Device for detecting quality of wafer with iron ring after film pasting
By designing a quality inspection device for wafers with iron rings after film application, and using an iron ring disk, a film application disk, and a high-pixel line scan camera CCD for automated inspection, the problem of high error rate in manual inspection is solved, and efficient and accurate film application quality control is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DOBEST SEMICON TECH (SUZHOU) CO LTD
- Filing Date
- 2025-05-12
- Publication Date
- 2026-05-08
AI Technical Summary
The lack of a dedicated wafer film-attaching inspection device in the current technology leads to a high error rate and low efficiency in manual inspection, making it difficult to ensure the consistency of film-attaching quality and affecting product performance and production efficiency.
Design a quality inspection device for wafers with iron rings after film application. The device uses an iron ring disk, a film application disk, a line scan light source, and a high-pixel line scan camera (CCD). It automatically detects film misalignment, bubbles, wrinkles, and dirt, and automatically judges and alarms to handle defective products.
This improved the accuracy and efficiency of film application inspection, prevented defective products from flowing into subsequent processes, ensured product quality stability, and reduced production costs and cycle time.
Smart Images
Figure CN224216113U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of testing device technology, and in particular to a quality testing device for wafers with iron rings after film lamination. Background Technology
[0002] In semiconductor manufacturing, the application of film to wafers with iron rings is one of the key processes, and the quality of the film application directly affects subsequent production and product performance.
[0003] Currently, after lamination of wafers with iron rings, there is either a lack of dedicated inspection equipment or reliance on manual judgment of the lamination effect, such as checking the lamination accuracy, the presence of bubbles and wrinkles, and the absence of dirt. Manual inspection has many drawbacks. On the one hand, human judgment is easily affected by subjective factors and fatigue, making it difficult to ensure the consistency of judgment standards, resulting in a high misjudgment rate. On the other hand, manual inspection is inefficient and prone to missed inspections, allowing defective products to flow into subsequent processes, thus leading to unstable product quality, increased production costs, and longer production cycles. Therefore, this application proposes a quality inspection device for wafers with iron rings after lamination. Utility Model Content
[0004] The purpose of this invention is to address the problem in the prior art that manual judgment of the film application effect is required after the film is applied, and to propose a quality inspection device for wafers with iron rings after film application.
[0005] The technical solution of this utility model: A quality inspection device for wafers with iron rings after film bonding, including an iron ring disk, and further comprising:
[0006] A film-applying tray is fixedly mounted on an iron ring tray. A line scan light source is provided on one side of the iron ring tray, and a CCD is provided on the top of the iron ring tray. The film-applying tray is provided with a Y-axis, which is used to move the wafer and the film during inspection, and to complete the inspection area coverage in conjunction with the CCD.
[0007] Optionally, an iron ring is provided on the iron ring disk, and the iron ring is located on the outside of the film-applying disk.
[0008] Optionally, a lens is fixedly mounted on the CCD.
[0009] Optionally, the CCD is a high-resolution line scan camera.
[0010] Optionally, the scanning frequency of the line scan light source is not less than 100Hz.
[0011] Optionally, a wafer is disposed on the iron ring disk, and the wafer is located inside the film-coating disk.
[0012] Compared with the prior art, the present invention has the following beneficial technical effects:
[0013] This invention moves the film-applying tray to the CCD imaging position, where the CCD takes a picture of the film for inspection (the film-applying tray moves along the Y-axis to take a picture of the entire film area). Good films can continue to the device, while bad films are alarmed and manually handled. It uses a high-pixel line scan camera and a high-precision line scan light source to determine whether the film is misaligned, has obvious bubbles, has wrinkles, or is dirty, thus avoiding the need for additional equipment due to defects. Attached Figure Description
[0014] Figure 1 A schematic diagram of a quality inspection device for wafers with iron rings after film lamination.
[0015] Figure 2 This is a schematic diagram of the lens and CCD structure.
[0016] Reference numerals: 1. Iron ring disk; 2. Iron ring; 3. Wafer; 4. Film coating disk; 5. Line scan light source; 6. Lens; 7. CCD. Detailed Implementation
[0017] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments.
[0018] The components of the present invention embodiments described and shown in the accompanying drawings can typically be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.
[0019] Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0020] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0021] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0023] Example
[0024] like Figure 1 and Figure 2 As shown, the present invention proposes a quality inspection device for wafers with iron rings after film application, including an iron ring disk 1 and a film application disk 4. The film application disk 4 is fixedly installed on the iron ring disk 1. A line scan light source 5 is provided on one side of the iron ring disk 1, and a CCD 7 is provided on the top of the iron ring disk 1. A Y-axis is provided on the film application disk 4. In the inspection process, the film application disk 4 carries the wafer 3 with the film applied. The Y-axis design allows it to move in a specific direction and work in conjunction with the CCD 7. The CCD 7 can perform comprehensive imaging inspection of the entire film area to ensure the integrity of the inspection. It is used to move the wafer 3 during inspection to complete the inspection area coverage. An iron ring 2 is provided on the iron ring disk 1, and the iron ring 2 is located on the outside of the film application disk 4.
[0025] like Figure 1 and Figure 2 As shown, lens 6 is fixedly mounted on CCD7. CCD7 is a high-pixel line scan camera with high resolution, which can clearly capture the subtle features of the film surface. Whether it is a tiny film displacement, or an imperceptible bubble, wrinkle, or dirt on the film surface, it can be clearly displayed through camera imaging, providing reliable image basis for subsequent accurate detection.
[0026] Among them, the scanning frequency of the line scan light source 5 is not less than 100Hz, which provides stable and uniform illumination when the CCD7 takes pictures. Its high scanning frequency can ensure that the light is stable throughout the entire picture taking process, avoid image blurring or shadow interference caused by light problems, ensure that the image acquired by the camera is clear and accurate, and help improve the reliability of the detection results. The iron ring disk 1 is equipped with a wafer 3, which is located inside the film-coating disk 4.
[0027] In this embodiment, after the wafer 3 with the iron ring completes the film application process, the film application tray 4 automatically moves to the CCD 7 imaging position. At this time, the high-frequency line scan light source 5 is turned on, providing sufficient and uniform light to the detection area. The CCD 7 starts working with the assistance of the light source. At the same time, the film application tray 4 moves along the Y-axis, driving the wafer 3 and the film to move slowly, so that the CCD 7 can scan and photograph the entire film area line by line to obtain a complete film image. According to the preset judgment rules, it is judged whether there are problems such as film offset, bubbles, wrinkles, dirt, etc. If it is judged as OK, the film application tray will automatically transfer the wafer to the subsequent process stage; if it is judged as NG, the device will trigger the alarm device to notify the operator to handle it, pick out the unqualified products, and prevent them from flowing into the subsequent production process. This realizes the photographic inspection of the wafer and iron ring after film application, avoids additional equipment requirements due to defects, and improves processing efficiency.
[0028] The above specific embodiments are merely several optional embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.
Claims
1. A quality inspection device for wafers with iron rings after film lamination, comprising an iron ring disk (1), characterized in that, Also includes: A film-applying tray (4) is fixedly mounted on an iron ring tray (1). A line scan light source (5) is provided on one side of the iron ring tray (1). A CCD (7) is provided on the top of the iron ring tray (1). A Y-axis is provided on the film-applying tray (4) to drive the wafer and film-applying material to move during inspection, and to cooperate with the CCD (7) to complete the inspection area coverage.
2. The quality inspection device for wafers with iron rings after film lamination according to claim 1, characterized in that, An iron ring (2) is provided on the iron ring disk (1), and the iron ring (2) is located on the outside of the film-applying disk (4).
3. The quality inspection device for wafers with iron rings after film lamination according to claim 1, characterized in that, A lens (6) is fixedly mounted on the CCD (7).
4. The quality inspection device for wafers with iron rings after film lamination according to claim 1, characterized in that, The CCD (7) is a high-pixel line scan camera.
5. The quality inspection device for wafers with iron rings after film lamination according to claim 1, characterized in that, The scanning frequency of the line scan light source (5) is not less than 100Hz.
6. The quality inspection device for wafers with iron rings after film lamination according to claim 1, characterized in that, A wafer (3) is disposed on the iron ring disk (1), and the wafer (3) is located inside the film-coating disk (4).