Stackable blister box tray for electronic components
By incorporating heat dissipation grooves and limiting components within the blister tray, the heat dissipation and protection issues of the blister tray during transportation are solved. This achieves efficient heat dissipation and protection of components, prevents overheating and damage from bumps, and improves transportation safety and equipment flexibility.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN XINSHENG PLASTIC CO LTD
- Filing Date
- 2025-04-27
- Publication Date
- 2026-05-08
AI Technical Summary
Existing blister trays lack effective heat dissipation and protection during the transportation of electronic components, resulting in excessively high component temperatures, which can affect performance or cause circuit failures. Furthermore, they pose a high risk of damage in environments unsuitable for refrigeration.
A stackable blister tray was designed, which includes a plastic tray base and a storage base. It has internal heat dissipation grooves and limiting components. The heat dissipation grooves are used for heat dissipation, and the limiting components are used for limiting and buffering to prevent components from overheating and being damaged by bumps.
Effective heat dissipation prevents components from overheating, prevents package deformation or solder joint detachment, increases equipment flexibility, and protects the integrity of components during transportation.
Smart Images
Figure CN224211452U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of electronic components, and in particular to a stackable blister tray for electronic components. Background Technology
[0002] Stackable blister trays for electronic components are commonly used to store, protect, and organize various electronic components, especially during manufacturing and assembly processes. These trays are designed to improve the efficiency of component storage and handling, and ensure the safety of components during transportation and storage. These stackable blister trays for electronic components play a crucial role in storage, protection, and transportation, improving work efficiency and reducing the risk of damage.
[0003] In current technologies, plastic trays are mostly used for storing electronic components. However, these blister trays lack protection during transport, and due to varying storage environments, especially those unsuitable for refrigeration, the heat from the electronic components inside the trays cannot dissipate effectively, potentially leading to overheating. Excessive heat can affect the performance of electronic components and may even cause circuit malfunctions or damage. Utility Model Content
[0004] To solve the above-mentioned technical problems, this utility model provides a stackable blister tray for electronic components.
[0005] This utility model is achieved by the following technical solution: a stackable blister tray for electronic components, including a plastic tray base, a stacking assembly on the top of the plastic tray base, and a limiting component inside the stacking assembly.
[0006] The stacking assembly includes a plastic box tray storage base, which is fixedly connected to the top of the plastic box tray base. The inner wall of the plastic box tray storage base has a heat dissipation groove, the inner wall of the plastic box tray base has a second heat dissipation groove, the inner wall of the plastic box tray storage base has an electronic component placement groove, the inner wall of the electronic component placement groove is fixedly connected with a cushioning rubber, and the bottom of the plastic box tray base has a stacking clearance groove.
[0007] As a further improvement to the above solution, several heat dissipation slots are provided, several heat dissipation slots are provided, several electronic component placement slots are provided, and several buffer rubbers are provided.
[0008] Through the above technical solution, the heat dissipation grooves and heat dissipation slots opened in the plastic box tray base and the plastic box tray storage seat can dissipate heat from the electronic components inside the blister tray of stacked electronic components, and prevent the electronic components located inside the electronic component placement slots opened in the plastic box tray storage seat from overheating and causing the component temperature to become too high.
[0009] As a further improvement to the above solution, the limiting component includes a limiting block, which is fixedly connected to the inner wall of the plastic box tray base. A limiting top plate is disposed in contact with the surface of the limiting block, and a second limiting block is fixedly connected to the bottom of the limiting top plate. The surface of the limiting top plate is disposed on the inner wall of the plastic box tray storage base.
[0010] As a further improvement to the above solution, a limiting groove is formed on the inner wall of the limiting block two, and a limiting slider is slidably connected to the inner wall of the limiting groove.
[0011] As a further improvement to the above scheme, several limiting blocks are provided, several second limiting blocks are provided, and several limiting sliders are provided.
[0012] As a further improvement to the above solution, a limiting spring is fixedly connected to the top of the inner wall of the limiting groove, the end of the limiting spring away from the limiting top plate is fixedly connected to the top of the limiting slider, and a buffer rubber is fixedly connected to the end of the limiting slider away from the limiting spring.
[0013] As a further improvement to the above solution, several limiting springs and several buffer rubbers are provided.
[0014] The above technical solution involves installing a limiting top plate inside the plastic tray storage base, then limiting the limiting top plate by a limiting block, and the limiting top plate driving the limiting block two into the electronic component placement slot. Then, the limiting spring inside the limiting groove of the limiting block two pushes the limiting slider downward, causing the limiting slider to push the buffer rubber two downward, thereby limiting the electronic components in the electronic component placement slot by the buffer rubber two.
[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0016] This invention utilizes heat dissipation grooves in the plastic tray base and the plastic tray storage seat to dissipate heat from electronic components inside the blister tray of stacked electronic components. This prevents overheating of electronic components located in the electronic component placement slots of the plastic tray storage seat, thus preventing deformation, cracking, or solder joint detachment of sensitive components and ensuring normal product use. Furthermore, the stacking clearance groove at the bottom of the plastic tray base allows for the stacking of identical plastic tray bases and plastic tray storage seats, increasing the flexibility of the equipment.
[0017] This invention involves installing a limiting top plate inside a plastic tray storage base when placing electronic components into the electronic component placement slot. A limiting block then limits the limiting top plate, causing the limiting top plate to move into the electronic component placement slot. A limiting spring inside the limiting groove of the limiting block then pushes a limiting slider downwards, causing the limiting slider to push a buffer rubber 2 downwards. This buffer rubber 2 then limits the electronic components in the placement slot, preventing damage to the electronic components due to bumps and vibrations. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0019] Figure 2 This is a schematic diagram of the stacked component structure of this utility model;
[0020] Figure 3 This is a schematic diagram of the stacking avoidance bottom groove structure of this utility model;
[0021] Figure 4 This is a schematic diagram of the limiting component structure of this utility model;
[0022] Figure 5 This utility model Figure 4 Enlarged structural diagram of section A in the middle;
[0023] Figure 6 This is a schematic diagram of the two cross-sectional structures of the limiting block of this utility model.
[0024] Explanation of key symbols:
[0025] 1. Plastic box tray base; 2. Stacking assembly; 201. Plastic box tray storage base; 202. Heat dissipation groove; 203. Heat dissipation groove II; 204. Electronic component placement groove; 205. Buffer rubber; 206. Stacking clearance bottom groove; 3. Limiting assembly; 301. Limiting block; 302. Limiting top plate; 303. Limiting block II; 304. Limiting slide; 305. Limiting spring; 306. Limiting slider; 307. Buffer rubber II. Detailed Implementation
[0026] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.
[0027] Please combine Figure 1-6 This embodiment provides a stackable blister tray for electronic components, including a blister tray base 1, a stacking assembly 2 on the top of the blister tray base 1, and a limiting assembly 3 inside the stacking assembly 2.
[0028] The stacking assembly 2 includes a plastic box tray storage base 201, which is fixedly connected to the top of the plastic box tray base 1. The inner wall of the plastic box tray storage base 201 is provided with a heat dissipation groove 202, the inner wall of the plastic box tray base 1 is provided with a heat dissipation groove 203, the inner wall of the plastic box tray storage base 201 is provided with an electronic component placement groove 204, and a cushioning rubber 205 is fixedly connected to the inner wall of the electronic component placement groove 204. The bottom of the plastic box tray base 1 is provided with a stacking clearance groove 206.
[0029] Several heat dissipation slots 202 and 203 are provided, several electronic component placement slots 204 are provided, and several buffer rubbers 205 are provided.
[0030] The limiting component 3 includes a limiting block 301, which is fixedly connected to the inner wall of the plastic box tray base 1. A limiting top plate 302 is provided in contact with the surface of the limiting block 301. A second limiting block 303 is fixedly connected to the bottom of the limiting top plate 302. The surface of the limiting top plate 302 is provided on the inner wall of the plastic box tray storage base 201.
[0031] Limiting block 2 303 has a limiting groove 304 on its inner wall, and a limiting slider 306 is slidably connected to the inner wall of the limiting groove 304.
[0032] There are several limit blocks 301, several limit blocks 303, and several limit sliders 306.
[0033] A limiting spring 305 is fixedly connected to the top of the inner wall of the limiting slide 304. The end of the limiting spring 305 away from the limiting top plate 302 is fixedly connected to the top of the limiting slider 306. A buffer rubber 307 is fixedly connected to the end of the limiting slider 306 away from the limiting spring 305.
[0034] Several limit springs 305 and several buffer rubbers 307 are provided.
[0035] The implementation principle of a stackable blister tray for electronic components in this embodiment is as follows: Heat dissipation grooves 203 and 202, formed in the blister tray base 1 and blister tray storage seat 201, allow for heat dissipation of the electronic components inside the stackable blister tray. This prevents overheating of the electronic components located in the electronic component placement slots 204 of the blister tray storage seat 201, thus preventing deformation, cracking, or solder joint detachment of sensitive components and ensuring normal product use. Furthermore, the stacking clearance groove 206 at the bottom of the blister tray base 1 allows for the stacking of identical blister tray bases 1 and blister tray storage seats 201, increasing the flexibility of the equipment. When electronic components are placed into the electronic component placement slot 204, the limiting top plate 302 is installed inside the plastic tray storage base 201. Then, the limiting block 301 limits the limiting top plate 302, and the limiting top plate 302 drives the second limiting block 303 into the electronic component placement slot 204. Then, the limiting spring 305 inside the limiting groove 304 opened inside the second limiting block 303 pushes the limiting slider 306 downward, so that the limiting slider 306 pushes the second buffer rubber 307 downward, thereby limiting the electronic components in the electronic component placement slot 204. Then, the buffer rubber 205 and the second buffer rubber 307 limit the electronic components to prevent damage to the electronic components due to bumps and vibrations.
[0036] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.
Claims
1. A stackable blister tray for electronic components, characterized in that, Includes a plastic box tray base (1), the top of which is provided with a stacking component (2), and the stacking component (2) is provided with a limiting component (3). The stacking assembly (2) includes a plastic box tray storage base (201), which is fixedly connected to the top of the plastic box tray base (1). The inner wall of the plastic box tray storage base (201) is provided with a heat dissipation groove (202), the inner wall of the plastic box tray base (1) is provided with a second heat dissipation groove (203), the inner wall of the plastic box tray storage base (201) is provided with an electronic component placement groove (204), the inner wall of the electronic component placement groove (204) is fixedly connected with a buffer rubber (205), and the bottom of the plastic box tray base (1) is provided with a stacking clearance groove (206).
2. The stackable blister tray for electronic components as described in claim 1, characterized in that: The heat dissipation slot (202) has several openings, the second heat dissipation slot (203) has several openings, the electronic component placement slot (204) has several openings, and the buffer rubber (205) has several openings.
3. The stackable blister tray for electronic components as described in claim 1, characterized in that: The limiting component (3) includes a limiting block (301), which is fixedly connected to the inner wall of the plastic box tray base (1). A limiting top plate (302) is provided on the surface of the limiting block (301). A second limiting block (303) is fixedly connected to the bottom of the limiting top plate (302). The surface of the limiting top plate (302) is provided on the inner wall of the plastic box tray storage seat (201).
4. The stackable blister tray for electronic components as described in claim 3, characterized in that: The inner wall of the limiting block 2 (303) is provided with a limiting groove (304), and the inner wall of the limiting groove (304) is slidably connected to a limiting slider (306).
5. A stackable blister tray for electronic components as described in claim 4, characterized in that: Several limit blocks (301) are provided, several limit blocks (303) are provided, and several limit sliders (306) are provided.
6. The stackable blister tray for electronic components as described in claim 4, characterized in that: A limiting spring (305) is fixedly connected to the top of the inner wall of the limiting groove (304). The end of the limiting spring (305) away from the limiting top plate (302) is fixedly connected to the top of the limiting slider (306). A buffer rubber two (307) is fixedly connected to the end of the limiting slider (306) away from the limiting spring (305).
7. A stackable blister tray for electronic components as described in claim 6, characterized in that: Several limiting springs (305) and several buffer rubbers (307) are provided.