Fixing device for semiconductor wafer processing

Abstract

The utility model discloses a fixing device for semiconductor wafer processing, which relates to the technical field of semiconductor wafer processing and comprises a base. The placing table is arranged at the top of the base; the fixing mechanism is arranged in the placing table and is used for adsorbing and fixing the workpiece on the placing table; the calibration mechanism is arranged at the top of the base and used for correcting the workpiece on the placing table; wherein the calibration mechanism comprises a two-way threaded rod which is rotationally arranged at the top of the base; the sliding blocks are arranged at the top of the base in a sliding mode through guide rods, and the two sliding blocks are in threaded connection with the two-way threaded rod and are symmetrically arranged; the calibration plate is arranged at the top of the sliding block; the first motor is arranged at the top of the base and used for driving the two-way threaded rod to rotate, manual intervention errors are eliminated, the problem of local stress concentration generated by rigid clamping can be avoided, meanwhile, negative pressure adsorption fixing is adopted, and the risks of microcracks, contamination or coating damage possibly caused by direct contact between a traditional mechanical clamping jaw and the surface of a wafer are avoided.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor wafer processing, and more specifically, to a fixing device for semiconductor wafer processing. Background Technology

[0002] In the semiconductor wafer fabrication industry, precise wafer positioning and non-destructive wafer fixation are critical factors affecting process yield. Traditional fixation devices mostly employ rigid mechanical clamping structures (such as pneumatic grippers or chucks) to fix the wafer through physical contact pressure. However, mechanical clamping is prone to creating localized stress concentrations at the wafer edges, leading to microcracks or even breakage. At the same time, direct contact between the grippers and the wafer surface may introduce particulate contamination or scratch the surface coating, affecting subsequent photolithography or deposition processes.

[0003] Based on this, the present invention provides a fixing device for semiconductor wafer processing. Utility Model Content

[0004] To address the problems mentioned in the background art, this utility model provides a fixing device for semiconductor wafer processing, which uses negative pressure adsorption to fix the wafer, avoiding the risks of microcracks, contamination, or coating damage that may occur if traditional mechanical grippers come into direct contact with the wafer surface.

[0005] The present invention provides a fixing device for semiconductor wafer processing, which adopts the following technical solution:

[0006] A fixing device for semiconductor wafer processing includes a base; a placement stage disposed on top of the base; a fixing mechanism disposed within the placement stage for adsorbing and fixing a workpiece on the placement stage; and a calibration mechanism disposed on top of the base for correcting the workpiece on the placement stage. The calibration mechanism includes a bidirectional threaded rod rotatably disposed on top of the base; a pair of sliders slidably disposed on top of the base via guide rods, both sliders being threadedly connected to the bidirectional threaded rod and symmetrically arranged; a calibration plate disposed on top of the sliders; and a motor disposed on top of the base for driving the bidirectional threaded rod to rotate.

[0007] Preferably, the fixing mechanism includes a plurality of suction holes opened on the top of the placement platform, and all the suction holes are connected. A flexible tube is provided at the center of the bottom of the placement platform and is connected to the suction holes. A negative pressure pump is provided inside the base and the output end of the negative pressure pump is connected to the flexible tube.

[0008] Preferably, the top end of the hose is rotatably connected to the bottom of the placement platform.

[0009] Preferably, each of the two calibration plates has a horizontal plate on its opposite side.

[0010] Preferably, the base is provided with an electric actuator, the output end of which is rotatably connected to a movable sleeve via a connecting sleeve, and the placement platform is fixedly mounted on the top of the movable sleeve.

[0011] Preferably, a rotating sleeve is rotatably provided on the top of the base, the moving sleeve and the rotating sleeve are plugged into each other, a driven gear is provided on the outer side of the rotating sleeve, a driving gear is provided on the top of the base, the driving gear meshes with the driven gear, and a second motor for driving the driven gear to rotate is provided on the base.

[0012] In summary, this utility model has the following beneficial technical effects:

[0013] 1. A semiconductor wafer is placed on a placement stage. A motor drives a bidirectional threaded rod to rotate, causing two sliders to move closer together. This, in turn, moves two calibration plates closer together, bringing them into contact with the sides of the wafer and aligning it to the center of the placement stage. A fixing mechanism then uses negative pressure to hold the wafer in place. This structural design eliminates human intervention errors and avoids the localized stress concentration problems caused by rigid clamping. Furthermore, negative pressure fixation avoids the risks of microcracks, contamination, or plating damage that can occur with direct contact between traditional mechanical grippers and the wafer surface.

[0014] 2. After the wafer is fixed, the moving sleeve can be moved up and down by an electric actuator, which in turn moves the placement stage up and down, thereby adjusting the wafer's position and height. A second motor drives the drive gear to rotate, which in turn rotates the driven gear, causing the rotating sleeve to rotate. This rotation of the rotating sleeve, in turn, causes the moving sleeve to rotate, thus allowing the wafer on the placement stage to rotate along its axis to meet processing requirements. This structural design satisfies the multi-directional dynamic adaptation needs of the wafer processing process.

[0015] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a fixing device for semiconductor wafer processing according to an embodiment of the present invention;

[0017] Figure 2 This is a schematic diagram of the front structure of a fixing device for semiconductor wafer processing according to an embodiment of this utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the driving gear and the driven gear in an embodiment of this utility model;

[0019] Figure 4 This is a schematic diagram of the structure of the hose, moving sleeve, and rotating sleeve in an embodiment of this utility model;

[0020] Figure 5 This is a schematic diagram of the internal structure of the placement platform in an embodiment of this utility model;

[0021] Figure 6 This is a schematic diagram of the arc-shaped card strip in an embodiment of this utility model.

[0022] Explanation of reference numerals in the attached drawings: 1. Base; 2. Placement platform; 3. Fixing mechanism; 300. Suction hole; 301. Hose; 302. Negative pressure pump; 4. Calibration mechanism; 400. Bidirectional threaded rod; 401. Slider; 402. Guide rod; 403. Calibration plate; 404. Motor 1; 405. Horizontal plate; 5. Electric actuator; 6. Connecting sleeve; 7. Moving sleeve; 8. Rotating sleeve; 9. Driven gear; 10. Driving gear; 11. Motor 2. Detailed Implementation

[0023] The following is in conjunction with the appendix Figures 1 to 6 The present invention will be described in further detail below.

[0024] It should be noted that the accompanying drawings are schematic and not to scale. For clarity and convenience, the relative dimensions and proportions of the parts shown are exaggerated or reduced in size; all dimensions are merely illustrative and not limiting. Furthermore, the same reference numerals are used for the same structures, elements, or fittings appearing in more than two drawings to indicate similar features.

[0025] Example 1

[0026] This utility model discloses a fixing device for semiconductor wafer processing. (Refer to...) Figures 1 to 6 A fixing device for semiconductor wafer processing includes a base 1, a placement stage 2, a fixing mechanism 3, and a calibration mechanism 4; the placement stage 2 is disposed on the top of the base 1; the fixing mechanism 3 is disposed inside the placement stage 2 for adsorbing and fixing the workpiece on the placement stage 2; the calibration mechanism 4 is disposed on the top of the base 1 for correcting the workpiece on the placement stage 2.

[0027] The calibration mechanism 4 includes a bidirectional threaded rod 400, a pair of sliders 401, a calibration plate 403, and a motor 404. The bidirectional threaded rod 400 is rotatably mounted on the top of the base 1. The pair of sliders 401 are slidably mounted on the top of the base 1 via guide rods 402. Both sliders 401 are threadedly connected to the bidirectional threaded rod 400, and the two sliders 401 are symmetrically arranged. The calibration plate 403 is mounted on top of the sliders 401. The motor 404 is mounted on the top of the base 1 and is used to drive the bidirectional threaded rod 400 to rotate.

[0028] Specifically, such as Figure 6 As shown, arc-shaped clips are provided on the opposite sides of the two calibration plates 403, and the arc-shaped clips contact the calibration wafer.

[0029] Specifically, the semiconductor wafer is placed on the placement stage 2, and then the bidirectional threaded rod 400 is rotated by the motor 404, thereby moving the two sliders 401 closer to each other, thereby moving the two calibration plates 403 closer to each other, and the two calibration plates 403 come into contact with the side of the wafer and calibrate the wafer to the center of the placement stage 2. Then, the wafer is fixed by the fixing mechanism 3 with adsorption negative pressure.

[0030] This structural design eliminates human intervention errors and avoids the problem of local stress concentration caused by rigid clamping. At the same time, negative pressure adsorption fixation avoids the risk of microcracks, contamination or coating damage that may be caused by direct contact between traditional mechanical grippers and the wafer surface.

[0031] like Figure 4 and Figure 5 As shown, the fixing mechanism 3 includes multiple suction holes 300 opened on the top of the placement platform 2, and each suction hole 300 is connected. A flexible tube 301 is provided at the center of the bottom of the placement platform 2, and the flexible tube 301 is connected to the suction holes 300. A negative pressure pump 302 is provided inside the base 1, and the output end of the negative pressure pump 302 is connected to the flexible tube 301.

[0032] Specifically, the negative pressure pump 302 operates to create a negative pressure inside the suction hole 300, thereby adsorbing and fixing the wafer on the top of the placement stage 2.

[0033] Specifically, the top of the hose 301 and the bottom of the placement platform 2 are rotatable.

[0034] like Figure 1 As shown, each of the two calibration plates 403 has a horizontal plate 405 on its opposite side. The side of the horizontal plate 405 has an arc-shaped structure. This design can correct wafers with an area smaller than that of the placement stage 2 to the top center of the placement stage 2.

[0035] Example 2

[0036] This embodiment is a further optimization based on the first embodiment described above. The parts that are the same as those in the aforementioned technical solution will not be repeated here. Figure 1 and Figure 2 As shown, in order to better realize this utility model, the following arrangement is adopted. In this embodiment, an electric push rod 5 is provided inside the base 1, and a movable sleeve 7 is rotatably provided at the output end of the electric push rod 5 through the connecting sleeve 6. The placement platform 2 is fixedly installed at the top of the movable sleeve 7.

[0037] After the wafer is fixed, the moving sleeve 7 can be moved up and down by the electric push rod 5, thereby moving the placement stage 2 up and down, so as to adjust the wafer position height.

[0038] like Figure 3 and Figure 4 As shown, a rotating sleeve 8 is rotatably mounted on the top of the base 1, and the moving sleeve 7 is inserted into the rotating sleeve 8. A driven gear 9 is mounted on the outer side of the rotating sleeve 8, and a driving gear 10 is mounted on the top of the base 1. The driving gear 10 meshes with the driven gear 9, and a motor 11 is mounted on the base 1 to drive the driven gear 9 to rotate.

[0039] Specifically, the motor 11 can drive the drive gear 10 to rotate, which in turn causes the driven gear 9 to rotate, thereby causing the rotating sleeve 8 to rotate. The rotating sleeve 8 then causes the moving sleeve 7 to rotate, thus allowing the wafer on the stage 2 to rotate to meet the processing requirements.

[0040] This structural design satisfies the need for multi-directional dynamic adaptation in the wafer fabrication process.

[0041] All standard parts used in this utility model can be purchased from the market. Irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0042] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. "A plurality of" means two or more, unless otherwise explicitly specified.

[0043] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0044] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0045] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0046] The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

[0047] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A fixing device for semiconductor wafer processing, characterized in that, include: Base (1); A placement platform (2) is set on top of the base (1); The fixing mechanism (3) is set inside the placement table (2) and is used to adsorb and fix the workpiece on the placement table (2); A calibration mechanism (4) is set on top of the base (1) for calibrating the workpiece on the placement table (2); The calibration mechanism (4) includes: A two-way threaded rod (400) is rotatably mounted on the top of the base (1); A pair of sliders (401) are slidably disposed on the top of the base (1) via a guide rod (402). Both sliders (401) are threadedly connected to a bidirectional threaded rod (400), and the two sliders (401) are symmetrically arranged. A calibration plate (403) is set on top of the slider (401); Motor 1 (404) is located on top of base (1) and is used to drive the bidirectional threaded rod (400) to rotate.

2. The fixing device for semiconductor wafer processing according to claim 1, characterized in that: The fixing mechanism (3) includes a plurality of suction holes (300) opened on the top of the placement platform (2), and each suction hole (300) is connected. A flexible tube (301) is provided at the center of the bottom of the placement platform (2), and the flexible tube (301) is connected to the suction hole (300). A negative pressure pump (302) is provided inside the base (1), and the output end of the negative pressure pump (302) is connected to the flexible tube (301).

3. The fixing device for semiconductor wafer processing according to claim 2, characterized in that: The top end of the hose (301) and the bottom end of the placement platform (2) are rotatably connected.

4. The fixing device for semiconductor wafer processing according to claim 1, characterized in that: The two calibration plates (403) are provided with horizontal plates (405) on their opposite sides.

5. The fixing device for semiconductor wafer processing according to claim 1, characterized in that: The base (1) is equipped with an electric push rod (5), and the output end of the electric push rod (5) is rotatably equipped with a movable sleeve (7) through a connecting sleeve (6). The placement platform (2) is fixedly installed on the top of the movable sleeve (7).

6. The fixing device for semiconductor wafer processing according to claim 5, characterized in that: The base (1) has a rotating sleeve (8) rotatably mounted on its top. The moving sleeve (7) and the rotating sleeve (8) are inserted into each other. The outer side of the rotating sleeve (8) is provided with a driven gear (9). The top of the base (1) is provided with a driving gear (10). The driving gear (10) meshes with the driven gear (9). The base (1) is provided with a motor (11) for driving the driven gear (9) to rotate.

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