Ultrasonic endoscope

Abstract

The utility model provides an ultrasonic endoscope with improved durability. An ultrasonic endoscope (12) is provided with: a metal ring (41c) comprising a metal; an ultrasonic transducer (48) provided at the tip (40) of the insertion section (22); and a backing material layer (54) provided between the ultrasonic transducer (48) and the metal ring (41c), the backing material layer (54) being configured from at least one of a polyurea resin, an epoxy resin having a polyurethane structure, and an epoxy resin having a polyether amine structure. According to the technology of the utility model, the durability can be improved.

Description

Technical Field

[0001] This utility model relates to an ultrasonic endoscope. Background Technology

[0002] Patent Documents 1, 2 and 3 describe an ultrasonic endoscope comprising an ultrasonic transducer array of multiple ultrasonic transducers arranged in a cylindrical shape.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2022-124502

[0004] Patent Document 2: International Publication No. 2018 / 003737

[0005] Patent Document 3: Japanese Patent Application Publication No. 2022-175241 Utility Model Content

[0006] The purpose of this invention is to provide an ultrasonic endoscope with improved durability.

[0007] An ultrasonic endoscope according to one embodiment of the present invention comprises: a cylindrical component comprising metal; an ultrasonic transducer disposed along the outer peripheral surface of the cylindrical component; and a backing material layer disposed between the ultrasonic transducer and the cylindrical component, wherein the backing material layer comprises at least one of polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure.

[0008] Utility Model Effect

[0009] The technology of this utility model can improve durability. Attached Figure Description

[0010] Figure 1 This is a schematic structural diagram of an endoscope device using an ultrasonic endoscope as one aspect of the technology of this utility model.

[0011] Figure 2 It means Figure 1 A partially enlarged perspective view of the appearance of an example of the anterior endoscope shown.

[0012] Figure 3 It is along Figure 2 The longitudinal sectional view of the axis of the anterior end of the ultrasonic endoscope shown.

[0013] Figure 4 yes Figure 3 A magnified view of a portion of the image. Detailed Implementation

[0014] Figure 1This is a schematic structural diagram of an endoscope device 10 that uses an ultrasonic endoscope 12 as one aspect of the technology of this utility model. Figure 2 It means Figure 1 A partially enlarged perspective view of the appearance of an example of the front end of the ultrasonic endoscope 12 shown. Figure 3 It is along Figure 2 A longitudinal sectional view of the axis of the anterior end of the ultrasonic endoscope 12 shown.

[0015] like Figure 1 As shown, the endoscope device 10 includes: an ultrasonic endoscope 12; an ultrasonic processor 14 for generating ultrasonic images; an endoscope processor 16 for generating endoscopic images; a light source 18 for supplying illumination light to the ultrasonic endoscope 12 to illuminate the body cavity; a display 20 for displaying ultrasonic images and endoscopic images, etc.; a water supply tank 21a for storing cleaning water, etc.; and a suction pump 21b for suctioning the aspirate from the body cavity.

[0016] The ultrasonic endoscope 12 has: an insertion part 22, which is inserted into the body cavity of the subject; an operation part 24, which is connected to the base of the insertion part 22 and is used for operation by the surgeon; and a universal lanyard 26, one end of which is connected to the operation part 24.

[0017] The following mechanisms are arranged side by side on the operation unit 24: an air and water supply button 28a, which opens and closes the air and water supply lines from the water supply tank 21a (not shown); and a suction button 28b, which opens and closes the suction line from the suction pump 21b (not shown). Furthermore, a pair of angle knobs 29 and a device insertion port 30 are provided on the operation unit 24.

[0018] The following mechanisms are provided on the other end of the universal plug rope 26: an ultrasonic connector 32a, connected to the ultrasonic processor device 14; an endoscope connector 32b, connected to the endoscope processor device 16; and a light source connector 32c, connected to the light source device 18. The ultrasonic endoscope 12 is detachably connected to the ultrasonic processor device 14, the endoscope processor device 16, and the light source device 18 via these connectors 32a, 32b, and 32c, respectively. Furthermore, connector 32c includes: an air / water supply hose 34a, connected to the water tank 21a; and a suction hose 34b, connected to the suction pump 21b.

[0019] The insertion part 22, from its front end side, comprises: a front end portion 40, formed of a rigid component and having an ultrasonic observation portion 36 and an endoscopic observation portion 38; a curved portion 42, connected to the base end side of the front end portion 40; and a flexible portion 44, connecting the base end side of the curved portion 42 to the front end side of the operating part 24. The curved portion 42 is formed by connecting multiple curved members (bent corner rings) and is configured to be flexible. The flexible portion 44 is slender and elongated, and has flexibility.

[0020] The ultrasonic processor device 14 generates and supplies ultrasonic transceiver 46 (see reference) for use in the ultrasonic observation unit 36 ​​described later. Figure 2 Multiple ultrasonic transducers 48 in the ultrasonic endoscope 12 generate ultrasonic signals. The center frequency of the ultrasonic transducers 48 used in the ultrasonic endoscope 12 is preferably 5 MHz or higher and 12 MHz or lower. The ultrasonic processor device 14 uses the ultrasonic transducers 48 to receive and acquire echo signals reflected from the observed part of the object from which ultrasonic waves are emitted, and performs various signal processing on the acquired echo signals to generate an ultrasonic image. The generated ultrasonic image is displayed on the display 20.

[0021] The endoscopic processor device 16 receives and acquires image signals from the observation area illuminated by illumination light from the light source device 18 in the endoscopic observation section 38, and performs various signal and image processing on the acquired image signals to generate an endoscopic image. The generated endoscopic image is displayed on the display 20.

[0022] In order to acquire image signals by using the endoscope observation section 38 to photograph the observation area inside the body cavity, the light source device 18 generates illumination light, including white light or light of a specific wavelength, which are the three primary colors of light such as red light, green light and blue light. The illumination light is propagated in the light guide (not shown) inside the ultrasonic endoscope 12 and emitted from the endoscope observation section 38, thereby illuminating the observation area inside the body cavity.

[0023] Next, refer to Figure 2 and Figure 3 The structure of the front end portion 40 will be described. Figure 3 In the diagram, the orientation of the insertion portion 22 of the ultrasonic endoscope 12 is shown as the frontal direction F from the base side to the frontal side and the base direction B from the frontal side to the base side. The frontal direction F and the base direction B are also described as the axial directions of the insertion portion 22. Figure 3 In the diagram, the radial direction (the direction perpendicular to the axis) of the insertion part 22 is shown as the upward direction U and the downward direction D, which is the opposite direction of the upward direction U.

[0024] like Figure 2 As shown, at the front end 40 of the ultrasonic endoscope 12, an ultrasonic observation section 36 for acquiring ultrasonic images is provided on the base side, and an endoscope observation section 38 for acquiring endoscope images is provided on the front end side.

[0025] The front end portion 40 of the ultrasonic endoscope 12 includes a cap-shaped front end part 41a that fits over the endoscope observation section 38 on the front end side, a cylindrical base end side ring 41b disposed on the base end side of the ultrasonic observation section 36 on the base end side, and a metal ring 41c (see reference). Figure 3Here, the front end part 41a and the base end side ring 41b comprise rigid components such as hard resin, thus becoming external components. A metal ring 41c is disposed inside the external component. The metal ring 41c is a cylindrical component made of metals such as SUS (Stainless Steel) or aluminum, preferably cylindrical. The shape of the metal ring 41c does not need to be a complete cylinder; it may also have partial notches.

[0026] The endoscopic observation section 38 includes: a treatment instrument outlet 76, an observation window 78, an illumination window 80, and a cleaning nozzle 82, etc., located on the front end face.

[0027] The ultrasonic observation unit 36 ​​is composed of an ultrasonic transceiver unit 46 supported on the outer peripheral surface of a metal ring 41c. The ultrasonic transceiver unit 46 includes: a plurality of ultrasonic transducers 48 arranged along the outer peripheral surface of the metal ring 41c; a backing material layer 54 disposed between the plurality of ultrasonic transducers 48 and the metal ring 41c; an intermediate layer 53 disposed between the backing material layer 54 and the metal ring 41c; an electrode unit 52 having individual electrodes 52a corresponding to each of the plurality of ultrasonic transducers 48 and a common electrode 52b shared by the plurality of ultrasonic transducers 48; a flexible printed circuit board 56 connected to each individual electrode 52a; a generally cylindrical acoustic matching layer 64 stacked on the plurality of ultrasonic transducers 48; and a generally cylindrical acoustic lens 66 stacked on the acoustic matching layer 64.

[0028] like Figure 2 As shown, the ultrasonic transducer 48 is an array of multiple channels, such as 48 to 192 channels (CH), of multiple ultrasonic transducers 48 arranged in a cylindrical shape, for example, 48 to 192 channels (CH).

[0029] In the ultrasonic transceiver unit 46, as shown in the figure, a plurality of ultrasonic transducers 48 are arranged circumferentially at a predetermined interval. Thus, each ultrasonic transducer 48 constituting the ultrasonic transceiver unit 46 is arranged at equal intervals in a cylindrical shape centered on the axis of the front end 40. Furthermore, each ultrasonic transducer 48 is sequentially driven according to a drive signal input from the ultrasonic processor device 14. Therefore, the area where the ultrasonic transducers 48 are arranged is used as the scanning range for radial electronic scanning.

[0030] The backing material layer 54 is composed of a layer of components containing backing material. The backing material layer 54 mechanically and flexibly supports the plurality of ultrasonic transducers 48 and has the function of attenuating ultrasonic waves propagating toward the backing material layer 54 from the ultrasonic signals oscillating from the plurality of ultrasonic transducers 48 or reflected from the object being observed.

[0031] like Figure 3As shown, the flexible printed circuit board 56 mounted on the base side of the backing material layer 54 is electrically connected to each individual electrode 52a of the electrode section 52, and is also wired to multiple coaxial cables 58 of the signal harness 72. Thus, the individual electrodes 52a of the ultrasonic transducer 48 are electrically connected to the coaxial cables 58, and each ultrasonic transducer 48 is electrically connected to the signal harness 72.

[0032] The ultrasonic endoscope 12 includes: a support 120 that supports a signal harness 72 at a front end 40 and extends along the signal harness 72; and a support member 110 that supports the support 120.

[0033] At least one of the bracket 120 and the bracket support member 110 is preferably made of metal. By making it of metal, its thickness can be reduced. Examples of metal materials include SUS or aluminum. It is preferred that both the bracket 120 and the bracket support member 110 are made of metal.

[0034] The acoustic lens 66, together with the front-end part 41a and the base-end ring 41b, constitutes the outer casing of the front end 40. The portion of the metal ring 41c that is further forward than the ultrasonic transceiver 46 is fixed to the inner side of the front-end part 41a by fitting or the like. The portion of the metal ring 41c that is further forward than the ultrasonic transceiver 46 is disposed inside the base-end ring 41b with a gap formed between it and the inner circumferential surface of the base-end ring 41b.

[0035] Thus, the front end part 41a and the base end side ring 41b constitute a receiving portion for accommodating the metal ring 41c. For example... Figure 4 As shown in the enlarged view, a filler 55 is filled around the base end portion of the metal ring 41c, for example, between the outer circumferential surface of the base end portion of the metal ring 41c and the inner circumferential surface of the base end ring 41b. The filler 55 is provided to restrict the movement of the contents inside the base end ring 41b and to prevent damage to the contents. The material of the filler 55 can be epoxy resin, silicone resin, polyurethane resin, or urea resin, etc.

[0036] The filler 55 preferably has a viscosity of less than 100 Pa·s at a shear rate of 0.01 / s in its uncured state. This prevents the filler 55 from penetrating into unintended areas within the front end 40 when the filler 55 is filled inside the base end ring 41b. To achieve the aforementioned shear rate, for example, a filler with a resin-based substrate and containing a thixotropic agent such as fumed silica as an additive can be used as the filler 55. By including the thixotropic agent, the thixotropy is improved, thus increasing the viscosity of the filler before curing. As for thixotropy, at a shear rate of 10 / s, it is preferably less than 100 Pa·s, more preferably less than 20 Pa·s.

[0037] The backing material layer 54 reduces stress when thermal load is applied to the ultrasonic endoscope 12, preventing cracks and improving durability. Specifically, the backing material layer 54 is composed of at least one of polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure, which sufficiently reduces stress under thermal load. From the viewpoint of further improving processability, the resin included in the backing material layer 54 preferably includes polyurea resin.

[0038] The resin contained in the backing material layer 54 is preferably a resin with a loss tangent of 0.06 or more in the range of 0 to 50°C and a loss tangent of less than 1.50 in the range of -20 to 110°C. When the content of the aforementioned resin in the backing material layer 54 is set to 25 to 50% by volume, the storage modulus of the backing material layer 54 in the range of 0 to 50°C is preferably 1000 MPa or more. The thickness of the backing material layer 54 used in the ultrasonic endoscope 12 is preferably 0.5 mm or more and 1.5 mm or less.

[0039] The following describes in detail the preferred resin contained in the backing material layer 54.

[0040] Polyurea resin

[0041] Polyurea resins can be obtained by reacting polyisocyanate compounds with polyamine compounds.

[0042] As a polyisocyanate compound, any polyisocyanate compound having two or more isocyanate groups can be used without particular restrictions. The polyisocyanate compound can be any one of an aliphatic isocyanate compound (a compound in which isocyanate groups are bonded to an aliphatic chain or aliphatic ring) and an aromatic isocyanate compound (a compound in which isocyanate groups are bonded to an aromatic ring), or a mixture thereof. The polyisocyanate compound can have a ring structure. From the viewpoint of low reactivity and long shelf life when producing cured products, aliphatic polyisocyanate compounds are preferred; from the viewpoint of further improving ultrasonic attenuation, aliphatic polyisocyanate compounds containing aromatic rings and aromatic polyisocyanate compounds are preferred.

[0043] As a polyamine compound, any polyamine compound having two or more amino groups can be used without particular restriction; polyamine compounds commonly used as curing agents for epoxy resins are preferred. The polyamine compound can be any one of aliphatic polyamine compounds (chain-like aliphatic polyamine compounds with amino groups bonded to aliphatic chains or cyclic aliphatic polyamine compounds with amino groups bonded to aliphatic rings) and aromatic polyamine compounds (compounds with amino groups bonded to aromatic rings), or a mixture thereof. Aliphatic polyamine compounds exhibit excellent reactivity and are therefore preferred. The polyamine compound can have a cyclic structure. Furthermore, in addition to nitrogen atoms, it may contain heteroatoms such as oxygen atoms. From the viewpoint of further improving ultrasonic attenuation and processability, the polyamine compound preferably includes aliphatic polyamine compounds with aromatic rings and chain-like aliphatic polyamine compounds without aromatic rings.

[0044] [Epoxy resin with polyurethane structure]

[0045] Epoxy resins with a polyurethane structure can be used without particular restrictions, as long as they have a polyurethane structure and epoxy groups. Commercially available epoxy resins with a polyurethane structure typically have a number-average molecular weight of 200 to 20,000. The viscosity of epoxy resins with a polyurethane structure at 25°C is not particularly limited; for example, 200 to 200,000 mPa·s is preferred, and 600 to 30,000 mPa·s is more preferred. Furthermore, the viscosity is a value measured under conditions of 25°C and a shear rate of 0.01 / s.

[0046] Polyamines or acid anhydrides can be used as curing agents for reacting with epoxy resins having a polyurethane structure, but polyamines are preferred. As for the polyamine compound that reacts with epoxy resins having a polyurethane structure, any polyamine compound having two or more amino groups can be used without particular restriction; polyamine compounds commonly used as curing agents for epoxy resins are preferred.

[0047] [Epoxy resin with polyetheramine structure]

[0048] As an epoxy resin with a polyetheramine structure, it is a reaction cured product of epoxy resin and polyamine compound having two or more amino groups. As long as it has a polyether structure, it can be used without particular restrictions.

[0049] Epoxy resins with a polyetheramine structure can be obtained by any one of the following: reaction of an epoxy resin with a polyether structure with a polyamine compound without a polyether structure, reaction of an epoxy resin without a polyether structure with a polyamine compound with a polyether structure, or reaction of an epoxy resin with a polyether structure with a polyamine compound with a polyether structure. Typically, the polyether structure of the reaction-cured product obtained in this way is a polyether structure with a number average molecular weight of 200 to 6000.

[0050] Among these, the preferred are either a reaction-cured product of an epoxy resin having a polyether structure and a polyamine compound not having a polyether structure, or a reaction-cured product of an epoxy resin not having a polyether structure and a polyamine compound having a polyether structure. From the viewpoint that the curable resin composition exhibits a more preferred viscosity, the preferred choice is a reaction-cured product of an epoxy resin not having a polyether structure and a polyamine compound having a polyether structure.

[0051] Commercially available epoxy resins with a polyether structure typically have a polyether structure and a number average molecular weight of 200 to 6000. Specifically, epoxy resins with a bisphenol structure are preferred from the viewpoint of excellent mechanical strength. Examples of epoxy resins with a polyether structure include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, and phenolic varnish type epoxy resin. From the viewpoint of excellent mechanical strength of the cured product, bisphenol A type epoxy resin is preferred.

[0052] As a polyamine compound with a polyether structure, any polyamine compound having two or more amino groups can be used without particular restrictions. Polyamine compounds commonly used as curing agents for epoxy resins are preferred. Commercially available polyamine compounds with a polyether structure typically have a polyether structure with a number average molecular weight of 200 to 6000.

[0053] [Resin content in the backing material layer]

[0054] The resin content in the backing material layer 54 is 25-50% by volume, preferably 30-50% by volume. The content of at least one of the following reactive cured resins in the backing material layer 54—polyurea resin, epoxy resin with a polyurethane structure, and epoxy resin with a polyetheramine structure—is not particularly limited, as long as the technical effect of this invention is achieved. For example, it can be set to 15% by volume or more, preferably 20% by volume or more, more preferably 30% by volume or more, further preferably 50% by volume or more, and especially preferably 70% by volume or more. It is also preferable that the resin contained in the backing material layer 54 is entirely composed of at least one of polyurea resin, epoxy resin with a polyurethane structure, and epoxy resin with a polyetheramine structure.

[0055] The backing material layer 54 is preferably composed of at least one of polyurea resin, epoxy resin with a polyurethane structure, and epoxy resin with a polyetheramine structure as the base material and includes heat-dissipating filler. The backing material layer 54 improves thermal conductivity by including thermally conductive particles as heat-dissipating filler. By improving the thermal conductivity of the backing material layer 54, heat generated in the ultrasonic transceiver 46 can be transferred to the heat dissipation structure (not shown), preventing heat accumulation at the front end 40. This reduces the thermal load on the backing material layer 54, further reducing stress caused by the thermal load. Furthermore, even when the difference between the coefficient of thermal expansion of the base material of the backing material layer 54 and the coefficient of thermal expansion of the metal ring 41c is slightly large, the stress applied to the base material can be reduced through heat dissipation by the heat-dissipating filler.

[0056] Regarding the thermally conductive particles, any type of inorganic or organic particle can be used as long as it is thermally conductive. To improve the thermal conductivity of the backing material layer 54, its thermal conductivity per unit weight is preferably 30 W / m·K or higher, more preferably 60 W / m·K or higher. Since the ultrasonic endoscope 12 is inserted into the body, the thermally conductive particles are preferably safe materials that are non-toxic and stable in environments with low moisture absorption. Furthermore, to improve attenuation, high density is preferred. Since it is disposed near the circuit, materials with low or no electrical conductivity that will not cause short-circuit faults are preferred.

[0057] The shape of the thermally conductive particles is not particularly limited; various shapes such as irregular shapes, spheres, fibers, branched fibers, and plates can be used. Spherical shapes are preferred as they increase the fill rate. Anisotropic shapes, such as fibers or plates, increase particle contact and improve heat dissipation, which is also preferred. Irregularly shaped particles can randomly reflect ultrasonic waves, which is preferable from the viewpoint of improving the ultrasonic attenuation of the backing material layer 54.

[0058] Examples of thermally conductive particles include alumina, tungsten oxide, silicon carbide, tungsten carbide, silicon nitride, boron nitride, or aluminum nitride. Nitrides are particularly preferred from the viewpoint of high thermal conductivity and high insulation. The thermally conductive particles may contain one or more of these thermally conductive materials. To facilitate dispersion in the resin, the surface of the thermally conductive particles may be surface-treated.

[0059] There is no particular limitation on the particle size of the thermally conductive particles. From the viewpoint of suppressing the viscosity of the curable resin composition contained in the backing material layer 54 to a low level while maintaining a high mechanical strength of the backing material layer 54, the particle size of the thermally conductive particles is preferably 1 to 300 μm, more preferably 5 to 100 μm, and even more preferably 8 to 30 μm. The "particle size" of the thermally conductive particles refers to the number average particle size.

[0060] The proportion of thermally conductive particles in the total amount of components other than the resin in the backing material layer 54 is preferably 50% by volume or more, more preferably 60% by volume or more, and even more preferably 65% ​​by volume or more. It is also preferable that all components in the backing material layer 54, excluding the resin, are thermally conductive particles. The content of thermally conductive particles in the backing material layer 54 is preferably 30-60% by volume, more preferably 30-55% by volume, and even more preferably 30-50% by volume.

[0061] In addition to the aforementioned resin and thermally conductive particles, the backing material layer 54 may also contain other components. These other components may include hollow particles. Including hollow particles can further improve ultrasonic attenuation. As hollow particles, there are no particular limitations on the use of hollow particles commonly used to exhibit improved sound wave attenuation or ultrasonic attenuation; either hollow glass particles or hollow resin particles can be used, with hollow resin particles being preferred.

[0062] Examples of hollow particles include, for instance, glass capsules, hollow silica, cenolite, phenolic resin microcapsules, urea-formaldehyde resin microcapsules, polymethyl methacrylate capsules, and thermally expandable microcapsules. Furthermore, a single type of hollow particle may be used, or two or more may be used in combination. In this specification, when two or more types of hollow particles are contained, the content of hollow particles refers to their total amount.

[0063] There is no particular limitation on the particle size of the hollow particles. From the viewpoint of suppressing the viscosity of the curable resin composition to a low level while maintaining a high mechanical strength of the backing material layer 54, the particle size of the hollow particles is preferably 1 to 300 μm, more preferably 5 to 100 μm, and even more preferably 20 to 80 μm. Furthermore, the term "particle size" for hollow particles has the same meaning as the term "particle size" for thermally conductive particles described above. That is, the "particle size" of hollow particles is the number-average particle size.

[0064] Other components mentioned above may include dispersants, diluents, colorants, viscosity modifiers, plasticizers, curing accelerators, etc. The content of other components in the backing material layer 54 can, for example, be set to 10-20% by volume.

[0065] A preferred embodiment of the backing material layer 54 may include, for example, a resin comprising at least one of polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure, and thermally conductive particles. This resin has the aforementioned specific loss tangent, the aforementioned specific storage modulus, and contains the aforementioned hollow particles. In this embodiment, the content of the resin in the backing material layer 54 is 25-50% by volume, preferably 30-50% by volume. The content of the thermally conductive particles is preferably 30-60% by volume, more preferably 30-55% by volume, and even more preferably 30-50% by volume. The content of the hollow particles is preferably 10-20% by volume.

[0066] The backing material layer 54 is preferably formed using a curable resin composition. The curable resin composition comprises any one of the following: the thermally conductive particles described above; a combination of a polyisocyanate compound and a polyamine compound as resin components; a combination of an epoxy resin having a polyurethane structure and a polyamine compound; or a combination of an epoxy resin and a polyamine compound, wherein at least one of the epoxy resin and the polyamine compound has a polyether structure.

[0067] <Manufacturing Method of Backing Material Layer>

[0068] The curable resin composition constituting the backing material layer 54 can be prepared by conventional methods. For example, as components constituting the curable resin composition, a resin component comprising the aforementioned thermally conductive particles, and at least one of polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure, along with suitable other components, can be obtained by mixing using a mixing apparatus such as a rotary kneader, a pressure kneader, a Banbury mixer (continuous kneader), or a two-roll mixer. The mixing order of the components is not particularly limited. The mixing conditions are not particularly limited, as long as the thermally conductive particles are dispersed in the resin component.

[0069] By curing the curable resin composition thus obtained, a backing material layer 54 can be obtained. The curing conditions can be adjusted according to the chemical reaction of the resin components contained in the curable resin composition, for example, by heating and curing it at a specific temperature for a constant time, thereby obtaining the backing material layer 54.

[0070] The shape of the backing material layer 54 is not particularly limited. For example, it can be made into the preferred shape of the backing material layer using the mold described above during curing, or it can be made by obtaining a sheet-like backing material and cutting it using cutting or the like to produce the desired backing material layer. In addition, the backing material layer 54 of this invention has excellent processability, so when it is cut into the desired shape at a spacing of μm, the occurrence of deformation, breakage, etc. can be suppressed while producing the desired backing material layer.

[0071] The intermediate layer 53 is provided to prevent ions generated from the metal contained in the metal ring 41c from contacting the backing material layer 54. The metal ring 41c generates ions through hydrogen peroxide gas used for sterilization, which could potentially degrade the backing material layer 54 made of the aforementioned materials. The presence of the intermediate layer 53 prevents these ions from reaching the backing material layer 54, thus preventing its deterioration.

[0072] Regarding the intermediate layer 53, it is preferable to make it thinner in order to reduce the diameter of the front end 40. For example, the intermediate layer 53 is preferably formed by coating the outer peripheral surface of the metal ring 41c with a material by means of coating or attaching, or by surface treating the outer peripheral surface of the metal ring 41c. As the intermediate layer 53, tape coated with heat-resistant silicone adhesive, DLC (Diamond-Like Carbon) coating, silicone coating, parylene coating, or ABEL BLACK (registered trademark) can be used. The intermediate layer 53 is more preferably made of a material with high voltage resistance. In addition, by also providing the intermediate layer 53 on the end face in the axial direction of the backing material layer 54, it is possible to further suppress ions from reaching the backing material layer 54.

[0073] The metal ring 41c and the backing material layer 54 are fixed together via an intermediate layer 53. Specifically, an adhesive is applied to the surface of the intermediate layer 53, which is formed by coating or similar means on the outer surface of the metal ring 41c, and the intermediate layer 53 and the backing material layer 54 are fixed together by this adhesive. In this way, by fixing the metal ring 41c and the backing material layer 54 together via the intermediate layer 53, the stress applied to the backing material layer 54 can be reduced even when the difference in the coefficients of thermal expansion between the metal ring 41c and the backing material layer 54 is large.

[0074] At the front end 40, a balloon (not shown) filled with an ultrasonic transmission medium (e.g., water, oil, etc.) covering the ultrasonic observation section 36 can be easily installed and removed.

[0075] like Figure 3 As shown, an observation system unit 85 is disposed at the front end 40, behind the observation window 78 (on the base end side). The observation system unit 85 includes, for example, an objective lens 86, a prism 88, an imaging element 90, a substrate 92, and a signal cable 94. The front end portion of the observation system unit 85 is inserted into the interior of the metal ring 41c. The observation system unit 85 constitutes an imaging module.

[0076] Reflected light from the object being observed, entering through the observation window 78, is captured by the objective lens 86. The captured reflected light passes through the prism 88, where its optical path is bent at a right angle, and is imaged onto the imaging surface of the imaging element 90. The imaging element 90 performs photoelectric conversion on the reflected light from the object being observed, which is transmitted through the observation window 78, the objective lens 86, and the prism 88 and imaged onto the imaging surface, to output an image signal.

[0077] An imaging element 90 is mounted on a substrate 92. A circuit pattern (not shown) electrically connected to the imaging element 90 is formed on the substrate 92. The circuit pattern has multiple electrodes at its ends, and multiple signal cables 94 are respectively connected to these electrodes. The multiple signal cables 94 are connected to an endoscope connector 32b (see reference). Figure 1 The endoscope connector 32b is connected to the endoscope processor device 16.

[0078] The emitting end of the light guide 98 is connected to the illumination window 80 (reference). Figure 2 The incident end of the light guide 98 is connected to the light source device 18 via a universal plug cord 26. The illumination light emitted from the light source device 18 is propagated through the light guide 98 and shines on the observed part through the illumination window 80.

[0079] To clean the surfaces of the observation window 78 and the lighting window 80, the cleaning nozzle 82 sprays air or cleaning water from the water supply tank 21a through the air and water supply channel 100 inside the ultrasonic endoscope 12 toward the observation window 78 and the lighting window 80. A treatment device channel 84 is connected to the treatment device outlet 76.

[0080] Example

[0081] The following describes an embodiment of the backing material layer 54 of the present invention, but the backing material layer 54 is not to be interpreted in a limiting manner based on these results.

[0082] <1> Preparation of compositions for backing material layers

[0083] A composition (curable resin composition) for a backing material layer having the following composition was prepared.

[0084] (Polyurea resin)

[0085] A composition for a backing material layer was prepared by mixing 2.5 parts of isophthalic diisocyanate (Tokyo Chemical Industry Co., Ltd.) as polyisocyanate, 45 parts of a resin composition consisting of 2 parts of ELASMER250P (KUMIAI CHEMICAL INDUSTRY CO.,LTD.) and 8 parts of ELASMER650P (KUMIAI CHEMICAL INDUSTRY CO.,LTD.) as polyamine, 25 parts of tungsten carbide particles (WC-100S (manufactured by ALMTCorp.)) and 15 parts of silicon carbide particles (SSC-A15 (manufactured by Shinano Electric Refining Co., Ltd.)) as thermally conductive particles.

[0086] (Epoxy resin with a polyurethane structure)

[0087] A composition for a backing material layer was prepared by mixing 10 parts of ADEKA RESIN EPU-11F (ADEKA CORPORATION) as an epoxy resin having a polyurethane structure, 45 parts of a resin composition consisting of 0.6 parts of 2,2,4-trimethylhexamethylenediamine (Tokyo Chemical Industry Co., Ltd.) and 1.0 parts of GASKAMINE-328 (MITSUBISHI GAS CHEMICAL COMPANY, INC.) as a polyamine, 25 parts of tungsten carbide particles (WC-100S (manufactured by ALMTCorp.)) and 15 parts of silicon carbide particles (SSC-A15 (manufactured by Shinano Electric Refining Co., Ltd.)) as thermally conductive particles.

[0088] (Epoxy resin with a polyetheramine structure)

[0089] A composition for a backing material layer was prepared by mixing 10 parts of jER828 (Mitsubishi Chemical Corporation) as a bisphenol A type epoxy resin, 45 parts of a resin composition consisting of 4.5 parts of JEFFAMINE D400 (Huntsman International LLC) and 6.0 parts of JEFFAMINE D2000 (Huntsman International LLC) as a difunctional polyether polyamine, 25 parts of tungsten carbide particles (WC-100S (manufactured by ALMTC orp.)) and 15 parts of silicon carbide particles (SSC-A15 (manufactured by Shinano Electric Refining Co., Ltd.)) as thermally conductive particles.

[0090] <2> Fabrication, testing, and evaluation of backing material sheets

[0091] The backing material layer composition prepared above was poured into a square mold with one side of 30 mm and the desired depth, heated at 80°C for 18 hours, and then heated at 150°C for 1 hour to cure it, thereby producing a square backing material sheet with one side of 30 mm and the desired thickness. The depth of the mold used and the thickness of the obtained sheet were 2 mm and 0.5 mm, respectively. The backing material sheet was measured and evaluated as follows.

[0092] (1) Determination of thermal conductivity

[0093] Test pieces were prepared by cutting square backing material sheets with a thickness of 0.5 mm into strips with a width of 5 mm. The test pieces were then tested using the laser flash method according to JIS (Japanese Industrial Standard) R 1611. Test pieces containing compositions with any backing material layer all showed a good value of 1.0 W / m·K.

[0094] (2) Determination of attenuation rate

[0095] According to the method described in JIS (Japanese Industrial Standard) Z 2354 (2012) Method for Determination of Ultrasonic Attenuation Coefficient of Solids, the intensity of the reflected echo was measured using a sing-around sound velocity measuring device (manufactured by ULTRASO NIC ENGINEERING CO., LTD., trade name "UVM-2 type"). In the measurement, a 2 MHz measuring probe was used in water at 25°C, and the attenuation rate was determined based on the intensity difference of the reflected echo caused by the presence or absence of a measuring test piece used for the aforementioned sound velocity measurement and the thickness of the measuring test piece. Test pieces containing any backing material layer composition showed a good attenuation rate exceeding 4.0 dB / mm·MHz.

[0096] The results above show that polyurea resin, epoxy resin with a polyurethane structure, or epoxy resin with a polyetheramine structure exhibits good thermal conductivity and attenuation rate, and is therefore a suitable material for the backing material layer of ultrasonic endoscopes.

[0097] In the ultrasonic endoscope 12, the imaging module extends through the interior of the metal ring 41c, and the endoscopic observation section 38 is located further forward than the ultrasonic observation section 36, but it is not limited to this. For example, it could also be a structure in which the endoscopic observation section 38 is positioned further forward than the ultrasonic observation section 36, and images are taken from the side of the front end 40 to the front of the front end 40.

[0098] As explained above, at least the following items are described in this instruction manual. (1)

[0100] An ultrasonic endoscope, comprising:

[0101] A cylindrical component, made of metal;

[0102] An ultrasonic transducer is disposed along the outer peripheral surface of the aforementioned cylindrical component; and

[0103] A backing material layer is disposed between the ultrasonic transducer and the cylindrical component.

[0104] The aforementioned backing material layer comprises at least one of polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure. (2)

[0106] According to the ultrasonic endoscope described in (1), wherein,

[0107] The aforementioned backing material layer is composed of heat-dissipating filler. (3)

[0109] According to the ultrasonic endoscope described in (2), wherein,

[0110] The thermal conductivity of the aforementioned heat dissipation filler is above 30 W / m·K. (4)

[0112] According to the ultrasonic endoscope described in (3), wherein,

[0113] The aforementioned heat dissipation filler includes at least one of aluminum oxide, tungsten oxide, silicon carbide, tungsten carbide, silicon nitride, boron nitride, and aluminum nitride. (5)

[0115] According to any one of (1) to (4) of the ultrasonic endoscope, wherein,

[0116] The aforementioned cylindrical component and the aforementioned backing material layer are fixed together via an intermediate layer. (6)

[0118] According to the ultrasonic endoscope described in (5), wherein,

[0119] The aforementioned intermediate layer prevents ions generated from the metal contained in the aforementioned cylindrical component from coming into contact with the aforementioned backing material layer. (7)

[0121] According to the ultrasonic endoscope described in (6), wherein,

[0122] The aforementioned backing material layer is fixed to the aforementioned intermediate layer formed on the outer peripheral surface of the aforementioned cylindrical component. (8)

[0124] The ultrasonic endoscope according to any one of (1) to (7) comprises:

[0125] The receiving section accommodates the aforementioned cylindrical component; and

[0126] A filler is used to fill the space around the cylindrical component in the aforementioned receiving portion.

[0127] The viscosity of the above-mentioned filler in its uncured state at a shear rate of 0.01 / s is less than 100 Pa·s. (9)

[0129] According to the ultrasonic endoscope described in (8), wherein,

[0130] The above-mentioned filler is based on resin and contains thixotropic agents. (10)

[0132] According to the ultrasonic endoscope described in (9), wherein,

[0133] The aforementioned thixotropic agent contains fumed silica. (11)

[0135] According to any one of (1) to (10) of the ultrasonic endoscope, wherein,

[0136] The thickness of the aforementioned backing material layer is 0.5 mm or more and 1.5 mm or less. (12)

[0138] According to any one of (1) to (11) of the ultrasonic endoscope, wherein,

[0139] The center frequency of the vibration frequency of the aforementioned ultrasonic transducer is above 5MHz and below 12MHz. (13)

[0141] The ultrasonic endoscope according to any one of (1) to (12) includes an imaging module comprising an imaging element.

[0142] The imaging module is inserted into the interior of the cylindrical component.

[0143] Symbol Explanation

[0144] 10-Endoscope device, 12-Ultrasonic endoscope, 14-Ultrasonic processor device, 16-Endoscope processor device, 18-Light source device, 20-Display, 21a-Water supply tank, 21b-Suction pump, 22-Insertion part, 24-Operating part, 26-Universal plug rope, 28a-Air and water supply button, 28b-Suction button, 29-Angle button, 30-Insertion port for treatment device, 32a, 32b, 32c-Connectors, 34a-Air and water supply hose, 34b-Suction hose, 36-Ultrasonic observation part, 38-Endoscope observation part, 40-Front end, 41a-Front end part, 41b-Base side ring, 41c-Metal ring, 42-Bend 44-Flexible section, 46-Ultrasonic transceiver section, 48-Ultrasonic transducer, 52a-Individual electrode, 52b-Common electrode, 52-Electrode section, 53-Intermediate layer, 54-Backing material layer, 55-Filler, 56-Flexible printed circuit board, 58-Coaxial cable, 64-Acoustic matching layer, 66-Acoustic lens, 72-Signal harness, 76-Disposal device outlet, 78-Observation window, 80-Illumination window, 82-Cleaning nozzle, 85-Observation system unit, 86-Objective lens, 88-Prism, 90-Imaging element, 92-Substrate, 94-Signal cable, 98-Light guide, 100-Air and water supply channels, 110-Support component, 120-Support.

Claims

1. An ultrasonic endoscope, characterized in that, have: A cylindrical component, made of metal; An ultrasonic transducer is disposed along the outer peripheral surface of the cylindrical component; and A backing material layer is disposed between the ultrasonic transducer and the cylindrical component. The backing material layer comprises at least one of polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure.

2. The ultrasonic endoscope according to claim 1, characterized in that, The backing material layer is composed of heat-dissipating filler.

3. The ultrasonic endoscope according to claim 2, characterized in that, The thermal conductivity of the heat dissipation filler is above 30 W / m·K.

4. The ultrasonic endoscope according to claim 3, characterized in that, The heat dissipation filler comprises at least one of aluminum oxide, tungsten oxide, silicon carbide, tungsten carbide, silicon nitride, boron nitride, and aluminum nitride.

5. The ultrasonic endoscope according to any one of claims 1 to 4, characterized in that, The cylindrical component is fixed to the backing material layer via an intermediate layer.

6. The ultrasonic endoscope according to claim 5, characterized in that, The intermediate layer prevents ions generated from the metal contained in the cylindrical component from coming into contact with the backing material layer.

7. The ultrasonic endoscope according to claim 6, characterized in that, The backing material layer is fixed to the intermediate layer formed on the outer peripheral surface of the cylindrical component.

8. The ultrasonic endoscope according to any one of claims 1 to 4, 6, and 7, characterized in that, have: A receiving portion for accommodating the cylindrical component; and A filler is used to fill the space around the cylindrical component within the receiving portion. The viscosity of the filler in its uncured state at a shear rate of 0.01 / s is less than 100 Pa·s.

9. The ultrasonic endoscope according to claim 8, characterized in that, The filler is based on resin and contains a thixotropic agent.

10. The ultrasonic endoscope according to claim 9, characterized in that, The thixotropic agent comprises fumed silica.

11. The ultrasonic endoscope according to any one of claims 1 to 4, 6, 7, 9, and 10, characterized in that, The thickness of the backing material layer is more than 0.5 mm and less than 1.5 mm.

12. The ultrasonic endoscope according to claim 11, characterized in that, The center frequency of the ultrasonic transducer is above 5MHz and below 12MHz.

13. The ultrasonic endoscope according to any one of claims 1 to 4, 6, 7, 9, 10, and 12, characterized in that, It has an imaging module that includes imaging elements. The imaging module is inserted into the interior of the cylindrical component.

Images