Electric power assembly and vehicle

Abstract

The utility model discloses an electric power assembly and a vehicle. The electric power assembly comprises a mounting plate, a power supply module, an electric control module and a heat dissipation piece, the mounting plate comprises a first area and a second area; the power module is arranged in the first area and comprises a cooling piece, and the cooling piece is detachably connected with the mounting plate; the electric control module is arranged in the second area; the heat dissipation piece is arranged on the mounting plate and correspondingly arranged in the first area and the second area. The electric power assembly provided by the utility model is high in integration level.

Description

Technical Field

[0001] This utility model relates to the field of vehicle technology, specifically to an electric powertrain and a vehicle. Background Technology

[0002] In new energy vehicles, the power supply module and the electronic control module are usually designed independently, resulting in high system redundancy. Furthermore, both the power supply module and the electronic control module require independent housings, heat dissipation structures, and mounting brackets, which increases the overall size. Therefore, the integration of the power supply module and the electronic control module is low, and they occupy a large amount of space. Utility Model Content

[0003] The purpose of this invention is to provide an electric powertrain and vehicle that solves the problem of low integration in the electric powertrain.

[0004] To achieve the objectives of this utility model, the following technical solution is provided:

[0005] In a first aspect, this utility model provides an electric power assembly, comprising:

[0006] Mounting plate, including a first area and a second area;

[0007] A power module is disposed in the first area, the power module includes a cooling component, and the cooling component is detachably connected to the mounting plate;

[0008] The electronic control module is located in the second area;

[0009] A heat sink is disposed on the mounting plate, and the heat sink is correspondingly disposed in the first region and the second region.

[0010] In one embodiment, the mounting plate has a first surface and a second surface facing away from each other, the power module and the electronic control module are both disposed on the first surface, and the heat sink is disposed on the second surface.

[0011] In one embodiment, the mounting plate protrudes toward the first surface to form a water nozzle, and the water inlet and outlet of the cooling component are both connected to the corresponding water nozzle.

[0012] In one embodiment, the cooling component is a three-dimensional water channel, the cooling component includes a bottom cover, the bottom cover is disposed on the mounting plate, and the bottom cover has an inlet and an outlet for the cooling component;

[0013] The power assembly also includes a seal, which is fitted onto the water tap and elastically abuts against the bottom cover.

[0014] In one embodiment, the power module further includes a main power device, which includes a spring-loaded sheet, a main board, and a power element. The main board is disposed on the side of the cooling component away from the mounting plate, and the power element is disposed on the main board. The spring-loaded sheet includes a spring-loaded portion and a base. The base is connected to the main board, and the spring-loaded portion elastically abuts against the power element to apply pressure so that the power element is tightly attached to the cooling component.

[0015] In one embodiment, the cooling component has a receiving groove, and the cooling component further includes a mounting post, which is disposed on the bottom wall of the receiving groove and passes through the base of the main board and the spring pressure plate.

[0016] In one embodiment, the power module includes an input filter device, which is disposed in the first region and detachably connected to the mounting plate. The input filter device includes an input filtering component and a first housing for accommodating the input filtering component.

[0017] The power module includes an output filter device, which is disposed in the first region and detachably connected to the mounting plate. The output filter device includes an output filter assembly and a second housing that accommodates the output filter assembly.

[0018] In one embodiment, the input filter is disposed on one side of the cooling element, and the output filter is disposed on the opposite side of the cooling element.

[0019] The power module also includes a transformer component, which is connected to the motherboard and housed within the receiving slot.

[0020] In one embodiment, the motherboard covers the input filter and the output filter, and in the orthographic projection of the first surface, the orthographic projection of the motherboard overlaps at least partially with the orthographic projection of the input filter and / or the output filter.

[0021] Secondly, the present invention provides a vehicle comprising an electric powertrain as described in any one of the various embodiments of the first aspect.

[0022] Compared to existing technologies where the power supply module and electronic control module are set separately, the power supply module and electronic control module of this utility model are integrated on the mounting plate of the power assembly. Furthermore, the power assembly of this utility model is equipped with heat sinks corresponding to the first and second areas of the mounting plate, and cooling components that are detachably connected to the mounting plate. Heat is sequentially transferred from the cooling components to the mounting plate and the heat sinks. All three work together to dissipate heat from the mounting plate, the power supply module, and the electronic control module, fully meeting the heat dissipation requirements of the power assembly and ensuring its normal operation. The detachable connection of the cooling components to the mounting plate gives it strong scalability and adaptability, facilitating flexible use of the power assembly, reducing its space occupation, and improving its integration. The detachable cooling components also enable maintenance personnel to quickly locate faults and simplify maintenance operations. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is an exploded view of the power assembly of one embodiment;

[0025] Figure 2 This is a bottom view of the power assembly of one embodiment;

[0026] Figure 3 This is a top view of the powertrain of one embodiment;

[0027] Figure 4 This is a top view of a portion of the structure of an electric powertrain according to one embodiment;

[0028] Figure 5 This is an exploded view of the powertrain of another embodiment;

[0029] Figure 6 This is a top view of the powertrain according to another embodiment;

[0030] Figure 7 This is a partial cross-sectional view of a portion of the structure of an electric powertrain according to one embodiment;

[0031] Figure 8 This is a partial cross-sectional view of another part of the structure of the powertrain in one embodiment;

[0032] Figure 9 This is a cross-sectional view of a further part of the structure of an electric powertrain according to one embodiment.

[0033] Figure 10 This is a perspective view of a cooling component according to one embodiment;

[0034] Figure 11 This is a perspective view of an input filtering device according to one embodiment;

[0035] Figure 12 This is a perspective view of an output filtering device according to one embodiment.

[0036] Explanation of reference numerals in the attached figures:

[0037] 100-Power assembly, 10-Mounting plate, 11-First area, 12-Second area, 13-Heat sink, 14-Main housing, 141-First surface, 142-Second surface, 15-Divider plate, 16-Water nozzle, 161-Water inlet nozzle, 162-Water outlet nozzle, 163-Receiving slot;

[0038] 20-Power supply module, 21-Cooling component, 211-Cooling channel, 2111-Inlet, 2112-Outlet, 212-Mounting slot, 214-Accommodation slot, 215-Mounting column, 216-Bottom cover, 217-Main body, 218-Water channel partition wall;

[0039] 22-Main power device, 221-Pressure plate, 2211-Pressure section, 2212-Base, 222-Main board, 223-Power element, 23-Input filter device, 231-Input filter assembly, 232-First housing, 24-Output filter device, 241-Output filter assembly, 242-Second housing, 25-Transformer device, 30-Electrical control module, 40-Sealing component. Detailed Implementation

[0040] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or it can be in a middle component. When a component is said to be "connected" to another component, it can be directly connected to the other component or it may be in a middle component.

[0042] Unless otherwise defined, all technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used in this invention includes any and all combinations of one or more of the associated listed items.

[0043] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0044] For reference Figure 1 , Figure 2 and Figure 3 This utility model provides a power assembly 100, which includes a mounting plate 10, a power module 20, an electronic control module 30, and a heat sink 13. The mounting plate 10 includes a first region 11 and a second region 12. The power module 20 is disposed in the first region 11 and includes a cooling component 21, which is detachably connected to the mounting plate 10. The electronic control module 30 is disposed in the second region 12. The heat sink 13 is disposed on the mounting plate 10 and is correspondingly disposed in the first region 11 and the second region 12.

[0045] Optionally, the mounting plate 10 is a heat dissipation shell, and the material of the mounting plate 10 can be metal, composite material, plastic, etc., without limitation. Specifically, the metal material can be aluminum alloy, copper, magnesium alloy, the composite material can be carbon fiber composite material, and the plastic can be thermally conductive plastic, etc., without limitation.

[0046] Optionally, the first region 11 and the second region 12 may partially overlap, or the first region 11 and the second region 12 may be arranged adjacent to each other. Optionally, the power assembly 100 includes a main housing 14 and a partition plate 15, the partition plate 15 being disposed on the main housing 14, the first region 11 being disposed on one side of the partition plate 15, and the second region 12 being disposed on the other side of the partition plate 15.

[0047] Optionally, the electronic control module 30 may include a vehicle controller, motor controller, battery management system, auxiliary system controller, body electronic control system, etc., without limitation. The electronic control module 30 can be detachably connected to the mounting plate 10, or it can be fixedly connected to the mounting plate 10, without limitation. The detachable connection between the electronic control module 30 and the mounting plate 10 is of core value in improving maintenance efficiency, reducing operating costs, and ensuring system reliability. The modular structure enables maintenance personnel to quickly locate faults and replace components, avoiding the high costs and risks associated with complete disassembly.

[0048] Optionally, the heat sink 13 and the cooling component 21 can be water-cooled, air-cooled, or have heat pipe cooling, etc., without limitation. The heat sink 13 and the mounting plate 10 can be an integral or separate structure. Specifically, when the heat sink 13 and the mounting plate 10 are an integral structure, the corresponding integral molding method can be casting, pouring, etc.; when the heat sink 13 and the mounting plate 10 are separate structures, the corresponding connection method can be bonding, welding, screwing, snap-fitting, magnetic attraction, etc., without limitation.

[0049] Optionally, the cooling component 21 can be detachably connected to the mounting plate 10 via magnetic connection, snap-fit, adhesive connection, threaded connection, etc., without limitation. The cooling component 21 is made of a high thermal conductivity material, such as aluminum alloy or copper alloy.

[0050] Compared to the existing technology where the power module 20 and the electronic control module 30 are set separately, the power assembly 100 of this utility model integrates the power module 20 and the electronic control module 30 on the mounting plate 10. Furthermore, the power assembly 100 of this utility model is provided with a heat sink 13 corresponding to the first region 11 and the second region 12 of the mounting plate 10, and a cooling component 21 detachably connected to the mounting plate 10. Heat is sequentially transferred from the cooling component 21 to the mounting plate 10 and the heat sink 13. All three components work together to dissipate heat from the mounting plate 10, the power module 20, and the electronic control module 30, fully meeting the heat dissipation requirements of the power assembly 100 and ensuring its normal operation. The detachable connection of the cooling component 21 to the mounting plate 10 gives it strong scalability and adaptability, facilitating flexible use of the power assembly 100, reducing its space occupation, and improving its integration. The detachable cooling component 21 also enables maintenance personnel to quickly locate faults and simplify maintenance operations.

[0051] For reference Figure 2 and Figure 3 In one embodiment, the mounting plate 10 has a first surface 141 and a second surface 142 facing away from each other. The power module 20 and the electronic control module 30 are both disposed on the first surface 141, and the heat sink 13 is disposed on the second surface 142.

[0052] Optionally, the partition plate 15 is disposed on the first surface 141. The connection method between the partition plate 15 and the first surface 141 can be screwed, welded, bonded, snap-fitted, magnetically connected, etc., without limitation. The partition plate 15 can also be an integral structure with the first surface 141.

[0053] Specifically, the heat sink 13 has heat dissipation channels, which are correspondingly arranged with the first region 11 and the second region 12. The heat dissipation channels are used to allow the cooling medium to flow and exchange heat with the heat sink shell.

[0054] The heat sink 13 is separately disposed on the second surface 142 of the mounting plate 10, separate from the power module 20 and the electronic control module 30. This avoids mutual interference between heat sources and allows the heat sink 13 to more efficiently handle the heat generated by the power module 20 and the electronic control module 30. The heat sink 13 directly faces the external environment or heat dissipation system (such as cooling fans, heat sinks, etc.), forming a more direct and effective heat dissipation path and accelerating heat dissipation. By placing the heat-generating components such as the power module 20 and the electronic control module 30 on different surfaces of the mounting plate 10, the thermal resistance during heat transfer is reduced, and the heat dissipation efficiency is improved. By placing the heat sink 13 on the second surface 142 of the mounting plate 10, the space of the mounting plate 10 can be fully utilized, avoiding excessive space occupation on the first surface 141 (i.e., the surface where the power module 20 and the electronic control module 30 are located), which helps to achieve a more compact system design within a limited space.

[0055] For reference Figure 7 and Figure 8 In one embodiment, the mounting plate 10 protrudes toward the first surface 141 to form a water nozzle 16, and the water inlet 2111 and water outlet 2112 of the cooling component 21 are both connected to the corresponding water nozzle 16.

[0056] Optionally, the water nozzle 16 protrudes from the mounting plate 10, and the direction in which the water nozzle 16 protrudes from the mounting plate 10 is the same as the facing direction of the first surface 141.

[0057] Optionally, the mounting plate 10 includes a main housing 14, with a water nozzle 16 disposed on the main housing 14. The main housing 14 has a first surface 141 and a second surface 142 facing away from each other. The direction in which the water nozzle 16 protrudes from the main housing 14 is the same as the facing direction of the first surface 141. The water nozzle 16 and the main housing 14 are an integral structure, meaning that the water nozzle 16 and the main housing 14 are formed by an integral process. The integral process can be casting, forging, etc., and is not limited.

[0058] Optionally, there may be multiple water nozzles 16. Specifically, the water nozzle 16 includes an inlet nozzle 161 and an outlet nozzle 162. The inlet nozzle 161 is connected to the water inlet 2111 of the cooling component 21, and the outlet nozzle 162 is connected to the water outlet 2112 of the cooling component 21.

[0059] Optionally, the cooling component 21 has a cooling channel 211, which can be an external channel or an internal channel, without limitation. The cooling channel 211 of the cooling component 21 can be a three-dimensional channel or a planar channel, without limitation. Specifically, the three-dimensional channel can be a spiral channel. Specifically, the channel at the inlet 2111 of the cooling component 21 is wide, and the channel at the outlet 2112 is narrow, which increases the flow velocity of the cooling medium at the outlet 2112 and improves the convective heat transfer capacity.

[0060] With this configuration, the water nozzle 16 is formed as a single piece of the mounting plate 10. This integrated design simplifies the installation and maintenance process. Traditional embedded water nozzles 16 require drilling holes in the mounting plate 10 and embedding metal parts, which is a complex process and can easily damage the substrate. In contrast, the integrated water nozzle 16 is directly formed by a mold, and only the mounting plate 10 needs to be fixed during installation. During maintenance, there is no need to disassemble the water nozzle 16, thus shortening the replacement cycle. The direct connection between the water nozzle 16 and the inlet 2111 and outlet 2112 of the cooling component 21 eliminates the "stagnant area" in traditional hose connections, preventing the coolant from forming eddies or localized high temperatures at the joint.

[0061] For reference Figure 7 and Figure 8 In one embodiment, the cooling component 21 is a three-dimensional water channel. The cooling component 21 includes a bottom cover 216, which covers the mounting plate 10. The bottom cover 216 has an inlet 2111 and an outlet 2112 for the cooling component 21, and a water nozzle 16 is correspondingly disposed at the inlet 2111 and the outlet 2112 of the cooling component 21.

[0062] The power assembly 100 also includes a seal 40, which is fitted onto the water tap 16 and elastically abuts against the bottom cover 216.

[0063] Optionally, the cooling component 21 also includes a body 217. The body 217 and the bottom cover 216 enclose a cooling channel 211, or the cooling channel 211 surrounds the outer periphery of the body 217. The cooling component 21 also includes a water channel partition 218, which is disposed within the body 217 and serves to separate the inlet 2111 and the outlet 2112. The body 217, the bottom cover 216, and the water channel partition 218 are integrally cast, which helps to reduce manufacturing costs and improve the structural strength and sealing performance of the cooling component 21.

[0064] For reference Figure 10 Optionally, the bottom cover 216 is fitted onto the mounting plate 10, and the bottom cover 216 is detachably connected to the mounting plate 10. The bottom cover 216 has a mounting groove 212, and the water nozzle 16 is detachably inserted into the mounting groove 212. The bottom wall of the mounting groove 212 has an inlet 2111 or an outlet 2112 for the cooling component 21. The sealing component 40 is fitted onto the water nozzle 16 and elastically abuts against the side wall of the mounting groove 212.

[0065] Optionally, the seal 40 and the mounting groove 212 are configured to correspond one-to-one with the water nozzle 16. Specifically, the water nozzle 16 includes an inlet nozzle 161 and an outlet nozzle 162, the seal 40 corresponds to a first seal 40 and a second seal 40, and the mounting groove 212 corresponds to a first mounting groove 212 and a second mounting groove 212.

[0066] Optionally, the material of the seal 40 can be rubber (nitrile rubber, fluororubber, EPDM rubber, silicone rubber, hydrogenated nitrile rubber), plastic (fluoroplastics, nylon, polyurethane), etc., without limitation. The seal 40 can be an O-ring, a plug seal, etc.

[0067] Optionally, the outer peripheral surface of the water nozzle 16 is provided with a receiving groove 163, the sealing member 40 is in close contact with the bottom wall of the receiving groove 163, and protrudes from the outer peripheral surface of the water nozzle 16 in the depth direction of the receiving groove 163 and elastically abuts against the side wall of the mounting groove 212.

[0068] With this configuration, the design of the cooling component 21 of the three-dimensional water channel meets the heat dissipation requirements of the power assembly 100 for high power density and high heat load, ensuring that the power module 20 operates within a safe temperature range and improving the reliability and lifespan of the system. The connection between the water nozzle 16 and the cooling component 21 is radially sealed by the sealing component 40. The radial seal fills the radial gap between the water nozzle 16 and the cooling component 21 through the elastic deformation of the sealing component 40. The sealing effect is significantly better than that of the axial seal. Moreover, the installation between the water nozzle 16 and the cooling component 21 using the radial seal is simpler and improves the installation efficiency.

[0069] For reference Figure 3 , Figure 5 , Figure 6 and Figure 9 In one embodiment, the power module 20 further includes a main power device 22, which includes a spring-loaded sheet 221, a main board 222, and a power element 223. The main board 222 is disposed on the side of the cooling component 21 away from the mounting plate 10, and the power element 223 is disposed on the main board 222. The spring-loaded sheet 221 includes a spring-loaded part 2211 and a base 2212. The base 2212 is connected to the main board 222, and the spring-loaded part 2211 elastically abuts against the power element 223 to apply pressure so that the power element 223 is tightly attached to the cooling component 21.

[0070] Optionally, the motherboard 222 can be a printed circuit board, with copper-clad laminate as its core material. Depending on the substrate, copper-clad laminate can be divided into phenolic paper-based copper-clad laminate, fiberglass cloth copper-clad laminate, composite-based copper-clad laminate, aluminum-based copper-clad laminate, etc. Power components 223 can be power transistors, silicon controlled rectifiers, controllable switches, power diodes, etc., without limitation.

[0071] Optionally, the connection method between the power component 223 and the motherboard 222 includes direct soldering, socket connection, flexible circuit connection, etc., without limitation.

[0072] Optionally, the base 2212 of the spring pressure plate 221 serves as the mounting reference for the spring pressure plate 221. It is fixed to the main board 222 by welding, snap-fitting, or screws, so as to evenly distribute the pressure applied by the spring pressure part 2211 to the main board 222 and avoid local stress concentration. The base 2212 can be made of beryllium bronze or stainless steel.

[0073] Optionally, the spring-loaded portion 2211 is integrally connected to the base 2212 by stamping. The spring-loaded portion 2211 has a wavy sheet structure and at least partially protrudes from the base 2212. Multiple spring-loaded portions 2211 are provided, each corresponding to a power element 223. The spring-loaded portion 2211 absorbs the thermal expansion difference between the power element 223 and the cooling element 21 through elastic deformation, maintaining a stable thermal interface material thickness. Simultaneously, the stiffness of the spring-loaded portion 2211 can be adjusted according to the weight of the power element 223. Specifically, the elastic bottom of the spring-loaded portion 2211 contacts the power element 223 to generate downward pressure, and the protruding structure on top of the spring-loaded portion 2211 increases elasticity, avoiding a rigid connection. The spring-loaded sheet 221 is formed using the internal material of a single sheet of material, requiring no additional material.

[0074] The elastic deformation of the protruding spring plate 221 generates a continuous vertical force on the power element 223, replacing the screw fastening force and avoiding hard connection. This allows the power element 223 of the main power device 22 to be in close contact with the cooling component 21. The spring plate 2211 can be used for power elements 223 in different positions, thereby accelerating the heat exchange between the power element 223 and the cooling component 21 and further improving the heat dissipation efficiency of the power assembly 100.

[0075] For reference Figure 1 , Figure 7 and Figure 8 In one embodiment, the cooling component 21 has a receiving groove 214 and the cooling component 21 also includes a mounting post 215. The mounting post 215 is disposed on the bottom wall of the receiving groove 214 and passes through the base 2212 of the main board 222 and the spring pressure plate 221.

[0076] Optionally, there may be multiple mounting posts 215, which are spaced apart on the bottom wall of the receiving groove 214.

[0077] The connection method between the mounting post 215 and the main board 222 and the spring-loaded contact plate 221 can be screwed, snap-fit, etc., without restriction. Specifically, both the main board 222 and the spring-loaded contact plate 221 have corresponding threaded holes, and the mounting post 215 passes through the corresponding threaded holes and is connected and fixed with screws, etc.

[0078] Optionally, the cooling channel 211 corresponds to the bottom wall and surrounding side walls of the receiving groove 214.

[0079] Optionally, some mounting posts 215 may also be provided on the outer periphery of the receiving groove 214 to provide further support for the motherboard 222 and improve the connection strength between the main power device 22 and the cooling component 21.

[0080] With this configuration, the mounting post 215 and the cooling element 21 together provide support for the main power device 22, etc. The mounting post 215 also penetrates the base 2212 of the main board 222 and the spring pressure plate 221, which can limit the excessive bending of the spring pressure plate 221 and prevent the base 2212 from fatigue fracture due to excessive deformation. The integrated design of the mounting post 215 and the bottom wall of the receiving groove 214 reduces the thermal resistance path from the power component 223 to the cooling element 21. During the installation process, the mounting post 215 can be pre-fixed to the bottom wall of the receiving groove 214, and the main board 222 and the spring pressure plate 221 are assembled at one time, reducing the screw tightening or welding process and improving the yield rate.

[0081] For reference Figure 4 , Figure 11 and Figure 12 In one embodiment, the power module 20 includes an input filter component 23, which is disposed in the first region 11 and detachably connected to the mounting plate 10. The input filter component 23 includes an input filter assembly 231 and a first housing 232 for accommodating the input filter assembly 231.

[0082] The power module 20 includes an output filter component 24, which is disposed in the first region 11 and is detachably connected to the mounting plate 10. The output filter component 24 includes an output filter assembly 241 and a second housing 242 that accommodates the output filter assembly 241.

[0083] Optionally, the interior of the first box 232 and the second box 242 is filled with encapsulation material, which may be epoxy resin (high temperature resistance, strong adhesion), silicone (good flexibility, good weather resistance) and polyurethane (chemical corrosion resistance), etc., without limitation.

[0084] Optionally, the materials of the first box 232 and the second box 242 can be aluminum alloy, carbon fiber reinforced epoxy resin + copper foil, magnesium aluminum alloy + conductive plastic inserts, etc., without restriction.

[0085] Optionally, the input filtering component 231 may include components such as inductors, capacitors, and resistors. The input filtering component 23 is used to selectively filter current or voltage signals of a specific frequency through specific circuit design, thereby effectively suppressing electromagnetic interference, protecting power equipment, and improving system stability.

[0086] Specifically, the input filter component 23 is detachably connected to the mounting plate 10, and the output filter component 24 is detachably connected to the mounting plate 10. The detachable connection can be screwed, snap-fitted, magnetically attached, etc., without limitation.

[0087] Optionally, the output filtering component 241 may include components such as filter inductors and filter capacitors. The output filtering component 24 is used to convert pulsating current into smooth DC current or AC current close to a sine wave, thereby protecting the drive motor and improving its working efficiency, suppressing harmonic interference, and improving the quality of control signals and feedback signals.

[0088] The input filter component 231 is integrated into the first housing 232, and the output filter component 241 is integrated into the second housing 242, enabling modular integration of the input filter component 23 and the output filter component 24. The input filter component 23 and the output filter component 24 are connected to the motherboard 222 via pins or interfaces. This configuration improves the integration and reliability of the power assembly 100. Furthermore, existing power assemblies 100 in new energy vehicles are typically single modules mounted on the vehicle, and the internal components are difficult to repair and maintain; generally, if any internal component fails, the entire power supply must be replaced. This invention, by designing the power module 20 into different modules and grouping each vulnerable component into a sub-module, achieves modularity and electronic control integration of the power module 20. Simultaneously, the input filter component 23 and the output filter component 24 are designed with a detachable connection to the mounting plate 10. When maintenance is required, only the corresponding sub-module needs to be replaced, making the power assembly of this invention easy to maintain and replaceable, avoiding the need for replacement of the entire power assembly due to partial module failure.

[0089] For reference Figure 8 and Figure 4 In one embodiment, the input filter element 23 is disposed on one side of the cooling element 21, and the output filter element 24 is disposed on the opposite side of the cooling element 21.

[0090] The power module 20 also includes a transformer component 25, which is connected to the motherboard 222 and housed in the receiving slot 214.

[0091] Optionally, the transformer component 25 can be a DC / DC converter, inverter, rotary transformer, etc., without limitation.

[0092] Optionally, the transformer component 25 can be directly soldered to the main board 222. The transformer component 25 can be spaced apart from the bottom wall and / or side wall of the receiving groove 214, or the transformer component 25 can abut against the bottom wall and / or side wall of the receiving groove 214. Specifically, the gap between the transformer component 25 and the receiving groove 214 is filled with encapsulating material. The encapsulating material is used to fix, protect, dissipate heat, and waterproof the transformer component 25, ensuring its performance and reliability.

[0093] Optionally, the input filter element 23 can be respectively disposed on both sides of the cooling element 21 along the width direction or on both sides of the cooling element 21 along the length direction, thereby reducing signal crosstalk between the input filter element 23 and the output filter element 24.

[0094] Optionally, the spacing between the input filter component 23 and the cooling component 21, and the spacing between the output filter component 24 and the cooling component 21, are both less than preset values. This arrangement saves the installation space required for the input filter component 23 and the output filter component 24 on the mounting plate 10, improving the space utilization of the mounting plate 10 and the power assembly 100. Furthermore, it allows the cooling component 21 to dissipate heat from the input filter component 23 and the output filter component 24, further improving the heat dissipation effect of the power assembly 100.

[0095] This utility model's power assembly 100 brings new ideas to the design and production of the power module 20, breaking down the originally single power module 20 into multiple modules to match different market and customer needs. It also improves the maintenance convenience of the highly integrated power assembly 100. The assembly of the power assembly 100 is convenient, as the originally complex assembly of the power module 20 and electronic control module 30 is broken down into different modules, allowing for independent production of different modules before assembly. Furthermore, this modular design can be matched with different highly integrated product designs, facilitating promotion to different customers and expanding the application scenarios of the power assembly 100.

[0096] For reference Figure 3 and Figure 6 In one embodiment, the motherboard 222 is covered with an input filter device 23 and an output filter device 24, and in the orthographic projection of the first surface 141, the orthographic projection of the motherboard 222 overlaps at least partially with the orthographic projection of the input filter device 23 and / or the output filter device 24.

[0097] Specifically, the input filter component 23 and the output filter component 24 are either in close contact with the motherboard 222, or the input filter component 23 and the output filter component 24 are spaced apart from the motherboard 222.

[0098] Optionally, the input filter device 23 and the output filter device 24 may overlap at least partially with the projection of the motherboard 222, and the heat dissipation copper foil or metal substrate of the motherboard 222 may be used to assist in heat dissipation.

[0099] By sharing space with the motherboard 222 in the vertical direction, the space required for the power assembly 100 in the direction perpendicular to the mounting plate 10 can be reduced. At the same time, the overlapping design of the input filter device 23, the output filter device 24 and the motherboard 222 can shorten the connection path between the input filter device 23 and the output filter device 24 and the power components 223 (such as IGBTs and SiC MOSFETs) on the motherboard 222, thereby reducing parasitic inductance.

[0100] Specifically, the assembly method of the power assembly 100 of this utility model is as follows: The cooling component 21 is assembled with the mounting plate 10, wherein the water nozzle 16 is connected to the water inlet 2111 and the water outlet 2112 of the cooling component 21; the input filter component 23 and the output filter component 24 are assembled on both sides of the cooling component 21, wherein the input filter component 23 and the output filter component 24 can be assembled and potted separately; the transformer component 25 and the main power device 22 are assembled on the cooling component 21, fixed and potted; the transformer component 25 and the main power device 22 are connected to the input filter component 23 and the output filter component 24; and the electronic control module 30 is disposed in the second area 12 of the mounting plate 10.

[0101] Specifically, the maintenance method of the power assembly 100 of this utility model is as follows: first, remove the main power device 22 and the cooling device 21 together; then remove the input filter device 23 and the output filter device 24; repair or replace the corresponding devices.

[0102] This utility model provides a vehicle including the electric powertrain 100 as described in any of the foregoing embodiments.

[0103] Optionally, the vehicle also includes a motor, which is mounted on the surface of the mounting plate 10 facing away from the power module 20 and the electronic control module 30.

[0104] This utility model's vehicle powertrain 100 boasts a high degree of integration while also allowing the single modular power supply module 20 and electronic control module 30 to be broken down into multiple modules to match different market and customer needs. It also improves the ease of maintenance for highly integrated products. Each module in the powertrain 100 can be independently manufactured and assembled, facilitating assembly and allowing it to be matched with different highly integrated product designs, thus facilitating promotion and expanding application scenarios.

[0105] In the description of the embodiments of this utility model, it should be noted that the orientation or positional relationship of the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and other indicators are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0106] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Those skilled in the art can understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present utility model are still within the scope of the present utility model.

Claims

1. An electric power assembly (100), characterized in that, include: Mounting plate (10), including a first region (11) and a second region (12); A power module (20) is disposed in the first region (11). The power module (20) includes a cooling component (21), which is detachably connected to the mounting plate (10). An electronic control module (30) is disposed in the second region (12); A heat sink (13) is disposed on the mounting plate (10), and the heat sink (13) is disposed in the first region (11) and the second region (12).

2. The power assembly (100) according to claim 1, characterized in that, The mounting plate (10) has a first surface (141) and a second surface (142) facing away from each other. The power module (20) and the electronic control module (30) are both disposed on the first surface (141), and the heat sink (13) is disposed on the second surface (142).

3. The power assembly (100) according to claim 2, characterized in that, The mounting plate (10) protrudes toward the first surface (141) and forms a water nozzle (16). The water inlet (2111) and water outlet (2112) of the cooling component (21) are both connected to the corresponding water nozzle (16).

4. The power assembly (100) according to claim 3, characterized in that, The cooling component (21) is a three-dimensional water channel. The cooling component (21) includes a bottom cover (216), which covers the mounting plate (10). The bottom cover (216) has an inlet (2111) and an outlet (2112) for the cooling component (21). The power assembly (100) also includes a seal (40), which is fitted onto the water tap (16) and elastically abuts against the bottom cover (216).

5. The power assembly (100) according to claim 3, characterized in that, The power module (20) also includes a main power device (22), which includes a spring plate (221), a main board (222), and a power element (223). The main board (222) is disposed on the side of the cooling component (21) away from the mounting plate (10). The power element (223) is disposed on the main board (222). The spring plate (221) includes a spring part (2211) and a base part (2212). The base part (2212) is connected to the main board (222). The spring part (2211) elastically abuts against the power element (223) to apply pressure so that the power element (223) is tightly attached to the cooling component (21).

6. The power assembly (100) according to claim 5, characterized in that, The cooling component (21) has a receiving groove (214) and the cooling component (21) also includes a mounting post (215). The mounting post (215) is disposed on the bottom wall of the receiving groove (214) and the mounting post (215) passes through the base (2212) of the main board (222) and the spring pressure plate (221).

7. The power assembly (100) according to claim 6, characterized in that, The power module (20) includes an input filter device (23), which is disposed in the first region (11) and detachably connected to the mounting plate (10). The input filter device (23) includes an input filter component (231) and a first housing (232) for accommodating the input filter component (231). The power module (20) includes an output filter device (24), which is disposed in the first region (11) and detachably connected to the mounting plate (10). The output filter device (24) includes an output filter assembly (241) and a second housing (242) for accommodating the output filter assembly (241).

8. The power assembly (100) according to claim 7, characterized in that, The input filter (23) is disposed on one side of the cooling element (21), and the output filter (24) is disposed on the opposite side of the cooling element (21). The power module (20) also includes a transformer (25), which is connected to the motherboard (222) and housed in the receiving slot (214).

9. The power assembly (100) according to claim 8, characterized in that, The motherboard (222) covers the input filter (23) and the output filter (24), and in the orthographic projection of the first surface (141), the orthographic projection of the motherboard (222) overlaps at least partially with the orthographic projection of the input filter (23) and / or the output filter (24).

10. A vehicle, characterized in that, Includes the power assembly (100) as described in any one of claims 1 to 9.

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