Heat dissipation device

Abstract

The utility model discloses a heat dissipation device which comprises a heat dissipation fin unit, a heat dissipation substrate and a plurality of heat pipe sets. The heat dissipation fin unit comprises an upper heat dissipation fin set and a lower heat dissipation fin set which are arranged in a laminated mode. The heat dissipation substrate is arranged on the lower heat dissipation fin group and covers at least part of the lower heat dissipation fin group, and the upper heat dissipation fin group is arranged on the heat dissipation substrate; the heat pipe sets are arranged in the long edge direction of the heat dissipation fin unit, each heat pipe set is provided with a heat dissipation part and a heat absorption part, the heat absorption part is used for being attached to a heat source, the heat dissipation part is clamped between the heat dissipation substrate and the upper heat dissipation fin set, and at least part of the heat dissipation part is located on the heat dissipation substrate; wherein each heat dissipation part extends into the heat dissipation fin unit from one side of the long edge of the heat dissipation fin unit and extends towards one side of the two short edges of the heat dissipation fin unit, and at least parts of every two adjacent heat dissipation parts 131 are arranged on the heat dissipation substrate in a staggered mode so that heat can be evenly gathered on the heat dissipation fin unit.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a passive heat dissipation device for servers. Background Technology

[0002] The continuous development of global technology, particularly AI and high-performance computing, is changing the world and shaping its future. However, the enormous computing demands brought about by these innovative technologies also present a significant challenge: heat dissipation. With the rapid growth of data volume and computing needs, the computational power requirements of servers are constantly increasing. The continuous evolution of high-performance chips and servers has led to increased thermal power consumption, placing higher demands on effective heat dissipation to ensure hardware operation and longevity.

[0003] Currently, artificial intelligence is mostly used for data collection, processing, and computation. The processing of large amounts of data places higher demands on chip performance. While performance improves, energy consumption and heat generation issues gradually emerge. This will lead to a greater demand for efficient heat dissipation solutions to ensure servers can operate stably under prolonged high loads.

[0004] With increasingly limited space for heat dissipation in modern server devices and a dramatic increase in CPU heat flux density, air-cooled products have become the mainstream design approach for electronic heat dissipation due to their simple manufacturing structure, high mass production capability, and low cost. Therefore, maximizing heat dissipation capacity under limited space and constrained system impedance has become a primary technical challenge. Utility Model Content

[0005] The present invention provides a heat dissipation device to reduce thermal resistance and improve heat dissipation effect.

[0006] An embodiment of this invention discloses a heat dissipation device, comprising:

[0007] The heat dissipation fin unit includes an upper heat dissipation fin group and a lower heat dissipation fin group arranged in layers;

[0008] A heat dissipation substrate is disposed on the lower heat dissipation fin group and covers at least a portion of the lower heat dissipation fin group, and the upper heat dissipation fin group is disposed on the heat dissipation substrate;

[0009] Multiple heat pipe groups are arranged along the long side of the heat dissipation fin unit. Each heat pipe group has a heat dissipation part and a heat absorption part. The heat absorption part is used to attach a heat source. The heat dissipation part is sandwiched between the heat dissipation substrate and the upper heat dissipation fin group. At least a portion of the heat dissipation part is located on the heat dissipation substrate.

[0010] Each heat dissipation section extends into the heat dissipation fin unit from one side of the long side and extends to one side of the two short sides of the heat dissipation fin unit. At least a portion of two adjacent heat dissipation sections are staggered on the heat dissipation substrate so that heat is evenly collected in the heat dissipation fin unit.

[0011] In the aforementioned heat dissipation device, a plurality of heat pipe groups are located on the same side or different sides of the long side of the heat dissipation fin unit.

[0012] In the aforementioned heat dissipation device, each heat pipe assembly further includes a heat-conducting part, the two ends of which are respectively connected to the heat dissipation part and the heat absorption part, and the heat received by the heat absorption part is conducted to the heat dissipation part through the heat-conducting part.

[0013] In the aforementioned heat dissipation device, each heat pipe assembly includes at least one heat pipe, each heat pipe having a heat absorption section, a heat conduction section, and a heat dissipation section. At least one heat absorption section is attached to each other to form the heat absorption portion. At least one heat dissipation section extends from one side of the long side of the heat dissipation fin unit into the heat dissipation fin unit and extends to one side of the two short sides of the heat dissipation fin unit to form the heat dissipation portion. The two ends of the heat conduction section are respectively connected to the heat absorption section and the heat dissipation section to form the heat conduction portion.

[0014] In the aforementioned heat dissipation device, each heat dissipation segment includes a curved structure and a straight structure. The two ends of the curved structure are respectively connected to the heat-conducting segment and the straight structure, and the curved structure is disposed on the heat dissipation substrate. The straight structure extends from the long side of the heat dissipation fin unit to the short side of the heat dissipation fin unit.

[0015] In the aforementioned heat dissipation device, the opposing linear structures are staggered on the heat dissipation substrate, and the opposing linear structures are disposed on the lower heat dissipation fin assembly.

[0016] The aforementioned heat dissipation device further includes: multiple heat dissipation bases and multiple end caps, wherein the heat dissipation bases are correspondingly mounted on the heat absorption part, and the end caps are correspondingly mounted on the heat dissipation bases.

[0017] The aforementioned heat dissipation device further includes multiple gripping units, each gripping unit comprising:

[0018] The first fixing member is installed on the heat dissipation base;

[0019] The second fixing member is installed on the upper heat dissipation fin assembly;

[0020] The handle has its two ends connected to the first fixing member and the second fixing member, respectively.

[0021] In the aforementioned heat dissipation device, the upper heat dissipation fin group includes at least one heat dissipation subgroup, a portion of which is disposed on the heat dissipation substrate and another portion of which is disposed on the lower heat dissipation fin group. Each heat dissipation subgroup is composed of multiple fins horizontally connected to each other.

[0022] In the aforementioned heat dissipation device, the lower heat dissipation fin group includes at least one heat dissipation subgroup, the heat dissipation substrate is disposed on a portion of the heat dissipation subgroup, and each heat dissipation subgroup is composed of multiple fins horizontally connected to each other.

[0023] In the aforementioned heat dissipation device, the fins are inclined fins.

[0024] In the aforementioned heat dissipation device, each of the heat dissipation subgroups has an inclined surface, and the inclination of the inclined surfaces of different heat dissipation subgroups may be the same or different.

[0025] According to the heat dissipation device of the above embodiment, the heat pipe direct contact technology is used to mill the heat pipe flat and make it directly contact the heat source core, thereby reducing the thermal resistance. The overall performance of the heat dissipation module is improved by increasing the contact area between the heat pipe and the heat dissipation fins. The contact area generated by different fin gaps can improve the heat transfer efficiency of the heat pipe, thereby improving the heat energy distribution.

[0026] The above description of the present utility model and the following description of the embodiments are used to demonstrate and explain the principle of the present utility model, and to provide a further explanation of the scope of the patent application of the present utility model. Attached Figure Description

[0027] Figure 1 This is a perspective view of the heat dissipation device according to an embodiment of the present invention.

[0028] Figure 2 This is a perspective view of the heat dissipation device according to another embodiment of the present invention.

[0029] Figure 3 for Figure 1 A partial sectional view.

[0030] Figure 4 for Figure 1 A partially enlarged schematic diagram of the heat dissipation fin unit within the dashed frame.

[0031] In the attached figures, the following labels are used:

[0032] Heat dissipation device: 1;

[0033] Heat dissipation fin units: 11;

[0034] Long side direction: X;

[0035] Long side: L;

[0036] Short side: S;

[0037] Upper heat dissipation fin assembly: 111;

[0038] Heat sink subgroup: 1111;

[0039] Fins: Q1;

[0040] Lower heat dissipation fin assembly: 112;

[0041] Heat sink subgroup: 1121;

[0042] Fins: Q2;

[0043] Heat dissipation substrate: 12;

[0044] Heat pipe assembly: 13;

[0045] Heat dissipation section: 131;

[0046] Heat absorption section: 132;

[0047] Thermal conductivity: 133;

[0048] Heat pipe: H;

[0049] Heat dissipation section: H1;

[0050] Bending structure: H11;

[0051] Linear structure: H12;

[0052] Heat absorption section: H2;

[0053] Thermal conduction section: H3;

[0054] Cooling pad: 14;

[0055] End cap: 15;

[0056] Grip unit: 16;

[0057] First fastener: 161;

[0058] Second fastener: 162;

[0059] Handle component: 163;

[0060] Installation components: 17;

[0061] First firmware lock: G1;

[0062] Second firmware: G2. Detailed Implementation

[0063] Please see Figures 1 to 4 . Figure 1This is a perspective view of the heat dissipation device according to an embodiment of the present invention. Figure 1 This is a perspective view of the heat dissipation device according to another embodiment of the present invention. Figure 3 for Figure 1 A partial sectional view. Figure 4 for Figure 1 A partially enlarged schematic diagram of the heat dissipation fin unit within the dashed box. (See attached image.) Figures 1 to 4 As shown, a heat dissipation device 1 in this embodiment includes: a heat dissipation fin unit 11, a heat dissipation substrate 12, and a plurality of heat pipe assemblies 13. The heat dissipation fin unit 11 includes an upper heat dissipation fin assembly 111 and a lower heat dissipation fin assembly 112 stacked together. The heat dissipation substrate 12 is disposed on the lower heat dissipation fin assembly 112 and covers at least a portion of the lower heat dissipation fin assembly 112. The upper heat dissipation fin assembly 111 is disposed on the heat dissipation substrate 12. The plurality of heat pipe assemblies 13 are arranged along the long side direction X of the heat dissipation fin unit 11, and each heat pipe assembly 13 has a heat dissipation part 131 and a heat absorption part 13. 2. The heat-absorbing part 131 is used to adhere to a heat source, and the heat-dissipating part 132 is sandwiched between the heat dissipation substrate 12 and the upper heat dissipation fin assembly 111. At least a portion of the heat dissipation part 131 is located on the heat dissipation substrate 12. Each heat dissipation part 131 extends into the heat dissipation fin unit 111 from one side of the long side L and extends to one side of the two short sides S of the heat dissipation fin unit 111. At least a portion of two adjacent heat dissipation parts 131 are staggered on the heat dissipation substrate 12 so that heat is evenly collected in the heat dissipation fin unit 11. Based on this, the present invention increases the heat dissipation module conversion power and improves the heat dissipation capacity by uniformly arranging heat pipes to the heat dissipation fins and increasing the heat dissipation area. At the same time, the passive heat dissipation device improves the conductivity by using the direct-contact design and arrangement of heat pipes, effectively transferring high heat energy and improving the module's temperature uniformity and heat dissipation performance, achieving a low thermal resistance effect in this limited space.

[0064] In this embodiment, the bottom surface P1 of the heat-absorbing part 132 is milled flat to directly contact the core of the heat source, thereby reducing thermal resistance.

[0065] It should be noted that in this embodiment, all of the heat pipe groups 13 are aligned with the long side L on the same side of the heat dissipation fin unit 11. In another embodiment of this utility model, some of the heat pipe groups 13 are aligned with the long side on one side of the heat dissipation fin unit 11, and the other part of the heat pipe groups 13 are aligned with the long side on the other side of the heat dissipation fin unit 11.

[0066] Furthermore, each heat pipe assembly 13 also includes a heat-conducting part 133, the two ends of which are connected to the heat dissipation part 131 and the heat absorption part 132, respectively, and the heat received by the heat absorption part 132 is conducted to the heat dissipation part 131 through the heat-conducting part 133.

[0067] Each heat pipe assembly 13 includes at least one heat pipe H. Each heat pipe H has a heat dissipation section H1, a heat absorption section H2, and a heat conduction section H3. At least one heat absorption section H2 is attached to each other to form the heat absorption part 132. At least one heat dissipation section H1 extends into the heat dissipation fin unit 11 from one side of the long side L and extends to one side of the two short sides S of the heat dissipation fin unit to form the heat dissipation part 131. The two ends of the heat conduction section H3 are respectively connected to the heat absorption section H2 and the heat dissipation section H1 to form the heat conduction part 133. Specifically, after the heat dissipation section H1 of each heat pipe assembly 13 extends into the heat dissipation fin unit 11 from one side of the long side L, part of the heat dissipation section H1 extends to one side of a short side S, and another part of the heat dissipation section H1 extends to the other short side S.

[0068] Each heat dissipation segment H1 includes a curved structure H11 and a straight structure H12. The two ends of the curved structure H11 are connected to the heat-conducting segment H3 and the straight structure H12, respectively, and the curved structure H11 is disposed on the heat dissipation substrate 12. The straight structure H12 extends from the long side X of the heat dissipation fin unit 11 to the short side S of the heat dissipation fin unit 11. The straight structures H12 extending towards each other are staggered on the heat dissipation substrate 12, and the straight structures H12 extending away from each other are disposed on the lower heat dissipation fin group 112.

[0069] Furthermore, the heat dissipation device 1 further includes: multiple heat dissipation bases 14, multiple end caps 15, and multiple first locking fasteners G1. The heat dissipation bases 14 are correspondingly mounted on the heat-absorbing part 132, and the end caps 15 are correspondingly mounted on the heat dissipation bases 14. The multiple first locking fasteners G1 are used to secure the heat-absorbing part 132 to the heat source. In this embodiment, it is preferred that the end caps 15 be made of plastic, but this invention is not limited thereto.

[0070] Furthermore, the heat dissipation device 1 also includes a plurality of gripping units 16, each gripping unit 16 including a first fixing member 161, a second fixing member 162, and a handle 163. The first fixing member 161 is mounted on the heat dissipation base 14; the second fixing member 162 is mounted on the upper heat dissipation fin assembly 111; and the handle 163 has its two ends connected to the first fixing member 161 and the second fixing member 162, respectively. The gripping units 16 facilitate the user's movement of the heat dissipation device 1.

[0071] In this embodiment, the heat dissipation device 1 further includes two mounting members 17, which are respectively disposed on one side of the short side S of the heat dissipation fin unit 11. The heat dissipation fin unit 11 is mounted on the mounting members 17, and the heat dissipation device is fixed in the electronic device by means of a second fastener G2 passing through the mounting members 17.

[0072] Furthermore, the upper heat dissipation fin assembly 111 includes at least one heat dissipation sub-assembly 1111, a portion of which is disposed on the heat dissipation substrate 12, and another portion of which is disposed on the lower heat dissipation fin assembly 112. Each heat dissipation sub-assembly 1111 is formed by multiple fins Q1 horizontally interlocked with each other. The lower heat dissipation fin assembly 112 includes at least one heat dissipation sub-assembly 1121, and the heat dissipation substrate 12 is disposed on a portion of the heat dissipation sub-assembly 1121. Each heat dissipation sub-assembly 1121 is formed by multiple fins Q2 horizontally interlocked with each other. In this embodiment, the upper heat dissipation fin assembly 111 includes multiple heat dissipation sub-assemblies 1111, and the lower heat dissipation fin assembly 112 includes one heat dissipation sub-assembly 1121. However, this utility model does not limit the number of heat dissipation sub-assemblies 1111 and 1121.

[0073] Specifically, each heat dissipation sub-group 1111, 1121 has an inclined surface P. The inclination angles of the inclined surfaces P of different heat dissipation sub-groups may be the same or different. For example, in this embodiment, a preferred implementation is an arrangement where the heat dissipation sub-group 1111 located in the middle of the upper heat dissipation fin group 1111 is taken as the center, and the inclination angles of the inclined surfaces P of multiple heat dissipation sub-groups 1111 on one side are different, while the inclination angles of the inclined surfaces P of the heat dissipation sub-groups 1111 on both sides are the same. However, this invention does not limit the arrangement of the heat dissipation sub-groups 1111. This invention increases the air passage area through the inclined design of the heat dissipation fins, effectively improving the heat dissipation effect.

[0074] In one embodiment of the present invention, the lower heat dissipation fin assembly 112 may further include a plurality of heat dissipation sub-assemblies 1121, wherein the inclination of the inclined surface P of the different heat dissipation sub-assemblies 1121 is the same or different.

[0075] In one embodiment of this utility model, the fins Q1 and Q2 are inclined fins.

[0076] It is worth noting that in this embodiment, the lengths of the heat dissipation subgroups 1111 and 1121 may be the same or different.

[0077] According to the heat dissipation device of the above embodiment, the heat pipe can directly contact the heat source of the chip, which can effectively reduce the thermal resistance by about 20%, and help improve the performance of the heat dissipation module. At the same time, the heat pipe is evenly arranged to the heat dissipation fins, thereby increasing the heat dissipation area and increasing the conversion power of the heat dissipation module, thus improving the heat dissipation capacity. Furthermore, the inclined design of the heat dissipation fins increases the area for air passage, effectively reducing the wind resistance by about 3%.

[0078] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the appended claims.

Claims

1. A heat dissipation device, characterized in that, Include: The heat dissipation fin unit includes an upper heat dissipation fin group and a lower heat dissipation fin group arranged in layers; A heat dissipation substrate is disposed on the lower heat dissipation fin group and covers at least a portion of the lower heat dissipation fin group, and the upper heat dissipation fin group is disposed on the heat dissipation substrate; Multiple heat pipe groups are arranged along the long side of the heat dissipation fin unit. Each heat pipe group has a heat dissipation part and a heat absorption part. The heat absorption part is used to attach a heat source. The heat dissipation part is sandwiched between the heat dissipation substrate and the upper heat dissipation fin group. At least a portion of the heat dissipation part is located on the heat dissipation substrate. Each heat dissipation section extends into the heat dissipation fin unit from one side of the long side and extends to one side of the two short sides of the heat dissipation fin unit. At least a portion of two adjacent heat dissipation sections are staggered on the heat dissipation substrate so that heat is evenly collected in the heat dissipation fin unit.

2. The heat dissipation device as described in claim 1, characterized in that, Multiple heat pipe pairs are located on the same or different sides of the long side of the heat dissipation fin unit.

3. The heat dissipation device as described in claim 1, characterized in that, Each heat pipe assembly further includes a heat-conducting section, the two ends of which are respectively connected to the heat dissipation section and the heat absorption section, and the heat received by the heat absorption section is conducted to the heat dissipation section through the heat-conducting section.

4. The heat dissipation device as described in claim 3, characterized in that, Each heat pipe assembly includes at least one heat pipe, each heat pipe having a heat absorption section, a heat conduction section, and a heat dissipation section. At least one heat absorption section is attached to each other to form the heat absorption portion. At least one heat dissipation section extends from one side of the long side of the heat dissipation fin unit into the heat dissipation fin unit and extends to one side of the two short sides of the heat dissipation fin unit to form the heat dissipation portion. The two ends of the heat conduction section are respectively connected to the heat absorption section and the heat dissipation section to form the heat conduction portion.

5. The heat dissipation device as described in claim 4, characterized in that, Each heat dissipation segment includes a curved structure and a straight structure. The two ends of the curved structure are respectively connected to the heat conduction segment and the straight structure, and the curved structure is disposed on the heat dissipation substrate. The straight structure extends from the long side of the heat dissipation fin unit to the short side of the heat dissipation fin unit.

6. The heat dissipation device as described in claim 5, characterized in that, The opposing linear structures are staggered on the heat dissipation substrate, and the opposing linear structures are disposed on the lower heat dissipation fin assembly.

7. The heat dissipation device as described in claim 1, characterized in that, Also includes: Multiple heat dissipation bases and multiple end caps are provided, wherein the heat dissipation bases are correspondingly mounted on the heat absorption part, and the end caps are correspondingly mounted on the heat dissipation bases.

8. The heat dissipation device as described in claim 7, characterized in that, It also includes multiple gripping units, each of which includes: The first fixing member is installed on the heat dissipation base; The second fixing member is installed on the upper heat dissipation fin assembly; The handle has its two ends connected to the first fixing member and the second fixing member, respectively.

9. The heat dissipation device as described in claim 1, characterized in that, The upper heat dissipation fin assembly includes at least one heat dissipation sub-assembly. A portion of the heat dissipation sub-assembly is disposed on the heat dissipation substrate, and another portion of the heat dissipation sub-assembly is disposed on the lower heat dissipation fin assembly. Each heat dissipation sub-assembly is composed of multiple fins horizontally connected to each other.

10. The heat dissipation device as claimed in claim 1, characterized in that, The lower heat dissipation fin assembly includes at least one heat dissipation sub-assembly, and the heat dissipation substrate is disposed on a portion of the heat dissipation sub-assembly. Each heat dissipation sub-assembly is composed of multiple fins horizontally connected to each other.

11. The heat dissipation device as described in claim 9 or 10, characterized in that, The fins are inclined fins.

12. The heat dissipation device as described in claim 9 or 10, characterized in that, Each of the heat dissipation sub-assemblies has an inclined surface, and the inclination of the inclined surfaces of different heat dissipation sub-assemblies may be the same or different.

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