 502 is fixedly connected to the top of the base 1 and is connected to the front of the spiral cooling coil 501. An intermediate connector 503 connects adjacent spiral cooling coils 501. A connecting pipe 506 is fixedly connected to the right side of the topmost spiral cooling coil 501. A hollow connecting box 507 is fixedly connected to the top left of the water tank 504. A water pump 508 is fixedly connected to the top of the hollow connecting box 507. A water supply pipe 509 is fixedly connected to the top right of the water tank 504. A connecting seat 510 is fixedly connected to the top of the water supply pipe 509. A sealing cover plate 511 is connected to the top of the connector 510. The top of the connector 510 has an internal thread groove, the depth of which is less than the thickness of the connector 510. The spiral cooling coil 501 is connected to the surface of the mold box 401. A threaded connection section is fixedly connected to the surface of the sealing cover plate 511. The threaded connection section is threadedly connected to the top of the connector 510. The sealing cover plate 511 can be sealed after water is added to prevent water vapor from escaping and dust and impurities from entering. A handle is fixedly connected to the top of the sealing cover plate 511. An anti-slip pad is fixedly connected to the surface of the handle. The end of the connecting pipe 506 away from the right side of the spiral cooling coil 501 is fixedly connected to the left side of the water pump 508. A float plate is installed inside the water tank 504. The float plate is connected to the back of the water level display 505.

[0029] The temperature-conducting mold assembly 4 includes a mold box 401, a connecting strip 402, aluminum heat dissipation fins 403, a magnetic strip 404, a magnetic plate 405, and a connecting rod 406. The mold box 401 is connected to the top of the base 1. The connecting strip 402 is inserted into the back of the mold box 401. The aluminum heat dissipation fins 403 are fixedly connected to the back of the connecting strip 402. The magnetic strip 404 is fixedly connected to the top of the back of the mold box 401. The magnetic plate 405 is fixedly connected to the top of the connecting strip 402. The connecting rod 406 is fixedly connected to the top of the magnetic plate 405. The top of the mold box 401... A phase change material placement groove is provided. The phase change material is added into the phase change material placement groove inside the mold box 401. The phase change material can absorb heat at high temperature and release it at low temperature, thereby maintaining temperature stability. The magnet plate 405 is magnetically connected to the magnet strip 404. The magnet plate 405 is slidably connected to the top of the magnet strip 404. A groove is fixedly connected to the back of the mold box 401. The width of the connecting strip 402 is adapted to the width of the groove. The groove is set as a reserved space for the insertion of the connecting strip 402 and the aluminum heat dissipation fins 403. It is closer to the internal processing part and can better dissipate heat and cool down.

[0030] In use, the raw materials to be processed are added into the mold box 401, and then phase change material is added into the phase change material placement groove inside the mold box 401. Cooling components such as connecting strips 402 and aluminum heat dissipation fins 403 are provided on the back of the mold box 401. During processing, the magnet plate 405 can be aligned and inserted into the top of the magnet strip 404. The magnet plate 405 can slide against the top of the magnet strip 404, and the magnet plate 405 and the magnet strip 404 are magnetically connected to form a lock. Adjacent magnet plates 405 are connected by connecting rods 406 to ensure synchronous sliding. Connecting strips 402 are fixedly connected to the back of the magnet plate 405, and aluminum heat dissipation fins 403 are fixedly connected to the back of the connecting strips 402 for cooling. A surface cooling structure 5 is provided on the top of the base 1. The cooling structure 5 is located on the surface of the mold box 401 and can also play a cooling role during processing. During processing, the water pump 508 can be started to draw water from the water tank 504 and then transport it to the spiral cooling coil 501 through the connecting pipe 506. The spiral cooling coils 501 can be connected through the intermediate connector 503 to circulate water. During the circulation, heat is carried away, achieving the purpose of cooling. A water replenishment pipe 509 is provided on the top of the water tank 504 on the right side. When water needs to be replenished, the handle can be held to drive the sealing cover 511 to unscrew it, and then water can be replenished through the water replenishment pipe 509. The water level display 505 can be used to know the internal water level, ensuring the continuous use of the device. The cooling device can be set on the surface of the processing mold to help cool the spiral coil and cooling structure, resulting in good cooling effect and good performance during use.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A molding device with a built-in cooling structure, comprising a base (1), characterized in that: The base (1) has a support frame (2) on its top back, a molding component (3) on its top, a temperature-conducting mold component (4) on its top, and a surface cooling structure (5) on its top. The surface cooling structure (5) includes a spiral cooling coil (501) and a water tank (504). The water tank (504) is fixedly connected to the top of the base (1). A water level indicator (505) is fixedly connected to the front of the water tank (504). A connecting plate (502) is fixedly connected to the top of the base (1). The connecting plate (502) is connected to the front of the spiral cooling coil (501). An intermediate connector (503) connects adjacent spiral cooling coils (501). A connecting pipe (506) is fixedly connected to the right side of the spiral cooling coil (501). A hollow connecting box (507) is fixedly connected to the top left side of the water tank (504). A water pump (508) is fixedly connected to the top of the hollow connecting box (507). A water supply pipe (509) is fixedly connected to the top right side of the water tank (504). A connecting seat (510) is fixedly connected to the top of the water supply pipe (509). A sealing cover plate (511) is connected to the top of the connecting seat (510).

2. The molding apparatus with a self-cooling structure according to claim 1, characterized in that: The temperature-conducting mold assembly (4) includes a mold box (401), a connecting strip (402), aluminum heat dissipation fins (403), a magnetic strip (404), a magnetic plate (405), and a connecting rod (406). The mold box (401) is connected to the top of the base (1). The connecting strip (402) is inserted into the back of the mold box (401). The aluminum heat dissipation fins (403) are fixedly connected to the back of the connecting strip (402). The magnetic strip (404) is fixedly connected to the top of the back of the mold box (401). The magnetic plate (405) is fixedly connected to the top of the connecting strip (402). The connecting rod (406) is fixedly connected to the top of the magnetic plate (405).

3. The molding apparatus with a built-in cooling structure according to claim 2, characterized in that: The magnet plate (405) is magnetically connected to the magnet strip (404), and the magnet plate (405) is slidably connected to the top of the magnet strip (404).

4. The molding apparatus with a self-cooling structure according to claim 2, characterized in that: The top of the connecting seat (510) is provided with an internal thread groove, the depth of which is less than the thickness of the connecting seat (510), and the spiral cooling coil (501) is connected to the surface of the mold box (401).

5. The molding apparatus with a self-cooling structure according to claim 1, characterized in that: The sealing cover (511) has a threaded connection section fixedly connected to its surface, and the threaded connection section is threaded to the top of the connecting seat (510).

6. The molding apparatus with a built-in cooling structure according to claim 1, characterized in that: A handle is fixedly connected to the top of the sealing cover (511), and an anti-slip pad is fixedly connected to the surface of the handle.

7. The molding apparatus with a self-cooling structure according to claim 2, characterized in that: The mold box (401) has a groove fixedly connected to its back, and the width of the connecting strip (402) is adapted to the width of the groove.

8. The molding apparatus with a self-cooling structure according to claim 1, characterized in that: The end of the connecting pipe (506) away from the right side of the spiral cooling coil (501) is fixedly connected to the left side of the water pump (508).

9. The molding apparatus with a self-cooling structure according to claim 1, characterized in that: The water tank (504) is equipped with a float plate inside, which is connected to the back of the water level display (505).

10. The molding apparatus with a self-cooling structure according to claim 2, characterized in that: The top of the mold box (401) is provided with a groove for placing phase change material.

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