Sensor connection assembly with golden finger structure and pressure sensor

The sensor connection assembly with a gold finger structure uses a mounting cavity defined by a support ring and a mounting shell to restrict PCB board movement, solving the problem of stable connection of pressure sensors in confined spaces, avoiding poor contact and bending breakage, and making it suitable for mass production.

CN224204392UActive Publication Date: 2026-05-05敏之捷传感科技(常州)有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
敏之捷传感科技(常州)有限公司
Filing Date
2025-04-10
Publication Date
2026-05-05

AI Technical Summary

Technical Problem

When arranging pressure sensors in confined spaces, existing technologies cannot be applied to common electrical connection methods. Spring contacts are prone to poor contact and are easily bent and broken, while cable connections are costly and unsuitable for mass production.

Method used

The sensor connection assembly adopts a gold finger structure. The PCB board is supported on the axial bearing part of the support ring, and the conductive contact is connected to the MCU. The movement of the PCB board is restricted by the mounting cavity jointly defined by the support ring and the mounting shell, so as to ensure stable connection.

Benefits of technology

Stable connection of pressure sensors was achieved in a confined space, avoiding problems such as poor contact and bending/breakage, making it suitable for mass production.

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Abstract

The utility model relates to a sensor connecting assembly with a golden finger structure and a pressure sensor, the sensor connecting assembly is limited in a mounting cavity jointly limited by a sensing element and a mounting shell, specifically, the bottom of a PCB is supported on an axial bearing part of a supporting ring, and the top of the PCB is in contact with the inner wall of the top of the mounting shell; therefore, the movement of the PCB and the sensor connecting assembly in the mounting cavity is limited, and the stable connection of the pressure sensor is ensured. The plug-in section of the PCB is provided with the conductive contact piece with a golden finger structure, so that the conductive contact piece is connected with the MCU, the stable connection of the pressure sensor is ensured, and the problems of poor contact and easy bending and breakage caused by a conventional spring connection mode are solved.
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Description

Technical Field

[0001] This utility model relates to the field of pressure sensors, specifically a sensor connection assembly with a gold finger structure and a pressure sensor. Background Technology

[0002] While electrical connections using connectors are common for pressure sensors (e.g., connectors, cables), they are unsuitable for small sensors where space is limited. Spring contacts can solve space constraints, but they are prone to poor contact and bending / breakage, resulting in a high failure rate. Cable connections are costly and time-consuming, making them unsuitable for mass production.

[0003] In summary, how to arrange pressure sensors in confined spaces and solve the problems of poor contact and easy bending and breakage of springs has become an urgent problem for researchers in this field. Utility Model Content

[0004] The technical problem to be solved by this utility model is: how to arrange pressure sensors in a confined space;

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] This utility model is a sensor connection assembly with a gold finger structure, at least partially axially confined within a mounting cavity defined by a sensing element and a mounting housing; the sensor connection assembly includes: a support ring, one end connected to the sensing element and the other end connected to the mounting housing, with an axial bearing portion extending circumferentially from its middle portion; a PCB board, the bottom of which rests on the axial bearing portion, the top insertion section of which passes through a through hole in the mounting housing, and its shoulder contacts the top inner wall of the mounting housing, the portion of the PCB board located within the mounting cavity being electrically connected to a strain gauge on the sensing element; and a conductive contact piece disposed at the insertion section of the PCB board.

[0007] Furthermore, conductive contacts are provided on both opposite sides of the plug segment.

[0008] Furthermore, the PCB board is distributed with a first surface and a second surface arranged opposite to each other; when the PCB board is placed on the axial bearing portion, the support ring is provided with at least a limiting portion that makes surface contact with the first surface and / or the second surface.

[0009] Furthermore, the support ring is provided with multiple weight-reducing holes.

[0010] Furthermore, the bottom sides of the PCB board are provided with notches that cooperate with the axial bearing portion.

[0011] This solution also discloses a pressure sensor, including a sensor connection assembly, interconnected sensing elements, and a mounting housing.

[0012] Furthermore, the mounting shell includes: a main housing having an inner cavity extending through it along its axial direction; and a mounting frame installed within the inner cavity of the main housing and located at the top of the inner cavity, with the through hole extending through its middle portion.

[0013] Furthermore, the upper surface of the mounting frame is provided with a sealing groove for injecting adhesive, and the through hole is provided through the sealing groove.

[0014] Furthermore, a radially penetrating limiting groove is provided on the lower surface of the mounting frame, and the shoulder is placed inside the limiting groove, with its top contacting the bottom of the limiting groove.

[0015] Furthermore, the outer peripheral wall of the sensing element is formed with a first limiting step for abutting against the main housing and a second limiting step for abutting against the support ring.

[0016] This invention relates to a sensor connection assembly with a gold finger structure and a pressure sensor. The sensor connection assembly is confined within a mounting cavity defined by the sensing element and the mounting housing. Specifically, the bottom of the PCB board is supported on the axial bearing portion of the support ring, and the top of the PCB board contacts the inner top wall of the mounting housing. This restricts the movement of the PCB board and the sensor connection assembly within the mounting cavity, ensuring a stable connection of the pressure sensor. The PCB board insertion section has conductive contacts with a gold finger structure, which connect to the MCU, ensuring a stable connection of the pressure sensor and avoiding problems such as poor contact and easy bending and breakage. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] Figure 1 This is a diagram of the external structure of the pressure sensor;

[0019] Figure 2 This is a front view of the pressure sensor;

[0020] Figure 3 This is a cross-sectional view of the pressure sensor along the BB direction;

[0021] Figure 4 This is a side view of the pressure sensor;

[0022] Figure 5 This is a cross-sectional view of the pressure sensor AA.

[0023] Figure 6 This is a schematic diagram of the sensor element;

[0024] Figure 7 This is a schematic diagram of the support ring structure in the sensor connection assembly;

[0025] Figure 8 This is a right view of the support ring and PCB board mating in the sensor connection assembly;

[0026] Figure 9 This is a 3D view of the support ring and PCB board in the sensor connection assembly;

[0027] Figure 10 This is a front view of the PCB board;

[0028] Figure 11 This is a left view of the PCB board;

[0029] Figure 12 This is a rear view of the PCB board;

[0030] Figure 13 This is a diagram showing the connection between the sensor connection assembly and the sensing element;

[0031] Figure 14 It is a 3D diagram of the installed frame;

[0032] Figure 15 Sectional view of the installed frame;

[0033] Figure 16 This is a three-dimensional view of the main shell;

[0034] In the figure: 1-sensing element, 11-first limiting step, 12-second limiting step, 13-detection channel, 14-vertical wall, 15-strain gauge, 2-mounting shell, 21-main shell, 211-inner cavity, 22-mounting frame, 221-through hole, 222-potting groove, 223-limiting groove, 3-PCB board, 31-plug section, 32-conductive contact, 33-shoulder, 34-first surface, 35-second surface, 36-conditioning chip, 37-notch, 4-mounting cavity, 5-support ring, 51-axial bearing part, 52-limiting part, 53-weight reduction hole, 6-aluminum wire. Detailed Implementation

[0035] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.

[0036] To facilitate the placement of pressure sensors in confined spaces and avoid poor contact, this solution provides the following embodiments.

[0037] See Figure 1 The figure shows the external structure of the pressure sensor, which includes a sensing element 1 located at the bottom. The sensing element is connected to the mounting housing 2. The plug-in section 31 at the top of the PCB board 3 passes through the top of the mounting housing 2, that is, through the mounting frame 22. Two conductive contacts 32 are provided on the plug-in section 31. The operator can hold the mounting housing 2 and insert the conductive contacts 32 of the plug-in section 31 into the interface of the host computer MCU to realize the connection of the pressure sensor.

[0038] See Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 2 This is a front view of the pressure sensor. Figure 3 This is a cross-sectional view of the pressure sensor along direction BB. Figure 4 This is a side view of the pressure sensor. Figure 5 This is a cross-sectional view of the pressure sensor along direction AA. Figure 3 , Figure 5 In the process, the sensing element 1 and the mounting shell 2 are connected to form a mounting cavity 4, and the sensor connection assembly is located inside the mounting cavity 4.

[0039] Specifically, the bottom of the support ring 5 in the sensor connection assembly abuts against the second limiting step 12 of the sensing element 1, and the bottom of the main housing 21 in the mounting housing 2 abuts against the first limiting step 11 of the sensing element 1. The bottom of the sensing element 1 has an upward-facing detection channel 13, into which fluid can enter, causing the strain gauge 15 at the top vertical wall 14 of the sensing element to deform. The strain gauge 15 is electrically connected to the PCB board 3 via the aluminum wire 6 to achieve signal transmission. The bottom of the PCB board 3 in the sensor connection assembly is supported on the axial bearing portion 51 of the support ring 5. The insertion section 31 at the top of the PCB board 3 passes through the mounting frame 22 in the mounting housing 2 and is located outside the mounting housing 2. The shoulder 33 of the PCB board 3 abuts against the mounting frame 22. This restricts the vertical axial movement of the PCB board 3 and the support ring 5 in the mounting cavity 4, ensuring the stability of the sensor connection assembly during the insertion and removal process with the host computer MCU.

[0040] See Figure 6 , Figure 6 This is a schematic diagram of the sensing element; the outer peripheral wall of the sensing element 1 has a first limiting step 11 and a second limiting step 12. The first limiting step 11 is located below the second limiting step 12, and the diameter of the first limiting step 11 is larger than the diameter of the second limiting step 12; the top of the sensing element 1 has a vertical wall 14, and a strain gauge 15 is bonded to the surface of the vertical wall 14 with glass glue; since the wall thickness of the vertical wall 14 to the detection channel 13 is relatively thin, the strain gauge 15 at this location is easily deformed due to the influence of the wall thickness.

[0041] See Figure 7 , Figure 7 This is a schematic diagram of the support ring in the sensor connection assembly. The support ring 5 has multiple weight-reducing holes 53, which can reduce the total weight of the sensor connection assembly and the pressure sensor. The lower part of the support ring 5 is roughly a ring structure, and the upper part of the support ring 5 is roughly an arc-shaped sheet structure. The sheet structure is formed by the ring structure extending upward along its axis. Axial bearing portions 51 are provided on both sides of the sheet structure extending circumferentially. The bottom of the PCB board 3 is supported on the upper surface of the axial bearing portion 51. Limiting portions 52 are provided on both sides of the sheet structure extending opposite to each other. The limiting portions 52 are located above the axial bearing portions 51, and the second surface 35 of the PCB board is in surface contact with the outer surface of the limiting portion 52.

[0042] In this way, the bottom of the PCB board 3 is supported on the upper surface of the axial bearing part 51, which restricts the downward movement of the PCB board 3; the second surface 35 of the PCB board 3 makes surface contact with the limiting part 52, which restricts the flipping of the PCB board 3.

[0043] Of course, in some unshown embodiments, the limiting parts 52 may be arranged in a front-to-back manner, so that the first surface 34 and the second surface 35 of the PCB board 3 are in surface contact with the limiting parts, further ensuring the stability of the PCB board 3 placed on the support ring 5.

[0044] See Figure 8 , Figure 9 , Figure 8 This is a right view of the support ring and PCB board mating in the sensor connection assembly. Figure 9 This is a three-dimensional view of the support ring 5 and PCB board 3 in the sensor connection assembly; in the figure, the bottom of PCB board 3 is supported on the axial bearing part 51, and the second surface 35 of PCB board 3 is in surface contact with the limiting part 52.

[0045] See Figure 10 , Figure 11 , Figure 12 , Figure 10 , Figure 11 , Figure 12 These are the front view, left view, and rear view of the PCB board in the sensor connection assembly. The top width of the PCB board 3 is smaller than the bottom width, forming a shoulder 33 between the top and bottom. The top of the PCB board 3 is a plug-in section 31, and conductive contacts 32 are provided on both the front and rear surfaces of the plug-in section 31, for a total of four conductive contacts 32. A conditioning chip 36 is provided on the first surface 34 (front surface) of the PCB board 3. The conditioning chip 36 is electrically connected to the strain gauge 15 and is also electrically connected to the conductive contacts 32. In this way, the signal generated by the strain gauge 15 is transmitted to the host computer MCU through the conditioning chip 36 and the conductive contacts 32. Figure 10The lower left and lower right portions of the PCB board 3 have notches 37 formed therein. The notches 37 cooperate with the axial bearing portion 51, which not only restricts the downward movement of the PCB board 3, but also restricts the left and right movement of the PCB board 3.

[0046] See Figure 13 , Figure 13 This is a diagram showing the connection between the sensor connection assembly and the sensing element; the bottom of the support ring 5 in the sensor connection assembly abuts against the second limiting step 12, and the strain gauge 15 on the sensing element is electrically connected to the PCB board 3 via an aluminum wire 6.

[0047] See Figure 14 , Figure 15 , Figure 14 It is a 3D diagram of the installed frame. Figure 15 This is a cross-sectional view of the mounting frame; the mounting frame 22 has a rectangular through hole 221 through which the insertion section 31 of the PCB board 3 passes; the upper surface of the mounting frame 22 also has a potting groove 222. When the insertion section 31 passes through the through hole 221, glue is poured into the potting groove 222. The glue bonds the insertion section 31 of the PCB board 3 to the mounting frame 22 and then cures, further ensuring the connection strength between the mounting frame 22 and the PCB board 3; a limiting groove 223 is formed at the bottom of the mounting frame 22; as shown... Figure 15 As shown, the frame 22 is installed through the left and right sides of the limiting groove 223. The shoulder 33 of the PCB board 3 is located in the limiting groove 223 and abuts against the bottom of the limiting groove 223. This can limit the upward movement of the PCB board 3 and limit the rotation of the PCB board 3.

[0048] See Figure 16 , Figure 16 This is a perspective view of the main housing 21. The main housing is a cylindrical structure that runs through the top and bottom. The main housing 21 has an inner cavity 211. When the mounting frame 22 is installed on the top of the inner cavity 211, the main housing 21 deforms inward, thus fixing the main housing 21 and the mounting frame 22 together.

[0049] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A sensor connection assembly with a gold finger structure, characterized in that, At least partially axially confined within a mounting cavity defined by the sensing element and the mounting housing; the sensor connection assembly includes: The support ring has one end connected to the sensing element and the other end connected to the mounting shell, and an axial bearing portion is provided in its middle part extending circumferentially. The PCB board has its bottom placed on the axial support part, and its top insertion section passes through the through hole opened on the mounting shell. Its shoulder contacts the top inner wall of the mounting shell, and the PCB board portion located in the mounting cavity is electrically connected to the strain gauge on the sensing element. And conductive contacts, which are disposed at the insertion section of the PCB board.

2. The sensor connection assembly with a gold finger structure according to claim 1, characterized in that, The conductive contact piece is provided on both sides of the plug segment that are opposite to each other.

3. The sensor connection assembly with a gold finger structure according to claim 1, characterized in that, The PCB board has a first surface and a second surface arranged opposite to each other; when the PCB board is placed on the axial bearing part, the support ring is provided with at least a limiting part that makes surface contact with the first surface and / or the second surface.

4. The sensor connection assembly with a gold finger structure according to claim 1, characterized in that, The support ring has multiple weight-reducing holes.

5. The sensor connection assembly with a gold finger structure according to claim 1, characterized in that, The PCB board has notches on both sides of its bottom that mate with the axial bearing portion.

6. A pressure sensor, comprising a sensor connection assembly with a gold finger structure as described in any one of claims 1-5, characterized in that, It also includes interconnected sensing elements and mounting housings.

7. A pressure sensor according to claim 6, characterized in that, The mounting housing includes: The main housing has an internal cavity extending through it along its axial direction; The mounting frame is installed inside the inner cavity of the main housing and located at the top of the inner cavity, with a through hole extending through its middle.

8. A pressure sensor according to claim 7, characterized in that, The upper surface of the mounting frame is provided with a sealing groove for injecting adhesive, and the through hole is provided through the sealing groove.

9. A pressure sensor according to claim 7, characterized in that, The lower surface of the mounting frame is provided with a radially penetrating limiting groove, and the shoulder is placed inside the limiting groove, with its top contacting the bottom of the limiting groove.

10. A pressure sensor according to claim 7, characterized in that, The outer peripheral wall of the sensing element is formed with a first limiting step for abutting against the main housing and a second limiting step for abutting against the support ring.