Pressure applying and polishing device

Abstract

The utility model belongs to the technical field of polishing, and discloses a pressing polishing device which comprises a support. The sliding rod is configured to be in sliding connection with the bracket; the clamping mechanism is mounted at one end of the sliding rod and is used for clamping a sample to be processed; the pressure exerting block can be attracted by magnetic force and is configured to exert pressure or pulling force on the clamping mechanism; the electromagnet is fixed on the bracket and is configured to attract or release the pressure block; and the power mechanism is configured to drive the clamping mechanism to reciprocate. The automatic polishing device has the advantages that the clamping mechanism is driven by the power mechanism to reciprocate, and automatic polishing can be achieved. And the clamping mechanism can be pressed through the pressing block, namely, the sample is pressed in the polishing process, the electromagnet generates magnetic attraction force after being electrified, the pressing block can be attracted, the pressing block does not press the clamping mechanism any more, and then the requirement that the sample needs to be applied or not applied in different strokes of the polishing process is met.

Description

Technical Field

[0001] This application belongs to the field of polishing technology, and in particular relates to a pressure application device for a polishing mechanism. Background Technology

[0002] Mechanical grinding is a common method for treating the surface of metal materials in laboratories. Currently, grinding in laboratories is still done manually. The operator holds the sample by hand and presses it onto sandpaper for grinding. This is not only time-consuming and laborious, but the sample is also easy to slip out of the hand. The operator's hands come into direct contact with the sandpaper, causing injury, and it is difficult to ensure the consistency of the applied pressure.

[0003] To ensure grinding quality, grinding of metal materials is typically unidirectional. This means that as the operator moves the sample back and forth on the sandpaper, pressure is applied to the sample when pushing it forward, but no pressure is applied when pulling it back, thus achieving unidirectional grinding. However, manual grinding often results in pressure being applied to the sample every time it is moved back and forth on the sandpaper, affecting the grinding quality. Utility Model Content

[0004] To address the technical problem of artificially affecting the grinding quality in existing technologies, this application provides a pressure grinding device.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is a pressure grinding device, including a support.

[0006] The sliding rod is configured to be slidably connected to the bracket;

[0007] A clamping mechanism, installed at one end of the sliding rod, is used to clamp the sample to be processed;

[0008] The pressure block is magnetically attracted and configured to apply pressure or tension to the clamping mechanism.

[0009] An electromagnet, fixed to the bracket, is configured to attract or release the pressure block;

[0010] The power mechanism is configured to drive the reciprocating motion of the clamping mechanism.

[0011] In some embodiments, the bracket is provided with a mounting hole, the sliding rod is slidably connected to the bracket through the mounting hole, and the top of the sliding rod has a limiting cover, the diameter of which is larger than the diameter of the mounting hole.

[0012] In some embodiments, a guide sleeve is fixed on the bracket, the guide sleeve is sleeved on the outside of the sliding rod, the surface of the sliding rod is provided with an axial guide groove, and the inner surface of the guide sleeve is provided with a guide block that slides with the guide groove.

[0013] In some embodiments, a first elastic buffer element is fixedly disposed on the clamping mechanism, and the pressure block is located between the first elastic buffer element and the electromagnet, and is fixedly connected to the first elastic buffer element.

[0014] In some embodiments, a second elastic buffer element is disposed below the electromagnet, and the pressure block is located between the first elastic buffer element and the second elastic buffer element.

[0015] In some embodiments, the pressure block is annular and sleeved on the outside of the sliding rod.

[0016] In some embodiments, the telescopic end of the power mechanism is connected to the bracket.

[0017] In some embodiments, a mounting base is also included, on which the power mechanism is mounted.

[0018] In some embodiments, the mounting base extends to include a support plate, the support plate has a sliding groove, and the bracket has a slider that matches the sliding groove. The bracket is slidably mounted on the support plate via the slider and the sliding groove.

[0019] In some embodiments, the support plate is provided with limit switches, the limit switches including a first limit switch and a second limit switch located at both ends of the slide groove, the first limit switch and the second limit switch being electrically connected to the electromagnet and used to control the electromagnet to be energized or de-energized.

[0020] Beneficial effects: This utility model device drives the clamping mechanism to reciprocate through a power mechanism, enabling automatic grinding. Furthermore, it can apply pressure to the clamping mechanism via a pressure block, i.e., apply pressure to the sample during grinding. When the electromagnet is energized, it generates magnetic attraction, which can hold the pressure block in place, preventing it from applying pressure to the clamping mechanism. This satisfies the need to apply or not apply pressure to the sample at different stages of the grinding process. Attached Figure Description

[0021] Figure 1 This is a three-dimensional structural diagram of the device in this application;

[0022] Figure 2 This is a front view of the device in this application;

[0023] Figure 3 for Figure 2 Sectional view along the AA direction;

[0024] In the diagram: 1. Bracket, 11. Horizontal frame, 12. Vertical frame, 2. Sliding rod, 21. Limiting cover, 22. Guide groove, 3. Pressure block, 31. First elastic buffer element, 32. Second elastic buffer element, 33. Limiting ring, 4. Electromagnet, 5. Clamping mechanism, 6. Power mechanism, 7. Guide sleeve, 71. Guide block, 8. Mounting base, 9. Support plate, 91. Slide groove, 92. Slider, 93. Mounting bracket, 94. First limit switch, 95. Second limit switch. Detailed Implementation

[0025] The present application will be further described below with reference to specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without making creative changes are within the protection scope of the present application.

[0026] like Figures 1-3 As shown, the pressure grinding device provided by this utility model includes a bracket 1, on which a sliding rod 2 is slidably connected, allowing the sliding rod 2 to slide freely on the bracket 1. A clamping mechanism 5 is fixedly installed at one end of the sliding rod 2. This mechanism is used to clamp the sample to be processed. In one embodiment, the clamping mechanism 5 is a pneumatic three-jaw chuck, which facilitates automatic sample clamping. Of course, in other embodiments, the clamping mechanism 5 can be other common clamping mechanisms 5, such as two-finger / three-finger grippers, etc. This utility model does not impose any limitations.

[0027] A pressure block 3 is installed on the clamping mechanism 5. When the weight of the pressure block 3 is borne by the clamping mechanism 5, the sliding rod 2 is slidably mounted on the support 1 in a movable state. During the sample grinding process, the weight of the pressure block 3 is converted into pressure on the sample. The pressure block 3 can be attracted by magnetic force, such as using a steel pressure block 3. When the electromagnet 4 fixed on the support 1 is energized, the electromagnet 4 generates magnetic attraction, which in turn attracts the pressure block 3. At this time, the weight of the pressure block 3 is borne by the electromagnet 4, the pressure of the pressure block 3 on the clamping mechanism 5 disappears, and a pulling force is generated on the clamping mechanism 5, causing the clamping mechanism 5 and the sliding rod 2 to rise a certain distance, thereby eliminating the pressure applied to the sample and causing the sample to detach from the sandpaper at its bottom. To meet the different stroke requirements of the grinding process, the electromagnet 4 is de-energized during the process of pushing the sample on the sandpaper, and the pressure block 3 applies pressure to the clamping mechanism 5, thereby applying pressure to grind the sample. During the process of pulling the sample back, the electromagnet 4 is energized, and the pressure block 3 is attracted by the electromagnet 4, no longer applying pressure to the clamping mechanism 5 and the sample, so that the sample is removed from the sandpaper at its bottom, thus realizing the function of unidirectional grinding.

[0028] The device also includes a power mechanism 6 that drives the clamping mechanism 5 to reciprocate, thereby realizing the above-mentioned actions of pushing and pulling back the sample.

[0029] In some embodiments, the sliding rod 2 is configured as a hollow structure, which facilitates the concealment of the electromagnet 4's power supply circuit and the pneumatic three-jaw chuck's ventilation circuit within the hollow structure.

[0030] To facilitate the assembly between the sliding rod 2 and the bracket 1, in some embodiments, the bracket 1 is provided with a mounting hole in the thickness direction. The sliding rod 2 passes through the mounting hole and is slidably connected to the bracket 1. The top of the sliding rod 2 has a limiting cover 21, the diameter of which is larger than the diameter of the mounting hole, to prevent the sliding rod 2 from disengaging from the mounting hole.

[0031] To ensure the stability of the sliding rod 2 within the mounting hole, in some embodiments, a guide sleeve 7 is fixed to the bracket 1. The guide sleeve 7 is fitted over the sliding rod 2, and the surface of the sliding rod 2 has an axial guide groove 22. The inner surface of the guide sleeve 7 has a guide block 71 that slides in cooperation with the guide groove 22. The guide sleeve 7 and guide block 71 prevent the sliding rod from deflecting within the mounting hole, improving the stability of the sliding rod 2 along the bracket 1. Simultaneously, the cooperation of the guide groove and guide block 71 also prevents the sliding rod 2 from rotating during grinding. Figures 1-3 As shown, in some embodiments, the guide groove 22 extends from the upper end of the sliding rod 2 to the outside of the guide sleeve 7, thereby ensuring that the sliding rod 2 can have sufficient upward and downward stroke along the guide sleeve 7. For the installation stability of the guide sleeve 7, the bracket 1 can be set as a C-shaped structure, that is, including two horizontally arranged horizontal frames 11 arranged vertically and horizontally and a vertical frame 12 fixed between the two horizontal frames 11. The guide sleeve 7 passes through the mounting holes of the two horizontal frames 11 and is fixedly connected to the two horizontal frames 11, so that the guide sleeve 7 is stably installed.

[0032] As an improvement to the above implementation, in some embodiments, a first elastic buffer element 31 is fixedly disposed on the clamping mechanism 5, and the pressure block 3 is located between the first elastic buffer element 31 and the electromagnet 4, and is fixedly connected to the upper end of the first elastic buffer element 31. The first elastic buffer element 31 can prevent the impact of the pressure block 3 falling freely on the clamping mechanism 5 and the sample when the electromagnet 4 is suddenly de-energized. In one embodiment, the first elastic buffer element 31 is a spring. The spring is sleeved on the outside of the sliding rod 2, and its bottom end is fixedly connected to the clamping mechanism 5, while its top end is fixedly connected to the pressure block 3. When the electromagnet 4 is de-energized, the pressure block 3 loses its electromagnetic attraction and falls freely together with the sliding rod 2 and the clamping mechanism 5 under the action of gravity. Using the spring as the first elastic buffer element 31 can not only reduce the impact of the pressure block 3 on the pressure mechanism and the sample, but also, the extension of the spring to a certain height can reduce the free fall stroke of the pressure block 3, the sliding rod 2 and the clamping mechanism 5, as well as the distance between the pressure block 3 and the electromagnet 4, further reducing the impact force of the pressure block 3 and ensuring that the pressure block 3 can be attracted when the electromagnet 4 is energized. Specifically, when the electromagnet 4 is de-energized, the pressure block 3 compresses the spring, which acts as the first elastic buffer element 31, and its weight is borne by the clamping mechanism, thereby applying pressure to the sample. When the electromagnet 4 is energized, the pressure block 3 is attracted and rises, and the spring, which acts as the first elastic buffer element 31, changes from a compressed state to a stretched state. The pressure block 3 generates a pulling force on the clamping mechanism 5 through the first elastic buffer element 31, thereby causing the clamping mechanism 5 and the sliding rod 2 to rise a certain distance and causing the sample to detach from the sandpaper at the bottom. Due to the change in the state of the spring, the distance that the clamping mechanism 5, the sliding rod 2, and the sample rise is less than the distance that the pressure block rises. Therefore, when the electromagnet 4 is de-energized, the free fall of the clamping mechanism 5, the sliding rod 2, and the sample is smaller, and the spring can buffer the free fall motion of the pressure block 3.

[0033] Meanwhile, to reduce the impact of the pressure block 3 on the electromagnet 4 when it is energized and attracts the pressure block 3 to rise, in some embodiments, a second elastic buffer element 32 is provided below the electromagnet 4, and the pressure block 3 is located between the first elastic buffer element 31 and the second elastic buffer element 32. In one embodiment, the second elastic buffer element 32 is a spring. The provision of the second elastic buffer element 32 avoids the impact force generated by the pressure block 3 directly contacting and engaging with the electromagnet 4 during the upward movement under magnetic attraction, thereby improving the service life of the electromagnet 4. It also effectively reduces the distance travel between the pressure block 3 and the clamping mechanism 5. In particular, in some embodiments where the first elastic buffer element 31 and the second elastic buffer element 32 are provided simultaneously, the first elastic buffer element 31 and the second elastic buffer element 32 not only prevent the pressure block 3 from directly contacting the clamping mechanism 5 or the electromagnet 4 and play a buffering role, but also limit the upward or downward travel of the pressure block 3, avoiding excessive upward or downward travel of the pressure block 3, which could lead to a large impact force and cause system instability.

[0034] In one embodiment, a limiting ring 33 can be fixedly provided at the end of the spring that serves as the first elastic buffer element 31 and the spring that serves as the second elastic buffer element 32 near the pressure block 3. The side of the limiting ring 33 near the pressure block 3 is flat to stably support the pressure block 3. The pressure block 3 is fixedly connected to the limiting ring 33 on the spring that serves as the first elastic buffer element 31. The specific fixing method can be a common detachable fixing method such as adhesive bonding or cable tie connection. This application does not limit the method.

[0035] Specifically, the pressure block 3 is ring-shaped and sleeved on the outside of the sliding rod 2, so that the pressure block 3 can rise and fall freely outside the sliding rod 2. In some embodiments, the pressure block 3 can be set as a two-part splicing structure to facilitate the installation and replacement of the pressure block 3. Different weight pressure blocks 3 can be matched and installed according to different needs.

[0036] In some embodiments, a commonly used cylinder is selected as the power mechanism 6, and the telescopic end of the cylinder is connected to the bracket 1, such as... Figure 1 and 2 As shown, in one embodiment, the telescopic end of the cylinder and the longitudinal frame 12 directly drive the support 1 to reciprocate, thereby driving the sliding rod 2, the clamping mechanism 5, and the sample to reciprocate by pushing and pulling on the sandpaper.

[0037] To facilitate installation, in some embodiments, the device further includes a mounting base 8 on which the power mechanism 6 is mounted. In use, the mounting base 8 can be used to mount the entire device to one side of the grinding table, with the sliding rod 2 positioned above the sandpaper area on the grinding table.

[0038] To ensure the stability of the device operation, in some embodiments, the mounting base 8 extends to provide a support plate 9, and the support plate 9 is provided with a sliding groove 91, which extends along the extension and retraction direction of the power mechanism 6, such as... Figure 2 As shown, a slider 92 matching the slide groove 91 is fixed on the bottom surface of the bottom horizontal frame 11. The bracket 1 is slidably mounted on the support plate 9 via the slider 92 and the slide groove 91. When the power mechanism 6 drives the bracket 1 to reciprocate, the bracket 1 is supported by the support plate 9 and guided by the slide groove 91 on it, preventing the bracket 1 from deflecting during reciprocating movement. In one embodiment, the slide groove 91 is set as a T-shaped groove, and the slider 92 is also set as a matching T-shaped structure to improve operational stability and prevent the slider 92 from detaching from the slide groove 91.

[0039] To facilitate control of energizing or de-energizing the electromagnet 4, in some embodiments, the support plate 9 is provided with limit switches. These limit switches include a first limit switch 94 and a second limit switch 95 located at opposite ends of the slide groove 91. The first limit switch 94 and the second limit switch 95 are electrically connected to the electromagnet 4 to control its energization or de-energization. In some embodiments, the first limit switch 94 and the second limit switch 95 are mounted on the support plate 9 via a mounting bracket 93, and are located at opposite ends of the travel path of the vertical frame 12, allowing the vertical frame 12 to contact the first limit switch 94 and the second limit switch 95 at its initial and maximum travel positions, respectively.

[0040] Taking an embodiment where the first limit switch 94 is further away from the sliding rod 2 relative to the second limit switch 95 as an example, the following is a specific description: The vertical frame 12 is located between the first limit switch 94 and the second limit switch 95. During the grinding process, the power mechanism 6 drives the support 1 to push the sample. The vertical frame 12 moves from the first limit switch 94 to the second limit switch 95, and the electromagnet 4 is de-energized. The pressure block 3 presses on the first elastic buffer element 31 above the clamping mechanism 5, applying pressure to grind the sample on the clamping mechanism 5. When the vertical frame 12 moves to contact the second limit switch 95, that is, when the vertical frame 12 reaches its maximum pushing stroke position, the second limit switch 95 energizes the electromagnet 4. The electromagnet 4 generates electromagnetic attraction, and the pressure block 3 is attracted to rise and touch the second elastic buffer. When component 32 contacts the clamping mechanism 5, it exerts a pulling force on the clamping mechanism 5 and the sample. At this time, the pressure block 3 no longer applies pressure to the clamping mechanism 5 and the sample. Simultaneously, the power mechanism 6 pulls the bracket 1 back, that is, moves it from the second limit switch 95 to the first limit switch 94. Since the pressure block 3 does not apply pressure to the sample, no pressure grinding operation is performed during the back-retraction process. When the vertical frame 12 moves to contact the first limit switch 94, that is, reaches the maximum back-retraction stroke position of the vertical frame 12, the first limit switch 94 de-energizes the electromagnet 4. The pressure block 3 presses on the first elastic buffer element 31 above the clamping mechanism 5, applying pressure to the sample on the clamping mechanism 5. At the same time, the power mechanism 6 pushes the vertical frame 12 from the first limit switch 94 to the second limit switch 95, that is, pushes the sample to perform the pressure grinding process. This reciprocating motion automatically realizes the unidirectional grinding action of the sample.

[0041] Furthermore, in some embodiments, a cooling nozzle is also configured to cool the sample during the grinding process. The cooling nozzle is fixed to the clamping mechanism 5, and the cooling water pipeline can be concealed inside the sliding rod 2 or directly fixed to the bracket 1. A solenoid valve can be installed on the cooling water pipeline, electrically connected to the first limit switch 94 and the second limit switch 95. This allows the solenoid valve to open and connect the cooling water pipeline when the device pushes the sample for pressure grinding, enabling the cooling nozzle to dispense water and cool the sample. Conversely, during the retraction of the bracket 1, the solenoid valve closes, preventing the cooling water pipeline from supplying water to the cooling nozzle, thus saving water.

[0042] While the disclosure is as stated above, its scope of protection is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of this disclosure, and all such changes and modifications will fall within the scope of protection of this application.

Claims

1. A pressure grinding device, characterized in that, Includes a support (1); The sliding rod (2) is configured to be slidably connected to the bracket (1); A clamping mechanism (5) is installed at one end of the sliding rod (2) for clamping the sample to be processed; The pressure block (3) is magnetically attracted and configured to apply pressure or tension to the clamping mechanism (5); An electromagnet (4), fixed on the bracket (1), is configured to attract or release the pressure block (3); The power mechanism (6) is configured to drive the reciprocating motion of the clamping mechanism (5).

2. The pressure grinding device according to claim 1, characterized in that, The bracket (1) is provided with a mounting hole, and the sliding rod (2) is slidably connected to the bracket (1) through the mounting hole. The top of the sliding rod (2) has a limiting cover (21), and the diameter of the limiting cover (21) is larger than the diameter of the mounting hole.

3. The pressure grinding device according to claim 2, characterized in that, A guide sleeve (7) is fixed on the bracket (1). The guide sleeve (7) is sleeved on the outside of the sliding rod (2). An axial guide groove (22) is provided on the surface of the sliding rod (2). A guide block (71) that slides with the guide groove (22) is provided on the inner surface of the guide sleeve (7).

4. The pressure grinding device according to claim 1, characterized in that, The clamping mechanism (5) is fixedly provided with a first elastic buffer element (31), and the pressure block (3) is located between the first elastic buffer element (31) and the electromagnet (4), and is fixedly connected to the first elastic buffer element (31).

5. The pressure grinding device according to claim 4, characterized in that, A second elastic buffer element (32) is provided below the electromagnet (4), and the pressure block (3) is located between the first elastic buffer element (31) and the second elastic buffer element (32).

6. The pressure-applying grinding device according to claim 4 or 5, characterized in that, The pressure block (3) is ring-shaped and is sleeved on the outside of the sliding rod (2).

7. The pressure-applying grinding device according to any one of claims 1 to 5, characterized in that, The telescopic end of the power mechanism (6) is connected to the bracket (1).

8. The pressure grinding device according to claim 7, characterized in that, It also includes a mounting base (8), on which the power mechanism (6) is mounted.

9. The pressure grinding device according to claim 8, characterized in that, The mounting base (8) extends to provide a support plate (9), the support plate (9) is provided with a sliding groove (91), the bracket (1) is provided with a slider (92) that matches the sliding groove (91), and the bracket (1) is slidably mounted on the support plate (9) by means of the slider (92) and the sliding groove (91).

10. The pressure grinding device according to claim 9, characterized in that, The support plate (9) is provided with limit switches. The limit switches include a first limit switch (94) and a second limit switch (95) located at both ends of the slide (91). The first limit switch (94) and the second limit switch (95) are electrically connected to the electromagnet (4) to control the electromagnet (4) to be energized or de-energized.

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