Packaging base, composition board and electronic device

Abstract

The utility model relates to the technical field of electronic packaging, and discloses a packaging base, a composition board and an electronic device.The packaging base comprises an insulating substrate, the insulating substrate comprises a main body part and a concentric-square-shaped part, the bottom of the main body part is provided with a first end face, and the top of the concentric-square-shaped part is provided with a second end face; the main body part and the concentric-square-shaped part jointly define a concave cavity, and the circumferential outer walls of the main body part and the concentric-square-shaped part are connected to form an outer side face; the plurality of external terminals are arranged on the first end face; and a plurality of connection wires, one end of which is connected to one of the external terminals, and the other end of which extends inside the main body portion and is exposed at the outer side surface to form a first exposed portion. The beneficial effects of the utility model are that the wiring structure is simplified, and the electroplating conduction of the external terminals between the adjacent packaging bases is facilitated; and meanwhile, the wiring structures are not exposed on the surfaces of the segmentation grooves, so that the wiring structures between adjacent packaging bases are prevented from being adhered when the composition board is electroplated, the segmentation efficiency of the packaging base composition board is improved, and the production efficiency is effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic packaging technology, and in particular to a packaging base, a combination board, and an electronic device. Background Technology

[0002] Packaging substrates are commonly used to encapsulate electronic components such as quartz crystals and semiconductor chips. The encapsulated components (such as semiconductor devices, temperature compensated oscillators (TCXO), tuning fork resonators, thermistor resonators, automotive components, general-purpose oscillators (OSC), pressure compensated oscillators (VCXO), etc.) are widely used in a wide variety of electronic devices.

[0003] Currently, the fabrication of packaging substrates typically involves processing a large-size insulating substrate to form a packaging substrate assembly. This assembly comprises packaging substrates arranged in a longitudinal and transverse pattern. Electroplated wiring on the assembly connects the conductive patterns on adjacent packaging substrates to achieve electroplating of all substrates. After electroplating, the assembly can be divided into individual packaging substrates using pre-set dividing slots.

[0004] In the prior art, the bottom of the packaging base is provided with external terminals for conducting the internal circuitry of the packaging base to the external circuitry. At the same time, in the packaging base assembly board, the external terminals between adjacent packaging bases are connected by a wiring structure. The wiring structure is relatively complex, resulting in some of the wiring structure being exposed on the surface of the dividing groove. As a result, when the packaging base assembly board is electroplated, adjacent packaging bases stick together because the wiring structure is exposed on the surface of the dividing groove. It is difficult to divide the assembly board into individual packaging bases, which reduces the dividing efficiency. In addition, the exposed wiring parts of the divided packaging bases need to be treated, which reduces the production efficiency. Utility Model Content

[0005] The purpose of this utility model is to provide a packaging base, a combination board, and electronic devices, which simplifies the wiring structure, facilitates electroplating of external terminals between adjacent packaging bases, and prevents the wiring structure from being exposed on the surface of the dividing groove. This avoids the wiring structure between adjacent packaging bases sticking together during the electroplating of the combination board, improves the dividing efficiency of the packaging base combination board, and effectively improves production efficiency.

[0006] To achieve the above objectives, this utility model provides a packaging base, including...

[0007] An insulating substrate includes a main body and a ring-shaped portion. The main body has a first end face at its bottom and the ring-shaped portion has a second end face at its top. The main body has a plate-like structure, and the ring-shaped portion has an annular structure. The main body and the ring-shaped portion together form a cavity. The circumferential outer wall of the main body and the circumferential outer wall of the ring-shaped portion are connected to form an outer surface surrounding the cavity. The first end face and / or the second end face are respectively connected to the outer surface through a dividing bevel.

[0008] Multiple external terminals are disposed on the first end face;

[0009] Multiple connecting wires are located within the main body. One end of each connecting wire is connected to an external terminal, and the other end extends within the main body and protrudes from the outer side to form a first exposed portion, which is disposed away from the dividing slope.

[0010] Furthermore, the connecting wiring has a strip-like structure, and the distance between the connecting wiring and the external terminal gradually increases in a first direction from the end of the connecting wiring connected to the external terminal to the first exposed portion.

[0011] Furthermore, the extension path of the connecting wiring in the first direction is an arc.

[0012] Furthermore, the length of the insulating substrate in the first direction is L1, and the minimum distance between the first exposed portion and the first end face is L2, where 0.1≤L2 / L1≤0.5.

[0013] Furthermore, the surface area of ​​the connecting wiring is S1, and the surface area of ​​the external terminal is S2, where 0.05 ≤ S1 / S2 ≤ 0.4.

[0014] Furthermore, it also includes an electrode pad, which is disposed within the cavity. The projected area of ​​the connection wiring on the first end face is S3, and the overlapping area of ​​the projection of the connection wiring and the electrode pad on the first end face is S4, where S4 / S3≤0.3.

[0015] Furthermore, the minimum distance between the projection of the connection wiring on the first end face and the projection of the electrode pad on the first end face is L3, where L3 > 30 μm.

[0016] Furthermore, the insulating substrate has four corner regions arranged diagonally, with side regions between adjacent corner regions, and each external terminal is connected to at least two connection wires, with at least two connection wires respectively located within adjacent side regions.

[0017] This utility model also provides a packaging base assembly plate, which is composed of a plurality of packaging bases as described above, wherein the dividing slopes between adjacent packaging bases cooperate to form a dividing groove, and the connecting wires that are electrically connected to each other are between adjacent packaging bases.

[0018] This utility model also provides an electronic device, including the packaging base described in any of the above claims, and further including electronic components and a sealing plate, wherein the electronic components are disposed in the cavity and the sealing plate covers the opening of the cavity.

[0019] Compared with the prior art, the present invention, which discloses a packaging base, a combination board, and electronic devices, has the following advantages: the connecting wiring is located inside the main body, one end of the connecting wiring is connected to an external terminal, and the other end extends inside the main body to the outer surface to form a first exposed portion. Due to the presence of the first exposed portion, the connecting wiring between two adjacent packaging bases can form an electrical connection. The overall structure of the connecting wiring in this invention is simple, which facilitates electroplating conduction between the external terminals of two adjacent packaging bases. Furthermore, the first exposed portion is located away from the dividing slope, so that the connecting wiring will not be exposed on the dividing slope, avoiding adhesion of the electroplated wiring between adjacent packaging bases during the electroplating process, which would increase the difficulty of dividing the combination board and effectively improve the dividing efficiency and production efficiency. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the packaging base according to an embodiment of the present invention;

[0021] Figure 2 This is a perspective view of the packaging base according to an embodiment of the present invention;

[0022] Figure 3 This is a top perspective view of the packaging base according to an embodiment of the present invention;

[0023] Figure 4 yes Figure 3 Sectional view at point BB;

[0024] Figure 5 yes Figure 3 Sectional view at CC;

[0025] Figure 6 yes Figure 3 Sectional view at point DD;

[0026] Figure 7 This is a top view of the packaging base according to an embodiment of the present invention;

[0027] Figure 8 This is a schematic diagram of the conductive pattern of the packaging base according to an embodiment of the present invention;

[0028] Figure 9This is a partial structural schematic diagram of the packaging base assembly plate according to an embodiment of the present utility model;

[0029] Figure 10 This is a schematic diagram of the conductive pattern of the encapsulation base assembly plate according to an embodiment of this utility model;

[0030] Figure 11 This is a top perspective view of the packaging base assembly plate according to an embodiment of this utility model;

[0031] Figure 12 yes Figure 10 Sectional view at EE

[0032] Figure 13 yes Figure 10 Sectional view at FF;

[0033] Figure 14 yes Figure 10 Sectional view at point GG.

[0034] In the figure, 1 is an insulating substrate; 11 is the main body; 12 is a U-shaped part; 101 is the outer side surface; 111 is the first end face; 121 is the second end face; 102 is a cavity; 103 is a dividing bevel; 2 is an external terminal; 3 is a connecting wiring; 31 is the first exposed part; 4 is a metal layer; 5 is an electrode pad; 6 is the first wiring; 7 is the second wiring; 71 is the second exposed part; 8 is the third wiring; 81 is the third exposed part; 9 is a through-hole conductor; K is a dividing groove; X is the first direction. Detailed Implementation

[0035] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0036] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer" and other terms used in this utility model to indicate the orientation or positional relationship are based on the positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device and element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0037] In the description of this utility model, it should be understood that the terms "first," "second," etc., are used to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this utility model, "first" information can also be referred to as "second" information, and similarly, "second" information can also be referred to as "first" information.

[0038] like Figures 1 to 14 As shown, a preferred embodiment of the present invention provides a packaging base including an insulating substrate 1, multiple external terminals 2, and multiple connecting wires 3. For ease of explanation, the height direction of the insulating substrate 1 is defined as the first direction X. Specifically, the insulating substrate 1 includes a main body portion 11 and a U-shaped portion 12, as shown... Figure 1 As shown, the bottom of the main body 11 has a first end face 111, and the top of the loop-shaped portion has a second end face 121. The circumferential outer wall of the main body 11 and the circumferential outer wall of the loop-shaped portion 12 are connected to form an outer surface 101 surrounding the cavity 102. The first end face 111 and / or the second end face 121 are respectively connected to the outer surface 101 through a dividing inclined surface 103. The main body 11 has a plate-like structure, and the loop-shaped portion 12 has a ring-like structure. The main body 11 and the loop-shaped portion 12 together enclose the cavity 102, which is used to install electronic components. A plurality of external terminals 2 are provided on the first end face 111 for connecting the electronic components in the cavity 102 to external electronic devices. The number of external terminals 2 can be adjusted according to actual design requirements. In this embodiment, the number of external terminals 2 is 4.

[0039] To enable electrical connection between the external terminals 2 of multiple package bases on the package base assembly board, each package base is provided with multiple connecting wires 3. To simplify the structure of the connecting wires 3, they are located within the main body 11. One end of each connecting wire 3 is connected to an external terminal 2, and the other end extends within the main body 11 to the outer surface 101 to form a first exposed portion 31. Adjacent package bases are connected through the first exposed portion 31, achieving electrical connection between the external terminals 2 of multiple package bases. To prevent the connecting wires 3 from being exposed on the surface of the dividing groove K, which could cause the electroplated wires between the package bases to stick together during electroplating and make the package base assembly board difficult to divide, in this embodiment, the first exposed portion 31 is positioned away from the dividing slope 103. (See also...) Figures 8 to 13 Within the packaging base assembly plate, the dividing slopes 103 of adjacent packaging bases cooperate to form crisscrossing dividing grooves K, and the shape of the dividing grooves K is V-shaped.

[0040] Furthermore, in order to simplify the connection wiring 3 structure and enhance the stability of the connection wiring 3 structure when the packaging base is subjected to external forces, in this embodiment, refer to... Figure 2 , Figure 6 The connecting wire 3 has a strip-shaped structure. Specifically, the connecting wire 3 extends from the end connected to the external terminal 2 to the first exposed portion 31. The distance between the connecting wire 3 and the external terminal 2 gradually increases in the first direction X, which facilitates the dispersion of stress transmitted from the packaging base to the connecting wire 3. Furthermore, in order to ensure that the connecting wire 3 is subjected to uniform stress during stress dispersion, the extension path of the connecting wire 3 in the first direction X is an arc.

[0041] Furthermore, in some embodiments, in order to reasonably arrange the connecting wires 3 within the main body 11 and reduce the difficulty of fabricating the encapsulation base, the length of the insulating substrate 1 in the first direction X is L1, and the minimum distance between the first exposed portion 31 and the first end face 111 is L2, where 0.1 ≤ L2 / L1 ≤ 0.5. If L2 / L1 < 0.1, the distance between the first exposed portion 31 of the connecting wires 3 and the first end face 111 is small. In this case, to avoid the connecting wires 3 being exposed on the inclined surface of the dividing groove K, the depth of the dividing groove K needs to be reduced, which is not conducive to dividing the encapsulation base assembly board into individual encapsulation bases. If L2 / L1 > 0.5, the distance between the first exposed portion 31 of the connecting wires 3 and the first end face 111 is large, the overall size of the connecting wires 3 becomes larger, and the fabrication difficulty of the encapsulation base increases. Therefore, in this embodiment, L2 / L1 = 0.3.

[0042] Furthermore, to reduce the manufacturing cost of the packaging base and lower the thermal stress generated during electroplating, the surface area of ​​the connecting wire 3 is S1, and the surface area of ​​the external terminal 2 is S2, with 0.05 ≤ S1 / S2 ≤ 0.4. If S1 / S2 < 0.05, the surface area of ​​the connecting wire 3 is too small, resulting in increased resistance and a higher risk of thermal stress during electroplating. If S1 / S2 > 0.4, the surface area of ​​the connecting wire 3 is too large, increasing the amount of paste used and thus increasing manufacturing costs.

[0043] Furthermore, in the practical application of the package base, to facilitate the electrical connection between the electronic components within the cavity 102 and the package base, electrode pads 5 are also included. Specifically, the electrode pads 5 are located within the cavity 102. To avoid parasitic capacitance between the connection wiring 3 and the electrode pads 5, which could cause signal interference in the package base during practical applications, the projected area of ​​the connection wiring 3 on the first end face 111 is S3, and the overlapping area of ​​the projections of the connection wiring 3 and the electrode pads 5 on the first end face 111 is S4, where S4 / S3 ≤ 0.3. If S4 / S3 > 0.3, parasitic capacitance will occur; therefore, the electrode pads 5 and the connection wiring 3 need to be arranged appropriately. Furthermore, to further reduce the parasitic capacitance between the electrode pads 5 and the connection wiring 3, the minimum distance between the projection of the connection wiring 3 on the first end face 111 and the projection of the electrode pads 5 on the first end face 111 is L3, where L3 > 30µm, to avoid signal interference caused by parasitic capacitance within the package base, which could affect normal operation.

[0044] Furthermore, to facilitate the rational arrangement of the connecting wiring 3 and the external terminal 2 on the insulating substrate 1, the insulating substrate 1 has four diagonally arranged corner areas, specifically, as follows: Figure 7As shown, the four corner regions are designated as first corner region a, second corner region b, third corner region c, and fourth corner region d, and adjacent corner regions c are separated by a side region e. Each external terminal 2 is connected to at least two connecting wires 3, and at least two connecting wires 3 are respectively located within adjacent side regions e. In this embodiment, there are four external terminals 2, eight connecting wires 3, and two connecting wires 3 for each external terminal 2. The number of electrode pads 5 is two, arranged diagonally within the cavity 102.

[0045] In practical applications of the packaging base, refer to Figure 2 The package also includes a metal layer 4, a first wiring 6, a second wiring 7, and a third wiring 8. The metal layer 4 is disposed on the second end face 121 in a manner surrounding the cavity 102, meeting multiple application requirements such as electrical or thermal management of the package substrate. One end of the first wiring 6 is located in the loop portion 12 and connected to the metal layer 4, while the other end extends to the main body portion 11 and is connected to an external terminal 2 through a through-hole conductor 9, for realizing the internal circuit arrangement of the package substrate. The second wiring 7 is disposed within the loop portion 12, with one end connected to the metal layer 4 and the other end extending to the outer side surface 101 to form a second exposed portion 71. The third wiring 8 is located within the loop portion 12, is insulated from the metal layer 4, and its other end extends towards the outer side surface 101 to form a third exposed portion 81.

[0046] For easier cabling layout, please refer to [reference needed]. Figure 2 , Figure 7 The first corner region a is provided with a first wiring 6 connected to an external terminal 2, or the first corner region a and the third corner region c are respectively provided with first wiring 6 connected to different external terminals 2. The first corner region a and the third corner region c are respectively provided with second wiring 7. The second corner region b and the fourth corner region d are respectively provided with third wiring 8. There are two electrode pads 5, arranged diagonally in the cavity 102, and each electrode pad 5 is connected to a different external terminal 2 through a through-hole conductor 9. Further, in some other embodiments, the second corner region b and the fourth corner region d are also provided with pad interconnect wiring, one end of which extends within the main body 11 and connects to an electrode pad 5, and the other end extends within the loop-shaped portion and protrudes from the outer side to form a fourth exposed portion, and the pad interconnect wiring is insulated from the metal layer 4.

[0047] This utility model also provides a packaging base assembly plate, see reference. Figures 9 to 14 It is composed of multiple packaging bases of any one of the above, and the dividing slopes 103 between adjacent packaging bases cooperate to form a dividing groove K, and the adjacent packaging bases have interconnecting wiring 3.

[0048] This utility model also provides an electronic device, including the packaging base of any of the above, and further including electronic components and a sealing plate, wherein the electronic components are disposed in the cavity 102, and the sealing plate covers the opening of the cavity 102.

[0049] In summary, this utility model embodiment provides a packaging base, a combination board, and electronic devices. Connecting wiring 3 is located within the main body 11. One end of the connecting wiring 3 is connected to an external terminal 2, and the other end extends within the main body 11 to the outer surface 101 to form a first exposed portion 31. Due to the presence of the first exposed portion 31, the connecting wiring 3 between two adjacent packaging bases can form an electrical connection. The overall structure of the connecting wiring 3 of this utility model is simple, facilitating electroplating conduction between the external terminals 2 of two adjacent packaging bases. Furthermore, the first exposed portion 31 is positioned away from the dividing slope 103, preventing the connecting wiring 3 from being exposed on the dividing slope 103. This avoids adhesion of the electroplated wiring between adjacent packaging bases during electroplating, which would increase the difficulty of dividing the combination board and effectively improves dividing efficiency and production efficiency.

[0050] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A packaging base, characterized in that: include An insulating substrate includes a main body and a ring-shaped portion. The main body has a first end face at its bottom and a second end face at its top. The main body has a plate-like structure, and the ring-shaped portion has an annular structure. The main body and the ring-shaped portion together form a cavity. The circumferential outer wall of the main body and the circumferential outer wall of the ring-shaped portion are connected to form an outer surface surrounding the cavity. The first end face and / or the second end face are respectively connected to the outer surface through a dividing bevel. Multiple external terminals are disposed on the first end face; Multiple connecting wires are located within the main body. One end of each connecting wire is connected to an external terminal, and the other end extends within the main body and protrudes from the outer side to form a first exposed portion, which is disposed away from the dividing slope.

2. The packaging base as described in claim 1, characterized in that: The connecting wire has a strip-shaped structure, and the connecting wire extends from one end connected to the external terminal to the first exposed portion. The distance between the connecting wire and the external terminal gradually increases in a first direction.

3. The packaging base as described in claim 2, characterized in that: The extension path of the connecting wiring in the first direction is an arc.

4. The packaging base as described in claim 1, characterized in that: The length of the insulating substrate in the first direction is L1, and the minimum distance between the first exposed portion and the first end face is L2, where 0.1≤L2 / L1≤0.

5.

5. The packaging base as described in claim 1, characterized in that: The surface area of ​​the connecting wiring is S1, and the surface area of ​​the external terminal is S2, where 0.05 ≤ S1 / S2 ≤ 0.

4.

6. The packaging base as described in claim 1, characterized in that: It also includes an electrode pad, which is disposed in the cavity. The projected area of ​​the connection wiring on the first end face is S3, and the overlapping area of ​​the projection of the connection wiring and the electrode pad on the first end face is S4, where S4 / S3≤0.

3.

7. The packaging base as described in claim 6, characterized in that: The minimum distance between the projection of the connection wiring on the first end face and the projection of the electrode pad on the first end face is L3, where L3 > 30 μm.

8. The packaging base as described in claim 1, characterized in that: The insulating substrate has four corner regions arranged diagonally, and there are side regions between adjacent corner regions. Each external terminal is connected to at least two of the connecting wires, and at least two of the connecting wires are respectively located in adjacent side regions.

9. A packaging base assembly board, characterized in that, The package is composed of multiple packaging bases as described in any one of claims 1-8, wherein the dividing slopes between adjacent packaging bases cooperate to form a dividing groove, and the connecting wiring is electrically connected to each other between adjacent packaging bases.

10. An electronic device comprising the packaging base according to any one of claims 1-8, characterized in that: It also includes electronic components and a sealing plate, wherein the electronic components are disposed within the cavity and the sealing plate covers the opening of the cavity.

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