Wafer box cross-unit or cross-line body carrying device with anti-collision function

Abstract

The utility model discloses a wafer box cross-unit or cross-line body carrying device with an anti-collision function. The wafer box cross-unit or cross-line body carrying device comprises a main frame, a carrying assembly is arranged on one side of the main frame, one end of the carrying assembly is arranged outside the main frame, and the other end of the carrying assembly is located at the bottom of the main frame. The carrying assembly and the main frame are vertically distributed; the top of the main frame is further provided with a three-axis mechanical arm, and the three-axis mechanical arm is located over the carrying assembly. By means of the designed suction assembly, an existing direct connection mode with a suction cup is abandoned, dislocation flexible connection is adopted, even if the three-axis mechanical arm rapidly descends, the wafer disc cannot be damaged, meanwhile, rapid connection can be achieved, the defects of an existing carrying device in the suction wafer disc are overcome, and the efficiency of carrying the wafer disc is improved. And meanwhile, the suction assembly can achieve negative pressure without additionally arranging a vacuumizing assembly, the manufacturing cost of the whole carrying device is further reduced, and follow-up maintenance is facilitated.

Description

Technical Field

[0001] This utility model belongs to the field of wafer box handling technology, specifically relating to a wafer box cross-unit or cross-line handling device with anti-collision function. Background Technology

[0002] In the precision processes of semiconductor manufacturing, wafer cassette handling is crucial, and the introduction of automation technology has made this process more efficient, precise, and reliable. Traditional manual handling of wafer cassettes is not only inefficient but also carries the risk of wafers falling or colliding due to human error, thus affecting wafer quality and causing significant economic losses. Today, automated wafer cassette handling systems have become the mainstream choice for semiconductor factories. These systems utilize advanced robotic arms, track transport devices, and intelligent control systems to achieve fully automated wafer cassette handling. The robotic arms can precisely grasp wafer cassettes with micron-level precision, ensuring that the cassettes are not damaged during handling. The track transport devices act as high-speed, stable "transport channels," quickly and accurately transporting wafer cassettes to designated locations. The intelligent control system is the "brain" of the entire automated handling system; it can plan the optimal handling path in real time based on production needs, coordinating the actions of various handling devices to achieve efficient collaborative operation. Automated wafer cassette handling not only significantly improves handling efficiency and shortens production cycles but also reduces the impact of human factors on wafer quality, increases product yield, and brings significant economic benefits and competitive advantages to semiconductor manufacturing companies.

[0003] In existing handling devices, a three-axis robot rapidly descends to the position of the wafer disk and then picks it up using a suction cup. At the same time, the suction cup needs to be operated under negative pressure by a vacuum device. However, if the descent speed of the three-axis robot is too fast, it will cause the suction cup to collide with the wafer disk, thereby damaging the wafer disk. Therefore, it has significant limitations in practical use and there is room for improvement. Utility Model Content

[0004] The purpose of this invention is to provide a wafer cassette cross-unit or cross-line transport device with anti-collision function, so as to solve the problem that existing transport devices mentioned in the background art are prone to damaging wafer disks during the picking up of wafer disks.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a wafer cassette cross-unit or cross-line transport device with anti-collision function, comprising a main frame; a transport component is provided on one side of the main frame, one end of the transport component is placed outside the main frame, and the other end is located at the bottom of the main frame; and the transport component is distributed perpendicularly to the main frame; a three-axis robot is also provided on the top of the main frame, the three-axis robot is located directly above the transport component, and the wafer cassette is transported by the three-axis robot and placed on a railcar; a suction component is installed at the bottom of the three-axis robot, the suction component comprising: a connector, fixed to the bottom of the three-axis robot, the connector shrinking its height during downward pressure; and a suction element, located at the bottom of the connector, which discharges its internal air and forms a negative pressure when the connector is pressed down, thereby achieving adsorption of the wafer cassette without the need for external vacuum equipment.

[0006] Preferably, the connector includes a connecting post, the bottom of which is fixed with an integral limiting post, and the top of which is mounted on a three-axis robotic arm.

[0007] Preferably, the suction component is a suction cup with an air tube inserted into its top. The air tube is connected to an external air blowing device. When placing a wafer cassette, the external air blowing device blows air into the suction cup, eliminating the negative pressure inside and allowing the wafer cassette to be placed. An exhaust port is located on the bottom side of the suction cup, and a film is placed inside the exhaust port. The surface of the film has a cross-shaped groove. When the suction cup is pressed down, the air inside the suction cup pushes the film up and exits through the cross-shaped groove. After the air is completely expelled, the cross-shaped groove closes. A collar is also fitted onto the connecting post, and a fixing ring is fixed to the side of the collar via a plate. The fixing ring is fixed to the suction cup, and a spring is also provided between the collar and the top of the connecting post. The spring is sleeved on the connecting post, and the bottom end of the spring is limited on the limiting post. When the three-axis robot presses down to pick up the wafer disk, the suction cup will move down synchronously under the initial elastic force limit of the spring until the suction cup contacts the wafer disk. At this time, the three-axis robot continues to descend. Since the suction cup has already contacted the wafer disk, the connecting post will be squeezed by the descending three-axis robot. At this time, the connecting post rebounds, and the elastic force of the rebound will expel the air inside the suction cup, avoiding the phenomenon of excessive pressure caused by directly driving the suction cup through the three-axis robot and damaging the wafer disk.

[0008] Preferably, a buffer assembly is also provided inside the main frame, and multiple buffer assemblies are provided and symmetrically distributed on both sides of the transport assembly; a railcar is also provided outside the main frame. The railcar moves towards the interior of the main frame under the push of the transport assembly, so as to push the railcar directly below the three-axis robot, thereby placing the wafer disk picked up by the three-axis robot. In use, the transport assembly first places the wafer box in the buffer assembly, and then the railcar picks up the wafer box temporarily stored in the buffer assembly and puts it onto the railcar. By loading from the left and right sides, perpendicular to the direction of travel of the railcar and without contact, the collision caused by the accidental start of the railcar during the picking process of the three-axis robot is avoided.

[0009] Preferably, the three-axis manipulator has synchronous wheels on both sides, and a synchronous belt is provided on the main frame to drive the synchronous wheels to rotate, thereby realizing the change of the loading and unloading position of the three-axis manipulator. Since this structure is existing technology, it will not be described in detail here. The vertical projected area of ​​the three-axis manipulator is equal to the projected area of ​​the railcar.

[0010] Preferably, a travel track is also provided on the outer side of the main frame, and the track vehicle moves along the travel track. The travel track is parallel to the side of the main frame. The travel track connects the main frames of multiple units or different lines, realizing the transportation of wafer boxes at different positions. Node components are also installed on the outer wall of the travel track. The node components contact the track vehicle, and the position of the track vehicle is obtained through the node components, providing data support for automation.

[0011] Preferably, the main frame is provided with a track for the railcar to move, so that the railcar can be pushed into the main frame by the push of the transport component, and the track is located directly below the three-axis manipulator.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] By designing a suction component, the existing direct connection to the suction cup is abandoned in favor of a staggered flexible connection. Even if the three-axis robot descends rapidly, the wafer disk will not be damaged. At the same time, it can also achieve quick connection, which improves the shortcomings of existing handling devices in picking up wafer disks. In addition, the suction component can achieve negative pressure without the need for a separate vacuum component, further reducing the manufacturing cost of the entire handling device and facilitating subsequent maintenance. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a top view of the railcar of this utility model when it is picking up materials;

[0016] Figure 3 This is a top view of the track vehicle of this utility model receiving the wafer box and entering the track system;

[0017] Figure 4 This is a cross-sectional view of the suction component of this utility model;

[0018] Figure 5 This is a top view of the connection between the collar and the fixed ring of this utility model.

[0019] In the picture:

[0020] 1. Railcar; 2. Three-axis robot; 3. Handling assembly; 4. Buffer assembly; 5. Node assembly; 6. Connecting column; 7. Spring; 8. Limiting column; 9. Fixing ring; 10. Air tube; 11. Suction cup; 12. Exhaust port; 13. Film; 14. Collar. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figures 1 to 5 This utility model provides a technical solution: a wafer cassette cross-unit or cross-line transport device with anti-collision function, including...

[0023] Main framework;

[0024] A transport component 3 is provided on one side of the main frame. One end of the transport component 3 is located outside the main frame, and the other end is located at the bottom of the main frame. The transport component 3 is distributed vertically to the main frame. A three-axis robot 2 is also provided on the top of the main frame. The three-axis robot 2 is located directly above the transport component 3. The three-axis robot 2 is used to transport the wafer cassette and place it on the railcar 1.

[0025] The bottom of the three-axis robotic arm 2 is equipped with a suction assembly, which includes:

[0026] The connector is fixed to the bottom end of the three-axis robot 2, and the connector retracts its height during downward pressure;

[0027] The suction element is located at the bottom of the connector. When the connector is pressed down, the suction element expels the air inside itself and creates a negative pressure, thereby achieving the adsorption of the wafer disk without the need for external vacuum equipment.

[0028] In this embodiment, preferably, the connector includes a connecting post 6, with an integral limiting post 8 fixed at the bottom of the connecting post 6, and the top of the connecting post 6 mounted on the three-axis robot 2.

[0029] In this embodiment, preferably, the suction component is a suction cup 11. An air tube 10 is inserted into the top of the suction cup 11, and the air tube 10 is connected to an external air blowing device. When it is necessary to place the wafer cassette, the external air blowing device blows gas into the suction cup 11, causing the negative pressure inside the suction cup 11 to disappear, thereby placing the wafer cassette. An exhaust port 12 is provided on the bottom side of the suction cup 11, and a film 13 is provided inside the exhaust port 12. A cross groove is provided on the surface of the film 13. When the suction cup 11 is pressed down, the air inside the suction cup 11 will push the film 13 up and discharge it from the cross groove of the film 13. When the gas is completely discharged, the cross groove of the film 13 closes. A collar 14 is also fitted on the connecting post 6, and the side of the collar 14 is fixed by the plate. A fixing ring 9 is provided, which is fixed on the suction cup 11. A spring 7 is also provided between the collar 14 and the top of the connecting post 6. The spring 7 is sleeved on the connecting post 6, and the bottom end of the spring 7 is limited by the limiting post 8. When the three-axis robot 2 presses down to pick up the wafer disk, under the initial elastic limit of the spring 7, it will drive the suction cup 11 to move down synchronously until the suction cup 11 contacts the wafer disk. At this time, the three-axis robot 2 continues to descend. Since the suction cup 11 has already contacted the wafer disk, the connecting post 6 will be squeezed by the descending three-axis robot 2. At this time, the connecting post 6 rebounds, and the elastic force of the rebound will expel the air inside the suction cup 11, avoiding the phenomenon of excessive pressure and damage to the wafer disk caused by directly driving the suction cup 11 through the three-axis robot 2.

[0030] In this embodiment, preferably, a buffer component 4 is also provided inside the main frame. Multiple buffer components 4 are provided and symmetrically distributed on both sides of the transport component 3. A railcar 1 is also provided outside the main frame. The railcar 1 moves towards the inside of the main frame under the push of the transport component 3, so as to push the railcar 1 directly below the three-axis robot 2, thereby placing the wafer disk picked up by the three-axis robot 2. In use, the transport component will first place the wafer box in the buffer component 4, and then pick up the wafer box temporarily stored in the buffer component 4 onto the railcar 1. By loading from the left and right sides, perpendicular to the direction of travel of the railcar and without contact, the collision caused by the accidental start of the railcar 1 during the picking process of the three-axis robot 2 is avoided.

[0031] In this embodiment, preferably, the three-axis robot 2 is provided with synchronous wheels on both sides, and the main frame is provided with a synchronous belt to drive the synchronous wheels to rotate, thereby realizing the change of loading and unloading position of the three-axis robot 2. Since this structure is the prior art, it will not be described in detail here. The vertical projection area of ​​the three-axis robot 2 is equal to the projection area of ​​the railcar 1.

[0032] In this embodiment, preferably, a travel track is also provided on the outer side of the main frame. The track car 1 moves along the travel track, which is parallel to the side of the main frame. The travel track connects the main frames of multiple units or different lines, enabling the transport of wafer cassettes at different positions. A node component 5 is also installed on the outer wall of the travel track. The node component 5 contacts the track car 1, and the position of the track car 1 is obtained through the node component 5, providing data support for automation.

[0033] In this embodiment, preferably, a track is provided inside the main frame for the railcar 1 to move, so that the railcar 1 can be pushed into the main frame by the push of the transport component 3. The track is located directly below the three-axis robot 2.

[0034] The track car 1 moves to the position of the transport component 3, and the transport component 3 transports the track car 1 to the loading and unloading position of the three-axis robot 2. The three-axis robot 2 transports the set round box to the track car 1 through the MCS dispatch command. After the track car 1 receives the wafer box, it re-enters the track system through the transport component 3 and transports the wafer box to the designated position of the system according to the MCS command. This is the loading and unloading mode.

[0035] Another loading mode is as follows: the railcar 1 transports the wafer box to the air buffer. The railcar 1 carries the wafer box from the set position to the handling component 3. The handling component 3 moves the railcar 1 to the loading and unloading position of the three-axis robot 2. The three-axis robot 2 grabs the wafer box and, according to the MCS instruction, stores the wafer box in the designated position of the buffer component 4.

[0036] Although embodiments of the present invention have been shown and described (see the detailed description above), it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer cassette transfer device with anti-collision function, comprising: Main framework; Its features are: A transport component (3) is provided on one side of the main frame. One end of the transport component (3) is placed outside the main frame, and the other end is located at the bottom of the main frame. The transport component (3) is distributed vertically to the main frame. A three-axis robot (2) is also provided on the top of the main frame. The three-axis robot (2) is located directly above the transport component (3). The bottom end of the three-axis manipulator (2) is equipped with a suction assembly, which includes: The connector is fixed to the bottom end of the three-axis robot (2), and the connector retracts its height during pressing. A suction element is located at the bottom of the connector. When the connector is pressed down, the suction element discharges its internal air and creates a negative pressure.

2. The wafer cassette cross-cell or cross-line transport device with anti-collision function according to claim 1, characterized in that: The connector includes a connecting column (6), the bottom of which is fixed with an integral limiting column (8), and the top of which is mounted on a three-axis robot (2).

3. A wafer cassette cross-cell or cross-line transport device with anti-collision function according to claim 2, characterized in that: The suction device is a suction cup (11). An air tube (10) is inserted into the top of the suction cup (11). The air tube (10) is connected to an external blowing device. An exhaust port (12) is opened on the bottom side of the suction cup (11). A film (13) is provided inside the exhaust port (12). A cross groove is opened on the surface of the film (13). A collar (14) is also fitted on the connecting post (6). A fixing ring (9) is fixed on the side of the collar (14) through the plate. The fixing ring (9) is fixed on the suction cup (11). A spring (7) is also provided between the collar (14) and the top of the connecting post (6). The spring (7) is fitted on the connecting post (6), and the bottom end of the spring (7) is limited on the limiting post (8).

4. A wafer cassette cross-cell or cross-line transport device with anti-collision function according to claim 1, characterized in that: The inner side of the main frame is also provided with a buffer component (4), and multiple buffer components (4) are provided and symmetrically distributed on both sides of the transport component (3); the outer side of the main frame is also provided with a railcar (1), and the railcar (1) moves toward the interior of the main frame under the push of the transport component (3).

5. A wafer cassette cross-cell or cross-line transport device with anti-collision function according to claim 4, characterized in that: The three-axis manipulator (2) has synchronous wheels on both sides, and a synchronous belt is provided on the main frame to drive the synchronous wheels to rotate. The vertical projected area of ​​the three-axis manipulator (2) is equal to the projected area of ​​the railcar (1).

6. A wafer cassette cross-cell or cross-line transport device with anti-collision function according to claim 4, characterized in that: A walking track is also provided on the outer side of the main frame. The track vehicle (1) moves along the walking track. The walking track is parallel to the side of the main frame. A node component (5) is also installed on the outer wall of the walking track. The node component (5) contacts the track vehicle (1).

7. A wafer cassette cross-cell or cross-line transport device with anti-collision function according to claim 6, characterized in that: The main frame is provided with a track for the railcar (1) to move, and the track is located directly below the three-axis manipulator (2).

Images