Induction heating type chip welding device
By separating the contact plate and heat-conducting block of the induction heating chip welding device to control pressure and heat, the problems of premature melting of solder and chip deformation in traditional welding equipment are solved, achieving consistency in solder joint density and welding quality, and adapting to different chip shapes.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUIZHOU FENGYU ELECTRONIC TECH CO LTD
- Filing Date
- 2025-07-11
- Publication Date
- 2026-05-05
AI Technical Summary
Traditional welding equipment lacks clear timing control for the heating and pressurization processes, leading to premature melting of the solder or deformation of the chip packaging material. Furthermore, uneven heat conduction affects welding quality.
An induction heating chip soldering device is used, which separates the pressure and heat control by the contact plate and the heat-conducting block. The pressure and heat are synchronized by the induction component. The gap between the contact plate and the heat-conducting block is designed to block heat transfer and ensure that the solder paste is heated and melted synchronously after the pressure is reached.
It improves the density and conductivity of solder joints, reduces solder oxidation and chip damage, ensures consistent soldering quality and equipment flexibility, and adapts to chips of different thicknesses and flatnesses.
Smart Images
Figure CN224196089U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip welding technology, specifically to an induction heating chip welding device. Background Technology
[0002] Varistor chips are typically in the form of sheets or blocks, with two electrodes that are connected in series or parallel to other components in a circuit. In the manufacturing process of varistors, solder paste is applied to the soldering area between the electrodes and the chip, and the two electrodes are aligned and bonded to the chip. A soldering device is then used to melt the solder paste to complete the soldering process.
[0003] Traditional soldering heads lack clear timing control for heating and pressurizing processes. The heating block begins to dissipate heat when it gets close to the chip, causing the solder to melt prematurely before pressure is applied, leading to solder oxidation, flow, or bridging. If pressure is applied before heating, the chip packaging material may deform due to excessively long pressure duration. Utility Model Content
[0004] Technical problems to be solved
[0005] To address the aforementioned shortcomings of existing technologies, this invention provides an induction heating chip welding device that effectively solves the problems of the lack of clear timing control in the heating and pressure application process, the heating block starting to dissipate heat when it approaches the chip, causing the solder to melt prematurely before pressure is applied, leading to solder oxidation, overflow, or bridging. Furthermore, if pressure is applied before heating, the chip packaging material may deform due to excessively long pressure duration.
[0006] Technical solution
[0007] To achieve the above objectives, this utility model provides the following technical solution:
[0008] This utility model provides an induction heating chip welding device, comprising:
[0009] A tooling fixture, wherein a support rod for placing a chip is fixedly connected to a placement cavity formed therein;
[0010] The welding section includes a hot press base, and two hot press bases are provided. The two hot press bases are symmetrically distributed around the tooling fixture. A heat-conducting block is fixedly connected to one end of the hot press base near the tooling fixture. A heat insulation plate is fixedly installed on the outer surface of the hot press base. The heat insulation plate is provided with a sensing component through a groove opened on its side near the tooling fixture.
[0011] Furthermore, the sensing component includes a touch plate, and a connecting frame is fixedly connected to the side of the touch plate near the heat-conducting block. The connecting frame is fixedly connected to a connecting post via a connecting plate disposed on the side away from the touch plate.
[0012] Furthermore, a limiting block that is connected to the inner wall surface of the slide is fixedly connected to the outer end of the connecting column.
[0013] Furthermore, a spring that fits against the connecting plate is fitted onto the outer surface of the connecting column.
[0014] Furthermore, the inside of the touch plate and the connecting frame is provided with a slot that fits against the surface of the support rod.
[0015] Furthermore, the outer surface of the touch plate is made of copper alloy.
[0016] Furthermore, the welding section also includes a guide rail. The hot press base is slidably connected to the outer surface of the guide rail via a heat insulation plate. A connecting seat is fixedly connected to the outer end of the guide rail. A cylinder is fixedly connected to the outer surface of the connecting seat. A connecting plate is fixedly connected to the output end of the cylinder. The outer side of the connecting plate is fixedly connected to the side of the heat insulation plate near the guide rail. During welding, by activating the cylinder, the output end of the cylinder slides the hot press base, the heat-conducting block, and the sensing component synchronously toward the tooling fixture side via the heat insulation plate, thereby pressing and welding the chip inside the placement cavity.
[0017] Beneficial effects
[0018] The technical solution provided by this utility model has the following advantages compared with the known public technology:
[0019] 1. In the welding section, the contact plate directly contacts the external chip, transferring pressure to the chip independently. The heat-conducting block is responsible for providing heat energy, achieving separate control of pressure and heat. This avoids problems such as poor heat conduction or uneven temperature gradient caused by the stress on a single component. The connecting rod and the slide can make the pressure transmission of the heat-conducting block more uniform, avoiding mechanical damage to the chip caused by overpressure. It is suitable for welding chips that are sensitive to pressure and have limited heat load.
[0020] 2. Traditional soldering equipment lacks clear timing control during the heating and pressurization processes. The heat-conducting block begins to dissipate heat (residual heat radiation from resistance heating) as it approaches the chip, causing the solder to melt prematurely before pressure is applied. This can lead to solder oxidation, flow, or bridging. If pressure is applied before heating, the prolonged pressure duration can deform the chip packaging material. Furthermore, heat is directly conducted through the rigid structure, easily diffusing to non-soldering areas of the chip, causing performance degradation for heat-sensitive chips. In contrast, this invention features an initial gap between the contact plate and the heat-conducting block (the solder paste inside the chip is unaffected by temperature; the gap design between the contact plate, connecting frame, and heat-conducting block reduces heat diffusion and prevents direct contact between the heat-conducting block and non-target areas, thus avoiding heat loss). Upon approaching the chip, the contact plate contacts the chip first, and the heat-conducting block continues to push the contact plate to complete the bonding. By blocking heat transfer through the initial gap, heat is only conducted after pressure is applied, ensuring that the solder paste melts under the simultaneous action of pressure and heat, improving the density and conductivity of the solder joint.
[0021] 3. The presence of the contact plate can evenly distribute heat, reduce localized overheating or hot spots during the soldering process, greatly improve heat conduction efficiency, and ensure the consistency of solder joints. Driven by the heat-conducting block, after the contact plate comes into contact with its adjacent surface, the force exerted by the contact plate on the chip and the heat conduction tend to stabilize, ensuring consistent soldering quality.
[0022] 4. Different types of chips have different thicknesses and surface flatness. Traditional lamination and welding equipment cannot adapt to these deviations and only applies pressure according to the preset stroke, which is prone to local overpressure (exceeding the chip's tolerance threshold, resulting in silicon wafer cracks or circuit damage) or local underpressure (the solder does not melt sufficiently, forming a cold solder joint). However, this utility model can be compatible with chips of different thicknesses through the spring in the sensing component, which improves the flexibility of the equipment.
[0023] 5. In traditional equipment, the heat-conducting block is in direct contact with the chip, making it susceptible to the effects of flux, thermal stress, and mechanical stress during the soldering process, which accelerates component wear. In this invention, the contact plate isolates the heat-conducting block from direct contact with the chip, transferring pressure to the contact plate and then transferring heat through it, protecting the heat-conducting block from external contamination and wear. Attached Figure Description
[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0025] Figure 1 This is a three-dimensional structural diagram of the present invention;
[0026] Figure 2 This is a schematic diagram of the tooling fixture, hot press base, and heat-conducting block of this utility model;
[0027] Figure 3 This is a cross-sectional structural diagram of the contact plate of this utility model;
[0028] Figure 4 This is a schematic diagram of the structure of the sensing component of this utility model.
[0029] The labels in the diagram represent: 1. Tooling fixture; 11. Placement cavity; 12. Support rod; 2. Welding part; 21. Hot press base; 22. Heat-conducting block; 23. Heat insulation plate; 231. Slide groove; 24. Sensing component; 241. Contact plate; 2411. Slot; 242. Connecting frame; 243. Connecting plate; 244. Connecting column; 245. Limiting block; 246. Spring. Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.
[0031] The present invention will be further described below with reference to the embodiments.
[0032] Example:
[0033] Please see Figure 1-4 This utility model provides an induction heating chip welding device, comprising:
[0034] Tooling fixture 1, the tooling fixture 1 is fixedly connected to a support rod 12 for placing the chip through a placement cavity 11 opened inside it;
[0035] Welding part 2 includes a hot press base 21. There are two hot press bases 21, which are symmetrically distributed around the tooling fixture 1. A heat-conducting block 22 is fixedly connected to one end of the hot press base 21 near the tooling fixture 1. A heat insulation plate 23 is fixedly installed on the outer surface of the hot press base 21. A sensing component 24 is provided on the heat insulation plate 23 through a groove 231 opened on the side of the heat insulation plate 23 near the tooling fixture 1.
[0036] The sensing component 24 includes a touch plate 241, a connecting frame 242 is fixedly connected to the side of the touch plate 241 near the heat-conducting block 22, and a connecting post 244 is fixedly connected to the connecting frame 242 via a connecting plate 243 disposed on the side away from the touch plate 241.
[0037] The outer end of the connecting column 244 is fixedly connected to a limiting block 245 that is connected to the inner wall surface of the slide groove 231.
[0038] A spring 246 that fits against the connecting plate 243 is fitted on the outer surface of the connecting column 244.
[0039] The inside of the touch plate 241 and the connecting frame 242 is provided with a slot 2411 that fits against the surface of the support rod 12.
[0040] The outer surface of the touch panel 241 is made of copper alloy.
[0041] The welding section 2 also includes a guide rail. The hot press base 21 is slidably connected to the outer surface of the guide rail through the heat insulation plate 23. A connecting seat is fixedly connected to the outer end of the guide rail. A cylinder is fixedly connected to the outer surface of the connecting seat. A connecting plate is fixedly connected to the output end of the cylinder. The outer side of the connecting plate is fixedly connected to the side of the heat insulation plate 23 near the guide rail. During welding, by starting the cylinder, the output end of the cylinder slides the hot press base 21, the heat-conducting block 22 and the sensing component 24 synchronously toward the tooling fixture 1 through the heat insulation plate 23 to press and weld the chip inside the placement cavity 11.
[0042] The process of bonding and soldering chips:
[0043] In practical applications, the chips are placed in the arrangement order onto the upper surface of the support rod 12 inside the placement cavity 11 of the tooling fixture 1 using an external feeding device. The welding part 2 includes two sets of hot press seats 21, heat conducting blocks 22, heat insulation plates 23 and induction components 24 distributed vertically, which can press the chips together from both the top and bottom sides towards the middle at the same time during chip welding.
[0044] In the initial state, the sensing component 24 is in the deployed state. The slide 231 is divided into two parts: a narrow slide and a coarse slide. The narrow slide is closer to the tooling fixture 1, and the coarse slide is located on the side of the heat insulation plate 23 away from the tooling fixture 1. The narrow slide and the coarse slide are internally connected. The outer circumferential surface of the connecting column 244 is always in contact with the inner wall of the narrow slide, and the outer circumferential surface of the limiting block 245 is always in contact with the inner wall surface of the coarse slide. Under the action of the elastic force of the spring 246, the connecting plate 243 and the connecting column 244 and the limiting block 245 fixedly connected to its lower surface are all within their stroke range on the side closer to the tooling fixture 1. Taking the welding part 2 located below as an example, at this time, the limiting block 245 is in contact with the top of the inner wall of the coarse slide in the slide 231, and there is a gap between the contact plate 241 and the heat-conducting block 22. The area enclosed by the inner wall of the connecting frame 242 is larger than the area enclosed by the heat-conducting block 22.
[0045] The cylinder is activated, and the heat insulation plates 23 and the hot press base 21 on both sides are moved towards the tooling fixture 1 via the connecting plate. Taking the welding part 2 on the lower side as an example, as the heat insulation plate 23 and the hot press base 21 move upward in the vertical direction, the sensing component 24 remains in the extended state. A fixing component for fixing the chip is provided inside the receiving cavity. When the hot press base 21 approaches the tooling fixture 1, the fixing component is automatically triggered, clamping and fixing the chip placed on the support rod 12 from the side. The cylinder continues to drive the hot press seat 21 to move upward until the slot 2411 inside the contact plate 241 and the connecting frame 242 passes through the support rod 12, so that the outer surface of the contact plate 241 is in contact with the lower surface of the chip to be processed at the bottom (at the same time, the lower surface of the contact plate 241 in the upper welding part 2 is also in contact with the upper surface of the chip at the top). At this time, the connecting frame 242 is located inside the placement cavity 11, and the upper surface of the connecting plate 243 is close to the lower surface of the tooling fixture 1.
[0046] As the cylinder continues to operate, the hot press base 21 and the heat-conducting block 22 continue to move towards the tooling fixture 1. The contact plate 241 remains stationary, while the contact plate 241 and the heat insulation plate 23 move relative to each other, gradually decreasing the distance between them. The spring 246, under pressure, begins to deform elastically, and more connecting columns 244 slide into the interior of the slide groove 231, while the limiting block 245 slides towards the bottom of the inner wall of the coarse groove. At the same time, the heat-conducting block 22 also moves relative to the contact plate 241, gradually decreasing the distance between them until the upper surface of the heat-conducting block 22 contacts the lower surface of the contact plate 241, and the sensing component 24 is in a compressed state. At this time, the heat-conducting block 22 transfers heat to the chip located inside the placement cavity 11 through the contact plate 241, melting the solder paste between the chips (the contact plate 241 is made of copper alloy, which has good thermal conductivity). This achieves synchronous heating after the pressure is reached, ensuring that the solder paste melts under the combined action of pressure and heat, reducing solder oxidation or chip preheating damage caused by preheating.
[0047] As the component that directly contacts the chip, the contact plate 241 can be made of a copper alloy material with low hardness to avoid surface scratches caused by direct contact between the hard heat-conducting block 22 and the chip. The connecting post 244 and the spring 246 can buffer the instantaneous impact force of the heat-conducting block 22, absorbing the impact energy and preventing the chip from cracking due to excessive instantaneous pressure peaks. The presence of the contact plate 241 can evenly distribute heat, reduce local overheating or hot spots during the soldering process, greatly improve heat conduction efficiency, and ensure the consistency of the solder joints. After the contact plate 241 comes into contact with its adjacent surface under the push of the heat-conducting block 22, the force and heat conduction of the contact plate 241 acting on the chip tend to stabilize, ensuring the consistency of soldering quality.
[0048] Different types of chips have different thicknesses and surface flatness. Traditional lamination and welding equipment cannot adapt to these deviations and only applies pressure according to the preset stroke, which is prone to local overpressure (exceeding the chip's tolerance threshold, resulting in silicon wafer cracks or circuit damage) or local underpressure (the solder does not melt sufficiently, forming a cold solder joint). However, this utility model can be compatible with chips of different thicknesses through the spring 246 in the sensing component 24, which improves the flexibility of the equipment.
[0049] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of this utility model.
Claims
1. An induction heating chip welding device, characterized in that, include: Tooling fixture (1), wherein a support rod (12) for placing chips is fixedly connected to a placement cavity (11) opened therein; The welding part (2) includes a hot press base (21), a heat-conducting block (22) is fixedly connected to one end of the hot press base (21) near the tooling fixture (1), and a heat insulation plate (23) is fixedly installed on the outer surface of the hot press base (21). The heat insulation plate (23) is provided with a sensing component (24) through a groove (231) opened on the side of it near the tooling fixture (1).
2. The induction heating chip welding device according to claim 1, characterized in that: The sensing component (24) includes a touch plate (241), and a connecting frame (242) is fixedly connected to the side of the touch plate (241) near the heat-conducting block (22). The connecting frame (242) is fixedly connected to a connecting post (244) by a connecting plate (243) on the side away from the touch plate (241).
3. The induction heating chip welding device according to claim 2, characterized in that: The outer end of the connecting column (244) is fixedly connected to a limiting block (245) that is connected to the inner wall surface of the slide groove (231).
4. The induction heating chip welding device according to claim 3, characterized in that: The outer surface of the connecting column (244) is fitted with a spring (246) that fits against the connecting plate (243).
5. The induction heating chip welding apparatus according to claim 2, characterized in that: The inside of the touch plate (241) and the connecting frame (242) are provided with slots (2411) that fit against the surface of the support rod (12).
6. The induction heating chip welding apparatus according to claim 5, characterized in that: The outer surface of the contact plate (241) is made of copper alloy.