Photoresist recovery device

Abstract

The utility model discloses a photoresist recovery device, which comprises a first shell, a second shell, a third shell and a fourth shell, the second shell is arranged in the first accommodating cavity and is provided with a second accommodating cavity; a communicating channel is formed in the side wall of the second shell so as to communicate the first accommodating cavity with the second accommodating cavity; the closing assembly is arranged on the second shell so as to control opening and closing of the communicating channel; the photoresist collecting part is provided with a first pipeline, and the first pipeline is arranged in the first accommodating cavity in a communicating manner; when the photoresist is sprayed to the wafer, the sealing assembly controls the communicating channel to be opened, and the redundant photoresist enters the first containing cavity in the spraying process and is collected by the photoresist collecting part after passing through the first pipeline. According to the invention, the problem of waste of the photoresist in the spraying process can be improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and more particularly to a photoresist recycling device. Background Technology

[0002] With the rapid development of the semiconductor industry, the demand for photoresist, as one of the core materials, is constantly increasing. However, the production cost of photoresist is relatively high, and its price is affected by various factors, such as raw material prices and the complexity of the production process. Therefore, saving on photoresist has become an important issue for semiconductor manufacturers from the perspective of resource efficiency and cost control.

[0003] In existing technologies, during photoresist recycling, a lifting platform is typically used to position the wafer at different heights, combined with the function of a protective cover, to separate the photoresist from the cleaning solvent. However, the lifting platform occupies space and requires the wafer to remain stationary during the lifting process, which affects the wafer coating process progress. In addition, if the lifting accuracy is inaccurate, it will affect the alignment of the wafer with the wafer inlet and outlet, and will still waste photoresist.

[0004] Therefore, it is necessary to provide a new photoresist recycling device to solve the above-mentioned problems existing in the prior art. Summary of the Invention

[0005] The purpose of this invention is to provide a photoresist recycling device for recycling photoresist, which can improve the problem of photoresist waste during the spraying process.

[0006] To achieve the above objectives, the technical solution of the present invention is as follows:

[0007] A photoresist recycling device, comprising:

[0008] The first housing has a first receiving cavity;

[0009] A second housing is disposed within the first receiving cavity and has a second receiving cavity; a communicating channel is provided on the side wall of the second housing to connect the first receiving cavity and the second receiving cavity;

[0010] A closure component, located in the second housing, controls the opening and closing of the communication channel;

[0011] The photoresist collection unit has a first channel that is connected to the first receiving cavity. When photoresist is sprayed onto the wafer, the sealing component controls the opening of the connecting channel. During the spraying process, excess photoresist enters the first receiving cavity and is collected by the photoresist collection unit after passing through the first channel.

[0012] By adopting the above technical solution, and by setting up a first shell and a second shell, photoresist can be recycled in a dual-shell manner. The opening and closing of the connecting channel can be controlled by the sealing component. When the wafer is sprayed with photoresist, the connecting channel is open, and the photoresist can enter the first receiving cavity and be collected through the first pipe. When the wafer is sprayed with other solvents, the connecting channel is closed, and the other solvents enter the second receiving cavity. In other words, the dual-shell method enables different solutions to enter different pipelines, thereby realizing the recycling of photoresist and improving the problem of photoresist waste caused during the photoresist spraying process in the prior art.

[0013] Optional, also includes:

[0014] The solvent collection section has a second pipe, one end of which passes through the first housing and is disposed in the second housing, so that the second pipe communicates with the second receiving cavity;

[0015] When the wafer is coated with solvents other than the photoresist, the sealing component controls the closure of the communication channel, and the excess solvent enters the second receiving cavity and is collected by the solvent collection section after passing through the second pipe.

[0016] Optionally, the bottom wall of the first housing is inclined, and the first channel is disposed on the bottom wall of the first housing, so that the photoresist in the first receiving cavity enters the first channel along the inclined direction of the bottom wall of the first housing.

[0017] Optionally, the bottom wall of the second housing is inclined, and the second pipe is disposed on the bottom wall of the second housing, so that the other solvent in the second receiving cavity enters the second pipe along the inclined direction of the bottom wall of the second housing.

[0018] Optionally, the sidewalls of the connecting channel are symmetrically provided with storage slots along the vertical direction; the closing component includes:

[0019] An electromagnetic adsorption component is movably disposed in the storage slot and adsorbs with adjacent electromagnetic adsorption components when energized.

[0020] An elastic element, one end of which is disposed on the inner wall of the storage groove, and the other end of which is disposed on the electromagnetic adsorption element;

[0021] When the electromagnetic adsorption element is energized, the symmetrically arranged electromagnetic adsorption elements attract each other and drive the elastic element to move, thus closing the connecting channel; when the electromagnetic adsorption element is de-energized, the elastic element drives the electromagnetic adsorption element to separate, thus opening the connecting channel.

[0022] Optionally, the enclosure component includes:

[0023] Electromagnetic adsorption components are symmetrically arranged on the sidewalls of the connecting channel along the vertical direction;

[0024] The second housing is made of a flexible material so that when the electromagnetic adsorption components are energized, the symmetrically arranged electromagnetic adsorption components attract each other, causing the sidewall of the second housing to deform and close the connecting channel.

[0025] Optionally, it also includes a controller, which is electrically connected to the electromagnetic adsorption component to control the conduction or disconnection of the circuit at the electromagnetic adsorption component.

[0026] Optionally, both the first housing and the second housing are annular, and the edges of the first housing and the second housing are sealed together to form a passage space for the passage of a wafer.

[0027] Optionally, a baffle is provided on the bottom wall of the second housing along the circumferential direction of the space, and the baffles are connected end to end to form a ring structure to intercept the photoresist or other solvents.

[0028] Optionally, both the first housing and the second housing are made of flexible material, and both the first housing and the second housing have baffles on their sidewalls, so that the first housing and the second housing form an annular structure to collect the photoresist or the other solvents. Attached Figure Description

[0029] Fig. 1 This is a cross-sectional view of the main structure of a photoresist recycling device according to an embodiment of the present invention;

[0030] Fig. 2 This is a cross-sectional view of a closed component arrangement according to an embodiment of the present invention;

[0031] Fig. 3 This is a cross-sectional view of another closed component configuration according to an embodiment of the present invention.

[0032] Figure label:

[0033] 100, First housing; 110, First receiving cavity; 200, Second housing; 210, Second receiving cavity; 220, Connecting channel; 221, Receiving slot; 300, Sealing assembly; 310, Electromagnetic adsorption component; 320, Elastic component; 400, Photoresist collecting part; 410, First collecting box; 420, First pipe; 500, Solvent collecting part; 510, Second collecting box; 520, Second pipe; 600, Processing part; 610, Support seat; 620, Nozzle; 710, Passing space; 720, Baffle. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects.

[0035] The following is in conjunction with the appendix Figs. 1-3 The specific embodiments of the present invention will be further described in detail below.

[0036] Embodiments of the present invention provide a photoresist recycling device for recycling excess photoresist during wafer processing, wherein the photoresist recycling device includes:

[0037] The first housing 100 has a first receiving cavity 110;

[0038] The second housing 200 is disposed within the first receiving cavity 110 and has a second receiving cavity 210; the side wall of the second housing 200 is provided with a communicating channel 220 to communicate with the first receiving cavity 110 and the second receiving cavity 210.

[0039] A closing component 300 is disposed in the second housing 200 to control the opening and closing of the communication channel 220;

[0040] The photoresist collection unit 400 has a first channel 420, which is connected to the first receiving cavity 110. When the photoresist is sprayed onto the wafer, the sealing component 300 controls the opening of the connecting channel 220. During the spraying process, excess photoresist enters the first receiving cavity 110 and is collected by the photoresist collection unit 400 after passing through the first channel 420.

[0041] The first housing 100 and the second housing 200 together form a photoresist recycling device, and there is a gap between the inner wall of the first housing 100 and the outer wall of the second housing 200. The space formed around the second housing 200 is a second receiving cavity 210, and the space formed around the first housing 100 is a first receiving cavity 110. The first receiving cavity 110 at the gap between the first housing 100 and the second housing 200 is used to collect photoresist. In some embodiments, the first housing 100 and the second housing 200 are coaxially arranged so that the distance from the inner wall of the first housing 100 to the outer wall of the second housing 200 is uniform.

[0042] The wafer is processed within the second receiving cavity 210, specifically by spraying photoresist onto the wafer within the second receiving cavity 210, and excess photoresist can be recycled. A connecting channel 220 is provided on the side wall of the second housing 200, extending radially through the side wall of the second housing 200, allowing the first receiving cavity 110 and the second receiving cavity 210 to communicate through the connecting channel 220. Simultaneously, a sealing component 300 is also provided on the first housing 100, which can move on the first housing 100 to control the opening or closing of the connecting channel 220. When the connecting channel 220 is open, the first receiving cavity 110 and the second receiving cavity 210 are connected; when the connecting channel 220 is closed, the first receiving cavity 110 and the second receiving cavity 210 are isolated.

[0043] To facilitate the collection of photoresist, the photoresist recycling device is also equipped with a photoresist collection section 400. The photoresist collection section 400 has a first pipe 420 and a first collection box 410. One end of the first pipe 420 is connected to the first receiving cavity 110, and the other end is connected to the first collection box 410. The photoresist can enter the first collection box 410 through the first pipe 420, thereby collecting the photoresist. It is worth noting that the first collection box 410 is not necessary. It can also be other devices or equipment connected to the first pipe 420 that can be used for collection to collect photoresist.

[0044] During the wafer processing, photoresist is sprayed onto the wafer. During the photoresist spraying process, the sealing component 300 controls the opening of the connecting channel 220. During the spraying process, the wafer rotates synchronously, causing excess photoresist to be thrown out and enter the first receiving cavity 110 through the connecting channel 220. The photoresist enters the first conduit 420 in the first receiving cavity 110 and is collected by the photoresist collection unit 400.

[0045] In some embodiments, since other solvents need to be sprayed in addition to photoresist during the wafer coating process, the photoresist recycling device also includes:

[0046] The solvent collection section 500 has a second pipe 520, one end of which passes through the first housing 100 and is disposed in the second housing 200, so that the second pipe 520 is connected to the second receiving cavity 210.

[0047] When the wafer is coated with solvents other than photoresist, the sealing component 300 controls the closure of the communication channel 220, and the excess other solvents enter the second receiving cavity 210 and are collected by the solvent collection unit 500 after passing through the second pipe 520.

[0048] In some embodiments, the solvent collection unit 500 includes a second collection tank 510 and a second pipe 520. One end of the second pipe 520 is disposed in the second collection tank 510 and communicates with the interior of the second collection tank 510. The other end of the second pipe 520 passes through the first housing 100 and is fixedly disposed in the second housing 200. The fixing method can be snap-fit, adhesive, or integral molding, etc., which is not limited here. The main requirement is that the second pipe 520 is stably connected to the second housing 200. At the same time, the second pipe 520 communicates with the second receiving cavity 210. It is worth noting that the part of the second pipe 520 that passes through the first housing 100 is kept sealed. The sealing method is prior art and will not be described in detail here. In addition, the second collection tank 510 is not necessary. It can also be other devices or equipment that communicate with the second pipe 520 for collecting other solvents.

[0049] In some embodiments, when other solvents are sprayed onto the wafer, the sealing component 300 controls the closure of the communication channel 220, so that other solvents cannot enter the first receiving cavity 110, but can only enter the second receiving cavity 210, and enter the second pipe 520 inside the second receiving cavity 210, so that they are collected by the solvent collection unit 500 after flowing through the second pipe 520.

[0050] In some embodiments, in order to facilitate the control of the first pipe 420 and the second pipe 520, control valves are provided on both the first pipe 420 and the second pipe 520 to control the opening and closing of the first pipe 420 and the second pipe 520 respectively.

[0051] In some specific embodiments, the control valve is a solenoid valve, which controls the connection or disconnection of the first pipeline 420 or the second pipeline 520 as needed during use.

[0052] In some more specific embodiments, to facilitate the collection of photoresist and other solvents, self-priming pumps are provided in both the first collection tank 410 and the second collection tank 510 to accelerate the collection of photoresist or other solvents.

[0053] The bottom wall of the first housing 100 is inclined, and the first pipe 420 is provided on the bottom wall of the first housing 100 so that the photoresist in the first receiving cavity 110 enters the first pipe 420 along the inclined direction of the bottom wall of the first housing 100.

[0054] The bottom wall of the second housing 200 is inclined, and the second pipe 520 is provided on the bottom wall of the second housing 200 so that other solvents in the second receiving cavity 210 enter the second pipe 520 along the inclined direction of the bottom wall of the second housing 200.

[0055] To facilitate the flow of photoresist within the first receiving cavity 110, the bottom wall of the first housing 100 is inclined, allowing the photoresist within the first receiving cavity 110 to flow along the inclined direction of the bottom wall of the first housing 100. To facilitate the photoresist entering the first channel 420, the first channel 420 is connected to the bottom of the inclined direction of the bottom wall of the first housing 100, allowing the photoresist to flow toward the first channel 420, thereby facilitating the entry of the photoresist into the first channel 420.

[0056] More specifically, in order to facilitate the flow of other solvents in the second receiving cavity 210, the bottom wall of the second housing 200 is inclined, so that other solvents in the second receiving cavity 210 can flow along the inclined direction of the bottom wall of the second housing 200. In order to facilitate other solvents to enter the second pipe 520, the second pipe 520 is connected to the bottom of the inclined direction of the bottom wall of the second housing 200, so that other solvents can flow toward the second pipe 520, thereby facilitating the entry of other solvents into the second pipe 520.

[0057] In some embodiments, the bottom wall of the first housing 100 may be inclined in a manner that is circumferentially inclined around the first pipe 420, that is, the bottom is at the first pipe 420, and the bottom wall of the first housing 100 gradually rises in a direction away from the first pipe 420, so as to facilitate the flow of photoresist into the interior of the first pipe 420; the bottom wall of the second housing 200 may be inclined in a manner that is circumferentially inclined around the second pipe 520, that is, the bottom is at the second pipe 520, and the bottom wall of the second housing 200 gradually rises in a direction away from the second pipe 520, so as to facilitate the flow of other solvents into the interior of the second pipe 520.

[0058] In some embodiments, in order for the enclosure component 300 to close the communication channel 220, the following configuration method is adopted:

[0059] The connecting channel 220 has symmetrically formed storage slots 221 along its vertical direction on its side wall; the enclosing assembly 300 includes:

[0060] The electromagnetic adsorption component 310 is movably disposed in the storage groove 221 and adsorbs with the adjacent electromagnetic adsorption component 310 when energized.

[0061] The elastic element 320 has one end located on the inner wall of the storage groove 221 and the other end located on the electromagnetic adsorption element 310.

[0062] When the electromagnetic adsorption component 310 is powered on, the symmetrically arranged electromagnetic adsorption components 310 adsorb each other and drive the elastic component 320 to move, thus closing the connecting channel 220; when the electromagnetic adsorption component 310 is de-powered, the elastic component 320 drives the electromagnetic adsorption component 310 to separate, thus opening the connecting channel 220.

[0063] The electromagnetic adsorption component 310 is disposed in the storage groove 221. The elastic component 320 can drive the electromagnetic adsorption component 310 to move along the axial direction of the storage groove 221 within the storage groove 221. In the initial state, the elastic component 320 contracts, pulling the electromagnetic adsorption component 310 to be stored in the storage groove 221. In some embodiments, the elastic component 320 is a spring.

[0064] In some embodiments, the electromagnetic adsorption element 310 is electrically connected to an external supply device via a circuit. The supply device can supply power to the electromagnetic adsorption element 310, which is prior art and will not be described in detail here. In operation, when the connecting channel 220 needs to be closed, the electromagnetic adsorption element 310 is energized. The symmetrically arranged electromagnetic adsorption elements 310 attract each other, causing the elastic element 320 to move, thereby closing the connecting channel 220. Furthermore, a flexible material is wrapped around the elastic element 320 to cover the receiving groove 221. When the electromagnetic adsorption elements 310 attract each other, the elastic element 320 stretches, simultaneously stretching the flexible material, thereby partially covering the movement trajectory of the elastic element 320, further isolating the first receiving cavity 110 and the second receiving cavity 210. In some specific embodiments, the elastic element 320 can be a plastic film or a film of other materials, or a hydrophilic flexible tube. When the connecting channel 220 needs to be opened, the electromagnetic adsorption component 310 is de-energized, and the elastic component 320 drives the symmetrically arranged electromagnetic adsorption components 310 to separate and move the electromagnetic adsorption components 310 toward the storage groove 221 so that the connecting channel 220 is opened.

[0065] Furthermore, the elastic element 320 inside the storage slot 221 can be one or multiple, and there is no restriction here.

[0066] In some embodiments, when a storage groove 221 is provided on the side wall of the connecting channel 220, the material of the second housing 200 can be a rigid material or a flexible material, without limitation, as long as it can enable the opening and closing of the connecting channel 220.

[0067] In some embodiments, when the second housing 200 is made of a flexible material, the enclosure assembly 300 includes:

[0068] The electromagnetic adsorption component 310 is symmetrically arranged on the side wall of the connecting channel 220 along the vertical direction;

[0069] The second housing 200 is made of a flexible material so that when the electromagnetic adsorption components 310 are energized, the symmetrically arranged electromagnetic adsorption components 310 adsorb each other, causing the side wall of the second housing 200 to deform and close the connecting channel 220.

[0070] Specifically, the electromagnetic adsorption component 310 is directly fixed to the side wall of the connecting channel 220, either by adhesive or bolts, with no limitation on the method, as long as the position of the electromagnetic adsorption component 310 does not shift. In operation, when the electromagnetic adsorption component 310 is energized, the symmetrically arranged electromagnetic adsorption components 310 will attract each other. Since the second housing 200 is made of flexible material, the electromagnetic adsorption components 310 can deform the side wall of the second housing 200 during the mutual attraction process, thereby sealing the connecting channel 220. It is worth noting that when the electromagnetic adsorption component 310 is directly disposed on the side wall of the connecting channel 220, to facilitate the sealing of the connecting channel 220, the connecting channel 220 can penetrate the second housing 200 circumferentially, allowing the second housing 200 to deform as a whole. When the symmetrically arranged electromagnetic adsorption components 310 attract each other, the second housing 200 deforms, ensuring that there are no gaps in the connecting channel 220 due to deformation.

[0071] In some specific embodiments, the second housing 200 is a flexible tube made of a hydrophilic material.

[0072] The photoresist recycling device also includes a controller, which is electrically connected to the electromagnetic adsorption component 310 to control the conduction or disconnection of the circuit at the electromagnetic adsorption component 310.

[0073] In some embodiments, the controller is located outside the first housing 100 and forms an electrical circuit with the electromagnetic adsorption component 310. The controller can be a power supply and a switch, or other device that can control the electromagnetic adsorption component 310 to be powered on or off. There are no restrictions here, as long as it can control the electromagnetic adsorption component 310 to be powered on and off.

[0074] To facilitate wafer coating, a processing unit 600 is provided, the position of which corresponds to the position of the second receiving cavity 210. The wafer is processed by the processing unit 600 within the second receiving cavity 210 to coat it with photoresist or other solvents. Specifically, the processing unit 600 includes a carrier 610 and a nozzle 620. The carrier 610 is rotatably disposed within the second receiving cavity 210 and is used to support the wafer. When the wafer is placed on the carrier 610, the rotation of the carrier 610 can drive the wafer to rotate synchronously. The nozzle 620 is disposed within the second receiving cavity 210, with a gap between one end of the nozzle 620 and the carrier 610, for spraying photoresist or solvent onto the carrier 610. The other end of the nozzle 620 is connected to an external supply device, which provides photoresist or other solvents to facilitate spraying from the nozzle 620.

[0075] Both the first housing 100 and the second housing 200 are annular, and the edges of the first housing 100 and the second housing 200 are sealed together to form a passage space 710, which is used for passing a wafer.

[0076] Since the carrier 610 can drive the wafer to rotate, the first housing 100 and the second housing 200 are both annular to facilitate the collection of photoresist or other solvents. The lower edges of the first housing 100 and the second housing 200 are sealed together to prevent leakage of photoresist or other solvents, and a passage space 710 is formed inside the first housing 100 and the second housing 200 after sealing. The upper edges of the first housing 100 and the second housing 200 may or may not be connected; in this embodiment, they are preferably connected. Therefore, passage spaces 710 are formed at the top and bottom of the first housing 100 and the second housing 200. The carrier 610 and the nozzle 620 are both inserted through the passage space 710; more specifically, the carrier 610 is inserted through the passage space 710 formed at the bottom of the first housing 100, and the nozzle 620 is inserted through the passage space 710 formed at the top of the first housing 100.

[0077] In some specific embodiments, during wafer coating, the carrier 610 supports the wafer and drives the wafer through the bottom passage space 710, and the nozzle 620 passes through the top passage space 710, so that the wafer is coated in the second receiving cavity 210.

[0078] The bottom wall of the second housing 200 is provided with a baffle 720 along the circumference of the space 710. The baffles 720 are connected end to end to form a ring structure to intercept photoresist or other solvents.

[0079] Furthermore, to prevent leakage of photoresist or other solvents, the baffle 720 is arranged circumferentially around the passage space 710 and connected end to end to form a ring structure; the diameter of the ring structure is larger than the diameter of the carrier 610, so that the carrier 610 and the wafer can pass through the passage space 710.

[0080] Furthermore, during the wafer processing, the wafer is placed on the carrier 610 by the robotic arm, and the carrier 610 drives the wafer to rotate. At this time, the nozzle 620 moves to the center of the wafer to spray solvent. At this time, the connecting channel 220 is closed to collect the solvent. In addition, when the nozzle 620 sprays the edge of the wafer, the connecting channel 220 is closed to collect the solvent.

[0081] When collecting photoresist, the controller opens the connecting channel 220 by controlling the sealing component 300. At this time, the nozzle 620 sprays photoresist, and excess photoresist can enter the first receiving cavity 110 for photoresist collection.

[0082] When the carrier 610 rotates the wafer for spin drying, the connecting channel 220 is closed, and excess solvent is collected through the second pipe 520. After wafer processing is complete, it is delivered out of the carrier 610 by a robotic arm.

[0083] In some embodiments, the first housing 100 and the second housing 200 are both made of flexible material, and the sidewalls of the first housing 100 and the second housing 200 are both provided on the baffle 720, so that the first housing 100 and the second housing 200 form an annular structure to collect photoresist or other solvents.

[0084] In some embodiments, both the first housing 100 and the second housing 200 are composed of a hose made of a hydrophilic material.

[0085] In some embodiments, the second housing 200 is composed of a flexible tube made of hydrophilic material combined with an end point made of electromagnetic material, namely the second housing 200 and the electromagnetic adsorption member 310.

[0086] The implementation principle of the photoresist recycling device in this embodiment is as follows: The wafer is placed on the carrier 610 by a robotic arm. The carrier 610 drives the wafer into the second receiving cavity 210 and rotates within the second receiving cavity 210. At this time, the nozzle 620 moves to the center of the wafer to spray photoresist or solvent. When spraying solvent, the sealing component 300 closes the connecting channel 220, and other solvents are collected through the second pipe 520. When spraying photoresist, the sealing component 300 opens the connecting channel 220, and excess photoresist is collected through the first pipe 420, so that different solutions enter different pipes, thereby realizing the recycling of photoresist.

[0087] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as set forth in the claims. Furthermore, the invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A photoresist recycling device, characterized in that, include: The first housing (100) has a first receiving cavity (110); The second housing (200) is disposed within the first receiving cavity (110) and has a second receiving cavity (210); the side wall of the second housing (200) is provided with a communicating channel (220) to communicate the first receiving cavity (110) and the second receiving cavity (210); A closure component (300), disposed in the second housing (200), controls the opening and closing of the communication channel (220); The photoresist collection unit (400) has a first conduit (420) which is connected to the first receiving cavity (110). When photoresist is sprayed onto the wafer, the sealing component (300) controls the opening of the connecting channel (220). During the spraying process, excess photoresist enters the first receiving cavity (110) and is collected by the photoresist collection unit (400) after passing through the first conduit (420).

2. The photoresist recycling device according to claim 1, characterized in that, Also includes: The solvent collection section (500) has a second pipe (520), one end of which passes through the first housing (100) and is disposed in the second housing (200), so that the second pipe (520) communicates with the second receiving cavity (210); When the wafer is coated with a solvent other than the photoresist, the sealing component (300) controls the closure of the communication channel (220), and the excess solvent enters the second receiving cavity (210) and is collected by the solvent collection section (500) via the second pipe (520).

3. The photoresist recycling device according to claim 2, characterized in that, The bottom wall of the first housing (100) is inclined, and the first pipe (420) is disposed on the bottom wall of the first housing (100) so that the photoresist in the first receiving cavity (110) enters the first pipe (420) along the inclined direction of the bottom wall of the first housing (100).

4. The photoresist recycling device according to claim 2, characterized in that, The bottom wall of the second housing (200) is inclined, and the second pipe (520) is provided on the bottom wall of the second housing (200) so that the other solvent in the second receiving cavity (210) enters the second pipe (520) along the inclined direction of the bottom wall of the second housing (200).

5. The photoresist recycling device according to claim 1, characterized in that, The connecting channel (220) has symmetrically formed storage slots (221) along its vertical direction on its sidewall; the enclosing assembly (300) includes: An electromagnetic adsorption component (310) is movably disposed in the storage groove (221) and adsorbs with the adjacent electromagnetic adsorption component (310) when energized. The elastic element (320) has one end disposed on the inner wall of the storage groove (221) and the other end disposed on the electromagnetic adsorption element (310); When the electromagnetic adsorption element (310) is energized, the symmetrically arranged electromagnetic adsorption elements (310) adsorb each other and drive the elastic element (320) to move, thereby closing the connecting channel (220); when the electromagnetic adsorption element (310) is de-energized, the elastic element (320) drives the electromagnetic adsorption element (310) to separate, thereby opening the connecting channel (220).

6. The photoresist recycling device according to claim 1, characterized in that, The enclosure component (300) includes: Electromagnetic adsorption components (310) are symmetrically arranged on the sidewalls of the connecting channel (220) along the vertical direction; The second housing (200) is made of a flexible material so that when the electromagnetic adsorption component (310) is energized, the symmetrically arranged electromagnetic adsorption components (310) adsorb each other, causing the side wall of the second housing (200) to deform, thereby closing the connecting channel (220).

7. The photoresist recycling apparatus according to claim 5 or 6, characterized in that, It also includes a controller, which is electrically connected to the electromagnetic adsorption element (310) to control the conduction or disconnection of the circuit at the electromagnetic adsorption element (310).

8. The photoresist recycling device according to claim 1, characterized in that, Both the first housing (100) and the second housing (200) are annular, and the edges of the first housing (100) and the second housing (200) are sealed together to form a passage space (710) for passing through a wafer.

9. The photoresist recycling device according to claim 8, characterized in that, The bottom wall of the second housing (200) is provided with a baffle (720) along the circumference of the passage space (710). The baffle (720) is connected end to end to form a ring structure to intercept the photoresist or other solvents.

10. The photoresist recycling apparatus according to claim 9, characterized in that, Both the first housing (100) and the second housing (200) are made of flexible material, and both the first housing (100) and the second housing (200) are provided with baffles (720) on their sidewalls, so that the first housing (100) and the second housing (200) form an annular structure to collect the photoresist or the other solvent.

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