Slide holder and wafer detection equipment

Abstract

The utility model relates to a slide holder and wafer detection equipment. The slide holder comprises a suction cup, a base and a supporting structure. A plurality of adsorption grooves are formed in the adsorption face of the suction cup in a sunken mode, the adsorption grooves are arranged around the center of the adsorption face, and the distances between the adsorption grooves and the center are unequal. A plurality of first main air channels are formed in the base and used for being externally connected with an air source. The supporting structure is connected between the base and the suction cup, a plurality of first air passing channels are formed in the supporting structure, and at least part of the first main air channels communicate with the different adsorption grooves through the different first air passing channels correspondingly. The air channels arranged in the base and the supporting structure are used for replacing part of external pipelines to achieve communication between the air source and the adsorption tank, the number of the external pipelines can be reduced, complex pipeline arrangement is avoided, and the overall structure of the slide holder is simplified.

Description

Technical Field

[0001] This application relates to the field of semiconductor inspection technology, and in particular to wafer carrier stages and wafer inspection equipment. Background Technology

[0002] In the wafer inspection industry, wafer carrier stages generally need to be compatible with wafers of different sizes. Each size of wafer needs to be connected to a positive or negative pressure gas path to interact when vacuuming or breaking the vacuum, and the gas pipes of different sizes of wafers need to be controlled independently. This often requires multiple exposed gas pipes to be connected to the wafer carrier stage, making the pipeline layout of the wafer carrier stage redundant and resulting in an unsimplistic overall structure. Utility Model Content

[0003] Therefore, it is necessary to provide a wafer carrier stage and wafer inspection equipment to address the problems of cumbersome pipeline layout and simplistic overall structure of wafer carrier stages.

[0004] In a first aspect, this application provides a film stage, comprising:

[0005] A suction cup has multiple suction grooves recessed on its suction surface. Each of the suction grooves is arranged around the center of the suction surface and has a different radial distance from the center.

[0006] The base has multiple primary air passages inside, each of which is used to connect to an external air source.

[0007] A support structure is connected between the base and the suction cup, and has multiple first air passages inside, with at least a portion of the first main air passages connected to different adsorption grooves via different first air passages.

[0008] In some embodiments, the base is further provided with a multi-branch airway that communicates with the first main airway;

[0009] At least some of the branch air passages are connected to different first main air passages, and the connected branch air passages and the first main air passages are connected to different positions of the same adsorption tank via different first air passages.

[0010] In some embodiments, the stage includes a gas collection plate disposed on the base, and has multiple transition gas channels therein, with each of the first main gas channels communicating with the corresponding branch gas channels via different transition gas channels.

[0011] In some embodiments, the support structure includes a plurality of support columns spaced apart from the base;

[0012] Multiple first air passages on the same support column are connected to different adsorption tanks; corresponding first air passages on different support columns that are connected through the same first main air passage are connected to different positions in the same adsorption tank enclosure direction.

[0013] In some embodiments, the stage includes a first suction nozzle, which is mounted on the support structure;

[0014] The suction cup has an air passage hole inside, one end of which is connected to the adsorption groove, and the first suction nozzle is sealed to the first air passage and the other end of the air passage hole.

[0015] In some embodiments, the stage includes a mounting platform and a push rod. The suction cup has a through hole that penetrates the adsorption surface and avoids the adsorption groove. The mounting platform is movably disposed along the extension direction of the through hole and can drive the push rod to move along the through hole during movement. The push rod has a top support end that can pass through the through hole.

[0016] In some embodiments, the mounting platform is provided with a second main air duct that can be connected to an external air source, and the top rod is provided with a second air passage that passes through the top support end, the second air passage connecting the second main air duct and the atmosphere.

[0017] In some embodiments, a plurality of push rods are configured, and the plurality of push rods are arranged around the center of the adsorption surface.

[0018] In some embodiments, the support structure includes a plurality of support columns, each of which is provided with a plurality of first air passages communicating with different adsorption tanks; all the support columns are arranged around the mounting platform and all the top rods.

[0019] In some embodiments, the mounting platform is provided with a mounting hole, and the top rod is sealed and mounted in the mounting hole via a sealing device;

[0020] The top support end of the top rod is provided with a second suction nozzle.

[0021] In some embodiments, the base has an air receiving side, which is provided with a plurality of first air nozzles. One end of each of the first main air passages passes through the air receiving side and is equipped with a first air nozzle.

[0022] Secondly, this application provides a wafer inspection device, including an inspection apparatus and a wafer stage as described in any of the above embodiments, wherein the inspection apparatus is used to inspect a wafer located on the adsorption surface.

[0023] The aforementioned wafer stage and wafer inspection equipment, by constructing a first main air channel within the base and a first through air channel within the support structure, allows the negative pressure provided by the negative pressure source to be transmitted sequentially through the first main air channel and the first through air channel to the adsorption tank, thereby achieving the adsorption function of the suction cup. Compared to existing solutions that connect the air source and the adsorption tank via external pipelines, this embodiment utilizes air channels built into the base and support structure to replace part of the external pipelines to achieve the connection between the negative air source and the adsorption tank. This reduces the number of external pipelines, avoids complex pipeline layouts, and simplifies the overall structure of the wafer stage. Attached Figure Description

[0024] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0025] Figure 1 This is a schematic diagram of the external shape of the stage in some embodiments.

[0026] Figure 2 for Figure 1 Another view of the stage plate shown.

[0027] Figure 3 for Figure 1 The diagram shows the internal structure of the slide stage.

[0028] Figure 4 for Figure 1 Another internal structure diagram of the slide stage is shown.

[0029] Figure 5 This is a view showing the air path distribution of the base and air collection plate in some embodiments.

[0030] Figure 6 for Figure 5 A schematic diagram of the internal structure of the gas collecting plate in the structure shown.

[0031] Figure 7 for Figure 3 Enlarged view of point A in the middle.

[0032] Figure 8 This is a schematic diagram of the internal structure of the stage in some embodiments.

[0033] Figure 9 This is a perspective view of the mounting platform for some embodiments.

[0034] The reference numerals in the detailed embodiments are as follows:

[0035] 100. Tablet stage; 10. Suction cup; S. Adsorption surface; 11. Adsorption groove; 12. Air passage hole; 13. Through hole; 11a. Circumferential groove; 11b. Radial groove; 20. Base; 21. First main air passage; 22. Branch air passage; J. Air receiving side; 23. First air nozzle; 30. Support structure; 31. First air passage; 32. Support column; 40. Air collecting plate; 41. Transition air passage; 42. Connecting hole; 50. First suction nozzle; 60. Mounting platform; 61. Second main air passage; 62. Mounting hole; 63. Second air nozzle; 70. Top rod; D. Top support end; 71. Second air passage; 80. Second suction nozzle; 90. Sealing device. Detailed Implementation

[0036] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0037] In the description of this application, it should be understood that, where they appear, the terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0038] Furthermore, where applicable, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., shall be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral part; they may refer to a mechanical connection or an electrical connection; they may refer to a direct connection or an indirect connection through an intermediate medium; they may refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0040] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0041] It should be noted that, if an element is described as "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is described as "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0042] This application addresses the problem of cumbersome external piping layout and an unsimplistic overall structure of a wafer carrier stage by providing a wafer carrier stage and a wafer inspection device. The wafer carrier stage in this application can be used, but is not limited to, for adsorbing wafers; it can also be applied to the adsorption of other adsorbed components. It is worth noting that this application uses wafers as an example for illustration and is not intended to limit the application of the solution.

[0043] Figure 1 This is a schematic diagram of the external shape of the stage in some embodiments. Figure 2 for Figure 1 Another view of the stage plate shown. Figure 3 for Figure 1 The diagram shows the internal structure of the slide stage. Figure 4 for Figure 1 Another internal structure diagram of the slide stage is shown.

[0044] Please refer to Figures 1 to 4The stage 100 in this embodiment includes a suction cup 10, a base 20, and a support structure 30. Multiple suction grooves 11 are recessed on the suction surface S of the suction cup 10, and each suction groove 11 is arranged around the center of the suction surface S, with varying distances from the center. The base 20 contains multiple first main air channels 21, each used to connect to an external air source. The support structure 30 connects the base 20 and the suction cup 10, and contains multiple first air passages 31. At least some of the first main air channels 21 are connected to different suction grooves 11 via different first air passages 31.

[0045] The chuck 10 is the main structure of the wafer stage 100 for adsorbing wafers, and its adsorption surface S is used to support and adsorb the wafers. Multiple adsorption grooves 11 are recessed on the adsorption surface S, each groove 11 is arranged around the center of adsorption, and the distance from each groove 11 to the center of the adsorption surface S is unequal. The distance from each groove 11 to the center can be understood as the shortest distance between each groove 11 and the center. If each groove 11 is an annular groove, then this distance is the radial distance from each groove 11 to the center.

[0046] It is worth emphasizing that each adsorption tank 11 is arranged around the center of the adsorption surface S. Specifically, the adsorption tank 11 can be a continuous ring structure arranged in a circle around the center, such as a circular ring or a square ring, or it can be a discontinuous ring structure arranged in a discontinuous manner around the center (it can be understood that the adsorption tank 11 includes multiple adsorption sections located in its surrounding direction).

[0047] Specifically, each adsorption cell 11 may include at least one circumferential groove 11a, with each circumferential groove 11a arranged in a ring around the center of the adsorption surface S. The circumferential groove 11a may be circular, square, or other annular in shape. When each adsorption cell 11 includes multiple circumferential grooves 11a, the adsorption cell 11 may also include radial grooves 11b connecting its multiple circumferential grooves 11a, with the radial grooves 11b intersecting the circumferential grooves 11a. In this case, the adsorption cell 11 occupies a larger arrangement area, providing a better adsorption effect. In practical applications, the gas source can be connected to different adsorption cells 11 to allow the suction cup 10 to adsorb wafers of different sizes. Figure 1 In the embodiment, three adsorption grooves 11 are formed on the adsorption surface S. Each adsorption groove 11 includes multiple circumferential grooves 11a and radial grooves 11b. Each adsorption groove 11 is not connected to the others.

[0048] A support structure 30 is mounted on a base 20, and a suction cup 10 is mounted on the support structure 30. A first main air passage 21 for connection to a negative pressure air source is formed within the base 20, and a first through air passage 31 is formed within the support structure 30. The first through air passage 31 connects the first main air passage 21 and the adsorption tank 11, so that the negative pressure provided by the negative pressure source passes sequentially through the first main air passage 21 and the first through air passage 31 to reach the adsorption tank 11, thereby achieving wafer adsorption. Specifically, the inlet end of the first main air passage 21 is used to install a first air nozzle 23, which connects to the negative pressure source.

[0049] Multiple first main air ducts 21 and multiple first through air ducts 31 are configured. At least a portion of the first main air ducts 21 are connected to different adsorption tanks 11 via different first through air ducts 31. By controlling a negative pressure source connected to different first main air ducts 21, negative pressure is provided to different adsorption tanks 11. Alternatively, all first main air ducts 21 may be connected to different adsorption tanks 11, or a portion of the first main air ducts 21 may be connected to the same adsorption tank 11. Optionally, the number of first main air ducts 21 is equal to the number of adsorption tanks 11, and they are connected in a one-to-one correspondence.

[0050] The aforementioned slide stage 100, by constructing a first main air channel 21 within the base 20 and a first through air channel 31 within the support structure 30, allows the negative pressure provided by the negative pressure source to be transmitted sequentially through the first main air channel 21 and the first through air channel 31 to the adsorption tank 11, thereby realizing the adsorption function of the suction cup 10. Compared to the existing solution that connects the air source and the adsorption tank 11 through external pipelines, in this embodiment, the air channels built into the base 20 and the support structure 30 replace part of the external pipelines to achieve the connection between the negative air source and the adsorption tank 11, which can reduce the number of external pipelines, avoid complicated pipeline layout, and simplify the overall structure of the slide stage 100.

[0051] In some embodiments, combined with Figure 3 and Figure 4 Understandably, the base 20 has multiple branch air passages 22 that are connected to the first main air passage 21. At least some of the branch air passages 22 are connected to different first main air passages 21, and the connected branch air passages 22 and the first main air passages 21 are connected to different positions in the same adsorption tank 11 enclosure direction via different first air passages 31.

[0052] Each primary air duct 21 can be connected to at least one secondary air duct 22, which serves to divert the airflow from each primary air duct 21. Each secondary air duct 22 and the primary air duct 21 connected thereto are connected to different positions of the same adsorption tank 11 via different primary air passages 31. In practice, the base 20, support structure 30, and suction cup 10 are arranged vertically in sequence. The primary air passages 31 within the support structure 30 extend from bottom to top to connect the same adsorption tank 11 to the primary air duct 21 or to the secondary air passage 22 connected to the primary air duct 21.

[0053] The enclosure direction of the adsorption tank 11 refers to the direction in which it is set around the center of the adsorption surface S. The first main air passage 21 and the branch air passage 22, which are connected, can be connected to the same circumferential tank 11a or to different circumferential tanks 11a through the first air passage 31, as long as they are connected to different positions in the enclosure direction of the same adsorption tank 11.

[0054] In this way, the negative pressure of the gas source can be transmitted synchronously to different positions in the same adsorption tank 11 enclosure direction through the first main gas channel 21 and the branch gas channel 22, so that the adsorption tank 11 can provide basically equivalent adsorption force from multiple positions simultaneously, the adsorption force on the wafer is more uniform, and the adsorption is more stable.

[0055] Moreover, each of the first main air passages 21 is connected to different positions of the same adsorption tank 11 via branch air passages 22, which can reduce the number of first main air passages 21, further reduce the number of external pipelines used, and further simplify the pipeline layout.

[0056] In other embodiments, if multiple first main air channels 21 are connected to the same adsorption tank 11, then the multiple first main air channels 21 are connected to different positions in the enclosing direction of the adsorption tank 11.

[0057] Figure 5 This is a view showing the airflow distribution of the base 20 and the air collection plate 40 in some embodiments. Figure 6 for Figure 5 A schematic diagram of the internal structure of the gas collecting plate 40 in the structure shown.

[0058] In some embodiments, refer to Figure 5 and Figure 6 The stage 100 includes a gas collecting plate 40, which is disposed on the base 20 and has multiple transition air passages 41. Each first main air passage 21 is connected to a corresponding branch air passage 22 via different transition air passages 41.

[0059] The transition air passage 41 is a channel structure formed inside the air collecting plate 40. The air collecting plate 40 and the base plate are usually connected separately, for example, by fasteners such as bolts. Specifically, each transition air passage 41 is provided with a connecting hole 42 corresponding to the first main air passage 21 and the branch air passage 22, and each transition air passage 41 is connected to the first main air passage 21 and the branch air passage 22 through different connecting holes 42. Understandably, the base 20 is also provided with a hole structure to connect the first main air passage 21 to the connecting hole 42, and the branch air passage 22 to the connecting hole 42.

[0060] In practical applications, such as Figure 4 As shown, the first main air passage 21 and the branch air passage 22 can be obtained by drilling holes from the surface of the base 20 toward the interior of the base 20 using a drilling tool. In order to connect the first main air passage 21 and the branch air passage 22, in some embodiments, an intermediate air passage with the same function as the transition air passage 41 can be machined inside the base 20 to connect the first main air passage 21 and the corresponding branch air passage 22. In this embodiment, the transition air passage 41 is formed using an externally mounted air collecting plate 40 on the base 20, and the connection between the first main air passage 21 and the branch air passage 22 is achieved using the transition air passage 41. Compared to machining the intermediate air passage inside the base 20, this greatly simplifies the machining process and allows for flexible design of the arrangement positions of the first main air passage and the branch air passage 22 within the base 20.

[0061] In one specific embodiment, reference is made to Figure 5 The base 20 is provided with a direction along the predetermined direction ( Figure 5 A plurality of first main air passages 21 are arranged sequentially in a left-right direction, and a plurality of branch air passages 22 are also arranged sequentially along the predetermined direction. The plurality of first main air passages 21 and the plurality of branch air passages 22 are spaced apart in the predetermined direction. A plurality of transition air passages 41 are provided on the air collecting plate 40, all extending along the predetermined direction. Each transition air passage 41 is arranged side by side in a direction intersecting the predetermined direction. Along the side-by-side direction of the transition air passages 41, the length of each transition air passage 41 decreases sequentially. The side of the plurality of first main air passages 21 facing the plurality of branch air passages 22 is defined as its inner side, and the side of the plurality of branch air passages 22 close to the plurality of first main air passages 21 is defined as its inner side. According to the order of arrangement from the outside to the inside, each first main air passage 21 is connected to a branch air passage 22 of the same order via a transition air passage 41, and the length of the transition air passage 41 connecting the innermost first main air passage 21 and the innermost branch air passage 22 is the shortest.

[0062] Figure 7 for Figure 3 A magnified view of point A. In some embodiments, refer to... Figure 7The stage 100 includes a first suction nozzle 50, which is mounted on the support structure 30. The suction cup 10 has an air passage 12, one end of which is connected to the adsorption groove 11. The first suction nozzle 50 is sealed to the first air passage 31 and the other end of the air passage 12.

[0063] Specifically, each suction cup 10 can be equipped with multiple air passages 12 corresponding to each adsorption groove 11. The air passages 12 are distributed and can transmit negative pressure to multiple positions in the adsorption groove 11. For example, different air passages 12 are connected to different circumferential grooves 11a. For another example, some air passages 12 are connected to circumferential grooves 11a, and some air passages 12 are connected to radial grooves 11b.

[0064] One end of the first suction nozzle 50 is sealed and installed at the outlet end of the first air passage 31, and the other end is sealed and connected to the air passage 12, thus sealing and connecting the first air passage 31 and the internal air passage of the suction cup 10. Specifically, a mounting hole 62 can be provided at the bottom of the suction cup 10, and the first suction nozzle 50 is inserted into the mounting hole 62 and sealed and connected to the air passage 12. In this way, even when the suction cup 10 and the support structure 30 are processed independently, an effective sealed connection between the suction cup 10 and the first air passage 31 can still be achieved.

[0065] Figure 8 This is a schematic diagram of the internal structure of the stage 100 in some embodiments. Figure 9 This is a perspective view of the mounting platform 60 in some embodiments.

[0066] In some embodiments, refer to Figure 8 The stage 100 includes a mounting platform 60 and a push rod 70. The suction cup 10 has a through hole 13 penetrating the suction surface S, which avoids the suction groove 11. The mounting platform 60 is movable along the extension direction of the through hole 13, and during the movement, it can drive the push rod 70 to move along the through hole 13. The push rod 70 has a support end D that can pass through the through hole 13.

[0067] In practical applications, the through hole 13 extends vertically through the adsorption surface S and the surface of the suction cup 10 opposite to the adsorption surface S. The through hole 13 is offset from the adsorption tank 11 to prevent air leakage from the adsorption tank 11, which would affect the adsorption effect.

[0068] Specifically, the mounting platform 60 is mounted on a lifting mechanism, which may, but is not limited to, be mounted on the base 20. The lifting mechanism drives the mounting platform 60 to move up and down, thereby causing the top rod 70 to move up and down along the through hole 13.

[0069] In practical applications, after the negative pressure supply is stopped, the push rod 70 can be driven to move until its top support end D passes through the through hole 13, thereby lifting the wafer and quickly breaking the negative pressure adsorption so that the wafer can be removed. When placing the wafer, the top support end D of the push rod 70 can also extend out of the through hole 13 and receive the wafer from the transfer robot, and then the top plate 70 descends until the wafer falls on the adsorption surface S.

[0070] Further in the embodiments, refer to Figure 8 and Figure 9 The mounting platform 60 has a second main air passage 61 that can be connected to an external air source, and the top rod 70 has a second air passage 71 that passes through the top support end D. The second air passage 71 connects the second main air passage 61 and the atmosphere.

[0071] The inlet end of the second main air duct 61 is used to install the second air nozzle 63, which is connected to either a negative pressure source or a positive pressure source. When the second main air duct 61 is connected to a negative pressure source, the negative pressure can act on the wafer on the adsorption surface S through the second main air duct 61 and the second through air duct 71, enhancing the adsorption effect on the wafer. When the second main air duct 61 is connected to a positive pressure source, the positive pressure can act on the wafer through the second main air duct 61 and the second through air duct 71, breaking the adsorption of the wafer by the suction cup 10, making it easier to remove the wafer.

[0072] Understandably, when it is necessary to adsorb the wafer onto the adsorption surface S, the support end D of the push rod 70 can be accommodated within the through hole 13 without interfering with the wafer placement. When the support end D is accommodated within the through hole 13, its end face can be flush with or lower than the end face of the through hole 13. When the second air passage 71 is connected to negative pressure, the end face of the support end D can be flush with the through hole 13 and contact the wafer to provide negative pressure adsorption.

[0073] In some embodiments, combined with Figure 2 and Figure 8 It is understood that there are multiple push rods 70, and the multiple push rods 70 are arranged around the center of the adsorption surface S.

[0074] Multiple push rods 70 can be installed on the mounting stage 60, corresponding to multiple through holes 13 on the suction cup 10. Each push rod 70 is inserted into a corresponding through hole 13. The multiple push rods 70 are spaced apart from each other and arranged around the center of the adsorption surface S. In this way, the multiple push rods 70 are distributed relative to the adsorption surface S, supporting the wafer from multiple positions, so that the wafer is subjected to uniform force and the pick-and-place is more stable.

[0075] Specifically, multiple push rods 70 can be arranged on the same circle surrounding the center of the adsorption surface S. That is, the distance from the projection center of each push rod 70 along its direction of movement to the center of the adsorption surface S is equal. In this way, the supporting force on the wafer is more evenly distributed, and the wafer is lifted more stably.

[0076] In some embodiments, refer to Figure 2 and Figure 3 The support structure 30 includes multiple support columns 32 spaced apart from the base 20. Multiple first air passages 31 on the same support column 32 are connected to different adsorption tanks 11. The corresponding first air passages 31 on different support columns 32, which are connected through the same first main air passage 21, are connected to different positions of the same adsorption tank 11.

[0077] Can the multiple support columns 32 arranged at intervals be arranged around the center of the adsorption surface S? Each support column 32 is independently supported between the base 20 and the suction cup 10. Each support column 32 is provided with multiple first air passages 31, and the adsorption tank 11 and the first main air passage 21 connected to each first air passage 31 are different. When the base 20 is constructed with a first main air passage 21 and branch air passages 22, the first air passages 31 of some support columns 32 are connected to the first main air passage 21, and the first air passages 31 of some support columns 32 are connected to the branch air passages 22.

[0078] The first air passages 31 on different support columns 32 that are connected to the same first main air passage 21 are connected to different positions in the same adsorption tank 11. That is, the first air passages 31 on different support columns 32 that are connected to the same main air passage 21 are connected to different positions in the same adsorption tank 11. Specifically, among the multiple first air passages 31 on different support columns 32 that are connected to the same adsorption tank 11, some of the first air passages 31 can be directly connected to the corresponding first main air passage 21, and the other part can be connected to the corresponding first main air passage 21 through the branch air passage 22 and the transition air passage 41.

[0079] At this time, multiple independently set support columns 32 are arranged at different positions in the adsorption tank 11 to deliver the negative pressure input from the same first main air channel 21 to different positions in the same adsorption tank 11 enclosure direction. The structure is simple and easy to implement.

[0080] In a preferred embodiment, the support structure 30 includes a plurality of support columns 32, each support column 32 being provided with a plurality of first air passages 31 communicating with different adsorption tanks 11. All support columns 32 are arranged around the mounting platform 60 and all top rods 70.

[0081] Thus, all the push rods 70 are arranged inside all the support columns 32, so that the push rods 70 can support wafers of different sizes and adapt to the loading and unloading of wafers of different sizes.

[0082] In some embodiments, refer to Figure 8The mounting platform 60 is provided with a mounting hole 62, and the push rod 70 is sealed and installed in the mounting hole 62 via a sealing device 90. The sealing device 90 can be a sealing ring, etc., which is sleeved on the part of the push rod 70 located in the mounting hole 62 to achieve sealed communication between the second air passage 71 and the second main air passage 61 inside the push rod 70.

[0083] In some embodiments, refer to Figure 8 The top support end D of the top rod 70 is provided with a second suction nozzle 80. The second suction nozzle 80 allows the top support end D to make flexible contact with the wafer, avoiding damage to the wafer, and also serves to transmit positive or negative pressure. In the embodiments of this application, both the first suction nozzle 50 and the second suction nozzle 80 can be commercially available conventional suction nozzle products. Specifically, the suction nozzle includes a retractable flexible tube section (such as a corrugated tube), and the suction nozzle is compressibly installed between two connected components to achieve a sealed connection between them.

[0084] In some embodiments, refer to Figure 2 The base 20 has an air-receiving side J, on which multiple first air nozzles 23 are provided. One end of each first main air passage 21 passes through the air-receiving side J and is equipped with a first air nozzle 23. At this time, the operator can install the first air nozzles 23 on the same side of the base 20 to speed up the installation of the first air nozzles 23, and can also quickly install multiple pipelines of the negative pressure source at the corresponding first air nozzles 23.

[0085] The first air nozzle 23 and the second air nozzle 63 in this embodiment are used to install pipelines that are connected to the corresponding negative pressure source or positive pressure source.

[0086] In addition, the wafer inspection equipment proposed in this application includes an inspection device and a wafer stage 100. The inspection device is used to inspect the wafer located on the adsorption surface S.

[0087] Specifically, wafer inspection equipment can be, but is not limited to, optical inspection equipment, used to inspect critical dimensions (such as linewidth, lineheight, film thickness, roughness, etc.), light transmittance, surface defects, etc., of wafers. As an example, the inspection device includes a detection light source, a detection camera, and a computer. The detection light source emits detection light onto the chuck 10, the detection camera acquires an image of the wafer, and the computer uses this image to inspect the wafer's light transmittance, surface defects, critical dimensions, etc.

[0088] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A slide stage (100), characterized in that, include: The suction cup (10) has a plurality of suction grooves (11) recessed on its suction surface (S). Each of the suction grooves (11) is arranged around the center of the suction surface (S), and the distance from each of the suction grooves (11) to the center is not equal. The base (20) has multiple first main air passages (21) inside, and each first main air passage (21) is used to connect to an external air source; and A support structure (30) is connected between the base (20) and the suction cup (10), and has multiple first air passages (31) therein. At least a portion of the first main air passages (21) are connected to different adsorption grooves (11) via different first air passages (31).

2. The stage (100) according to claim 1, characterized in that, The base (20) also contains a multi-branch airway (22) that communicates with the first main airway (21); At least some of the branch air passages (22) are connected to different first main air passages (21), and the connected branch air passages (22) and the first main air passages (21) are connected to different positions in the same adsorption tank (11) enclosure direction via different first air passages (31).

3. The stage (100) according to claim 2, characterized in that, The slide stage (100) includes a gas collection plate (40), which is disposed on the base (20) and has multiple transition air channels (41) inside. Each of the first main air channels (21) is connected to the corresponding branch air channel (22) via different transition air channels (41).

4. The stage (100) according to any one of claims 1-3, characterized in that, The support structure (30) includes a plurality of support columns (32) spaced apart from the base (20); Multiple first air passages (31) on the same support column (32) are connected to different adsorption tanks (11); corresponding first air passages (31) on different support columns (32) are connected to different positions of the same adsorption tank (11) through the same first main air passage (21).

5. The stage (100) according to any one of claims 1-3, characterized in that, The stage (100) includes a first suction nozzle (50), which is mounted on the support structure (30); The suction cup (10) has an air passage (12) inside, one end of which is connected to the adsorption groove (11), and the first suction nozzle (50) is sealed to the other end of the first air passage (31) and the air passage (12).

6. The stage (100) according to any one of claims 1-3, characterized in that, The slide stage (100) includes a mounting platform (60) and a push rod (70). The suction cup (10) is provided with a through hole (13) that penetrates the adsorption surface (S). The through hole (13) avoids the adsorption groove (11). The mounting platform (60) is movably disposed along the extension direction of the through hole (13), and during the movement, it can drive the push rod (70) to move along the through hole (13). The push rod (70) has a top support end (D) that can pass through the through hole (13). The mounting platform (60) has a second main air passage (61) that can be connected to an external air source. The top rod (70) has a second air passage (71) that passes through the top support end (D). The second air passage (71) connects the second main air passage (61) and the atmosphere.

7. The stage (100) according to claim 6, characterized in that, Multiple top rods (70) are provided, and the multiple top rods (70) are arranged around the center of the adsorption surface (S); The support structure (30) includes a plurality of support columns (32), each of the support columns (32) being provided with a plurality of first air passages (31) connected to different adsorption grooves (11); all the support columns (32) are arranged around the mounting platform (60) and all the top rods (70).

8. The stage (100) according to claim 6, characterized in that, The mounting platform (60) is provided with a mounting hole (62), and the top rod (70) is sealed and installed in the mounting hole (62) via a sealing device (90); The top support end (D) of the top rod (70) is provided with a second suction nozzle (80).

9. The stage (100) according to any one of claims 1-3, characterized in that, The base (20) has an air receiving side (J), and the air receiving side (J) is provided with a plurality of first air nozzles (23). One end of each of the first main air channels (21) passes through the air receiving side (J) and is equipped with the first air nozzle (23).

10. A wafer inspection device, characterized in that, Includes a detection device and a wafer stage (100) as described in any one of claims 1-9, the detection device being used to detect a wafer located on the adsorption surface (S).

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