Bulb aging test device based on infrared thermal imaging

Abstract

The utility model relates to the technical field of bulb aging test devices, and particularly discloses a bulb aging test device based on infrared thermal imaging, which comprises a test board and a sliding plate, a guide rail is arranged on the surface of the test board, a base is fixedly arranged on the bottom surface of the guide rail, a power connection port is arranged on the surface of the base, and positioning plates are fixedly arranged on two sides of the surface of the guide rail. According to the bulb aging test device based on the infrared thermal imaging, an operator only needs to slide the sliding plate provided with the bulb body to a designated position along the guide rail, automatic butt joint of a bulb and a power connection port is achieved, and the bulb aging test device based on the infrared thermal imaging has the advantages that the bulb aging test efficiency is greatly improved; manual one-by-one bulb connection is not needed, and the batch bulb testing efficiency is greatly improved. And meanwhile, multiple groups of bases and power connection ports uniformly distributed on the bottom surface of the guide rail, and butt joint ports corresponding to the bases and the power connection ports at the bottom of the inner side of the sliding plate realize simultaneous testing of multiple bulbs, and the detection efficiency is further improved.

Description

Technical Field

[0001] This utility model relates to the technical field of bulb aging testing devices, specifically a bulb aging testing device based on infrared thermal imaging. Background Technology

[0002] In the lighting product manufacturing industry, bulb aging testing is a crucial step in ensuring product quality and performance reliability. Traditional bulb aging testing methods mainly rely on electrical parameter testing, assessing the degree of aging by measuring data such as bulb voltage, current, and power.

[0003] Traditional testing devices often require manual wiring to connect the bulbs to the test circuit. This method is not only time-consuming and labor-intensive, but also prone to errors and poor contact during batch testing, as operators need to repeatedly plug and unplug connections, leading to inaccurate test data and affecting the accurate assessment of bulb aging performance. Furthermore, the lack of positioning and moving mechanisms requires operators to precisely align all connecting components during bulb installation, demanding a high level of skill and hindering testing efficiency. This makes it difficult to meet the needs of rapid bulb testing in large-scale production scenarios. Therefore, we propose a bulb aging testing device based on infrared thermal imaging. Utility Model Content

[0004] The purpose of this invention is to provide a bulb aging test device based on infrared thermal imaging, in order to solve the problems mentioned in the background art, which require workers to repeatedly plug and unplug connections, which easily leads to wiring errors, poor contact, and other problems, resulting in inaccurate test data and low test efficiency.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a bulb aging test device based on infrared thermal imaging, comprising a test platform and a slide plate, a guide rail is provided on the surface of the test platform, a base is fixedly installed on the bottom surface of the guide rail, an electrical connection port is provided on the surface of the base, positioning plates are fixedly installed on both sides of the guide rail, side plates are fixedly installed on both sides of the slide plate, and a docking interface is provided at the bottom of the top of the slide plate, on which a bulb body is movably attached.

[0006] The test bench is fixedly installed with a cover plate on top, a data receiving board is fixedly installed on the bottom inside the cover plate, baffles are fixedly installed on both sides of the surface of the data receiving board, and fixing plates are fixedly installed on the sides of the baffles.

[0007] A snap-fit ​​plate is fixedly installed on one side of the test bench surface, and a snap-fit ​​groove is opened at the center of the surface of the snap-fit ​​plate.

[0008] The side plates and positioning plates are parallel and corresponding, and the slide plate is adjusted by sliding on the guide rail surface through the side plates and positioning plates.

[0009] The slide plate slides on the guide rail surface, contacts the snap-fit ​​plate surface, and slides and snaps into the snap-fit ​​groove surface.

[0010] The base and power interface are evenly distributed on the bottom surface of the guide rail, and the interface is evenly distributed on the bottom inner side of the slide plate, and is perpendicular to the base and power interface.

[0011] The base is connected to the bulb body via a power inlet and a docking port.

[0012] The bottom of the data receiving board is perpendicular to the surface of the bulb body, and the baffle and fixing plate are fixedly installed around the surface of the data receiving board.

[0013] This utility model has at least the following beneficial effects:

[0014] 1. The test bench surface is equipped with guide rails. The slide plate slides and adjusts on the guide rail surface via side plates and positioning plates. As the slide plate slides on the guide rail surface, it contacts and engages with the snap-fit ​​plate in the snap-fit ​​groove. This design makes the installation and testing of bulbs more convenient. Operators only need to slide the slide plate containing the bulb along the guide rail to the designated position to automatically connect the bulb to the power interface, eliminating the need for manual connection of each bulb individually and greatly improving the testing efficiency of batch bulbs. Simultaneously, multiple sets of bases and power interfaces evenly distributed on the bottom surface of the guide rail, as well as corresponding mating interfaces on the inner bottom of the slide plate, allow for simultaneous testing of multiple bulbs, further enhancing testing efficiency.

[0015] 2. The data receiving board, in conjunction with infrared thermal imaging technology, enables real-time dynamic monitoring of the bulb aging process, continuously collecting temperature data at different aging stages. This data can be transmitted to a subsequent data processing system for analysis, helping technicians gain a deeper understanding of the bulb's aging patterns and providing strong data support for optimizing bulb design and manufacturing processes.

[0016] 3. The structural design, including the base fixedly mounted on the bottom surface of the guide rail, the positioning plates on both sides of the guide rail surface, and the side plates on both sides of the slide plate, ensures the stability of the device during testing, preventing test results from being affected by insecure bulb installation or device shaking. Meanwhile, the sliding engagement method between the slide plate and the guide rail and locking plate is simple and easy to understand, reducing the difficulty and labor intensity for operators and improving the convenience and reliability of the testing work. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the connection structure between the test platform, cover plate, and slide plate of this utility model;

[0018] Figure 2 This is a schematic diagram of the connection structure of the base, power interface, and docking interface of this utility model;

[0019] Figure 3 This is a schematic diagram of the connection structure of the bulb body, baffle and fixing plate of this utility model;

[0020] Figure 4 This is a schematic diagram of the connection structure of the baffle, fixing plate, data receiving plate, snap-fit ​​plate and snap-fit ​​groove of this utility model.

[0021] In the diagram: 100, Test stand; 101, Cover plate; 102, Guide rail; 103, Base; 104, Power interface; 105, Positioning plate; 106, Baffle; 107, Fixing plate; 108, Data receiving board; 109, Snap-on plate; 110, Snap-on slot;

[0022] 200. Slide plate; 201. Side plate; 202. Bulb body; 203. Connecting interface. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figures 1 to 4 This utility model provides a technical solution: a bulb aging test device based on infrared thermal imaging, including a test platform 100 and a slide plate 200. The slide plate 200 slides on the surface of a guide rail 102, contacts the surface of a snap-fit ​​plate 109, and is slidably snapped onto the surface of a snap-fit ​​groove 110. The test platform 100 is provided with a guide rail 102, and a base 103 is fixedly installed on the bottom surface of the guide rail 102. A power connection port 104 is opened on the surface of the base 103. The base 103 and the power connection port 104 are evenly distributed on the bottom surface of the guide rail 102, and the interface 203 is evenly distributed on the inner side of the slide plate 200. At the bottom, and vertically corresponding to the base 103 and the power inlet 104, positioning plates 105 are fixedly installed on both sides of the surface of the guide rail 102, and side plates 201 are fixedly installed on both sides of the surface of the slide plate 200. The side plates 201 and the positioning plates 105 are parallel and corresponding. The slide plate 200 slides and adjusts on the surface of the guide rail 102 through the side plates 201 and the positioning plates 105. A docking interface 203 is opened at the bottom of the upper part of the slide plate 200. The bulb body 202 is movably snapped onto the surface of the docking interface 203. The base 103 is connected to the docking interface 203 through the power inlet 104 and is electrically connected to the bulb body 202.

[0025] A cover plate 101 is fixedly installed on the top of the test bench 100. A data receiving board 108 is fixedly installed on the bottom inner side of the cover plate 101. Baffles 106 are fixedly installed on both sides of the surface of the data receiving board 108. Fixing plates 107 are fixedly installed on the sides of the baffles 106. The bottom of the data receiving board 108 is perpendicular to the surface of the bulb body 202. Baffles 106 and fixing plates 107 are fixedly installed around the surface of the data receiving board 108.

[0026] A snap-fit ​​plate 109 is fixedly installed on one side of the surface of the test bench 100, and a snap-fit ​​groove 110 is opened at the center of the surface of the snap-fit ​​plate 109.

[0027] Working principle: During bulb installation, the operator snaps the bulb body 202 onto the interface 203 at the bottom of the slide plate 200. Since the side plate 201 and the positioning plate 105 are parallel and corresponding, the slide plate 200 can slide smoothly along the guide rail 102 on the surface of the test bench 100. When the slide plate 200 slides to the snap-fit ​​plate 109 on one side of the test bench 100, the slide plate 200 contacts the surface of the snap-fit ​​plate 109 and slides into the snap-fit ​​groove 110, completing the positioning. During this process, the interfaces 203 evenly distributed on the inner bottom of the slide plate 200 will vertically correspond to the bases 103 and power connectors 104 evenly distributed on the bottom surface of the guide rail 102, achieving automatic connection between the bulb and the power supply system, eliminating the need for manual wiring and significantly improving installation efficiency.

[0028] During the power-on testing phase, the base 103 provides stable power to the bulb body 202 through the connection between the power interface 104 and the interface 203, putting the bulb into operation and simulating the aging process under actual use scenarios. Multiple evenly distributed bases 103, power interfaces 104, and interfaces 203 support simultaneous power-on testing of multiple bulbs, further accelerating the testing process.

[0029] Simultaneously, infrared thermal imaging monitoring is initiated. A data receiving board 108, fixedly mounted on the bottom inner side of a cover plate 101 above the test bench 100, is perpendicularly aligned with the surface of the bulb body 202. The data receiving board 108 is equipped with an infrared thermal imaging device, capable of capturing the infrared radiation emitted from the bulb surface in real time and converting it into thermal image data. During the bulb's aging process, as internal components wear out, the temperature distribution and values ​​on the bulb surface change; these changes are precisely captured by the infrared thermal imaging device.

[0030] During the data acquisition and analysis phase, the data receiving board 108 transmits the acquired thermal image data, along with other electrical parameter data that may be acquired simultaneously, to the subsequent data processing system. Technicians use specialized data analysis software to analyze the temperature data at different stages of bulb aging, such as studying temperature change trends, locating hotspot areas, and assessing temperature uniformity. This data visually reflects the aging state of the bulb, helping technicians gain a deeper understanding of the bulb's aging patterns and providing a scientific basis for optimizing bulb design and manufacturing processes.

[0031] Furthermore, the base 103 at the bottom of the guide rail 102, the positioning plates 105 on both sides of the guide rail 102, and the side plates 201 on both sides of the slide plate 200 together constitute a stable structural system. The positioning plates 105 and the side plates 201 restrict the movement direction of the slide plate 200, ensuring its smooth sliding on the guide rail 102; the base 103 provides support and electrical connection for the slide plate 200, while the locking plate 109 and the locking groove 110 achieve precise positioning after the slide plate 200 is in place. This structural design ensures that the bulb is fixed in position during testing, avoiding unstable electrical connections or affecting the accuracy of infrared thermal imaging data due to shaking, thus comprehensively ensuring the reliability and efficiency of the testing work.

[0032] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A bulb aging test device based on infrared thermal imaging, comprising a test platform (100) and a slide plate (200), characterized in that: The test bench (100) is provided with a guide rail (102) on its surface. A base (103) is fixedly installed on the bottom surface of the guide rail (102). An electrical connection port (104) is opened on the surface of the base (103). Positioning plates (105) are fixedly installed on both sides of the surface of the guide rail (102). Side plates (201) are fixedly installed on both sides of the surface of the slide plate (200). A docking interface (203) is opened at the bottom of the top of the slide plate (200). A bulb body (202) is movably attached to the surface of the docking interface (203).

2. The bulb aging test device based on infrared thermal imaging according to claim 1, characterized in that: A cover plate (101) is fixedly installed above the test bench (100). A data receiving board (108) is fixedly installed on the bottom inner side of the cover plate (101). Baffles (106) are fixedly installed on both sides of the surface of the data receiving board (108). A fixing plate (107) is fixedly installed on the side of the baffle (106).

3. The bulb aging test device based on infrared thermal imaging according to claim 1, characterized in that: A snap-fit ​​plate (109) is fixedly installed on one side of the surface of the test bench (100), and a snap-fit ​​groove (110) is provided at the center of the surface of the snap-fit ​​plate (109).

4. The bulb aging test device based on infrared thermal imaging according to claim 1, characterized in that: The side plate (201) and the positioning plate (105) are parallel and correspond to each other. The slide plate (200) slides and adjusts on the surface of the guide rail (102) through the side plate (201) and the positioning plate (105).

5. The bulb aging test device based on infrared thermal imaging according to claim 4, characterized in that: The slide plate (200) slides on the surface of the guide rail (102), contacts the surface of the snap plate (109), and is slidably snapped onto the surface of the snap groove (110).

6. The bulb aging test device based on infrared thermal imaging according to claim 1, characterized in that: The base (103) and the power interface (104) are evenly distributed on the bottom surface of the guide rail (102), and the interface (203) is evenly distributed on the bottom inner side of the slide plate (200) and is perpendicular to the base (103) and the power interface (104).

7. The bulb aging test device based on infrared thermal imaging according to claim 6, characterized in that: The base (103) is connected to the bulb body (202) via the corresponding connection port (104) and the docking port (203).

8. The bulb aging test device based on infrared thermal imaging according to claim 2, characterized in that: The bottom of the data receiving board (108) is perpendicular to the surface of the bulb body (202), and the baffle (106) and the fixing plate (107) are fixedly installed around the surface of the data receiving board (108).

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