Dustproof edge computer

Abstract

The utility model provides a dustproof edge computer which specifically comprises a computer shell, a first heat dissipation assembly and a second heat dissipation assembly, and a mainboard and a display card connected with the mainboard in an inserted mode are installed in the computer shell. Due to the fact that the first heat dissipation assembly is located at the top of the computer shell, ventilation and heat dissipation can be effectively conducted on the mainboard, the second heat dissipation assembly is specially used for heat dissipation of the display card, targeted heat dissipation of the mainboard and the display card is achieved, the overall temperature is reduced, and it is ensured that the computer can still operate normally under high loads. Due to the fact that the dustproof cotton and the second dustproof pad play a dustproof role, dust and sundries can be effectively prevented from entering the computer, the risk that internal parts are polluted by dust is reduced, the long-term stability and reliability of equipment are improved, and the edge computer is particularly suitable for running in a severe environment with much dust or meets the requirements of different scenes. Therefore, the technical problems that the heat dissipation channel of the edge computer is single and the heat dissipation effect is poor are solved.

Description

Technical Field

[0001] This utility model relates to the field of computer heat dissipation and dust prevention technology, and in particular to a dustproof edge computer. Background Technology

[0002] With the rapid development of information technology, edge computing has been widely applied in various industries, especially in vehicle-to-everything (V2X) communication, special vehicle onboard systems, intelligent security, high-precision machine vision, medical imaging, aviation, telecommunications, and industrial measurement and control. Edge computers have become critical computing devices. These devices often need to support high-power graphics cards and handle complex computing tasks. However, in practical applications, edge computers face many challenges, especially heat dissipation and dust prevention, which affect the stability, performance, and lifespan of the devices.

[0003] In existing technologies, most edge computers employ a uniform heat dissipation design, with the CPU and GPU cooling systems sharing a single heat dissipation channel. This design cannot effectively prevent dust from entering the device, especially when operating in high-temperature or harsh environments. Dust and impurities can affect heat dissipation efficiency and reduce the device's lifespan. Furthermore, traditional airflow designs are mostly single-channel structures, which cannot meet the heat dissipation requirements of high-power graphics cards, resulting in the graphics card's performance not being fully utilized. Utility Model Content

[0004] The purpose of this invention is to provide a dustproof edge computer, which solves the technical problem of edge computers having a single heat dissipation channel and poor heat dissipation effect.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A dustproof edge computer includes: a computer casing, a first heat dissipation component and a second heat dissipation component, wherein a motherboard and a graphics card connected to the motherboard are installed inside the computer casing;

[0007] The first heat dissipation component and the second heat dissipation component are respectively connected to the computer housing. The first heat dissipation component is located at the top of the computer housing and is used to ventilate and dissipate heat on the motherboard. The second heat dissipation component is used to ventilate and dissipate heat on the graphics card. The computer housing has a second air inlet and a second air outlet.

[0008] A dustproof cotton and a dustproof bracket are installed at the second air inlet, and the dustproof bracket fixes the dustproof cotton inside the computer casing with screws; a second dustproof pad with a square shape is installed at the second air outlet.

[0009] Optionally, the computer housing includes a bottom cover, on which a first side plate, a second side plate, a third side plate, and a fourth side plate are installed in sequence.

[0010] The second air inlet is located on the bottom cover, and the dustproof bracket is fastened to the bottom cover by screws. The second air outlet is located on the fourth side plate.

[0011] Optionally, the first heat dissipation component includes a heat dissipation housing, on which a first heat dissipation fan electrically connected to the motherboard is mounted, the heat dissipation housing is fixedly connected to the motherboard via copper pillars, and a baffle plate is mounted on the heat dissipation housing.

[0012] Optionally, the heat dissipation housing is provided with a plurality of first air inlets, and the baffle plate is provided with a plurality of first air outlets.

[0013] Optionally, the second heat dissipation component includes a heat sink and a second cooling fan. The heat sink is fastened to the graphics card by a back clip and screws. The heat sink is fixed to the copper pillars of the motherboard by screws. The back of the motherboard is provided with a fan bracket for mounting the second cooling fan.

[0014] Optionally, a first dustproof pad arranged in a ring is adhered to the second cooling fan.

[0015] Optionally, the heat sink is equipped with a plurality of filling pads, which are bonded to the inner wall of the computer casing.

[0016] Optionally, the motherboard is provided with a connector that is fixed to the graphics card.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] This invention provides a dustproof edge computer, specifically comprising a computer casing, a first heat dissipation component, and a second heat dissipation component. The computer casing houses a motherboard and a graphics card connected to the motherboard. Since the first heat dissipation component is located at the top of the computer casing, it effectively ventilates and dissipates heat from the motherboard. The second heat dissipation component is specifically designed for cooling the graphics card, achieving targeted cooling for both the motherboard and graphics card, reducing overall temperature, and ensuring the computer can still operate normally under high load. Because both the dustproof cotton and the second dustproof pad serve a dustproof function, they effectively prevent dust and debris from entering the computer's interior, reducing the risk of dust contamination of internal components, improving the long-term stability and reliability of the device. This makes the edge computer particularly suitable for operation in dusty or harsh environments, meeting the needs of various scenarios. Therefore, this invention solves the technical problem of edge computers having a single heat dissipation channel and poor heat dissipation effect. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0021] Figure 1 One of the three-dimensional structural schematic diagrams of a dustproof edge computer provided by this utility model;

[0022] Figure 2 A second three-dimensional structural schematic diagram of a dustproof edge computer provided by this utility model;

[0023] Figure 3 One of the exploded structural diagrams of a dustproof edge computer provided by this utility model;

[0024] Figure 4 A schematic diagram of the structure of a dustproof wind deflector in an edge computer provided by this utility model;

[0025] Figure 5 A second exploded structural diagram of a dustproof edge computer provided for this utility model;

[0026] Figure 6 A schematic diagram of the structure of a dustproof edge computer bottom cover provided by this utility model;

[0027] Figure 7 This is a partial exploded view of the second heat dissipation component in a dustproof edge computer provided by this utility model.

[0028] Illustration:

[0029] 10. Computer casing; 11. Bottom cover; 111. Second air inlet; 12. First side panel; 13. Second side panel; 14. Third side panel; 15. Fourth side panel; 151. Second air outlet; 20. First heat dissipation assembly; 21. Heat dissipation shell; 211. First air inlet; 22. First cooling fan; 23. Baffle plate; 231. First air outlet; 30. Second heat dissipation assembly; 31. Heat sink; 32. Second cooling fan; 33. Back clip; 34. Fan bracket; 35. Filler pad; 40. Motherboard; 41. Connector; 50. Graphics card; 60. Dustproof cotton; 70. Dustproof bracket; 80. First dustproof pad; 90. Second dustproof pad. Detailed Implementation

[0030] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0031] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0032] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0033] This utility model embodiment provides a dustproof edge computer, such as Figures 1 to 7 As shown, it includes: a computer casing 10, a first heat dissipation component 20 and a second heat dissipation component 30, and a motherboard 40 and a graphics card 50 connected to the motherboard 40 are installed inside the computer casing 10.

[0034] The first heat dissipation component 20 and the second heat dissipation component 30 are respectively connected to the computer housing 10. The first heat dissipation component 20 is located at the top of the computer housing 10 and is used to ventilate and dissipate heat on the motherboard 40. The second heat dissipation component 30 is used to ventilate and dissipate heat on the graphics card 50. The computer housing 10 has a second air inlet 111 and a second air outlet 151.

[0035] A dustproof cotton 60 and a dustproof bracket 70 are installed at the second air inlet 111. The dustproof bracket 70 fixes the dustproof cotton 60 inside the computer casing 10 with screws. A square-shaped second dustproof pad 90 is installed at the second air outlet 151. In this embodiment, the motherboard 40 and the graphics card 50 are well-known structures in the art and will not be described in detail here.

[0036] It should be noted that the dustproof edge computer provided by this utility model specifically includes a computer casing 10, a first heat dissipation component 20, and a second heat dissipation component 30. A motherboard 40 and a graphics card 50 connected to the motherboard 40 are installed inside the computer casing 10. Since the first heat dissipation component 20 is located at the top of the computer casing 10, it can effectively ventilate and dissipate heat from the motherboard 40. The second heat dissipation component 30 is specifically used for dissipating heat from the graphics card 50, achieving targeted heat dissipation for the motherboard 40 and graphics card 50, reducing the overall temperature, and ensuring that the computer can still operate normally under high load. Since both the dustproof cotton 60 and the second dustproof pad 90 serve a dustproof function, they can effectively prevent dust and debris from entering the computer, reducing the risk of internal components being contaminated by dust, improving the long-term stability and reliability of the device, making this edge computer particularly suitable for operation in dusty or harsh environments, meeting the needs of different scenarios. Therefore, this utility model solves the technical problem of edge computers having a single heat dissipation channel and poor heat dissipation effect.

[0037] like Figures 1 to 7 As shown, the computer casing 10 includes a bottom cover 11, on which a first side plate 12, a second side plate 13, a third side plate 14, and a fourth side plate 15 are sequentially connected end to end. A second air inlet 111 is disposed on the bottom cover 11, and a dustproof bracket 70 is fastened to the bottom cover 11 by screws. A second air outlet 151 is disposed on the fourth side plate 15. In this embodiment, the first side plate 12, the second side plate 13, the third side plate 14, and the fourth side plate 15 are all fastened together by screws.

[0038] It should be noted that the reasonable configuration of the second air inlet 111 and the second air outlet 151 allows air to flow in from the bottom, forming a smooth airflow channel from the bottom to the side, improving heat dissipation efficiency and effectively reducing the internal temperature of the computer. The fixed connection of the dustproof cotton 60 ensures that it is not easily detached, and also facilitates regular replacement and maintenance, which is especially important for using computers in environments where dust easily accumulates.

[0039] like Figures 1 to 4As shown, the first heat dissipation assembly 20 includes a heat dissipation shell 21, on which a first cooling fan 22 electrically connected to the motherboard 40 is mounted. The heat dissipation shell 21 is fixedly connected to the motherboard 40 by copper pillars, and a baffle plate 23 is mounted on the heat dissipation shell 21. The heat dissipation shell 21 has several first air inlets 211, and the baffle plate 23 has several first air outlets 231. In this embodiment, thermal grease is coated on the motherboard 40, and the thermal grease is in close contact with the heat dissipation shell 21. The heat dissipation shell 21 absorbs the heat emitted by the motherboard 40, and the operation of the first cooling fan 22 drives airflow, dissipating the heat of the heat dissipation shell 21 to the external space.

[0040] It should be noted that the combination of the heat sink 21 and the first cooling fan 22 makes the entire cooling system more efficient. By combining active and passive cooling, the temperature of the motherboard 40 is significantly reduced, ensuring its stable operation under high load. The design of the baffle 23 effectively guides the airflow direction, making it easier for cool air to enter the heat dissipation area and drive heat out quickly, thereby improving the overall effect of the cooling system.

[0041] like Figures 1 to 7 As shown, the second heat dissipation assembly 30 includes a heatsink 31 and a second cooling fan 32. The heatsink 31 is securely connected to the graphics card 50 via a back clip 33 and screws. The heatsink 31 is fixed to the copper pillars of the motherboard 40 by screws. A fan bracket 34 for mounting the second cooling fan 32 is provided on the back of the motherboard 40. A first dustproof pad 80 arranged in a ring is adhered to the second cooling fan 32. Several filler pads 35 are installed on the heatsink 31 and are adhered to the inner wall of the computer casing 10. Specifically, the filler pads 35 are adhered to the inner wall of the bottom cover 11, and the number of filler pads 35 is set to four.

[0042] It should be noted that the effective fixing method of the heatsink 31 ensures good thermal contact with the graphics card 50. Combined with the active exhaust of the second cooling fan 32, the temperature of the graphics card 50 can be quickly reduced, achieving efficient heat dissipation. The back clip 33 and screws ensure that the heatsink 31 is not easily loosened during operation, increasing the overall stability and heat dissipation performance of the system. The first dustproof pad 80 is used to protect the second cooling fan 32 from dust intrusion, effectively preventing dust from entering, maintaining the normal operation of the cooling fan, and reducing maintenance frequency. The padding pad 35 not only improves heat dissipation efficiency but also helps reduce vibration and noise, enhancing the user experience.

[0043] like Figure 4As shown, the motherboard 40 is equipped with a connector 41 for connecting and fixing the graphics card 50. The high-quality connector 41 secures the graphics card 50 to the motherboard 40, preventing poor contact due to vibration during operation and improving the stability and reliability of the graphics card 50. Users can easily replace the graphics card 50, enhancing system scalability and upgrade convenience, and meeting users' needs for hardware upgrades and maintenance.

[0044] Working Principle: This utility model provides a dustproof edge computer, specifically including a computer casing 10, a first heat dissipation component 20, and a second heat dissipation component 30. A motherboard 40 and a graphics card 50 connected to the motherboard 40 are installed inside the computer casing 10. Since the first heat dissipation component 20 is located at the top of the computer casing 10, it can effectively ventilate and dissipate heat from the motherboard 40. The second heat dissipation component 30 is specifically used for dissipating heat from the graphics card 50, achieving targeted heat dissipation for the motherboard 40 and graphics card 50, reducing the overall temperature, and ensuring that the computer can still operate normally under high load. Since both the dustproof cotton 60 and the second dustproof pad 90 serve a dustproof function, they can effectively prevent dust and debris from entering the computer's interior, reducing the risk of dust contamination of internal components, improving the long-term stability and reliability of the device, making this edge computer particularly suitable for operation in dusty or harsh environments, meeting the needs of different scenarios. Therefore, this utility model solves the technical problem of edge computers having a single heat dissipation channel and poor heat dissipation effect.

[0045] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A dustproof edge computer, characterized in that, include: The computer housing (10), the first heat dissipation component (20) and the second heat dissipation component (30) are provided. The computer housing (10) contains a motherboard (40) and a graphics card (50) that is connected to the motherboard (40). The first heat dissipation component (20) and the second heat dissipation component (30) are respectively connected to the computer housing (10). The first heat dissipation component (20) is located on the top of the computer housing (10) and is used to ventilate and dissipate heat from the motherboard (40). The second heat dissipation component (30) is used to ventilate and dissipate heat from the graphics card (50). The computer housing (10) has a second air inlet (111) and a second air outlet (151). A dustproof cotton (60) and a dustproof bracket (70) are installed at the second air inlet (111). The dustproof bracket (70) fixes the dustproof cotton (60) inside the computer casing (10) with screws. A second dustproof pad (90) with a square arrangement is installed at the second air outlet (151).

2. The dustproof edge computer according to claim 1, characterized in that, The computer housing (10) includes a bottom cover (11), on which a first side plate (12), a second side plate (13), a third side plate (14), and a fourth side plate (15) are installed in sequence. The second air inlet (111) is provided on the bottom cover (11), the dustproof bracket (70) is fastened to the bottom cover (11) by screws, and the second air outlet (151) is provided on the fourth side plate (15).

3. The dustproof edge computer according to claim 1 or 2, characterized in that, The first heat dissipation component (20) includes a heat dissipation shell (21), on which a first heat dissipation fan (22) electrically connected to the motherboard (40) is installed. The heat dissipation shell (21) is fixedly connected to the motherboard (40) by copper pillars. A baffle plate (23) is installed on the heat dissipation shell (21).

4. The dustproof edge computer according to claim 3, characterized in that, The heat dissipation shell (21) is provided with a plurality of first air inlets (211), and the baffle plate (23) is provided with a plurality of first air outlets (231).

5. The dustproof edge computer according to claim 1 or 2, characterized in that, The second heat dissipation component (30) includes a heat sink (31) and a second cooling fan (32). The heat sink (31) is fastened to the graphics card (50) by a back clip (33) and screws. The heat sink (31) is fixed to the copper pillars of the motherboard (40) by screws. The back of the motherboard (40) is provided with a fan bracket (34) for mounting the second cooling fan (32).

6. The dustproof edge computer according to claim 5, characterized in that, The second cooling fan (32) has a first dustproof pad (80) arranged in a ring.

7. The dustproof edge computer according to claim 5, characterized in that, A plurality of filling pads (35) are installed on the heat sink (31), and the filling pads (35) are bonded to the inner wall of the computer casing (10).

8. The dustproof edge computer according to claim 1 or 2, characterized in that, The motherboard (40) is provided with a connector (41) that is plugged into and fixed to the graphics card (50).

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