Heat dissipation structure, electric control box and heating and ventilation equipment

Abstract

The utility model relates to the technical field of air conditioners, in particular to a heat dissipation structure, an electric control box, an outdoor unit and heating and ventilation equipment, the heat dissipation structure comprises a heat dissipation plate, the heat dissipation plate comprises a heat conduction plate section and a connecting plate section which are connected together, and the heat conduction plate section is used for exchanging heat with a heat exchange medium; according to the electric control box, the connecting plate section is provided with the heat insulation part, the heat insulation part is used for blocking heat exchange between the heat conduction plate section and the connecting plate section, the problem that condensate water appears in the corresponding power connection area of the heat dissipation plate is solved, therefore, short circuit at the node part is avoided, and normal use of the electric control box is ensured.

Description

Technical Field

[0001] This application relates to the field of air conditioning technology, and in particular to a heat dissipation structure, an electrical control box, and a heating and ventilation device. Background Technology

[0002] In the outdoor unit of an air conditioning system, the main function of the electrical control box is to control and manage the electrical system of the outdoor unit, including functions such as driving the motor and regulating the refrigeration cycle. At the same time, through heat dissipation design, it ensures that the internal electronic components operate stably in high-temperature environments.

[0003] In related technologies, the heat of electronic components can be transferred to a heat dissipation structure, which is provided with heat dissipation channels for the flow of heat exchange medium, thereby removing the heat of electronic components through the heat exchange medium.

[0004] However, when the temperature of the heat dissipation structure is low, condensation may occur on the heat sink, and water may form on the electrical contact area of ​​the heat sink, causing a short circuit at the electrical contact point. Utility Model Content

[0005] This application provides a heat dissipation structure, an electrical control box, and HVAC equipment, which can improve the overall structural compactness of the electrical control box.

[0006] In a first aspect, this application provides a heat dissipation structure, including a heat dissipation plate, the heat dissipation plate including a heat-conducting plate segment and a connecting plate segment connected together, the heat-conducting plate segment being used for heat exchange with a heat exchange medium;

[0007] The connecting plate segment is provided with a heat insulation part, which is used to block heat exchange between the heat-conducting plate segment and the connecting plate segment.

[0008] As an optional implementation, the heat insulation part is disposed on the side of the connecting plate section near the heat-conducting plate section to prevent the low temperature on the heat-conducting plate section from being transferred to the connecting plate section, and to prevent the condensate on the heat-conducting plate section from flowing to the connecting plate section.

[0009] As an optional implementation, the heat insulation part is a blocking groove, and at least part of the blocking groove extends through the thickness direction of the connecting plate segment.

[0010] As an optional implementation, the heat sink has a first extending direction and a second extending direction that are perpendicular to each other, the heat-conducting plate segment and the connecting plate segment are arranged along the second extending direction, and at least part of the blocking groove extends along the first extending direction.

[0011] As an optional implementation, there are multiple blocking grooves, which are arranged at intervals along the first extending direction to further improve the heat insulation effect.

[0012] As an alternative implementation, the extension lengths of the multiple blocking grooves are not equal.

[0013] As an optional implementation, there are multiple blocking grooves, which are arranged at intervals along the second extending direction to further improve the heat insulation effect.

[0014] As an optional implementation, there are two connecting plate segments, which are respectively disposed on both sides of the heat-conducting plate segment along the second extension direction, and each connecting plate segment is provided with at least one heat insulation part.

[0015] As an optional implementation, the heat sink has a first extension direction and a second extension direction that are perpendicular to each other, a power-connecting area is provided on the connecting plate segment, at least a portion of the heat insulation part is located on the side of the power-connecting area near the heat-conducting plate segment, and the connecting plate segment and the heat-conducting plate segment are arranged along the second extension direction.

[0016] As an optional implementation, the length of the heat insulation portion is greater than or equal to the length of the electrical contact area along the first extension direction of the heat sink, so as to ensure that heat insulation can be guaranteed at each position along the width direction of the electrical contact area.

[0017] As an optional implementation, multiple heat insulation parts are provided, one of which is a cross-zone heat insulation part; in the first extension direction of the heat sink, the cross-zone heat insulation part is arranged around one side of the electrical contact area to the other side of the electrical contact area, so that the blocking groove isolates the electrical contact area to a certain extent, further ensuring that the low temperature on the heat conduction plate segment is not transferred to the location of the electrical contact area of ​​the connecting plate segment.

[0018] As an optional implementation, the cross-zone heat insulation part is a blocking groove, which includes a first groove segment, a second groove segment and a third groove segment connected in sequence. The first groove segment and the third groove segment are respectively located on both sides of the power receiving area along the first extension direction, and the second groove segment is located on the side of the power receiving area near the heat conducting plate segment. The first groove segment and the third groove segment both extend along the second extension direction of the heat dissipation plate, and the second groove segment extends along the first extension direction.

[0019] As an optional implementation, along the first extending direction, the length of the second slot segment is greater than or equal to the length of the electrical contact area, and along the second extending direction, the lengths of the first slot segment and the third slot segment are both greater than or equal to the length of the electrical contact area.

[0020] As an alternative implementation, the heat sink includes a first plate and a second plate stacked together, and both the first plate and the second plate have heat-conducting plate segments and connecting plate segments formed on them.

[0021] As an optional implementation, the heat insulation part is a blocking groove, which is disposed on the first plate and extends through the thickness direction of the first plate; or, blocking grooves are disposed on both the first plate and the second plate, and the blocking grooves extend through the first plate and the second plate along the thickness direction of the heat dissipation plate.

[0022] As an optional implementation, the heat-conducting plate segment is provided with heat dissipation channels for the flow of heat exchange medium.

[0023] As an optional implementation, the heat sink has a medium channel inside for connecting to external piping, and the medium channel forms a heat dissipation channel.

[0024] As an optional implementation, the heat sink includes a first plate and a second plate stacked together. A first flow channel groove is formed on the side of the first plate facing the second plate, and the second plate and the first flow channel groove together form a medium channel; or, the first plate has a first flow channel groove on the side facing the second plate, and the second plate has a second flow channel groove on the side facing the first plate, with the second flow channel groove opposite to the first flow channel groove, and the first and second flow channel grooves together forming a medium channel.

[0025] As an optional implementation, the heat dissipation structure also includes cooling pipes disposed on the heat dissipation plate, and the cooling pipes form heat dissipation channels.

[0026] As an optional implementation, the heat-conducting plate segment and the connecting plate segment are an integral structure.

[0027] Secondly, this application provides an electrical control box, including a main box body, a first power module, a second power module, a power terminal block, and the aforementioned heat dissipation structure; wherein, the heat dissipation structure is connected to the main box body and forms a first cavity with the main box body, the first power module is disposed in the first cavity, the first power module is thermally connected to a heat-conducting plate segment, a second cavity is also formed on the main box body, and the second power module is disposed in the second cavity; furthermore, there are two connecting plate segments, the two connecting plate segments are respectively disposed on both sides of the heat-conducting plate segment, one connecting plate segment is located between the first power module and the second power module, and the other connecting plate segment is provided with a power receiving area, and the power terminal block is disposed in the power receiving area.

[0028] As an optional implementation, the main box body includes a box section and a first box cover. The box section and the heat sink form a first cavity, and the box section and the first box cover form a second cavity.

[0029] As an optional implementation, the electrical control box has a height direction and a thickness direction. The box includes a first enclosure plate, a first main board, a second enclosure plate, and a second main board. The first main board and a heat sink are both connected to the first enclosure plate, the second enclosure plate and the second main board are both connected to the first enclosure plate, the second main board and the first box cover are both connected to the second enclosure plate, and the second enclosure plate is connected to a corresponding connecting plate segment. Furthermore, the first main board and the second main board are arranged at intervals in both the height direction and the thickness direction. The first enclosure plate, the first main board, and the heat sink together form a first cavity, and a portion of the first enclosure plate, the second enclosure plate, the second main board, and the first box cover together form a second cavity.

[0030] As an optional implementation, the first enclosure plate, the first main plate, the second enclosure plate, and the second main plate are integrated into a single structure to further simplify the structure and improve assembly efficiency.

[0031] As an optional implementation, the first power module includes a driver board, and the second power module is a main control module;

[0032] The drive board includes a first drive module and a second drive module. The first drive module is used to drive the compressor, and the second drive module is used to drive the fan. Both the first drive module and the second drive module are attached to the heat-conducting plate segment.

[0033] As an optional implementation, the heat dissipation structure and the main box body also enclose a third cavity, which is arranged opposite to the first cavity;

[0034] The electrical control box also includes a third power module, which is located in the third cavity.

[0035] As an optional implementation, the box also includes a third enclosure plate and a third main plate connected to each other, with the third enclosure plate and the first enclosure plate respectively connected to opposite sides of the heat sink.

[0036] The third enclosure, the third main board, and the heat sink together form the third cavity.

[0037] As an optional implementation, the third power module includes a filter board, with the second end of the power terminal block extending into the third cavity to connect to the filter board.

[0038] As an optional implementation, the power terminal block includes an insulating base and a conductive post. The insulating base is connected to the power receiving area, and the conductive post passes through the insulating base. The power receiving area is provided with a through hole that communicates with the third cavity. The conductive post passes through the insulating base and through the through hole, so that both ends of the conductive post are electrically connected to the filter board and the external power line, respectively.

[0039] As an optional implementation, a protective cover is also included, which is connected to the heat sink and forms a protective cavity with the heat sink.

[0040] Part of the power connector structure is located inside the protective cavity.

[0041] Thirdly, this application provides a heating and ventilation device, including a housing and the aforementioned electrical control box, wherein the electrical control box is installed in the housing; wherein the housing has an access port, and the first main board of the electrical control box is disposed facing the access port.

[0042] The heat dissipation structure, electrical control box, and HVAC equipment provided in this application include a heat dissipation plate. The heat dissipation plate comprises a heat-conducting plate segment and a connecting plate segment connected together. The heat-conducting plate segment is used for heat exchange with the heat exchange medium. The connecting plate segment is provided with a heat insulation part, which is used to block the heat exchange between the heat-conducting plate segment and the connecting plate segment. In this way, not only can the low temperature on the heat-conducting plate segment not be transferred to the location of the connecting plate segment, preventing the temperature on the connecting plate segment from becoming too low and causing condensation, but also the condensate on the heat-conducting plate segment will not flow to the location of the connecting plate segment. Therefore, the heat dissipation plate will not have the problem of condensation in the corresponding electrical connection area, thus preventing short circuits at the electrical connection points and ensuring the normal use of the electrical control box. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0044] Figure 1 A three-dimensional structural diagram of the electrical control box provided in an embodiment of this application;

[0045] Figure 2 A side view of the electrical control box provided in an embodiment of this application;

[0046] Figure 3 A rear view of the electrical control box provided in an embodiment of this application;

[0047] Figure 4 This is a schematic diagram of the structure of the first power module of the electrical control box provided in an embodiment of this application;

[0048] Figure 5 A schematic diagram of the heat dissipation structure and part of the main body of the electrical control box provided in the embodiments of this application;

[0049] Figure 6 A schematic diagram of the heat dissipation structure of the electrical control box and a portion of the main box from another perspective, provided in an embodiment of this application;

[0050] Figure 7A schematic diagram of the structure of the first power module and part of the main body of the electrical control box provided in the embodiments of this application;

[0051] Figure 8 This is a schematic diagram of the structure of a portion of the main body of the electrical control box provided in an embodiment of this application;

[0052] Figure 9 This is a schematic diagram of the heat dissipation structure of the electrical control box provided in the embodiments of this application;

[0053] Figure 10 A schematic diagram of the first plate of the heat dissipation structure of the electrical control box provided in the embodiments of this application;

[0054] Figure 11 A schematic diagram of the second plate and pipe connector of the heat dissipation structure of the electrical control box provided in the embodiments of this application;

[0055] Figure 12 A schematic diagram of the first plate and external connecting pipe of the heat dissipation structure of the electrical control box provided in the embodiments of this application;

[0056] Figure 13 This is a schematic diagram of the first plate and cooling pipe of the heat dissipation structure of the electrical control box provided in the embodiments of this application.

[0057] Explanation of reference numerals in the attached figures:

[0058] 10. Electrical control box;

[0059] 1. Main box body; 110. First cavity; 120. Second cavity;

[0060] 11. Box section; 111. First enclosure panel; 112. First main board; 113. Second enclosure panel; 114. Second main board; 115. Third enclosure panel; 116. Third main board; 12. First box cover; 13. Wiring sealing cover; 14. Wiring socket cover; 15. Hanging plate;

[0061] 2. Heat dissipation structure; 21. Heat dissipation plate; 210. Clearance groove; 211. First plate; 2111. First flow channel groove; 2112. Liquid inlet end; 2113. Liquid outlet end; 212. Second plate; 2121. Liquid inlet hole; 2122. Liquid outlet hole; 213. Heat-conducting plate section; 2130. Heat dissipation flow channel; 2131. Medium channel; 2132. Channel section; 214. Connecting plate section; 2141. Electrical contact area; 215. Heat insulation part; 2150. Blocking groove; 2151. First groove section; 2152. Second groove section; 2153. Third groove section; 216. Through hole; 22. Liquid inlet pipe; 23. Liquid outlet pipe; 24. Pipe connector; 25. External pipe; 26. Cooling pipe;

[0062] 3. First power module; 31. Driver board; 311. Driver base plate; 312. Fan drive module; 313. Compressor drive module;

[0063] 41. Power terminal block; 42. Adapter structure;

[0064] A. First extension direction; B. Second extension direction.

[0065] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0066] In the outdoor unit of an air conditioning system, the main function of the electrical control box is to control and manage the unit's electrical system, including functions such as driving the motor and regulating the refrigeration cycle. Simultaneously, it ensures the stable operation of internal electronic components in high-temperature environments through heat dissipation design. Related technologies utilize a heat sink inside the control box, where electronic components contact the heat sink, transferring heat to the heat dissipation structure. This structure also incorporates heat exchange channels for the flow of heat exchange medium, which carries away the heat from the electronic components. However, at lower temperatures, condensation may occur on the heat sink, potentially leading to short circuits at electrical connection points.

[0067] Therefore, embodiments of this application provide a heat dissipation structure, an electrical control box, and a heating and ventilation device. By providing a heat insulation part on the connecting plate segment of the heat dissipation plate, the heat insulation part prevents heat exchange between the heat-conducting plate segment of the heat dissipation plate and the connecting plate segment.

[0068] The embodiments of this application will now be described clearly and in detail with reference to the accompanying drawings and specific implementation details. In the description of the embodiments of this application, unless otherwise stated, "multiple" refers to two or more, and the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0069] Please see Figures 1-3 ,in, Figure 1 This is a three-dimensional structural diagram of the electrical control box 10 provided in the embodiments of this application. Figure 2 This is a side view of the electrical control box 10. Figure 3 This is a front view of the electrical control box 10.

[0070] like Figures 1-3As shown, this application embodiment provides an electrical control box 10, which includes a main box body 1, a heat dissipation structure 2, and multiple power modules. The heat dissipation structure 2 and the main box body 1 are interconnected and enclose an internal space of the electrical control box 10, with each power module disposed at a corresponding position within this internal space.

[0071] The power module of the electrical control box 10 may be a drive inverter module or a main control module. In some embodiments, the electrical control box 10 includes a first power module 3, which includes a drive board 31. The drive board 31 is used to realize the normal operation and precise control of the air conditioning system. For example, it can precisely control the current required by the motor according to the requirements of the control signal to realize the start, operation and stop of the motor. It can also regulate the voltage to ensure that the motor receives a suitable voltage supply under different operating conditions. The drive board 31 can also control the speed of the motor as needed to adapt to different operating modes and requirements.

[0072] Specifically, the drive board 31 includes a drive base plate 311, a first drive module, and a second drive module. The first drive module can be a fan drive module 312 for driving a fan, and the second drive module can be a compressor drive module 313 for driving a compressor.

[0073] The fan drive module 312 and the compressor drive module 313 are disposed on the same side of the drive base plate 311. Since both the fan drive module 312 and the compressor drive module 313 are high-power components, they are disposed on the side of the drive base plate 311 facing the heat dissipation structure 2 for corresponding arrangement with the heat dissipation structure 2, so that the heat dissipation structure 2 can dissipate heat and cool down the fan drive module 312 and the compressor drive module 313.

[0074] In some specific embodiments, the fan drive module 312 and the compressor drive module 313 can be attached to the heat sink 21 of the heat dissipation structure 2. This allows the heat generated by the fan drive module 312 and the compressor drive module 313 to be transferred to the heat dissipation structure 2 and then dissipated. In some optional embodiments, thermally conductive adhesive can be applied between the fan drive module 312 and the heat dissipation structure 2, and between the compressor drive module 313 and the heat dissipation structure 2, to achieve better heat conduction.

[0075] Furthermore, the driver board 31 also includes a driver power supply, a fan chip, and a compressor chip. Correspondingly, the driver power supply, fan chip, and compressor chip can be disposed on the other side of the driver substrate 311.

[0076] In some embodiments, the electrical control box 10 further includes a second power module, which is a main control module. The main control module includes a main control board and a main control power supply board. The main control board is responsible for monitoring, controlling, and managing the entire electrical control system to achieve automatic operation and stability control of the system. Specifically, the main control board is electrically connected to the main control power supply board.

[0077] In some embodiments, the control box 10 further includes a third power module, which includes a filter board. The filter board ensures the stability and reliability of the control box 10. Through the filtering circuit, the filter board filters the power signal in the control system, removing high-frequency noise and interference to ensure the stability and purity of the power supply signal. It can also effectively suppress the impact of electromagnetic interference and power fluctuations on the control system, providing a stable power environment and reducing interference to other electronic components.

[0078] Specifically, the filter board includes a filter substrate, a common-mode inductor, and a capacitor, etc., with the capacitor and common-mode inductor all disposed on the filter substrate and located on the same side of the filter substrate. In one feasible embodiment, the capacitor and common-mode inductor may be disposed on the side of the filter substrate facing the heat dissipation structure 2.

[0079] Furthermore, the third power module also includes a reactor, which is located on the side of the filter board and electrically connected to the capacitor of the filter board to achieve functions such as resonance and noise suppression.

[0080] In some specific embodiments, both the reactor and the common-mode inductor of the filter board can be bonded to the heat sink 21. In this way, the heat generated by the reactor and the common-mode inductor can be transferred to the heat dissipation structure 2 and then dissipated through the heat dissipation structure 2. In some optional embodiments, thermally conductive adhesive can also be applied between the reactor and the heat dissipation structure 2, and between the common-mode inductor and the heat dissipation structure 2, to achieve better thermal conductivity.

[0081] In some embodiments, the control box 10 further includes a power terminal block 41, which is used to connect the control box 10 to a power source. The power terminal block 41 includes an insulating base, conductive posts, and a protective cover. The insulating base is used to connect to the heat dissipation structure 2, the conductive posts are disposed on the insulating base and are used to connect to the filter board, and the protective cover is disposed on the insulating base.

[0082] In some embodiments, the electrical control box 10 further includes a compressor terminal block and a converter structure 42. The compressor terminal block is electrically connected to the compressor drive module 313 of the first power module 3, and the converter structure 42 is electrically connected to the fan drive signal interface of the first power module 3.

[0083] The arrangement of the power modules within the mounting space formed by the main housing 1 and the heat dissipation structure 2 can be achieved by referring to the following implementation method.

[0084] See Figures 1-2 As shown, the main box 1 includes a box part 11 and a first box cover 12. The box part 11 and the heat sink 21 enclose a first cavity 110, and the box part 11 and the first box cover 12 enclose a second cavity 120.

[0085] Furthermore, the box portion 11 includes a first enclosure plate 111 and a first main board 112. The first main board 112 is connected to the first enclosure plate 111. The heat dissipation structure 2 specifically includes a heat dissipation plate 21. The heat dissipation plate 21, the first main board 112 and the first enclosure plate 111 together enclose to form a first cavity 110. The first power module 3 is correspondingly disposed in the first cavity 110.

[0086] To simplify the operation steps and improve the assembly efficiency of the electrical control box 10, the first enclosure 111 and the first main board 112 can be an integrated structure. In this way, when assembling the drive board 31, the first enclosure 111 can be connected to the heat sink 21 to form the first cavity 110.

[0087] The first enclosure 111 and the heat sink 21 can be connected, for example, by fasteners. Specifically, multiple connection holes can be provided around the circumferential edge of the heat sink 21, and connection holes can also be provided on the first enclosure 111 at the corresponding positions of the connection holes. By inserting connecting bolts through the corresponding connection holes of the heat sink 21 and the first enclosure 111, the installation between the first enclosure 111 and the heat sink 21 can be achieved.

[0088] In addition, the first motherboard 112 is provided with an installation port for installing the adapter structure 42, and the main box 1 also includes a wiring sealing cover 13, which covers the installation port on the first base plate to seal the inside of the first cavity 110.

[0089] The power connector 41 is located on one side of the first cavity 110 and is connected to the heat sink 21. The main housing 1 also includes a connector cover 14, which covers the power connector 41 to seal the power connector 41.

[0090] Please continue reading Figure 2 As shown, the box portion 11 also includes a second surrounding plate 113 and a second main plate 114. Both the second surrounding plate 113 and the second main plate 114 are connected to the first surrounding plate 111. The second main plate 114 and the first box cover 12 are both connected to the second surrounding plate 113. The second surrounding plate 113 is connected to the corresponding connecting plate segment 214. The second surrounding plate 113, the second main plate 114, and the first box cover 12 together enclose and form the second cavity 120. The second surrounding plate 113 and the first surrounding plate 111 are located on the same side of the heat sink 21, so as to achieve the second cavity 120 and the first cavity 110 being spaced apart and arranged side by side.

[0091] In addition, in order to simplify the operation steps and improve the assembly efficiency of the electrical control box 10, the second enclosure 113 and the first enclosure 111 can be an integral structure, so that the first cavity 110 and the second cavity 120 can be directly distributed side by side.

[0092] It should be noted that although the second enclosure 113 is located on the same side of the heat sink 21 as the first enclosure 111, the second power module is not in direct contact with the heat sink 21. In this embodiment, the second power module is disposed inside the second cavity 120 and spaced apart from the heat sink 21.

[0093] To simplify the operation steps and improve the assembly efficiency of the electrical control box 10, the second enclosure 113 and the second main board 114 can be an integrated structure. In this way, when assembling the drive board 31, the side enclosure can be connected to the heat sink 21 to form the second cavity 120.

[0094] Furthermore, since the second enclosure 113 and the first enclosure 111 are located on the same side of the heat sink 21, the sides of the second enclosure 113 and the first enclosure 111 that are close to each other can be shared. This saves material in the main box 1 and further saves space in the main box 1, thus improving the structural compactness of the electrical control box 10.

[0095] Based on this, the second enclosure 113 and the first cover 12 can be connected, for example, by fasteners. Specifically, multiple connection holes can be provided around the groove edge of the side enclosure of the second enclosure 113, and connection holes are also provided on the first cover 12 at the corresponding positions of each connection hole, so as to achieve installation by connecting bolts.

[0096] The main housing 1 and the heat dissipation structure 2 also enclose a third cavity, which is located opposite to the first cavity 110, and the third power module is located in the third cavity.

[0097] In some specific embodiments, the housing 11 further includes a third surrounding plate 115 and a third main plate 116. The third surrounding plate 115 and the first surrounding plate 111 are respectively located on both sides of the heat sink 21. Specifically, the third surrounding plate 115 is connected to the heat sink 21, so that the heat sink 21, the third main plate 116, and the third surrounding plate 115 together enclose a third cavity. In this way, the first cavity 110 and the third cavity can be arranged opposite to each other along the thickness direction of the heat sink 21. Thus, the first power module 3 and the third power module are respectively located on both sides of the heat sink 21 along the thickness direction, so that both can realize heat exchange with the heat sink 21.

[0098] Please continue reading Figure 1-3 As shown, the main box 1 also includes a mounting plate 15, and the electrical control box 10 is specifically installed and fixed to the outdoor unit's housing via the mounting plate 15.

[0099] Since electrical connections are required between the driver board 31 and the filter board, and between the driver board 31 and the reactor, the control box 10 also includes a first conductive element, through which the driver board 31 and the filter board are connected. Correspondingly, the control box 10 also includes a second conductive element, through which the driver board 31 and the reactor are connected.

[0100] In some specific embodiments, the heat sink 21 is provided with a clearance groove 210, which is used to avoid the positions of the first conductive component and the second conductive component, so as to ensure the electrical connection between the drive board 31 and the filter board, and between the drive board 31 and the reactor. There is no need to provide other space for the conductive components in the main box 1, which saves the internal space of the main box 1 and improves the structural compactness of the electrical control box 10.

[0101] Please continue reading Figure 7 As shown, in some specific embodiments, the control box 10 includes two drive boards 31. Further, one drive board 31 is configured to be oriented in opposite directions to the other drive board 31. In this way, the positions on the two drive boards 31 that are connected to the module board can be close to each other. This also allows the positions on the two drive boards 31 that are connected to the filter board to be close together. The surface area required on the filter substrate for the connection between the drive board 31 and the filter board can be further reduced, thereby saving internal space of the control box 10 and reducing product cost.

[0102] Please continue reading Figure 1-2 As shown, in some specific embodiments, the power connector 41 is located on one side of the first cavity 110 and is disposed opposite to the third cavity. For example, the second cavity 120 and the power connector 41 may be located on both sides of the first cavity 110 along the height direction.

[0103] The power terminal block 41 includes an insulating base and conductive posts. The conductive posts are disposed on one side of the insulating base, and the insulating base is connected to the filter board through the conductive posts. Furthermore, the power terminal block 41 also includes a terminal block cover 14, which covers the other side of the insulating base opposite to the conductive posts.

[0104] Please continue reading Figure 9-13 As shown, where, Figure 9 This is a schematic diagram of the overall structure of the heat sink 21. Figure 10 , Figure 12 and Figure 13 This is a structural schematic diagram of the first plate 211. Figure 11This is a schematic diagram of the second plate 212. Since some power modules generate heat during operation, resulting in a high-temperature environment, the heat dissipation structure 2 is needed to dissipate heat from the electronic components. Therefore, in some specific embodiments, the power modules need to be thermally connected to the heat dissipation structure 2. Furthermore, the heat sink 21 includes a heat-conducting plate segment 213 and a connecting plate segment 214. At least a portion of the heat dissipation channel 2130 is formed on the heat-conducting plate segment 213, and the heat dissipation channel 2130 is used for the flow of the heat exchange medium.

[0105] Specifically, the first power module 3 is thermally connected to the heat sink 21. For example, the first and second drive modules of the drive board 31 are thermally connected to the heat-conducting plate segment 213 of the heat sink 21. In this way, when the electronic components on the first power module 3 generate heat, the heat can be transferred to the heat sink 21 in sequence through the drive substrate 311 and the heat-conducting component. The heat sink 21 can exchange heat with the heat exchange medium flowing inside the heat dissipation channel 2130, so that the heat exchange medium carries away the heat on the heat sink 21. The heat exchange medium then achieves heat dissipation and cooling of the first power module 3.

[0106] One way to extend the heat dissipation channel 2130 is to include multiple straight segments and multiple curved segments, and the multiple straight segments and multiple curved segments are connected in an alternating manner. In this way, adjacent straight segments can be connected through curved segments, and a complete heat dissipation channel 2130 with a serpentine orientation can be formed on the heat sink 21. This allows as much heat exchange medium as possible to flow into the heat sink 21 and maximizes the heat exchange area between the heat exchange medium and the heat sink 21, thereby improving the heat dissipation effect of the heat sink 21.

[0107] Please continue reading Figure 12 As shown, each straight segment extends along the first extending direction A of the heat sink 21, and multiple straight segments can be arranged at intervals along the second extending direction B of the heat sink 21. Specifically, the first extending direction A and the second extending direction B are perpendicular to each other.

[0108] Please see Figure 12 As shown, the first extension direction A is, for example, the width direction of the heat sink 21, and the second extension direction B is, for example, the height direction of the heat sink 21. That is to say, each straight segment of the heat dissipation channel 2130 extends along the width direction of the heat sink 21, and all straight segments are arranged at intervals along the height direction of the heat sink 21. In this way, more straight segments can be provided on the heat sink 21, and the length of the heat dissipation channel 2130 is correspondingly longer, thereby further improving the heat dissipation effect of the heat exchange medium on the heat sink 21.

[0109] In other feasible embodiments, the first extension direction A and the second extension direction B can also be other directions along the plane where the heat sink 21 is located, such as the first extension direction A being the width direction and the second extension direction B being the height direction, as long as the heat sink 21 achieves normal heat dissipation through the heat exchange medium.

[0110] Based on the above, the specific implementation method for forming heat dissipation channels 2130 on the heat sink 21 can be implemented according to the following specific implementation method.

[0111] In the first implementation, the heat sink 21 has a medium channel 2131 inside for connecting to the piping of the outdoor unit system. The medium channel 2131 forms all the heat dissipation channels 2130 of the heat sink 21. That is, the medium channel 2131 directly forms a complete heat dissipation channel 2130 in a serpentine shape inside the heat sink 21, which allows the heat exchange medium to flow inside the heat sink 21 and directly exchange heat with the heat sink 21.

[0112] Please continue reading Figure 10 and Figure 11 As shown. In one specific embodiment, the heat sink 21 includes a first plate 211 and a second plate 212 stacked together, and a first flow channel groove 2111 is formed on the side of the first plate 211 facing the second plate 212, and the second plate 212 and the first flow channel groove 2111 together form a medium channel 2131.

[0113] The first flow channel 2111 has an inlet end 2112 and an outlet end 2113. The second plate 212 has an inlet hole 2121 at the position corresponding to the inlet end 2112, which communicates with the inlet end 2112. The second plate 212 has an outlet hole 2122 at the position corresponding to the outlet end 2113, which communicates with the outlet end 2113.

[0114] Furthermore, the heat dissipation structure 2 also includes an inlet pipe 22 and an outlet pipe 23, wherein the inlet pipe 22 is connected to the inlet hole 2121 and the outlet pipe 23 is connected to the outlet hole 2122.

[0115] The two ends of the liquid inlet pipe 22 are connected to the heat exchange medium storage unit and the liquid inlet hole 2121, respectively. The heat exchange medium storage unit contains the heat exchange medium. The heat exchange medium storage unit is, for example, a compressor or a heat exchange medium storage container connected to the compressor. The heat exchange medium is, for example, refrigerant. That is to say, the heat dissipation structure 2 of this embodiment can directly use the refrigerant of the outdoor unit system as the heat exchange medium to exchange heat with the heat sink 21.

[0116] Based on this, the liquid inlet pipe 22 can be connected to the compressor or the heat exchange medium storage container so that the heat exchange medium flows into the heat dissipation channel 2130.

[0117] Please continue reading Figure 6 and Figure 9 As shown. Furthermore, the heat dissipation structure 2 also includes a pipe connector 24, which is disposed on the second plate 212, with one connector at each position corresponding to the liquid inlet hole 2121 and the liquid outlet hole 2122. The function of the pipe connector 24 is to connect the liquid inlet pipe 22 to the liquid inlet hole 2121 and the liquid outlet pipe 23 to the liquid outlet hole 2122, thereby ensuring reliable connection between the liquid inlet pipe 22, the liquid outlet pipe 23 and the second plate 212.

[0118] In the second implementation scheme, compared with the method where the heat dissipation channel 2130 is entirely formed inside the heat sink 21, the medium channel 2131 inside the heat sink 21 can form only the straight section of the heat dissipation channel 2130. On this basis, the heat exchange structure also includes an external pipe 25. The two ends of the external pipe 25 are respectively connected to two adjacent channel sections 2132. One end of the external pipe 25 is connected to the medium outlet of one channel section 2132, and the other end of the external pipe 25 is connected to the medium inlet of another channel section 2132. That is to say, the external pipe 25 forms the arc section of the heat dissipation channel 2130.

[0119] This configuration, compared to directly forming straight and curved segments within the heat sink 21, reduces the processing difficulty of the heat sink 21, lowers the manufacturing cost, and improves processing efficiency. In one specific embodiment, the medium channel 2131 may include multiple channel segments 2132, with each channel segment 2132 forming a straight segment of the heat dissipation channel 2130.

[0120] Specifically, the medium inlet of the upstream channel segment 2132 can be made into the liquid inlet 2112 of the heat dissipation channel 2130, and the liquid inlet pipe 22 is connected to the medium inlet of the upstream channel segment 2132. Correspondingly, the medium outlet of the downstream channel segment 2132 can be made into the liquid outlet 2113 of the heat dissipation channel 2130, and the liquid outlet pipe 23 is connected to the medium outlet of the downstream channel segment 2132, so that the heat exchange medium in the heat dissipation channel 2130 can flow out.

[0121] See Figure 13 As shown, in the third implementation scheme, the heat dissipation structure 2 may also include a cooling pipe 26, which forms the entire heat dissipation channel 2130.

[0122] In other words, when the heat dissipation channel 2130 of the heat dissipation structure 2 is formed through the cooling pipe 26, the cooling pipe 26 is filled with heat exchange medium, and the heat dissipation channel 2130 is formed inside it. The heat sink 21 is a structure used to assemble the cooling pipe 26 and enable the corresponding power module to exchange heat with the heat exchange medium in the cooling pipe 26 through the heat sink 21. With this configuration, there is no need to form a medium channel 2131 on the heat sink 21, which reduces the process requirements of the heat sink 21 and lowers the manufacturing difficulty of the heat dissipation structure 2.

[0123] In practice, the cooling pipe 26 can be mounted on the heat sink 21. For example, the cooling pipe 26 and the heat sink 21 can be welded together to ensure a reliable connection. In addition, in order to make good contact between the cooling pipe 26 and the heat sink 21 and to ensure the heat transfer effect between the cooling pipe 26 and the heat sink 21, at least a portion of the cooling pipe 26 can be sandwiched between the first plate 211 and the second plate 212.

[0124] See Figure 10-12 As shown, the heat sink 21 in this embodiment includes two connecting plate segments 214, which are respectively disposed on both sides of the heat-conducting plate segment 213 along the second extending direction B. One connecting plate segment 214 is disposed between the first power module 3 and the second power module, and can be connected to the second enclosure plate 113. The other connecting plate segment 214 can be used to set the power receiving area 2141 for connection to the power terminal block 41.

[0125] In practice, the heat-conducting plate segment 213 and the connecting plate segment 214 are an integral structure. The part of the heat sink 21 with the heat dissipation channel 2130 corresponds to the heat-conducting plate segment 213, while the part of the heat sink 21 that contacts or is connected to other components is the connecting plate segment 214.

[0126] It should be noted that there is no clear division between the positions of the connecting plate segment 2144 and the heat-conducting plate segment 213. It can be understood that the connecting plate segment 214 and the heat-conducting plate segment 213 are two parts of the heat sink 21. The positions that can be connected to the electronic components that need to be cooled can belong to the heat-conducting plate segment 213, while the positions that can be connected to the areas that need to be waterproofed can belong to the connecting plate segment 214.

[0127] Furthermore, a heat insulation part 215 is provided on the connecting plate segment 214 of the heat sink 21, which is used to block heat exchange between the heat conducting plate segment 213 and the connecting plate segment 214. When there are two connecting plate segments 214, each connecting plate segment 214 is provided with at least one heat insulation part 215.

[0128] Since the connecting plate segment 214 of the heat sink 21 has an electrical contact area 2141, meaning that the corresponding electrical contact position of the heat sink 21 is the connecting plate segment 214, and by providing a heat insulation part 215 on the connecting plate segment 214 of the heat sink 21, the heat insulation part 215 blocks the heat exchange between the heat conduction plate segment 213 and the connecting plate segment 214. In this way, the low temperature on the heat conduction plate segment 213 cannot be transferred to the position of the connecting plate segment 214, so the temperature on the connecting plate segment 214 will not be too low and condensation will not occur. Therefore, the heat sink 21 will not have the problem of condensation in the corresponding electrical contact area 2141, thus preventing short circuits at the electrical contact points and ensuring the normal use of the electrical control box 10.

[0129] Furthermore, the heat insulation part 215 is provided on the side of the connecting plate section 214 near the heat-conducting plate section 213 to achieve a better heat insulation effect.

[0130] Please see Figure 10-12 As shown, in some specific embodiments, the heat insulation part 215 is a blocking groove 2150. The blocking groove 2150 can directly disconnect the partial connection between the two plate segments at the installation location, thus achieving a better heat insulation effect. Furthermore, the groove structure facilitates installation on the heat sink 21, avoiding increasing the manufacturing difficulty of the heat sink 21 and ensuring product production efficiency.

[0131] Please continue reading Figure 10-12 As shown, the blocking groove 2150 extends along the first extending direction A to provide heat insulation at various positions along the width direction of the heat sink 21. Furthermore, since the connecting plate segment 214 is located on the side of the heat-conducting plate segment 213 along the second extending direction B, the extension of the blocking groove 2150 along the first direction further reduces the connection length between the heat-conducting plate segment 213 and the connecting plate segment 214, thereby improving the heat insulation effect.

[0132] Please see Figure 10 and Figure 11 As shown, in some specific embodiments, the blocking groove 2150 extends through the thickness direction of the connecting plate segment 214, which allows the connection plate segment 214 to be more completely disconnected from the heat-conducting plate segment 213, thus improving the heat insulation effect at the blocking groove 2150.

[0133] In some embodiments, there are multiple blocking grooves 2150, and the multiple blocking grooves 2150 are arranged at intervals along the second extending direction B. In this way, multiple blocking grooves 2150 can be provided between the heat-conducting plate segment 213 and the connecting plate segment 214 to achieve a better blocking effect.

[0134] It should be noted that although more blocking slots 2150 result in better heat insulation, too many slots can affect the structural strength of the heat sink 21. Therefore, the number of blocking slots 2150 can be adjusted according to actual needs. For example, since the second power module does not directly contact the heat sink 21, only one blocking slot 2150 can be provided on the connecting plate segment 214 connected to the second power module, i.e., to the second enclosure plate 113. Correspondingly, since the other connecting plate segment 214 has a power contact area 2141, the heat insulation requirement for the other connecting plate segment 214 is stronger. Therefore, two blocking slots 2150 can be provided between the other connecting plate segment 214 and the heat-conducting plate segment 213 to achieve better heat insulation.

[0135] See Figure 10 and Figure 11 As shown, in some specific embodiments, the multiple blocking grooves 2150 can also be arranged at intervals along the first extending direction A. In this way, on the one hand, blocking grooves 2150 can be provided for multiple electrical contacts or electronic components, and on the other hand, the structural strength at the blocking grooves 2150 can be strengthened. In specific implementation, the lengths of the multiple blocking grooves 2150 located in the first extending direction A can be unequal.

[0136] It should be noted that when a heat insulation part 215, or a blocking groove 2150, is provided on the connecting plate segment 214 with the power receiving area 2141, the heat insulation part 215 is specifically provided on the side of the power receiving area 2141 near the heat conducting plate segment 213.

[0137] In one specific embodiment, the length of the heat insulation portion 215 along the first extending direction A is greater than or equal to the length of the electrical contact area 2141, so that heat insulation can be guaranteed at each position along the width direction of the electrical contact area 2141.

[0138] Please continue reading Figure 10-12 As shown, in some specific embodiments, one of the heat insulation portions 215 can be formed as a cross-zone heat insulation portion 215. The cross-zone heat insulation portion 215 can be arranged along the first extending direction A from one side of the electrical contact area 2141 to the other side of the electrical contact area 2141. In this way, the cross-zone heat insulation portion can isolate the electrical contact area 2141 to a certain extent, so as to further ensure that the cold energy on the heat-conducting plate segment 213 will not be transferred to the position of the electrical contact area 2141 of the connecting plate segment 214.

[0139] Specifically, the cross-zone heat insulation section is also a blocking groove 2150. The blocking groove 2150 forming the cross-zone heat insulation section may include a first groove segment 2151, a second groove segment 2152 and a third groove segment 2153 connected in sequence. The first groove segment 2151 and the third groove segment 2153 are respectively disposed on both sides of the power receiving area 2141 along the first extension direction A. The second groove segment 2152 is located on the side of the power receiving area 2141 near the heat conducting plate segment 213. The first groove segment 2151 and the third groove segment 2153 are both extended along the second extension direction B of the heat dissipation plate 21, and the second groove segment 2152 is extended along the first extension direction A.

[0140] As can be seen, the blocking groove 2150, through the above-mentioned arrangement, can form a "U"-shaped enclosure on the side of the power-connecting area 2141 facing the heat-conducting plate section 213. In this way, no matter where the cold energy comes from in the three groove sections, it cannot be transferred to the location of the power-connecting area 2141, thereby protecting the power-connecting area 2141 from condensation as much as possible.

[0141] In a specific implementation, the length of the second slot segment 2152 can be greater than the length of the power receiving area 2141 along the first extension direction A, and the lengths of the first slot segment 2151 and the third slot segment 2153 can also be greater than or equal to the length of the power receiving area 2141 along the second extension direction B.

[0142] To facilitate the configuration of the heat dissipation channel 2130, in one specific embodiment, the heat dissipation plate 21 includes a first plate 211 and a second plate 212 stacked together, and the heat dissipation structure 2 also includes a cooling pipe 26, which forms the entire heat dissipation channel 2130. Specifically, the cooling pipe 26 is sandwiched between the first plate 211 and the second plate 212.

[0143] Based on this, when setting the blocking groove 2150, heat-conducting plate segments 213 and connecting plate segments 214 can be formed on both the first plate 211 and the second plate 212. Correspondingly, heat-insulating parts 215, i.e., the blocking groove 2150 structure, can be provided on both the first plate 211 and the second plate 212. Specifically, the blocking groove 2150 can be made to extend through the first plate 211 and the second plate 212.

[0144] In some specific embodiments, the blocking groove 2150 may be provided only on the first plate 211, and the blocking groove 2150 may be made to extend through the thickness direction of the first plate 211.

[0145] Regarding the aforementioned electrical control box 10, this embodiment also provides a heating, ventilation, and air conditioning (HVAC) device, which includes a housing and the aforementioned electrical control box 10, with the electrical control box 10 installed inside the housing. The structure of the electrical control box 10 has been described in detail in the above embodiments and will not be repeated here.

[0146] Furthermore, the housing is provided with an access port. In some embodiments, to facilitate later maintenance of the electrical control box 10 provided in this embodiment, the electrical control box 10 can be positioned close to the access port on the housing. For example, when the electrical control box 10 is installed inside the housing, the side where the access port is located is the front of the housing. In one specific implementation, the first main board 112 of the electrical control box 10 can be positioned facing the access port.

[0147] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation structure, characterized in that, It includes a heat sink, which comprises a heat-conducting plate segment and a connecting plate segment connected together, the heat-conducting plate segment being used for heat exchange with a heat exchange medium; The connecting plate segment is provided with a heat insulation part, which is used to block heat exchange between the heat-conducting plate segment and the connecting plate segment.

2. The heat dissipation structure according to claim 1, characterized in that, The heat insulation part is disposed on the side of the connecting plate section near the heat-conducting plate section.

3. The heat dissipation structure according to claim 1, characterized in that, The heat insulation part is a blocking groove, and at least part of the blocking groove extends through the thickness direction of the connecting plate segment.

4. The heat dissipation structure according to claim 3, characterized in that, The heat sink has a first extending direction and a second extending direction that are perpendicular to each other, and the heat-conducting plate segment and the connecting plate segment are arranged along the second extending direction; At least a portion of the blocking groove extends along the first extending direction.

5. The heat dissipation structure according to claim 4, characterized in that, The number of blocking grooves is multiple, and the multiple blocking grooves are arranged at intervals along the first extending direction.

6. The heat dissipation structure according to claim 5, characterized in that, The extension lengths of the multiple blocking grooves are not equal.

7. The heat dissipation structure according to claim 4, characterized in that, The number of blocking grooves is multiple, and the multiple blocking grooves are arranged at intervals along the second extending direction.

8. The heat dissipation structure according to any one of claims 1-7, characterized in that, The number of connecting plate segments is two, and the two connecting plate segments are respectively disposed on both sides of the heat-conducting plate segment along the second extension direction; Each of the connecting plate segments is provided with at least one of the heat insulation parts.

9. The heat dissipation structure according to any one of claims 1-7, characterized in that, The heat sink has a first extending direction and a second extending direction that are perpendicular to each other. The connecting plate segment is provided with an electrical contact area, and at least a portion of the heat insulation part is located on the side of the electrical contact area closer to the heat-conducting plate segment. The connecting plate segment and the heat-conducting plate segment are arranged along the second extending direction.

10. The heat dissipation structure according to claim 9, characterized in that, In the first extending direction, the size of the heat insulation portion is greater than or equal to the size of the electrical contact area.

11. The heat dissipation structure according to claim 9, characterized in that, The heat insulation part is provided in multiple parts, and one of the multiple heat insulation parts is a cross-zone heat insulation part; In the first extending direction, the cross-zone heat insulation portion is arranged around one side of the electrical contact area to the other side of the electrical contact area.

12. The heat dissipation structure according to claim 11, characterized in that, The cross-zone heat insulation part is a blocking groove, which includes a first groove segment, a second groove segment, and a third groove segment connected in sequence; The first groove segment and the third groove segment are respectively located on both sides of the first extension direction, and the second groove segment is located on the side of the electrical contact area closer to the heat-conducting plate segment; Wherein, the first groove segment and the third groove segment both extend along the second extension direction, and the second groove segment extends along the first extension direction.

13. The heat dissipation structure according to claim 12, characterized in that, Along the first extending direction, the size of the second slot segment is greater than or equal to the size of the electrical contact area; Along the second extending direction, the length of the first slot segment and the size of the third slot segment are both greater than or equal to the size of the electrical contact area.

14. The heat dissipation structure according to any one of claims 1-7, characterized in that, The heat sink includes a first plate and a second plate stacked together, and the heat-conducting plate segment and the connecting plate segment are formed on both the first plate and the second plate.

15. The heat dissipation structure according to claim 14, characterized in that, The heat insulation part is a blocking groove; The blocking groove is disposed on the first plate and extends through the thickness of the first plate; or, The first plate and the second plate are each provided with the blocking groove, and the blocking groove extends through the first plate and the second plate along the thickness direction of the heat sink.

16. The heat dissipation structure according to any one of claims 1-7, characterized in that, The heat-conducting plate segment is provided with heat dissipation channels, which are used for the flow of heat exchange medium.

17. The heat dissipation structure according to claim 16, characterized in that, The heat sink has a medium channel inside for connecting to external piping, and the medium channel forms the heat dissipation channel.

18. The heat dissipation structure according to claim 17, characterized in that, The heat sink includes a first plate and a second plate stacked together. The first plate has a first flow channel groove on the side facing the second plate, and the second plate and the first flow channel groove together form the medium channel; or... A first flow channel groove is formed on the side of the first plate facing the second plate, and a second flow channel groove is formed on the side of the second plate facing the first plate. The second flow channel groove is opposite to the first flow channel groove, and the first flow channel groove and the second flow channel groove together form the medium channel.

19. The heat dissipation structure according to claim 16, characterized in that, The heat dissipation structure also includes a cooling pipe, which is disposed on the heat dissipation plate; The cooling pipe forms the heat dissipation channel.

20. The heat dissipation structure according to any one of claims 1-7, characterized in that, The heat-conducting plate segment and the connecting plate segment are an integral structure.

21. An electrical control box, characterized in that, It includes a main housing, a first power module, a second power module, a power connector, and a heat dissipation structure as described in any one of claims 1-20; The heat dissipation structure is connected to the main box and forms a first cavity with the main box. The first power module is disposed in the first cavity and is thermally connected to the heat-conducting plate segment. A second cavity is also formed on the main housing, and the second power module is disposed in the second cavity; There are two connecting plate segments, which are respectively disposed on both sides of the heat-conducting plate segment. One connecting plate segment is located between the first power module and the second power module, and the other connecting plate segment is provided with a power receiving area, and the power terminal block is disposed in the power receiving area.

22. The electrical control box according to claim 21, characterized in that, The main box body includes a box section and a first box cover. The box section and the heat sink form the first cavity, and the box section and the first box cover form the second cavity.

23. The electrical control box according to claim 22, characterized in that, The electrical control box has a height direction and a thickness direction, and the box part includes a first main board, a first surrounding plate, a second main board and a second surrounding plate; The first motherboard and the heat sink are both connected to the first enclosure plate, the second motherboard and the second enclosure plate are both connected to the first enclosure plate, the second motherboard and the first cover are both connected to the second enclosure plate, and the second enclosure plate is connected to the corresponding connecting plate segment; The first motherboard and the second motherboard are arranged at intervals in both the height direction and the thickness direction. The first motherboard, the first surrounding plate, and the heat sink together form the first cavity. A portion of the first surrounding plate, the second surrounding plate, the second motherboard, and the first cover together form the second cavity.

24. The electrical control box according to claim 23, characterized in that, The first enclosure, the first main board, the second enclosure, and the second main board are an integral structure.

25. The electrical control box according to claim 24, characterized in that, The first power module includes a driver board, and the second power module is a main control module; The drive board includes a first drive module and a second drive module. The first drive module is used to drive the compressor, and the second drive module is used to drive the fan. Both the first drive module and the second drive module are attached to the heat-conducting plate segment.

26. The electrical control box according to claim 23, characterized in that, The heat dissipation structure and the main box body also enclose a third cavity, which is disposed opposite to the first cavity; The electrical control box also includes a third power module, which is disposed within the third cavity.

27. The electrical control box according to claim 26, characterized in that, The box also includes a third main board and a third surrounding plate connected to each other, the third surrounding plate and the first surrounding plate being respectively connected to opposite sides of the heat sink; The third enclosure, the third main board, and the heat sink together form the third cavity.

28. The electrical control box according to claim 27, characterized in that, The third power module includes a filter board, and the second end of the power terminal extends into the third cavity and is connected to the filter board.

29. The electrical control box according to claim 28, characterized in that, The power terminal block includes an insulating base and a conductive post. The insulating base is connected to the power receiving area, and the conductive post passes through the insulating base. The power receiving area is provided with a through hole, which is connected to the third cavity. The conductive post passes through the through hole, so that both ends of the conductive post are electrically connected to the filter plate and the external power line, respectively.

30. The electrical control box according to claim 29, characterized in that, It also includes a protective cover, which is connected to the heat sink and forms a protective cavity with the heat sink; Part of the power connector is located inside the protective cavity.

31. A heating, ventilation, and air conditioning (HVAC) device, characterized in that, It includes a housing and an electrical control box as described in any one of claims 21-30, wherein the electrical control box is installed within the housing; The housing has an access port, and the first mainboard of the electrical control box is positioned facing the access port.

Images