Plastic package detection assembly of chip

Abstract

The utility model discloses a plastic package detection assembly of a chip, which comprises a main machine body, a fixing frame is arranged at the front end of the main machine body, fixing columns are fixed at the left side and the right side of the upper end and the lower end of the fixing frame, and a plurality of through round holes and sliding grooves are distributed at the front ends of the fixing columns. A handle is installed at the left end of the movable plate, a rotating shaft is fixed to the end face of the inner side of the handle, the movable plate can extend towards the outer side along the fixing column, and during adjustment, the baffle needs to be rotated to the upward position, the baffle moves at the inner side of the sliding groove, so that the movable plate can be adjusted, and the movable plate can be adjusted. And after the movable plate is adjusted to a proper height, the baffle plate is moved to a position passing through the inner part of the round hole, and when the handle is rotated to rotate, the baffle plate is located at the position passing through the inner part of the round hole, so that the position of the movable plate is adjusted in such a manner, and the main machine body is convenient to install.

Description

Technical Field

[0001] This utility model belongs to the technical field of chip molding and testing components, specifically relating to a chip molding and testing component. Background Technology

[0002] Chip molding inspection components are devices or systems used to inspect the quality of chip molding processes. Molding is a critical step in the chip packaging process, protecting the chip with packaging materials. Molding inspection components need to inspect the appearance, internal structure, and electrical performance of the packaged chip. For example, visual inspection equipment is used to check for defects such as cracks, bubbles, and missing materials on the surface of the molding compound. X-ray inspection technology is used to check the gold wire bonding inside the chip, the connection status between the chip and the substrate, and the bonding between the packaging material and the chip. Electrical testing modules are used to check whether the electrical parameters of the chip pins, such as conductivity and insulation, meet the standards, ensuring that the packaged chip meets the reliability and functionality requirements, and guaranteeing the stability and lifespan of the chip in subsequent applications.

[0003] The chip encapsulation testing component is in use. The mounting bracket is used to install the main unit through mounting holes and bolts. However, when the mounting holes are not aligned with the external holes, it will affect the installation of the main unit. Therefore, the market needs a new device to solve the current problem. Utility Model Content

[0004] The purpose of this utility model is to provide a chip encapsulation testing component to solve the problem mentioned in the background art. In the use of the chip encapsulation testing component, the mounting bracket installs the main body through mounting holes and bolts. However, when the mounting holes are not aligned with the external holes, it will affect the installation of the main body. Therefore, the market needs a new device to solve the current problem.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a chip encapsulation testing component, comprising a main body, a fixing frame installed at the front end of the main body, fixing posts fixed at the upper and lower ends of the fixing frame at the left and right sides, multiple through holes and sliding grooves distributed at the front end of the fixing posts, movable plates installed on the fixing frame at the upper and lower ends and the left and right sides of the fixing posts, a handle installed at the left end of the movable plate, a rotating shaft fixed at the inner end face of the handle, baffles fixed at the left and right sides of the outer wall of the rotating shaft, and an arrow provided at the front end of the handle.

[0006] Preferably, a camera holder is installed at the upper end of the main body, and a pad is installed at the upper end of the camera holder.

[0007] Preferably, a support frame is installed at the upper end of the gasket, and a lens mounting bracket is installed at the rear end of the support frame.

[0008] Preferably, a standard flat key is installed at the left end of the lens mounting bracket, and a handle is installed at the right end of the lens mounting bracket.

[0009] Preferably, the front end of the fixing frame is provided with multiple through holes, and two movable plates are provided, which are respectively installed at the upper and lower ends of the fixing frame.

[0010] Preferably, multiple through holes and grooves are provided, and the multiple through holes and grooves are interconnected.

[0011] Preferably, the baffle is sleeved inside the circular hole, and the handle controls the rotating shaft to rotate, causing the baffle to rotate.

[0012] Preferably, the baffle is oriented in the same direction as the arrow. When the arrow is pointing upwards, the movable plate can move outwards, allowing the baffle to enter the groove.

[0013] Compared with the prior art, the present invention provides a chip encapsulation testing component, which has the following advantages:

[0014] The movable plate of this device can extend outward along the fixed column. When adjusting, the baffle needs to be rotated to the upward position so that when the movable plate is moved, the baffle moves inside the slide groove. After adjusting to the appropriate height, move the baffle to the position inside the circular hole. When the handle can be rotated, it indicates that the baffle is in the position inside the circular hole. The position of the movable plate is adjusted in this way, which facilitates the installation of the main body.

[0015] The direction of the arrow indicates the direction of the baffle rotation. When the baffle is located inside the movable plate, the control handle is rotated. The direction of the baffle can be seen through the arrow at the front end, which makes it easy to adjust the movable plate. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a chip encapsulation testing component according to the present invention.

[0017] Figure 2 This is a partially enlarged structural diagram of a chip encapsulation detection component according to the present invention.

[0018] Figure 3 This is a cross-sectional schematic diagram of a movable plate of a chip encapsulation testing component according to the present invention.

[0019] Figure 4 This is a schematic diagram of the fixing post structure of a chip encapsulation testing component according to the present invention.

[0020] In the diagram: 1. Main body; 2. Camera stand; 3. Gasket; 4. Lens mounting bracket; 5. Standard flat key; 6. Handle; 7. Support frame; 8. Fixing frame; 9. Movable plate; 10. Arrow; 11. Handle; 12. Baffle; 13. Fixing post; 14. Rotating shaft; 15. Through round hole; 16. Slide. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0022] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] The utility model provides, for example Figure 1-4The chip encapsulation testing assembly shown includes a main body 1. A mounting bracket 8 is installed at the front end of the main body 1. Mounting posts 13 are fixed at the upper and lower ends of the mounting bracket 8 at the left and right sides. Multiple through holes 15 and sliding grooves 16 are distributed at the front end of the mounting posts 13. Movable plates 9 are installed at the upper and lower ends of the mounting bracket 8 via the mounting posts 13 at the left and right sides. A handle 11 is installed at the left end of the movable plate 9. A rotating shaft 14 is fixed at the inner end face of the handle 11. Baffles 12 are fixed at the outer wall of the rotating shaft 14 at the left and right sides. An arrow 10 is provided at the front end of the handle 11.

[0025] The system uses a high-precision industrial camera located inside the main body 1 to scan the surface of the encapsulated chip. By comparing the image with a standard sample using an image recognition algorithm, it detects the presence of appearance defects that are difficult to detect with the naked eye, such as cracks, bubbles, burrs, missing materials, and pin deformation. It quickly screens out obviously unqualified products. The detection components are usually linked with the production line and are automatically fed by a robotic arm or conveyor belt. The system sequentially completes multi-station inspections of appearance, internal structure, and electrical performance. The system records the inspection data in real time and marks or sorts out unqualified products.

[0026] like Figure 1 and Figure 2 As shown, a camera mount 2 is installed at the upper end of the main body 1, a pad 3 is installed at the upper end of the camera mount 2, a support frame 7 is installed at the upper end of the pad 3, a lens mount 4 is installed at the rear end of the support frame 7, a common flat key 5 is installed at the left end of the lens mount 4, and a handle 6 is installed at the right end of the lens mount 4. Multiple through holes are provided at the front end of the fixed frame 8. Two movable plates 9 are provided, installed at the upper and lower ends of the fixed frame 8 respectively. Multiple through holes 15 and slide grooves 16 are provided, and the multiple through holes 15 and slide grooves 16 are interconnected. A baffle 12 is sleeved inside the through hole 15. The handle 11 controls the rotating shaft 14 to rotate, so that the baffle 12 rotates. The orientation of the baffle 12 is consistent with the orientation of the arrow 10. When the arrow 10 is pointing upward, the movable plate 9 can move outward, so that the baffle 12 enters the slide groove 16.

[0027] The direction of arrow 10 indicates the rotation of baffle 12. When baffle 12 is located inside the movable plate 9, control handle 11 is rotated. The orientation of baffle 12 can be viewed through arrow 10 at the front end, which facilitates the adjustment of movable plate 9.

[0028] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A chip encapsulation testing component, characterized in that, The device includes a main body (1), a mounting frame (8) is installed at the front end of the main body (1), and mounting posts (13) are fixed at the upper and lower ends of the mounting frame (8) at the left and right sides. Multiple through holes (15) and sliding grooves (16) are distributed at the front end of the mounting posts (13). Movable plates (9) are installed at the upper and lower ends of the mounting frame (8) through the mounting posts (13) at the left and right sides. A handle (11) is installed at the left end of the movable plate (9). A rotating shaft (14) is fixed at the inner end face of the handle (11). A baffle (12) is fixed on the outer wall of the rotating shaft (14) at the left and right sides. An arrow (10) is provided at the front end of the handle (11).

2. The chip encapsulation testing component according to claim 1, characterized in that: A camera mount (2) is installed at the upper end of the main body (1), and a pad (3) is installed at the upper end of the camera mount (2).

3. The chip encapsulation testing component according to claim 2, characterized in that: A support frame (7) is installed at the upper end of the gasket (3), and a lens mounting bracket (4) is installed at the rear end of the support frame (7).

4. The chip encapsulation testing component according to claim 3, characterized in that: A standard flat key (5) is installed at the left end of the lens mounting bracket (4), and a handle (6) is installed at the right end of the lens mounting bracket (4).

5. The chip encapsulation testing component according to claim 1, characterized in that: The fixed frame (8) has multiple through holes at its front end, and two movable plates (9) are provided, which are respectively installed at the upper and lower ends of the fixed frame (8).

6. The chip encapsulation testing component according to claim 1, characterized in that: Multiple through holes (15) and grooves (16) are provided, and the multiple through holes (15) and grooves (16) are interconnected.

7. The chip encapsulation testing component according to claim 6, characterized in that: The baffle (12) is fitted inside the circular hole (15), and the handle (11) controls the rotating shaft (14) to rotate, so that the baffle (12) rotates.

8. The chip encapsulation testing component according to claim 7, characterized in that: The baffle (12) is oriented in the same direction as the arrow (10). When the arrow (10) is pointing upward, the movable plate (9) can move outward so that the baffle (12) enters the groove (16).

Images