Stamping device for LED chip production

Abstract

The utility model relates to the technical field of LED chip production and processing, and discloses a stamping device for LED chip production, which comprises a support assembly, the support assembly is mounted at the top of a movable base assembly, a height adjusting assembly is mounted in the support assembly, a protective door assembly is mounted in the middle of the front side of the support assembly, and the protective door assembly is mounted in the middle of the rear side of the support assembly. And a stamping assembly is mounted on the front side of the top of the height adjusting assembly. The protective door assembly is installed on the front side of the device, so that when the device is used, in the stamping process, the process can be protected through the arranged protective door assembly, the situation that products are broken and splashed in the stamping process due to the fact that the products are unqualified is avoided, and the production efficiency is improved. And personnel injury is avoided.

Description

Technical Field

[0001] This utility model relates to the technical field of LED chip manufacturing and processing, specifically to a stamping device for LED chip manufacturing. Background Technology

[0002] With the rapid development of the electronics and communications industry, the demand for electronic components is increasing daily. LED chips, as a key component, often require stamping equipment in their processing. Stamping is a forming process that uses a press and molds to apply external force to sheet metal, strip, tube, and profiles, causing plastic deformation or separation of the material to obtain workpieces of specific shapes and sizes. In the LED chip stamping process, a large amount of tiny, lightweight waste is generated. If not cleaned up promptly, this waste easily scatters, causing significant difficulties for subsequent cleanup and seriously affecting the production environment and efficiency. Furthermore, some stamping devices suffer from insufficient positioning accuracy when stamping and cutting strip material. For example, existing dies rely on the inlet guide plate for guidance, combined with positioning guide pins / holes and umbrella-shaped adjustment for positioning the strip. When the strip's umbrella shape (horizontal bend) exceeds 1.5mm, the strip is prone to inaccurate positioning at the outlet. This not only prevents normal production but also leads to defects such as scraping and damage at the inlet, damage to the positioning guide pins / holes, and deformation of the LED chip bracket connecting rod, resulting in product scrap. Therefore, developing a stamping device for LED chip production that can effectively clean up waste and improve positioning accuracy has become an important issue that the industry urgently needs to address.

[0003] Application number CN202122282736.0 discloses a stamping device for LED chip production, including a stamping device body and a front panel. A stamping table is fixedly connected to the bottom of the stamping device body, and a waste recycling mechanism and a fixing mechanism are provided inside the stamping table. The stamping device used for LED chip production first inserts and fixes the LED chip into the slot at the top of the fixing plate. After the chip is stamped, waste remains on the top of the fixing plate and the top of the chip. The drive cylinder is activated to move the fixing plate downwards into the stamping table. When the bottom of the fixing plate overlaps with the rectangular box, the air pump inside the pneumatic box is activated to pressurize the branch pipe. The branch pipe pressurizes the four sets of exhaust vents, blowing the waste on the fixing plate and the top of the chip to the left. The waste hits the right side of the baffle and falls into the waste bin, where it is mechanically recycled. This waste recycling method solves the problem of inconvenience in manual waste cleaning. However, there is a drawback: during the stamping process, the product may break and splash, posing a risk of injury to workers. Utility Model Content

[0004] The purpose of this invention is to provide a stamping device for LED chip production, which solves the problem that during the stamping process, the product may break and splash, posing a risk of injury to workers.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0006] This utility model is a stamping device for LED chip production, including a bracket assembly, which is installed on top of a movable base assembly, and a height adjustment component is installed inside the bracket assembly. At the same time, a protective door assembly is installed in the middle of the front side of the bracket assembly, and a stamping component is installed on the top front side of the height adjustment component.

[0007] The protective door assembly includes a braking mechanism, which is mounted on the inner wall of a support frame. An active rotating wheel is mounted on the outer side of the braking mechanism. The active rotating wheel is limited on the outer wall of the support frame, and a transmission belt is mounted on the outer wall of the active rotating wheel. A passive rotating wheel is mounted on the other end of the inner side of the transmission belt. A rotating rod is mounted in the middle of the passive rotating wheel. The rotating rod passes through the outer wall of the support frame and is installed inside the mounting plate. A flip-over protective plate is mounted in the middle of the rotating rod.

[0008] Furthermore, the bracket assembly includes a support frame, a placement groove is provided in the middle of the bottom of the support frame, a fixed top plate is installed on the rear side of the top of the support frame, and an installation plate is installed in the middle of the front side of the support frame.

[0009] Furthermore, the movable base assembly includes an adjustment frame, a rotary motor is mounted on the rear outer wall of the adjustment frame via a fixing bolt, a threaded rod is fixedly mounted on the inner side of the rotary motor, a threaded moving block is mounted at the middle limit of the threaded rod, a connecting base is mounted on the top of the threaded moving block, and the connecting base is fixedly mounted on the bottom of the support frame.

[0010] Furthermore, the height adjustment assembly includes a pneumatic telescopic pump, which is mounted on the bottom of the fixed top plate via a bracket, and a telescopic rod is mounted on the top of the pneumatic telescopic pump. A lifting top plate is fixedly mounted on the top of the telescopic rod, and a lifting plate is fixedly mounted on the bottom front side of the lifting top plate.

[0011] Furthermore, the stamping assembly includes a fixed connecting plate, which is fixedly installed on the front side of the mounting lifting plate, and a hydraulic pump is fixedly installed on the top of the front side of the fixed connecting plate, and a stamping block is installed on the bottom of the hydraulic pump.

[0012] Furthermore, the flip-over protective plate is correspondingly disposed at the front end of the support frame.

[0013] This utility model has the following beneficial effects:

[0014] (1) The present invention provides a stamping device for LED chip production. By installing a protective door assembly on the front side of the device, the process can be protected during the stamping process, avoiding the situation of broken and splashed products during stamping due to product defects, which could cause injury to personnel.

[0015] (2) The present invention provides a stamping device for LED chip production. By installing a movable base assembly at the bottom of the device, the device can be adjusted according to different positional requirements, making the device more convenient to use.

[0016] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of a stamping device for LED chip production according to this utility model;

[0019] Figure 2 This is a schematic diagram of the moving base assembly of a stamping device for LED chip production according to this utility model.

[0020] Figure 3 This is a schematic diagram of the height adjustment component and the stamping component structure of a stamping device for LED chip production according to this utility model;

[0021] Figure 4 This is a schematic diagram of the protective door assembly of a stamping device for LED chip production according to this utility model;

[0022] The attached diagram lists the components represented by each number as follows:

[0023] In the diagram: 1. Bracket assembly; 2. Movable base assembly; 3. Height adjustment assembly; 4. Stamping assembly; 5. Protective door assembly; 101. Support frame; 102. Placement slot; 103. Fixed top plate; 104. Mounting plate; 201. Adjustment frame; 202. Rotary motor; 203. Threaded rod; 204. Threaded moving block; 205. Connecting base; 301. Pneumatic telescopic pump; 302. Telescopic rod; 303. Lifting top plate; 304. Mounting lifting plate; 401. Fixed connecting plate; 402. Hydraulic pump; 403. Stamping block; 501. Braking mechanism; 502. Active rotating wheel; 503. Transmission belt; 504. Passive rotating wheel; 505. Rotating rod; 506. Tilting protective plate. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figures 1-4 As shown, this utility model is a stamping device for LED chip production, including a bracket assembly 1, which is installed on the top of a movable base assembly 2, and a height adjustment assembly 3 is installed inside the bracket assembly 1. Meanwhile, a protective door assembly 5 is installed in the middle of the front side of the bracket assembly 1, and a stamping assembly 4 is installed on the top front side of the height adjustment assembly 3.

[0026] The protective door assembly 5 includes a braking mechanism 501, which is mounted on the inner wall of the support frame 101. An active rotating wheel 502 is mounted on the outer side of the braking mechanism 501. The active rotating wheel 502 is limited on the outer wall of the support frame 101. A transmission belt 503 is mounted on the outer wall of the active rotating wheel 502. A passive rotating wheel 504 is mounted on the other end of the inner side of the transmission belt 503. A rotating rod 505 is mounted in the middle of the passive rotating wheel 504. The rotating rod 505 passes through the outer wall of the support frame 101 and is installed inside the mounting plate 104. A flip-over protective plate 506 is mounted in the middle of the rotating rod 505.

[0027] By installing a protective door assembly 5 on the front side of the device, the process of stamping can be protected by the protective door assembly 5, avoiding the situation where broken and flying objects during stamping caused by defective products, which could result in personnel injury.

[0028] The bracket assembly 1 includes a support frame 101, a placement groove 102 is provided in the middle of the bottom of the support frame 101, a fixed top plate 103 is installed on the rear side of the top of the support frame 101, and an installation plate 104 is installed in the middle of the front side of the support frame 101.

[0029] The movable base assembly 2 includes an adjusting frame 201. A rotary motor 202 is mounted on the rear outer wall of the adjusting frame 201 via a fixing bolt. A threaded rod 203 is fixedly mounted on the inner side of the rotary motor 202. A threaded moving block 204 is mounted at the middle limit of the threaded rod 203. A connecting base 205 is mounted on the top of the threaded moving block 204. The connecting base 205 is fixedly mounted on the bottom of the support frame 101. The movable base assembly 2 drives the threaded rod 203 to rotate via the rotary motor 202, causing the threaded moving block 204 to move along the threaded rod 203. This, in turn, drives the connecting base 205 and the bracket assembly 1 mounted on it to move back and forth, thereby adjusting the horizontal position of the stamping device to align with the LED chip production station.

[0030] The height adjustment assembly 3 includes a pneumatic telescopic pump 301, which is mounted on the bottom of the fixed top plate 103 via a bracket. A telescopic rod 302 is mounted on the top of the pneumatic telescopic pump 301, and a lifting top plate 303 is fixedly mounted on the top of the telescopic rod 302. A mounting lifting plate 304 is fixedly mounted on the bottom front side of the lifting top plate 303. When the pneumatic telescopic pump 301 of the height adjustment assembly 3 is activated, it controls the telescopic rod 302 to extend and retract. The telescopic rod 302 drives the lifting top plate 303 and the mounting lifting plate 304 to move up and down, thereby adjusting the height of the stamping assembly 4 to adapt to different stamping requirements. When the hydraulic pump 402 of the stamping assembly 4 is activated, it pushes the stamping block 403 downward to perform a stamping operation on the LED chip placed in the placement slot 102 at the bottom of the support frame 101.

[0031] The stamping assembly 4 includes a fixed connecting plate 401, which is fixedly installed on the front side of the mounting lifting plate 304. A hydraulic pump 402 is fixedly installed on the top of the front side of the fixed connecting plate 401, and a stamping block 403 is installed on the bottom of the hydraulic pump 402.

[0032] The tilting protective plate 506 is positioned at the front end of the support frame 101. The brake mechanism 501 of the protective door assembly 5 drives the active rotating wheel 502 to rotate, which in turn drives the passive rotating wheel 504 to rotate via the transmission belt 503. The passive rotating wheel 504 drives the rotating rod 505 to rotate, thereby causing the tilting protective plate 506 to tilt around the rotating rod 505. During stamping operations, the tilting protective plate 506 is in a closed state to prevent personnel from contacting the stamping area and ensure the safety of operators. When equipment maintenance or loading / unloading operations are required, the tilting protective plate 506 is opened for easy operation.

[0033] The movable base assembly 2 drives the threaded rod 203 to rotate via the rotary motor 202, causing the threaded moving block 204 to move along the threaded rod 203. This, in turn, drives the connecting base 205 and the bracket assembly 1 mounted on it to move back and forth, completing the adjustment of the horizontal position of the stamping device to align with the LED chip production station. The pneumatic telescopic pump 301 of the height adjustment assembly 3 is activated, controlling the telescopic rod 302 to extend and retract. The telescopic rod 302 drives the lifting top plate 303 and the mounting lifting plate 304 to move up and down, thereby adjusting the height of the stamping assembly 4 to adapt to different stamping requirements. The hydraulic pump 402 of the stamping assembly 4 is activated, pushing the stamping block 403 downward to stamp the LED chips placed in the placement slot 102 at the bottom of the support frame 101. During the stamping process, the height adjustment assembly 3 and the movable base assembly 2 can be finely adjusted according to actual needs to ensure the accuracy and stability of the stamping. The brake mechanism 501 of the protective door assembly 5 drives the active rotating wheel 502 to rotate, which in turn drives the passive rotating wheel 504 to rotate via the transmission belt 503. The passive rotating wheel 504 drives the rotating rod 505 to rotate, which in turn causes the flip-over protective plate 506 to flip around the rotating rod 505. During stamping operations, the flip-over protective plate 506 is closed to prevent personnel from contacting the stamping area and ensure operator safety. When equipment maintenance or loading / unloading operations are required, the flip-over protective plate 506 is opened for easy operation. In use, the LED chip to be stamped is first placed in the placement slot 102 at the bottom of the support frame 101. Based on the processing position of the LED chip, the rotary motor 202 of the moving base assembly 2 is started to adjust the horizontal position of the stamping device. According to the stamping process requirements, the pneumatic telescopic pump 301 of the height adjustment assembly 3 is started to adjust the height of the stamping assembly 4. The brake mechanism 501 of the protective door assembly 5 is started to close the flip-over protective plate 506 to ensure operator safety. The hydraulic pump 402 of the stamping assembly 4 is started, and the stamping block 403 moves downward to stamp the LED chip. After stamping, the hydraulic pump 402 is started to raise the stamping block 403 back to its original position. The brake mechanism 501 is started to open the flip-over protective plate 506 and remove the stamped LED chip.

[0034] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A stamping apparatus for LED chip production, comprising a bracket assembly (1), characterized in that: The bracket assembly (1) is installed on top of the mobile base assembly (2), and a height adjustment assembly (3) is installed inside the bracket assembly (1). Meanwhile, a protective door assembly (5) is installed in the middle of the front side of the bracket assembly (1), and a stamping assembly (4) is installed on the top front side of the height adjustment assembly (3). The protective door assembly (5) includes a braking mechanism (501), which is mounted on the inner wall of the support frame (101). An active rotating wheel (502) is mounted on the outer side of the braking mechanism (501). The active rotating wheel (502) is limited to the outer wall of the support frame (101). A transmission belt (503) is mounted on the outer wall of the active rotating wheel (502). A passive rotating wheel (504) is mounted on the other end of the inner side of the transmission belt (503). A rotating rod (505) is mounted in the middle of the passive rotating wheel (504). The rotating rod (505) passes through the outer wall of the support frame (101) and is mounted inside the mounting plate (104). A flip-over protective plate (506) is mounted in the middle of the rotating rod (505).

2. The stamping apparatus for LED chip production according to claim 1, characterized in that: The bracket assembly (1) includes a support frame (101), a placement groove (102) is provided in the middle of the bottom of the support frame (101), and a fixed top plate (103) is installed on the rear side of the top of the support frame (101), while an installation plate (104) is installed in the middle of the front side of the support frame (101).

3. The stamping apparatus for LED chip production according to claim 1, characterized in that: The movable base assembly (2) includes an adjustment frame (201). A rotary motor (202) is mounted on the rear outer wall of the adjustment frame (201) by a fixing bolt. A threaded rod (203) is fixedly mounted on the inner side of the rotary motor (202). A threaded moving block (204) is mounted at the middle limit of the threaded rod (203). A connecting base (205) is mounted on the top of the threaded moving block (204). The connecting base (205) is fixedly mounted on the bottom of the support frame (101).

4. The stamping apparatus for LED chip production according to claim 1, characterized in that: The height adjustment assembly (3) includes a pneumatic telescopic pump (301), which is mounted on the bottom of a fixed top plate (103) via a bracket. A telescopic rod (302) is mounted on the top of the pneumatic telescopic pump (301), and a lifting top plate (303) is fixedly mounted on the top of the telescopic rod (302). A lifting plate (304) is fixedly mounted on the bottom front side of the lifting top plate (303).

5. The stamping apparatus for LED chip production according to claim 1, characterized in that: The stamping assembly (4) includes a fixed connecting plate (401), which is fixedly installed on the front side of the mounting lifting plate (304), and a hydraulic pump (402) is fixedly installed on the top of the front side of the fixed connecting plate (401), and a stamping block (403) is installed on the bottom of the hydraulic pump (402).

6. The stamping apparatus for LED chip production according to claim 1, characterized in that: The flip-over protective plate (506) is correspondingly disposed at the front end of the support frame (101).

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