Insulation testing device for semiconductor packaging piece

Abstract

The utility model provides a semiconductor packaging piece insulation testing device which comprises a detection seat and an installation frame, the detection seat is provided with a plurality of detection grooves used for placing packaging pieces to be tested, and an ejection assembly is arranged in the installation frame and can automatically eject the tested packaging pieces out of the detection grooves. The detection assembly drives the left-handed rotation assembly and the right-handed rotation assembly through a bidirectional screw rod, a guide rod and a detection motor so as to realize synchronous insulation detection. The positive and negative pole assemblies respectively comprise an insulating frame, a contact and a buffer spring, thereby ensuring stable contact and not damaging a packaging piece. And the ejection assembly adopts a bidirectional screw design, and is provided with an elastic abutting head and an ejection spring, so that buffer protection is provided, and the packaging piece is prevented from being damaged. According to the device, efficient and accurate insulation performance testing is achieved, meanwhile, the working efficiency is improved, and the overall design effectively improves the detection precision and the safety of a packaging piece.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor package testing equipment, and in particular to a semiconductor package insulation testing equipment. Background Technology

[0002] In today's booming semiconductor industry, semiconductor packages serve as a crucial bridge connecting chips to external circuits, and their quality directly impacts the performance and reliability of electronic products. As electronic products continue to advance towards miniaturization and high performance, the quality requirements for semiconductor packages are becoming increasingly stringent, especially regarding insulation performance. Even slight defects can lead to serious problems such as short circuits and leakage, causing electronic products to malfunction or even fail.

[0003] Traditional insulation testing methods for semiconductor packages largely rely on manual operation, using simple multimeters or single-electrode testing tools to inspect each package individually. This approach reveals numerous drawbacks when facing ever-increasing production scales. Firstly, manual inspection is extremely inefficient, consuming significant manpower and time, making it difficult to meet the rapid pace demands of large-scale industrial production. Secondly, manual operation is highly subjective; human factors such as poor contact and uneven pressure during the inspection process can easily lead to inaccurate results, causing good products to be confused with defective ones. This allows potentially defective semiconductor packages to enter subsequent processes, posing a significant risk to product quality. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a semiconductor package insulation testing device to solve the problems of low detection efficiency and inaccurate detection results in the prior art.

[0005] To achieve the above and other related objectives, this utility model provides the following technical solution:

[0006] An insulation testing device for semiconductor packages includes a test base and a mounting frame for supporting the test base. The test base has a plurality of test slots for placing semiconductor packages. The mounting frame has an ejection assembly for ejecting the semiconductor packages from the test slots. The test base has a test assembly for simultaneously performing insulation testing on a plurality of semiconductor packages.

[0007] To achieve the above technical solution, during operation, the semiconductor package to be tested for insulation is first placed in the test slot of the test holder. The test slot provides a stable placement position for the semiconductor package, facilitating subsequent testing operations. The ejection component is located in the mounting frame. After the semiconductor package completes the insulation test, the ejection component activates, using upward thrust to eject the semiconductor package from the test slot, making it easy for personnel to remove the tested semiconductor package. The testing component is set on the test holder. After the semiconductor package is placed in the test slot, the testing component starts working to determine whether the semiconductor package has good insulation, thereby achieving simultaneous insulation testing of several semiconductor packages. The test holder has multiple test slots, and the testing component can perform insulation testing on several semiconductor packages simultaneously, greatly shortening the testing time and enabling more semiconductor packages to be tested per unit time, thus improving overall testing efficiency. The ejection component in the mounting frame can automatically eject the semiconductor package from the test slot after the test is completed. This design avoids the difficult manual removal of the semiconductor package from the test slot.

[0008] In one embodiment of the present invention, the detection assembly includes a bidirectional lead screw, a guide rod arranged parallel to the bidirectional lead screw, a detection motor disposed at one end of the bidirectional lead screw, and a left-handed assembly and a right-handed assembly sleeved on the bidirectional lead screw and the guide rod.

[0009] To achieve the above technical solution, the left-hand and right-hand components are connected to electrodes of different polarities. These two components are respectively mounted on the bidirectional lead screw and the guide rod, and can move along the bidirectional lead screw under the drive of the detection motor to contact and apply appropriate pressure to the semiconductor package placed in the detection slot to complete the insulation performance detection process.

[0010] In one embodiment of the present invention, the left-handed component includes a left-handed plate and a plurality of positive electrode components disposed on the left-handed plate; the right-handed component includes a right-handed plate and a plurality of negative electrode components disposed on the right-handed plate and disposed opposite to the positive electrode components.

[0011] To achieve the above technical solution, during the rotation of the bidirectional lead screw driven by the detection motor, the left and right rotating plates move towards each other along the bidirectional lead screw and guide rod until the positive and negative electrode components respectively contact the predetermined parts of the semiconductor package. In this way, voltage can be applied to multiple semiconductor packages simultaneously and their insulation resistance and other parameters can be measured, achieving synchronous detection.

[0012] In one embodiment of the present invention, both the positive electrode assembly and the negative electrode assembly include an insulating frame, a contact extending from the insulating frame, and a retaining plate located in the insulating frame and connected to the contact; a positioning protrusion is provided on the side of the retaining plate away from the contact, a buffer spring is sleeved on the outer side of the positioning protrusion, and the side of the buffer spring away from the retaining plate is connected to the insulating plate.

[0013] To achieve the above technical solution, each positive and negative electrode assembly includes an insulating frame from which contacts extend. These contacts directly contact the semiconductor package for electrical connection. A retaining plate and locating protrusions are located inside the insulating frame, and the contacts are fixed and connected via the retaining plate. A locating protrusion is located on the side of the retaining plate away from the contacts; this protrusion provides a mounting position for the buffer spring and helps maintain the stability of the entire assembly structure. The side of the buffer spring away from the retaining plate is connected to an insulating plate. The insulating plate not only provides physical support but also enhances the electrical insulation performance of the entire assembly.

[0014] In one embodiment of the present invention, a through-hole is provided at the bottom of the detection groove.

[0015] To achieve the above technical solution, a through ejection hole is provided at the bottom of each test slot. When a semiconductor package that has completed testing or needs to be replaced needs to be removed from the test slot, the ejection assembly applies an upward thrust to the package through these ejection holes.

[0016] In one embodiment of the present invention, the ejection assembly includes a bidirectional screw, a left-hand nut and a right-hand nut threadedly connected to the bidirectional screw, an ejection motor disposed at one end of the bidirectional screw, and an ejection plate for mounting a plurality of ejection rods; the lower end of the ejection plate is provided with a hinge plate, and a hinge rod is hinged to both the left-hand nut and the right-hand nut, and the other end of the hinge rod is hinged to the hinge plate.

[0017] To achieve the above technical solution, a hinged plate is provided at the lower end of the ejector plate, and hinged rods are hinged to both the left-hand and right-hand nuts, with the other ends of these hinged rods hinged to the hinged plate. As the bidirectional screw rotates, the left-hand and right-hand nuts move in opposite directions, transmitting force to the hinged plate through the hinged rods, thus driving the ejector plate to move up and down. The design of the bidirectional screw and the left-hand and right-hand nuts ensures that the vertical movement of the ejector plate can be precisely controlled, thereby achieving precise ejection of the semiconductor package.

[0018] In one embodiment of the present invention, the ejector rod includes an ejector pin disposed on the ejector plate and an elastic abutment disposed above the ejector pin. The elastic abutment has a buffer groove, and the ejector pin has an ejector pin located in the buffer groove. An ejector spring sleeved on the ejector pin is connected between the elastic abutment and the ejector pin.

[0019] To achieve the above technical solution, the design of the elastic abutment and ejection spring significantly reduces the risk of damage to the semiconductor package during ejection. The buffer mechanism absorbs impact force, ensuring that even sensitive or fragile packages can be safely ejected.

[0020] As described above, the semiconductor package insulation testing device of this utility model has the following beneficial effects: the test base is equipped with multiple test slots, and combined with the test components, it can simultaneously perform insulation testing on several semiconductor packages, greatly shortening the test cycle and significantly increasing the test volume per unit time, perfectly meeting the fast-paced needs of large-scale production, effectively reducing production costs, and enhancing the competitiveness of enterprises in the market; by utilizing bidirectional screws, guide rods, and precisely controlled positive and negative electrode components, it is ensured that each package under test can be accurately subjected to voltage and its insulation resistance and other parameters can be measured, improving the accuracy and repeatability of the test results; the ejection component includes a bidirectional screw, a left-hand nut, a right-hand nut, and an ejection rod with a buffer structure, ensuring that the applied thrust is smooth and gentle when ejecting the semiconductor package, reducing the defect rate caused by the ejection operation; the insulating frame, buffer spring, and other structures in the positive and negative electrode components not only ensure electrical insulation safety and prevent leakage, short circuits, and other problems during the test process, but also play a buffering role when contacting the package, avoiding physical damage such as scratches and indentations caused by rigid contact. Attached Figure Description

[0021] Figure 1 The image shown is a side view of this utility model.

[0022] Figure 2 The image shown is a top view of this utility model.

[0023] Figure 3 The diagram shown is a structural schematic of the detection seat.

[0024] Figure 4 Displayed as a top view of the positive or negative electrode assembly.

[0025] Figure 5 Displayed as a side view of the positive or negative electrode assembly.

[0026] Figure 6 The diagram shown is a structural schematic of the ejector rod.

[0027] Component designation explanation

[0028] 1. Detection seat; 2. Mounting bracket; 3. Detection groove; 4. Bidirectional lead screw; 5. Guide rod; 6. Detection motor; 7. Left-hand rotating plate; 8. Right-hand rotating plate; 9. Insulating frame; 10. Contact; 11. Clamping plate; 12. Positioning protrusion; 13. Buffer spring; 14. Insulating plate; 15. Ejection hole; 16. Bidirectional screw; 17. Left-hand nut; 18. Right-hand nut; 19. Ejection motor; 20. Ejection plate; 21. Hinge plate; 22. Hinge rod; 23. Ejection pin; 24. Elastic abutment joint; 25. Buffer groove; 26. Ejection pin; 27. Ejection spring. Detailed Implementation

[0029] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. It should be noted that, unless otherwise specified, the following embodiments and features can be combined with each other.

[0030] Please see Figures 1 to 6 This utility model provides a semiconductor package insulation testing device, including a test base 1 and a mounting frame 2 for supporting the test base 1. The test base 1 has a plurality of test slots 3 for placing semiconductor packages. The mounting frame 2 is provided with an ejection component for ejecting the semiconductor packages from the test slots 3. The test base 1 is provided with a test component for simultaneously testing the insulation of a plurality of semiconductor packages.

[0031] During operation, the semiconductor package to be tested for insulation is first placed in the test slot 3 of the test holder 1. The test slot 3 provides a stable placement position for the semiconductor package, facilitating subsequent testing operations. The ejection component is located in the mounting frame 2. After the semiconductor package completes the insulation test, the ejection component is activated, using upward thrust to eject the semiconductor package from the test slot 3, making it easy for personnel to remove the tested semiconductor package. The testing component is set on the test holder 1. After the semiconductor package is placed in the test slot 3, the testing component starts working to determine whether the semiconductor package has good insulation, thereby achieving simultaneous insulation testing of several semiconductor packages. The test holder 1 has multiple test slots 3, and the testing component can perform insulation testing on several semiconductor packages simultaneously, greatly shortening the testing time and enabling more semiconductor packages to be tested per unit time, thus improving overall testing efficiency. The ejection component in the mounting frame 2 can automatically eject the semiconductor package from the test slot 3 after the test is completed. This design avoids the difficult manual removal of the semiconductor package from the test slot 3.

[0032] The detection assembly includes a bidirectional lead screw 4, a guide rod 5 arranged parallel to the bidirectional lead screw 4, a detection motor 6 disposed at one end of the bidirectional lead screw 4, and a left-handed component and a right-handed component sleeved on the bidirectional lead screw 4 and the guide rod 5, respectively. The left-handed component and the right-handed component are respectively connected to electrodes of different polarities. These two components are respectively sleeved on the bidirectional lead screw 4 and the guide rod 5, and can move along the bidirectional lead screw 4 under the drive of the detection motor 6 to contact and apply appropriate pressure to the semiconductor package placed in the detection slot 3 to complete the insulation performance detection process.

[0033] The left-handed component includes a left-handed plate 7 and a plurality of positive electrode components disposed on the left-handed plate 7; the right-handed component includes a right-handed plate 8 and a plurality of negative electrode components disposed on the right-handed plate 8 and disposed opposite to the positive electrode components.

[0034] During the rotation of the bidirectional lead screw 4 driven by the detection motor 6, the left-hand plate 7 and the right-hand plate 8 move towards each other along the bidirectional lead screw 4 and the guide rod 5 until the positive and negative components respectively contact the predetermined parts of the semiconductor package. In this way, voltage can be applied to multiple semiconductor packages simultaneously and their insulation resistance and other parameters can be measured, achieving synchronous detection.

[0035] Both the positive electrode assembly and the negative electrode assembly include an insulating frame 9, a contact 10 extending from the insulating frame 9, and a retaining plate 11 located in the insulating frame 9 and connected to the contact 10; a positioning protrusion 12 is provided on the side of the retaining plate 11 away from the contact 10, a buffer spring 13 is sleeved on the outside of the positioning protrusion 12, and the side of the buffer spring 13 away from the retaining plate 11 is connected to the insulating plate 14.

[0036] Each positive and negative electrode assembly includes an insulating frame 9 from which a contact 10 extends. The contact 10 is used for direct contact with the semiconductor package for electrical connection. A retaining plate 11 and a positioning protrusion 12 are located inside the insulating frame 9, and the contact 10 is fixed and connected via the retaining plate 11. The retaining plate 11 has a positioning protrusion 12 on the side away from the contact 10. This positioning protrusion 12 provides a mounting position for the buffer spring 13 and helps maintain the stability of the entire assembly structure. The side of the buffer spring 13 away from the retaining plate 11 is connected to an insulating plate 14. The insulating plate 14 not only provides physical support but also enhances the electrical insulation performance of the entire assembly.

[0037] The bottom of the test groove 3 is provided with a through ejection hole 15. When a semiconductor package that has completed testing or needs to be replaced needs to be removed from the test groove 3, the ejection assembly applies an upward thrust to the package through these ejection holes 15.

[0038] The ejection assembly includes a bidirectional screw 16, a left-hand nut 17 and a right-hand nut 18 threadedly connected to the bidirectional screw 16, an ejection motor 19 disposed at one end of the bidirectional screw 16, and an ejection plate 20 for mounting a plurality of ejection rods; the lower end of the ejection plate 20 is provided with a hinge plate 21, and both the left-hand nut 17 and the right-hand nut 18 are hinged with hinge rods 22, the other end of which is hinged to the hinge plate 21.

[0039] The lower end of the ejector plate 20 is provided with a hinge plate 21, and hinge rods 22 are hinged to both the left-hand nut 17 and the right-hand nut 18. The other ends of these hinge rods 22 are hinged to the hinge plate 21. As the bidirectional screw 16 rotates, the left-hand nut 17 and the right-hand nut 18 move in opposite directions, transmitting force to the hinge plate 21 through the hinge rods 22, thus driving the ejector plate 20 to move up and down. The design of the bidirectional screw 16 and the left-hand and right-hand nuts 18 ensures that the vertical movement height of the ejector plate 20 can be precisely controlled, thereby achieving precise ejection of the semiconductor package.

[0040] The ejector rod includes an ejector pin 23 disposed on the ejector plate 20 and an elastic abutment 24 disposed above the ejector pin 23. The elastic abutment 24 has a buffer groove 25. The ejector pin 23 is provided with an ejector pin 26 located in the buffer groove 25. An ejector spring 27 sleeved on the ejector pin 26 is connected between the elastic abutment 24 and the ejector pin 23.

[0041] The design incorporating a resilient abutment 24 and an ejection spring 27 significantly reduces the risk of damage to the semiconductor package during ejection. This cushioning mechanism absorbs impact forces, ensuring that even sensitive or fragile packages can be safely ejected.

[0042] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit this utility model. All equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A semiconductor package insulation testing apparatus, comprising a test base (1) and a mounting bracket (2) for supporting the test base (1), characterized in that: The detection seat (1) has several detection slots (3) for placing semiconductor packages; The mounting bracket (2) is provided with an ejection assembly for ejecting the semiconductor package from the detection slot (3); The detection base (1) is equipped with a detection component for synchronously insulating and detecting several semiconductor packages.

2. The semiconductor package insulation testing device according to claim 1, characterized in that: The detection assembly includes a bidirectional lead screw (4), a guide rod (5) arranged parallel to the bidirectional lead screw (4), a detection motor (6) disposed at one end of the bidirectional lead screw (4), and a left-hand rotating assembly and a right-hand rotating assembly sleeved on the bidirectional lead screw (4) and the guide rod (5).

3. The semiconductor package insulation testing device according to claim 2, characterized in that: The left-handed assembly includes a left-handed plate (7) and a plurality of positive electrode components disposed on the left-handed plate (7); The right-handed assembly includes a right-handed plate (8) and a plurality of negative electrode components disposed on the right-handed plate (8) and disposed opposite to the positive electrode assembly.

4. The semiconductor package insulation testing device according to claim 3, characterized in that: Both the positive electrode assembly and the negative electrode assembly include an insulating frame (9), a contact (10) extending from the insulating frame (9), and a retaining plate (11) located in the insulating frame (9) and connected to the contact (10); The card plate (11) has a positioning protrusion (12) on the side away from the contact (10), and a buffer spring (13) is sleeved on the outside of the positioning protrusion (12). The side of the buffer spring (13) away from the card plate (11) is connected to the insulating plate (14).

5. The semiconductor package insulation testing device according to claim 1, characterized in that: The bottom of the detection groove (3) is provided with a through ejection hole (15).

6. The semiconductor package insulation testing apparatus according to claim 5, characterized in that: The ejection assembly includes a bidirectional screw (16), a left-hand nut (17) and a right-hand nut (18) threaded onto the bidirectional screw (16), an ejection motor (19) disposed at one end of the bidirectional screw (16), and an ejection plate (20) for mounting a plurality of ejection rods. The lower end of the ejector plate (20) is provided with a hinge plate (21), and both the left-hand nut (17) and the right-hand nut (18) are hinged with hinge rods (22), the other end of which is hinged to the hinge plate (21).

7. The semiconductor package insulation testing apparatus according to claim 6, characterized in that: The ejector rod includes an ejector pin (23) disposed on the ejector plate (20) and an elastic abutment (24) disposed above the ejector pin (23). The elastic abutment (24) has a buffer groove (25). The ejector pin (23) is provided with an ejector pin (26) located in the buffer groove (25). An ejector spring (27) sleeved on the ejector pin (26) is connected between the elastic abutment (24) and the ejector pin (23).

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