Semiconductor processing high-precision linear motor

Abstract

The utility model relates to the technical field of linear motors, and discloses a high-precision linear motor for semiconductor processing, which comprises a bottom shell, the outer surface of the bottom shell is fixedly connected with a fixed seat, the surface of the bottom shell is provided with a heat dissipation assembly, and the surface of the bottom shell is provided with a splicing assembly. According to the utility model, through the splicing assembly and the assembling assembly, by using the insertion columns and the insertion grooves at the two ends of the bottom shell, a plurality of motor stator bottom shells can be conveniently assembled according to the high-precision linear stroke length requirement of semiconductor processing, the clamping strips on the end covers and the clamping grooves in the surfaces of the bottom shells are used, and the two ends of the expanded and combined bottom shells are rapidly positioned and the end covers are assembled; in order to meet the high-precision linear stroke double-station requirement of semiconductor processing, a cover plate is mounted at the top of the bottom shell through a second assembly bolt, and two linear sliding tables with motor rotors are assembled in a limiting manner, so that the requirements of different lengths and double stations are met by quickly and flexibly expanding and assembling, and the applicability of the linear motor is improved.

Description

Technical Field

[0001] This utility model relates to the field of linear motor technology, and in particular to a high-precision linear motor for semiconductor processing. Background Technology

[0002] In semiconductor manufacturing, the motion accuracy and stability of linear motors directly affect the quality and efficiency of manufacturing. They require high-precision position and speed control to ensure that the positioning and movement of wafers during the manufacturing process can achieve extremely high precision.

[0003] A linear motor can be considered a structural variation of a rotary motor. It can be seen as a rotary motor that has been cut along its radial direction and then flattened to evolve into a linear motor. In a linear motor, the part that is equivalent to the stator of the rotary motor is called the primary, and the part that is equivalent to the rotor of the rotary motor is called the secondary. The primary is energized with alternating current, and the secondary moves linearly along the primary under the action of electromagnetic force.

[0004] While existing linear motors perform well in positioning and movement in semiconductor manufacturing, their fixed and non-expandable dimensions make it difficult to quickly adapt to different lengths and dual-station requirements in different processing steps, affecting the applicability and efficiency of linear motors and making them inconvenient to use. Therefore, a high-precision linear motor for semiconductor processing is proposed to solve the above problems. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a high-precision linear motor for semiconductor processing, aiming to solve the problem that the fixed and non-expandable size of the linear motor in different processing steps makes it difficult to quickly adapt to different lengths and dual-station requirements, thus affecting the applicability and efficiency of the linear motor.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a high-precision linear motor for semiconductor processing, comprising a base, a fixing seat fixedly connected to the outer surface of the base, a heat dissipation assembly provided on the surface of the base, and a splicing assembly provided on the surface of the base;

[0007] The splicing assembly includes a connecting plate, connecting screw holes, splicing pins, and splicing slots. The surface of the connecting plate is fixedly connected to one side of the outer surface of the bottom shell. The connecting screw holes are located on the other side of the outer surface of the bottom shell. End caps are movably snapped onto both sides of the bottom shell. An assembly assembly is provided between the end caps and the bottom shell. A motor stator is fixedly connected to the inner wall of the bottom shell. A linear slide is slidably connected to the upper surface of the bottom shell. A motor mover is fixedly connected to the inner wall of the linear slide. A cover plate is attached to the upper surface of the bottom shell. A second assembly bolt is threadedly connected between the cover plate and the end caps.

[0008] As a further description of the above technical solution:

[0009] The splicing post is fixedly connected to one end of the bottom shell, and the splicing slot is located at the other end of the bottom shell. The outer wall of the splicing post is adapted to the inner wall of the splicing slot.

[0010] As a further description of the above technical solution:

[0011] The heat dissipation assembly includes a heat dissipation groove and heat dissipation fins. The heat dissipation groove is located on the inner surface of the bottom shell, and the ends of the heat dissipation fins are fixedly connected to the outer surface of the bottom shell.

[0012] As a further description of the above technical solution:

[0013] The heat dissipation fins are evenly distributed along the length of the bottom shell. T-shaped through grooves are formed inside the heat dissipation grooves on the surface of the heat dissipation fins. Air guide plates are fixedly connected inside the T-shaped through grooves.

[0014] As a further description of the above technical solution:

[0015] The air guide plate has an isosceles triangular structure.

[0016] As a further description of the above technical solution:

[0017] The assembly component includes a positioning through hole, an assembly plate, an assembly slot, and an assembly base. The positioning through hole is located on the outer surface of the end cover. One side of the inner surface of the assembly plate is fixedly connected to the outer surface of the end cover, and the other side of the inner surface of the assembly plate is fixedly connected to an assembly strip. The assembly slot is located on the outer surface of the bottom shell. The outer wall of the assembly base is fixedly connected to the inner wall of the end cover, and a first assembly bolt is threaded between the assembly base and the bottom shell.

[0018] As a further description of the above technical solution:

[0019] The inner wall of the positioning through hole is adapted to the outer wall size of the splicing post.

[0020] As a further description of the above technical solution:

[0021] The outer wall of the assembly card strip is adapted to the inner wall size of the assembly card slot.

[0022] This utility model has the following beneficial effects:

[0023] 1. In this utility model, by splicing components and assembling components, and utilizing the inserts and slots at both ends of the bottom shell, multiple motor stator bottom shells can be easily assembled according to the high-precision linear stroke length requirements of semiconductor processing. Using the clips on the end covers and the slots on the surface of the bottom shell, the end covers are quickly positioned and assembled at both ends of the expanded and combined bottom shell. To meet the dual-station requirements of high-precision linear stroke in semiconductor processing, a cover plate is installed on the top of the bottom shell using a second assembly bolt to limit the assembly of two linear slides with motor movers. This allows for quick and flexible expansion of the assembly to meet different length and dual-station requirements, thereby improving the applicability of the linear motor.

[0024] 2. In this utility model, the heat dissipation component utilizes the heat dissipation fins on the outer surface of the bottom shell and the T-shaped through groove in the heat dissipation groove to achieve efficient heat dissipation of the linear motor during semiconductor processing. At the same time, the T-shaped through groove is equipped with an air guide plate to ensure ventilation and heat dissipation while preventing dust from entering the bottom shell and adhering to the surface of the motor stator, thus ensuring the normal operation of the motor. Attached Figure Description

[0025] Figure 1 This is a three-dimensional schematic diagram of a high-precision linear motor for semiconductor processing proposed in this utility model.

[0026] Figure 2 This invention provides a schematic diagram of the overall disassembled structure of a high-precision linear motor for semiconductor processing. Figure 1 ;

[0027] Figure 3 This invention provides a schematic diagram of the overall disassembled structure of a high-precision linear motor for semiconductor processing. Figure 2 ;

[0028] Figure 4 This is a schematic diagram of the cross-sectional structure of the bottom shell of a high-precision linear motor for semiconductor processing proposed in this utility model.

[0029] Figure 5 This is a schematic diagram of the splicing structure at the bottom shell of a high-precision linear motor for semiconductor processing proposed in this utility model.

[0030] Legend:

[0031] 1. Base shell; 2. Mounting base; 3. Heat dissipation assembly; 31. Heat dissipation groove; 32. Heat dissipation fins; 33. T-shaped through slot; 34. Air guide plate; 4. Splicing assembly; 41. Connecting hole plate; 42. Connecting screw hole; 43. Splicing post; 44. Splicing slot; 5. End cover; 6. Assembly assembly; 61. Positioning through hole; 62. Assembly plate; 63. Assembly clip; 64. Assembly slot; 65. Assembly base; 66. First assembly bolt; 7. Motor stator; 8. Linear slide; 9. Motor mover; 10. Cover plate; 11. Second assembly bolt. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Reference Figure 1 , Figure 2 and Figure 4 This utility model provides an embodiment of a high-precision linear motor for semiconductor processing, comprising a base shell 1, a fixing seat 2 fixedly connected to the outer surface of the base shell 1, and a heat dissipation assembly 3 for efficient heat dissipation of motor components inside the base shell 1, the heat dissipation assembly 3 including a heat dissipation groove 31 and heat dissipation fins 32, the heat dissipation groove 31 being located on the inner surface of the base shell 1, the ends of the heat dissipation fins 32 being fixedly connected to the outer surface of the base shell 1, and multiple heat dissipation fins 32 being evenly distributed along the length direction of the base shell 1, the surfaces of the multiple heat dissipation fins 32 penetrating the interior of the heat dissipation groove 31. The system includes T-shaped slots 33, with air guide plates 34 of isosceles triangular structure fixedly connected inside. Through the heat dissipation assembly 3, several heat dissipation fins 32 are set on the outer surface of the bottom shell 1, and T-shaped slots 33 are opened through the heat dissipation groove 31. This facilitates efficient internal heat dissipation of the linear motor during semiconductor processing. Through the air guide plates 34 inside the T-shaped slots 33, dust can be effectively prevented from entering the bottom shell 1 and adhering to the surface of the motor stator 7 without affecting the ventilation and heat dissipation, thus ensuring the normal operation of the linear motor.

[0034] Reference Figure 1 , Figure 2 and Figure 5 A motor stator 7 is fixedly connected to the inner wall of the bottom shell 1. A splicing assembly 4 for expanding and splicing the bottom shell 1 is provided on the surface of the bottom shell 1. The splicing assembly 4 includes a connecting plate 41, a connecting screw hole 42, a splicing post 43, and a splicing slot 44. The surface of the connecting plate 41 is fixedly connected to one side of the outer surface of the bottom shell 1. The connecting screw hole 42 is opened on the other side of the outer surface of the bottom shell 1. The end of the splicing post 43 is fixedly connected to one end of the bottom shell 1. The splicing slot 44 is opened at the other end of the bottom shell 1. The outer wall of the splicing post 43 and the inner wall of the splicing slot 44 are adapted to each other. Through the splicing assembly 4, multiple bottom shells 1 with motor stators 7 can be assembled according to the high-precision linear stroke length requirements of semiconductor processing by using the splicing post 43 and the splicing slot 44 at both ends of the bottom shell 1.

[0035] Reference Figure 1 , Figure 3 and Figure 5 The bottom shell 1 has end caps 5 that are movably engaged on both sides. An assembly component 6 for positioning and docking assembly is provided between the end caps 5 and the bottom shell 1. The assembly component 6 includes a positioning through hole 61, an assembly plate 62, an assembly slot 64, and an assembly base 65. The positioning through hole 61 is located on the outer surface of the end cap 5, and its inner wall is adapted to the outer wall size of the splicing post 43. One side of the inner surface of the assembly plate 62 is fixedly connected to the outer surface of the end cap 5, and the other side of the inner surface of the assembly plate 62 is fixedly connected to an assembly clip 63. The assembly slot 64 is located on the outer surface of the bottom shell 1, and the outer wall of the assembly clip 63 is adapted to the inner wall size of the assembly slot 64. The outer wall of the assembly base 65 is fixedly connected to the inner wall of the end cap 5, and a first assembly bolt 66 is threadedly connected between the assembly base 65 and the bottom shell 1. A linear slide 8 is slidably connected to the upper surface, and a motor mover 9 is fixedly connected to the inner wall of the linear slide 8. A cover plate 10 is attached to the upper surface of the bottom shell 1, and a second assembly bolt 11 is threadedly connected between the cover plate 10 and the end cover 5. The end cover 5 has an assembly plate 62 with an assembly strip 63 and an assembly slot 64 on the surface of the bottom shell 1. The end cover 5 is quickly positioned and assembled at both ends of the bottom shell 1 after expansion and assembly. The linear slide 8 with the motor mover 9 is assembled according to the high-precision linear stroke dual-station requirements of semiconductor processing. The cover plate 10 is assembled on the top of the bottom shell 1 by the second assembly bolt 11 to limit the installation of the linear slide 8. This facilitates quick and flexible expansion and assembly according to the high-precision linear stroke length and dual-station requirements of semiconductor processing, and improves the applicability of the linear motor.

[0036] Working principle: During use, multiple base shells 1 with motor stators 7 can be assembled according to the high-precision linear stroke length requirements of semiconductor processing. The end cover 5 is quickly positioned and assembled by the assembly plate 62 with assembly strips 63 and the assembly slots 64 on the surface of the base shell 1. According to the high-precision linear stroke dual-station requirements of semiconductor processing, a linear slide 8 with a motor mover 9 is assembled. The cover plate 10 is installed on the top of the base shell 1 by the second assembly bolt 11 to realize the limited installation of the linear slide 8. In the actual operation of the linear motor, the outer surface of the base shell 1 is provided with several heat dissipation fins 32.

[0037] These fins have through-hole heat dissipation grooves 31 and T-shaped slots 33 inside, which helps the linear motor to dissipate heat efficiently during semiconductor processing. The T-shaped slots 33 are equipped with air guide plates 34, which ensure ventilation and heat dissipation while effectively preventing dust from entering the bottom shell 1 and adhering to the surface of the motor stator 7, affecting magnetic flux and ensuring the normal operation of the linear motor. This structure is simple and can be quickly and flexibly expanded and assembled according to the high-precision linear stroke length and dual-station requirements of semiconductor processing, thus improving the applicability of the linear motor.

[0038] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-precision linear motor for semiconductor processing, comprising a base shell (1), characterized in that: A fixing seat (2) is fixedly connected to the outer surface of the bottom shell (1), a heat dissipation component (3) is provided on the surface of the bottom shell (1), and a splicing component (4) is provided on the surface of the bottom shell (1). The splicing assembly (4) includes a connecting hole plate (41), a connecting screw hole (42), a splicing post (43), and a splicing slot (44). The surface of the connecting hole plate (41) is fixedly connected to one side of the outer surface of the bottom shell (1). The connecting screw hole (42) is opened on the other side of the outer surface of the bottom shell (1). The two sides of the bottom shell (1) are movably snapped with end caps (5). An assembly assembly (6) is provided between the end caps (5) and the bottom shell (1). The inner wall of the bottom shell (1) is fixedly connected with a motor stator (7). The upper surface of the bottom shell (1) is slidably connected with a linear slide (8). The inner wall of the linear slide (8) is fixedly connected with a motor mover (9). The upper surface of the bottom shell (1) is fitted with a cover plate (10). A second assembly bolt (11) is threadedly connected between the cover plate (10) and the end cap (5).

2. The high-precision linear motor for semiconductor processing according to claim 1, characterized in that: The splicing post (43) is fixedly connected to one end of the bottom shell (1), and the splicing slot (44) is opened at the other end of the bottom shell (1). The outer wall of the splicing post (43) is adapted to the inner wall size of the splicing slot (44).

3. A high-precision linear motor for semiconductor processing according to claim 1, characterized in that: The heat dissipation assembly (3) includes a heat dissipation groove (31) and heat dissipation fins (32). The heat dissipation groove (31) is located on the inner surface of the bottom shell (1), and the ends of the heat dissipation fins (32) are fixedly connected to the outer surface of the bottom shell (1).

4. A high-precision linear motor for semiconductor processing according to claim 3, characterized in that: The heat dissipation fins (32) are evenly distributed along the length of the bottom shell (1). The surface of the heat dissipation fins (32) is provided with T-shaped through grooves (33) that penetrate the heat dissipation grooves (31). The interior of the T-shaped through grooves (33) is fixedly connected with air guide plates (34).

5. A high-precision linear motor for semiconductor processing according to claim 4, characterized in that: The air guide plate (34) has an isosceles triangular structure.

6. A high-precision linear motor for semiconductor processing according to claim 1, characterized in that: The assembly component (6) includes a positioning through hole (61), an assembly plate (62), an assembly slot (64), and an assembly base (65). The positioning through hole (61) is located on the outer surface of the end cover (5). One side of the inner surface of the assembly plate (62) is fixedly connected to the outer surface of the end cover (5), and the other side of the inner surface of the assembly plate (62) is fixedly connected to an assembly strip (63). The assembly slot (64) is located on the outer surface of the bottom shell (1). The outer wall of the assembly base (65) is fixedly connected to the inner wall of the end cover (5), and a first assembly bolt (66) is threaded between the assembly base (65) and the bottom shell (1).

7. A high-precision linear motor for semiconductor processing according to claim 6, characterized in that: The inner wall of the positioning through hole (61) is adapted to the outer wall size of the splicing insert (43).

8. A high-precision linear motor for semiconductor processing according to claim 6, characterized in that: The outer wall of the assembly strip (63) is adapted to the inner wall size of the assembly slot (64).

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