Rectifier bridge pile capable of improving insulation and voltage endurance capability

Abstract

A bridge rectifier capable of improving insulation and voltage endurance capability relates to the technical field of semiconductors. Comprising a positive frame, a negative frame and an alternating-current frame, through the design of the frame structure and the layout, a plurality of uniformly distributed long round holes are formed in the area close to the glue inlet, the hole edges of the long round holes are of semicircular angle structures, the hole long axis direction is perpendicular to the main flow direction of a plastic package material, and the hole structures form a transverse turbulent flow barrier, so that stress can be guided to be transmitted in multiple directions; and compared with uniform radial diffusion of a circular hole, concentrated impact force can be decomposed into multiple strands of vortexes more effectively, and instantaneous impact on the frame is reduced. And meanwhile, the right-angle edge easily causes the molding compound to be cured in advance to form an insufficient filling area, the hole edge fillet design can reduce backflow of the molding compound, local pressure sudden change is avoided, and the filling uniformity is improved. On the premise that the thickness of the frame is not increased, the risks of deformation and insulation failure caused by plastic packaging stress are reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to an improvement in the structure of a rectifier bridge rectifier to enhance its insulation withstand voltage capability. Background Technology

[0002] A rectifier bridge is a semiconductor device that converts alternating current (AC) to direct current (DC). It is composed of multiple rectifier diodes packaged in a specific circuit structure. It utilizes the unidirectional conductivity of diodes to rectify the input AC voltage, thereby outputting a pulsating DC voltage. Rectifier bridges are widely used in various power supply circuits, chargers, motor drives, inverters, and other electronic devices, and are one of the core components in electronic circuits for realizing the conversion of electrical energy.

[0003] The packaging of a rectifier bridge rectifier, as a key component, not only fulfills the basic function of protecting internal components but also plays a crucial role in electrical performance, thermal management, ease of installation, and reliability. During the packaging process, the molding compound enters through the top injection port. During high-speed injection molding, the molding compound impacts the metal frame during its high-speed flow, causing the copper frame within the molded product to deform and bend. After deformation, the frame becomes too close to the edge of the molded product, resulting in a decrease in insulation withstand voltage. Existing technologies address this issue by increasing the thickness of the metal frame to prevent excessive deformation; however, simply increasing the frame thickness sacrifices the need for lightweight design; localized reinforcing ribs are difficult to balance stress and also affect heat dissipation.

[0004] Therefore, the key challenge is how to reduce the risk of deformation and insulation failure caused by molding stress through structural design while ensuring lightweight requirements. Utility Model Content

[0005] To address the above problems, this utility model provides a rectifier bridge rectifier that improves insulation withstand voltage by reducing the risk of deformation and insulation failure caused by molding stress while ensuring lightweight requirements.

[0006] The technical solution of this utility model is:

[0007] Rectifier bridge rectifiers with improved insulation withstand voltage capability, including those with spaced configurations:

[0008] The positive electrode frame, located on top of the molding compound, has an L-shaped structure and includes a horizontal metal frame and a vertical metal frame that are fixedly connected. The horizontal metal frame is provided with a number of evenly distributed elongated holes, and the long axis of the elongated holes is perpendicular to the direction of molding compound injection.

[0009] A negative electrode frame is disposed below the positive electrode frame;

[0010] The AC frame is provided in pairs, each disposed below the negative electrode frame.

[0011] Specifically, the radius of the semicircles on both sides of the elongated hole is 0.1mm-0.3mm.

[0012] Specifically, the vertical metal frame is perpendicular to the horizontal metal frame;

[0013] The vertical metal frame is fixedly connected to the positive electrode pin;

[0014] The positive lead extends out of the plastic package.

[0015] Specifically, the negative electrode frame has a first notch near the molding compound injection port at the top.

[0016] Specifically, the negative electrode frame is fixedly connected to the negative electrode pin extending out of the encapsulation body via the negative electrode extension.

[0017] Specifically, the communication framework includes:

[0018] AC frame one is located below the negative electrode frame and is fixedly connected to the first AC pin extending out of the plastic encapsulation body;

[0019] AC frame two is located below the negative electrode frame and is fixedly connected to the second AC pin extending out of the plastic encapsulation.

[0020] Specifically, the positive electrode frame is provided with a first ceramic epoxy composite layer.

[0021] Specifically, the negative electrode frame is provided with a second ceramic epoxy composite layer.

[0022] Specifically, the communication frame is provided with a third ceramic epoxy composite layer.

[0023] Specifically, the top of the horizontal metal frame is provided with several arc-shaped grooves near the edge.

[0024] This utility model includes a positive electrode frame, a negative electrode frame, and an AC frame. Through the design of the frame structure and layout, several evenly distributed elongated holes are provided near the glue inlet. The edges of the elongated holes have a semi-rounded corner structure, and the long axis of the holes is perpendicular to the mainstream direction of the molding compound. The hole structure forms a lateral turbulence barrier, which can guide stress transmission in multiple directions. Compared with the uniform radial diffusion of circular holes, it can more effectively decompose concentrated impact force into multiple eddies, reducing the instantaneous impact on the frame. At the same time, right-angled edges can easily cause the molding compound to cure prematurely, forming areas of insufficient filling. The rounded corner design of the hole edges can reduce the backflow of the molding compound, avoid local pressure changes, and improve filling uniformity. Without increasing the frame thickness, the risk of deformation and insulation failure caused by molding stress is reduced. Attached Figure Description

[0025] Figure 1 This is a structural schematic diagram of the present invention.

[0026] Figure 2 This is a schematic diagram of the layout structure of the ceramic-epoxy composite layer;

[0027] In the diagram, 100 is the positive electrode frame, 110 is the horizontal metal frame, 111 is the oblong hole, 112 is the arc-shaped groove, and 120 is the vertical metal frame.

[0028] 400 is the negative electrode frame, and 410 is the first gap.

[0029] 500 is a plastic encapsulated form.

[0030] 610 is the positive pin, 620 is the first AC pin, 630 is the second AC pin, and 640 is the negative pin. Detailed Implementation

[0031] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0032] In the description of this utility model, it should be understood that the terms "upper," "lower," "left," "right," "vertical," "horizontal," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0033] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0034] Refer to Figure 1 below and Figure 2 Describe this utility model;

[0035] Rectifier bridge rectifiers with improved insulation withstand voltage capability, including those with spaced configurations:

[0036] The positive electrode frame 100, disposed on top of the molding compound 500, has an L-shaped structure and includes a horizontal metal frame 110 and a vertical metal frame 120 fixedly connected. The horizontal metal frame 110 has several evenly distributed elongated holes 111, the long axis of which is perpendicular to the molding compound injection direction. In this case, the molding compound injection port is located at... Figure 1 The top middle area is Figure 1 The vertical direction is the injection direction;

[0037] Specifically, the radius of the semicircles on both sides of the oblong hole 111 is 0.1mm-0.3mm.

[0038] The vertical metal frame 120 is perpendicular to the horizontal metal frame 110; the vertical metal frame 120 is fixedly connected to the positive pin 610; the positive pin 610 extends out from the encapsulation body 500.

[0039] Several arc-shaped grooves 112 are provided at the top of the horizontal metal frame 110 near the edge.

[0040] In this case, the arc-shaped groove 112 is positioned with its opening facing upwards, and its extension direction is consistent with the mainstream direction of the molding compound. Figure 2 The direction of the middle arrow is parallel to that of the plastic seal, which is used to absorb the shrinkage stress of the plastic seal.

[0041] The negative electrode frame 400 is disposed below the positive electrode frame 100;

[0042] The negative electrode frame 400 has a first notch 410 near the molding compound injection port at the top.

[0043] The negative electrode frame 400 is fixedly connected to the negative electrode pin 640 extending out of the encapsulation body 500 via the negative electrode extension.

[0044] The AC frame is provided in pairs, each disposed below the negative electrode frame 400.

[0045] In this design, the long axis of the oblong hole 111 is horizontally positioned. The oblong hole 111 forms a lateral flow barrier, guiding stress transmission in multiple directions. Compared to the uniform radial diffusion of a circular hole, it more effectively decomposes concentrated impact force into multiple eddies, reducing the instantaneous impact on the frame. Simultaneously, right-angled edges can easily lead to premature curing of the molding compound, resulting in underfilled areas. The rounded corner design of the hole edges reduces the backflow of the molding compound, avoids sudden local pressure changes, and improves filling uniformity.

[0046] The communication framework includes:

[0047] AC frame 200 is located below the negative frame 400 and is fixedly connected to the first AC pin 620 extending out of the encapsulation body 500.

[0048] AC frame 2 300 is located below the negative frame 400 and is fixedly connected to the second AC pin 630 extending out of the encapsulation body 500.

[0049] A first ceramic epoxy composite layer is provided on the positive electrode frame 100.

[0050] A second ceramic epoxy composite layer is provided on the negative electrode frame 400.

[0051] A third ceramic epoxy composite layer is provided on the communication frame.

[0052] In this case, the ceramic epoxy composite layer was electroplated in the non-chip connection area of ​​the frame. Figure 2 The dotted line section enhances the insulation performance of the frame; the thickness of the ceramic epoxy composite layer is 2~5µm.

[0053] Regarding the information disclosed in this case, the following points need to be clarified:

[0054] (1) The accompanying drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design.

[0055] (2) Where there is no conflict, the embodiments and features disclosed in this case can be combined with each other to obtain new embodiments;

[0056] The above are merely specific embodiments disclosed in this case, but the scope of protection of this disclosure is not limited thereto. The scope of protection disclosed in this case shall be determined by the scope of protection of the claims.

Claims

1. A rectifier bridge rectifier with improved insulation withstand voltage capability, characterized in that, Including interval settings: A positive electrode frame (100) is set on top of the molding compound (500) and has an L-shaped structure, including a horizontal metal frame (110) and a vertical metal frame (120) that are fixedly connected; the horizontal metal frame (110) is provided with a number of evenly distributed elongated holes (111), and the long axis of the elongated holes (111) is perpendicular to the direction of the molding compound injection; A negative electrode frame (400) is disposed below the positive electrode frame (100); The AC frame is provided in pairs, each disposed below the negative electrode frame (400).

2. The rectifier bridge rectifier with improved insulation withstand voltage capability according to claim 1, characterized in that, The radius of the semicircles on both sides of the elongated hole (111) is 0.1mm-0.3mm.

3. The rectifier bridge rectifier with improved insulation withstand voltage capability according to claim 1, characterized in that, The vertical metal frame (120) is perpendicular to the horizontal metal frame (110); The vertical metal frame (120) is fixedly connected to the positive pin (610); The positive lead (610) extends from the encapsulation (500).

4. The rectifier bridge rectifier with improved insulation withstand voltage capability according to claim 1, characterized in that, The negative electrode frame (400) has a first notch (410) near the molding compound injection port at the top.

5. The rectifier bridge rectifier with improved insulation withstand voltage capability according to claim 1 or 4, characterized in that, The negative electrode frame (400) is fixedly connected to the negative electrode pin (640) extending out of the encapsulation body (500) via the negative electrode extension.

6. The rectifier bridge rectifier with improved insulation withstand voltage capability according to claim 1, characterized in that, The communication framework includes: AC frame 1 (200) is located below the negative frame (400) and is fixedly connected to the first AC pin (620) extending out of the encapsulation body (500); AC frame 2 (300) is located below the negative frame (400) and is fixedly connected to the second AC pin (630) extending out of the encapsulation body (500).

7. The rectifier bridge rectifier with improved insulation withstand voltage capability according to claim 1, characterized in that, The positive electrode frame (100) is provided with a first ceramic epoxy composite layer.

8. The rectifier bridge rectifier with improved insulation withstand voltage capability according to claim 1, characterized in that, The negative electrode frame (400) is provided with a second ceramic epoxy composite layer.

9. The rectifier bridge rectifier with improved insulation withstand voltage capability according to claim 1, characterized in that, The communication frame is provided with a third ceramic epoxy composite layer.

10. The rectifier bridge rectifier with improved insulation withstand voltage capability according to claim 1, characterized in that, The top of the transverse metal frame (110) near the edge is provided with several arc-shaped grooves (112).

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