Diode lead stamping die
By using a diode lead stamping die with partial extrusion, the problem of plating peeling caused by loose connection between the outer shell and the inner core was solved, resulting in a more stable connection and extending product life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- KUSN CHENYI SEMICON
- Filing Date
- 2025-05-22
- Publication Date
- 2026-05-08
AI Technical Summary
In traditional diode manufacturing processes, the mechanical connection between the outer casing and the inner core causes the plating to peel off, increasing internal resistance and reducing product lifespan.
A diode lead stamping die with partial extrusion is used. Through the cooperation of the press head and the drive block, the connection between the outer shell and the inner core is increased, and the plating is prevented from peeling off.
It improves the tightness of the connection between the outer shell and the inner core, prevents the coating from peeling off, and extends the product's service life.
Smart Images
Figure CN224208957U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of diode manufacturing technology, and in particular to a diode lead stamping die. Background Technology
[0002] The diode leads adopt a composite conductive structure, which consists of a metal shell and a conductive inner core in a coaxial assembly relationship. The metal shell is specifically a copper shell with a plating layer on its surface, and the shell is tightly fitted onto the outside of the inner core.
[0003] Traditional manufacturing processes use hexagonal flat pressing technology to achieve mechanical connection between the outer shell and the inner core. This causes the outer shell to undergo radial shrinkage deformation to enclose the inner core. During the pressing process, the plating inside the outer shell may peel off, which will increase internal resistance and reduce the product's service life. Utility Model Content
[0004] This application provides a diode lead stamping die, which reduces the extrusion area, increases the local extrusion strength, and improves the tightness of the connection between the outer shell and the inner core, thereby avoiding the problem of plating peeling.
[0005] This application provides a diode lead stamping die, including:
[0006] A first mounting base is provided with a first hole, and there are multiple first holes, forming a molding area between the first holes;
[0007] A pressure block is slidably inserted into the first hole. The end of the pressure block facing the forming area is a pressure head, which is used to press the outer shell of the diode lead.
[0008] An elastic element is disposed between the first mounting base and the pressure block, and the elastic element applies a spring force to the pressure block to retract toward the first hole;
[0009] The second mounting base is disposed adjacent to the first mounting base;
[0010] A drive block is connected to the second mounting base. The drive block is correspondingly arranged with the pressure block and is used to drive the pressure block to move toward the forming area.
[0011] The beneficial effects of the above embodiments are as follows: the driving block drives the pressure block to squeeze the outer shell. Since the pressure head is used for local squeezing, the local pressure is large, which makes the connection between the deformation position of the outer shell and the inner core more tight, thereby avoiding the problem of easy peeling of the inner plating due to loose connection.
[0012] Based on the above embodiments, the embodiments of this application can be further improved as follows:
[0013] In one embodiment of this application: the first hole is uniformly distributed around the central axis of the forming area. The beneficial effect of this step is that by uniformly distributing the first hole (and the pressure block) around the central axis of the forming area, the outer shell is subjected to uniform force during the stamping process. This uniformly distributed load can significantly reduce the thickness deviation in the deformation area of the outer shell.
[0014] In one embodiment of this application: the first orifice includes a communicating hole A and a hole B, the pressure block is slidably inserted into the hole A, and the hole B is used to slidably connect to the drive block. The beneficial effect of this step is that by designing the first orifice as a communicating hole A (for the pressure block to slide) and hole B (for the drive block to slide), a split guide structure is formed, ensuring that the movement paths of the pressure block and the drive block strictly correspond, avoiding radial displacement of the pressure block during the extrusion process, significantly improving the verticality and stability of the stamping action, and ensuring precise and controllable deformation position of the outer shell.
[0015] In one embodiment of this application: the pressure block has a first pressure surface, and the driving block has a second pressure surface. The first pressure surface and the second pressure surface are inclined structures relative to the direction of movement of the pressure block. The pressure block moves within the first hole by the mutual pressing of the first pressure surface and the second pressure surface. The beneficial effects of this step are: the inclined structure converts the linear motion of the driving block into the vertical pressing action of the pressure block, and the inclined guide has the characteristic of stable movement, making the stamping process more stable. Furthermore, the large contact area of the inclined surface reduces the pressure at the contact point between the pressure block and the driving block.
[0016] In one embodiment of this application: each pressure block is equipped with two elastic elements, which are stacked on both sides of the pressure head. The beneficial effect of this step is that the elastic elements arranged on both sides ensure stable rebound of the pressure block.
[0017] In one embodiment of this application: the upper surface of the pressure head has a recessed area, and all the recessed areas together form the diode support structure. The beneficial effect of this step is to achieve the diode positioning function. Attached Figure Description
[0018] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.
[0019] Figure 1 This is a three-dimensional structural diagram of a diode lead stamping die;
[0020] Figure 2 This is a two-dimensional structural schematic diagram of a diode lead stamping die;
[0021] Figure 3 for Figure 2 Sectional view along the middle AA;
[0022] Figure 4 This is a three-dimensional schematic diagram of the structure of the diode lead stamping die.
[0023] Among them, 1 is the first mounting base, 101 is the first hole body, 2 is the pressure block, 201 is the pressure head, 202 is the recessed area, 3 is the elastic element, 4 is the second mounting base, and 5 is the driving block. Detailed Implementation
[0024] In this application, unless otherwise expressly specified and limited, the terminology used should be interpreted broadly. For example, a connection can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of different terms in this utility model according to the specific circumstances, and the scope of the specific meaning should be limited to achieving the function of this application.
[0025] In the description of this application, it should be understood that the directional terms or positional relationships described are based on the orientation or positional relationships shown in the accompanying drawings, or based on the orientation or positional relationships in actual use, and are only for the purpose of facilitating the description of the contents of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0026] like Figure 1-4 As shown, a diode lead stamping die includes: a first mounting base 1, a pressure block 2, an elastic element 3, a second mounting base 4, and a driving block 5. The first mounting base 1 is provided with a first hole 101, and there are multiple first holes 101. A forming area is formed between the first holes 101. The pressure block 2 is slidably inserted into the first hole 101. The end of the pressure block 2 facing the forming area is a pressure head, which is used to stamp the outer shell of the diode lead. The elastic element 3 is disposed between the first mounting base 1 and the pressure block 2. The elastic element 3 applies a spring force to the pressure block 2 to retract toward the first hole 101. The second mounting base 4 is disposed adjacent to the first mounting base 1. The driving block 5 is connected to the second mounting base 4 and is disposed correspondingly to the pressure block 2. The driving block 5 is used to drive the pressure block 2 to move toward the forming area.
[0027] In some embodiments of this application, such as Figure 3 As shown, the first seat includes: a base plate, a ring plate, and a cover plate. The ring plate is connected to the base plate and has a first hole 101. The cover plate is connected to the ring plate and confines the pressure block 2 and the elastic element 3 in the ring plate.
[0028] In some embodiments of this application, such as Figure 3 , 4 As shown, the first orifice 101 includes a connected hole A and a hole B. The pressure block 2 is slidably inserted into the hole A, and the hole B is used to slidably insert the driving block 5. The pressure block 2 is slidably inserted into the hole A laterally, and the driving block 5 is slidably inserted into the hole B vertically. The movement directions of the pressure block 2 and the driving block 5 in the same first orifice 101 are perpendicular to each other. By designing the first orifice 101 as a connected hole A (for the pressure block 2 to slide) and hole B (for the driving block 5 to slide), a split guide structure is formed, so that the movement paths of the pressure block 2 and the driving block 5 strictly correspond, avoiding radial displacement of the pressure block 2 during the extrusion process, significantly improving the verticality and stability of the stamping action, and ensuring that the deformation position of the outer shell is accurately controllable.
[0029] In some embodiments of this application, such as Figure 4 As shown, there are six first holes 101, which are evenly distributed around the central axis of the forming area. By evenly distributing the first holes 101 (and the pressure block 2) around the central axis of the forming area, the shell is subjected to uniform force during the stamping process. This uniform load can significantly reduce the thickness deviation of the shell deformation area.
[0030] In some embodiments of this application, such as Figure 3 As shown, the pressure block 2 has a first pressure surface, and the driving block 5 has a second pressure surface. The first pressure surface and the second pressure surface are inclined surfaces relative to the direction of movement of the pressure block 2. The pressure block 2 moves within the first hole 101 by the mutual pressing of the first pressure surface and the second pressure surface. The inclined surface structure converts the linear motion of the driving block 5 into the vertical pressing action of the pressure block 2. The inclined surface guide has the characteristic of stable motion, making the stamping process more stable. In addition, the large contact area of the inclined surface can reduce the pressure at the contact point between the pressure block 2 and the driving block 5.
[0031] In some embodiments of this application, such as Figure 4 As shown, each pressure block 2 is equipped with two elastic elements 3, which are stacked on both sides of the pressure head. Specifically, the elastic elements 3 are cylindrical compression springs (hereinafter referred to as compression springs). Protrusions are arranged on both sides of the pressure block 2, and mounting holes are provided on the protrusions corresponding to the compression springs. One end of the compression spring is inserted into the mounting hole, thereby stably positioning the compression spring between the pressure block 2 and the inner wall of hole A. The elastic elements 3 arranged on both sides of the pressure block 2 ensure stable rebound of the pressure block 2.
[0032] In some embodiments of this application, such as Figure 3 As shown, the second mounting base 4 is a plate-shaped structure. The second mounting base 4 has a through hole in the molding area. The second hole is a through hole and is used to place a diode with an inner core and a shell.
[0033] In some embodiments of this application, such as Figure 4 As shown, the upper surface of the pressure head 201 has a recessed area 202, and all the recessed areas 202 together form the support structure of the diode.
[0034] This type of diode stamping die requires the use of other compression equipment. Taking a press as an example, the first mounting base 1 is connected to the worktable, and the second mounting base 4 is connected to the slider. The diode leads are placed downwards in the holding structure. At this time, the leads, initially fitted with the outer shell, are located in the forming area. The slider drives the entire structure to move towards the worktable, and the first pressing surface contacts the second pressing surface. This drives the pressure head to move towards the outer shell and squeezes the outer shell surface from six directions, making the outer shell and inner core tightly connected. The slider then reverses and resets, and the pressure block 2 retracts towards the first hole 101 under the action of the compression spring. The pressure head separates from the outer shell, thus completing one stamping connection between the inner core and the outer shell. In this process, the use of the pressure head for local extrusion increases the local pressure, making the connection between the deformed outer shell and the inner core tighter, ensuring a tight connection between the outer shell and the inner core. The original stamping process was uniform stamping on six sides, which had the problem of loose connections leading to easy peeling of the inner plating layer. Therefore, this tooling can solve this problem.
[0035] The above are merely embodiments of this utility model. Commonly known structures and characteristics are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are aware of all existing technologies in that field, and have the ability to apply conventional experimental methods prior to that date. Those skilled in the art can, based on the guidance provided in this application, improve and implement this solution in combination with their own capabilities. Some typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of this utility model. These should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent.
Claims
1. A diode lead stamping die, characterized in that, include: A first mounting base is provided with a first hole, and there are multiple first holes, forming a molding area between the first holes; A pressure block is slidably inserted into the first hole. The end of the pressure block facing the forming area is a pressure head, which is used to press the outer shell of the diode lead. An elastic element is disposed between the first mounting base and the pressure block, and the elastic element applies a spring force to the pressure block to retract toward the first hole; The second mounting base is disposed adjacent to the first mounting base; A drive block is connected to the second mounting base. The drive block is correspondingly arranged with the pressure block and is used to drive the pressure block to move toward the forming area.
2. The diode lead stamping die according to claim 1, characterized in that, The first hole is uniformly surrounded by the central axis of the forming area.
3. The diode lead stamping die according to claim 1, characterized in that, The first hole body includes a communicating hole A and a hole B. The pressure block is slidably inserted into the hole A, and the hole B is used to slidably insert the driving block.
4. The diode lead stamping die according to claim 1, characterized in that, The pressure block has a first pressure surface, and the driving block has a second pressure surface. The first pressure surface and the second pressure surface are inclined structures relative to the direction of movement of the pressure block. The pressure block moves in the first hole by the mutual pressing of the first pressure surface and the second pressure surface.
5. The diode lead stamping die according to claim 1, characterized in that, Each of the pressure blocks is equipped with two elastic elements, which are stacked on both sides of the pressure head.
6. The diode lead stamping die according to claim 1, characterized in that, The upper surface of the pressure head has a recessed area, and all the recessed areas together form the diode support structure.