Microphone and electronic equipment

Abstract

The utility model provides a microphone and an electronic device, the microphone comprises a substrate and a chip body, the chip body is located above the substrate, and a first electrode layer on the chip body is connected with the substrate; a back polar plate assembly is arranged above the substrate, the back polar plate assembly comprises a supporting frame and is connected with a chip body through a connecting piece, and the chip body is located between the supporting frame and the substrate; a second electrode layer is arranged on one side, facing the chip body, of the supporting frame, a vibrating diaphragm is arranged at the top of the chip body, and variable capacitance is formed between the vibrating diaphragm and the second electrode layer; the supporting frame is provided with a plurality of sound hole sets, each sound hole set comprises a sound hole groove, and a plurality of strip-shaped sound holes are formed in the sound hole grooves. According to the microphone, the sound wave propagation path is changed through the multiple sound hole groups, standing waves are reduced, and high-frequency response is improved; the connecting piece realizes stable connection between the support frame and the chip body, and reduces vibration conduction at the same time.

Description

Technical Field

[0001] This utility model belongs to the field of microphone technology, and more specifically, relates to a microphone and electronic device. Background Technology

[0002] As a core acoustic component, the microphone can effectively collect acoustic signals and is widely used in the field of acoustic signal acquisition. However, the microphone's sound holes are mostly arranged in a single direction, and the sound waves are easily reflected on the back plate surface to form standing waves, resulting in poor high-frequency response. At the same time, the diaphragm support structure adopts a rigid fixing method, and the substrate vibration is easily transmitted to the diaphragm, which increases mechanical noise and seriously affects the microphone's sound acquisition quality and performance. Utility Model Content

[0003] To address the aforementioned technical problems, this utility model provides a microphone and electronic device to solve the technical problems in the prior art where the single arrangement of sound holes in traditional microphones leads to poor high-frequency response and mechanical noise caused by rigid fixed diaphragms, thus affecting the quality of sound acquisition.

[0004] The purpose and effect of this utility model of a microphone and electronic device are achieved by the following specific technical means:

[0005] A microphone includes a substrate and a chip body, the chip body being located above the substrate, and a first electrode layer being disposed on the side of the chip body facing the substrate, the first electrode layer being connected to the substrate.

[0006] A back electrode assembly is disposed on the substrate. The back electrode assembly includes a support frame. The support frame is connected to the chip body through a connector. The chip body is located between the support frame and the substrate.

[0007] The support frame has a second electrode layer on the side facing the chip body, and a diaphragm is provided on the top of the chip body. A variable capacitor is formed between the diaphragm and the second electrode layer.

[0008] The support frame is provided with multiple sets of sound hole groups, each set of sound hole groups including a sound hole groove opened on the support frame, and multiple sets of strip-shaped sound holes opened in the sound hole groove.

[0009] According to a preferred embodiment, a mounting boss is provided at the center of the substrate, the first electrode layer is mounted on the mounting boss, and two sets of symmetrical conductive pillars are provided on the first electrode layer. The top of the conductive pillars passes through the chip body, and the bottom of the conductive pillars is connected to the copper foil circuit on the substrate. The first electrode layer is connected to the substrate through the conductive pillars.

[0010] According to a preferred embodiment, the connector includes an elastic arm, the support frame is provided with four sets of mounting slots, the mounting slots are located at the diagonal of the support frame, the chip body is provided with mounting slots corresponding to the mounting slots, one end of the elastic arm is engaged in the mounting slot, the other end is engaged in the mounting slot, and a gap is formed between the support frame and the chip body.

[0011] The elastic arm is U-shaped with its opening facing the center of the support frame, and the contact surface between the elastic arm and the chip body is chamfered.

[0012] According to a preferred embodiment, the support frame is made of low-stress silicon nitride.

[0013] According to a preferred embodiment, anchor points are provided at all four corners of the diaphragm, and the diaphragm is connected to the chip body through multiple sets of the anchor points;

[0014] The chip body has a groove, the diaphragm is in contact with the chip body, and a cavity is formed through the groove.

[0015] According to a preferred embodiment, the acoustic hole groove of one group of acoustic holes intersects with the acoustic hole groove of an adjacent pair of acoustic holes, wherein the strip-shaped acoustic holes at the center of the two groups of acoustic hole grooves intersect.

[0016] According to a preferred embodiment, the surface of the second electrode layer is provided with an anti-stick coating, which is a diamond-like carbon film.

[0017] According to a preferred embodiment, a packaging shell is disposed above the substrate, and a plurality of pad pins are disposed on the packaging shell. The pad pins are connected to the substrate, and a packaging cavity is formed between the packaging shell and the substrate. The back electrode assembly and the chip body are both located within the packaging cavity.

[0018] An electronic device including the microphone described above.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. Multiple sets of acoustic holes are arranged on the support frame, with some sets of holes intersecting and the central strip-shaped acoustic holes also intersecting, forming a staggered layout. This unique arrangement of acoustic holes alters the propagation path of sound waves on the back electrode surface, causing the incident sound waves to vibrate asymmetrically and effectively suppressing the generation of standing waves. Compared to traditional acoustic holes arranged in a single direction, this design can significantly improve the microphone's high-frequency response, reducing distortion in the frequency band above 20kHz by 30%, thereby improving the accuracy and clarity of sound acquisition.

[0021] 2. In the diaphragm support structure, a U-shaped elastic arm replaces the traditional rigid fixing method. One end of the elastic arm is engaged in the mounting groove of the support frame, and the other end is engaged in the mounting groove of the chip body, forming a gap between the support frame and the chip body. This elastic connection structure can reduce the transmission of substrate vibration to the diaphragm; at the same time, the U-shaped elastic arm also allows the diaphragm to generate freer bending vibration in the high-frequency range, further optimizing the microphone's performance in high-frequency sound signal acquisition and effectively solving the problem of poor sound acquisition quality in existing technologies.

[0022] 3. Regarding electrode connection and signal transmission, the first electrode layer on the side of the chip body facing the substrate is stably connected to the substrate via mounting bosses, and electrically connected to the copper foil circuitry of the substrate through two sets of symmetrical conductive pillars, ensuring the stability and reliability of signal transmission. The support frame is made of low-stress silicon nitride material, combined with the second electrode layer on its inner side and the diamond-like carbon film anti-stick coating on the surface, which not only ensures structural strength but also prevents the diaphragm from sticking to the second electrode layer, extending the microphone's lifespan. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the assembled structure of this utility model;

[0024] Figure 2 This is a schematic diagram of the disassembled structure of this utility model;

[0025] Figure 3 This is a structural diagram of the supporting frame;

[0026] Figure 4 yes Figure 3 A magnified view of a portion of region a.

[0027] In the diagram, the correspondence between component names and their corresponding reference numerals is as follows:

[0028] 11. Substrate; 12. Mounting boss; 21. Chip body; 22. First electrode layer; 23. Diaphragm; 24. Conductive pillar; 25. Mounting slot; 26. Groove; 31. Support frame; 32. Second electrode layer; 33. Acoustic hole groove; 34. Strip acoustic hole; 35. Mounting slot; 41. Flexible arm; 42. Package housing; 43. Bonding pad pin. Detailed Implementation

[0029] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the technical solution of this utility model, but should not be used to limit the scope of protection of this utility model.

[0030] Example:

[0031] like Figures 1 to 4As shown, this utility model provides a microphone and electronic device, including a substrate 11 and a chip body 21. The substrate 11, as a basic supporting component, provides a mounting platform for other components of the microphone. Its material possesses certain mechanical strength and insulation properties, enabling it to stably support the chip body 21. The chip body 21, located above the substrate 11, is one of the core components of the microphone that converts acoustic signals into electrical signals. A first electrode layer 22 is provided on the side of the chip body 21 facing the substrate 11. The first electrode layer 22 serves as an electrical signal transmission and connection layer. It is connected to the substrate 11 and, through structures such as conductive pillars 24, conducts the electrical signals converted within the chip body 21 to the circuitry on the substrate 11, thereby enabling further signal processing and output.

[0032] A back electrode assembly, including a support frame 31, is disposed above the substrate 11. The support frame 31 primarily supports and fixes other components in the back electrode assembly, maintaining the shape and structural stability of the entire back electrode assembly. The support frame 31 is connected to the chip body 21 via connectors, forming a relatively stable integrated structure between the back electrode assembly and the chip body 21. The chip body 21 is located between the support frame 31 and the substrate 11, ensuring that the components can work collaboratively. The connectors provide mechanical strength for the connection and, to some extent, buffer the impact of external vibrations and other factors on the assembly.

[0033] A second electrode layer 32 is disposed on the side of the support frame 31 facing the chip body 21, forming a variable capacitance between the second electrode layer 32 and the diaphragm 23 on the top of the chip body 21. When external sound waves act on the diaphragm 23, the diaphragm 23 vibrates, thereby changing the distance between it and the second electrode layer 32, and thus causing a change in capacitance. This capacitance change is related to the vibration characteristics of the sound waves. By detecting the change in capacitance, the information of the sound waves can be converted into electrical signals, realizing the microphone's sound-to-electrical conversion function.

[0034] like Figure 3 , Figure 4 As shown, the support frame 31 is provided with multiple sets of sound holes. Each set includes a sound hole groove 33 formed on the support frame 31, within which multiple sets of strip-shaped sound holes 34 are formed. These sound hole sets serve as channels for external sound waves to enter the microphone. The sound waves propagate through the strip-shaped sound holes 34 and the sound hole groove 33 to the diaphragm 23, enabling the diaphragm 23 to sense the vibration of the sound waves. The arrangement of multiple sets of sound holes allows the sound waves to act more evenly on the diaphragm 23, and also allows for adjustment of the sound wave propagation path and intensity to a certain extent, adapting to the sound acquisition needs of different environments and improving the microphone's sound signal acquisition effect.

[0035] like Figure 2As shown, a mounting boss 12 is provided at the center of the substrate 11. The substrate 11 serves as the basic support component for the microphone, providing a mounting surface and electrical connection platform for other components. The mounting boss 12 protrudes from the surface of the substrate 11, and its function is to provide a clear mounting position for the first electrode layer 22, defining the specific placement area of ​​the first electrode layer 22 on the substrate 11, making the installation of the first electrode layer 22 more orderly and systematic, and at the same time enhancing the stability of the first electrode layer 22 after installation to a certain extent, preventing it from moving randomly on the substrate 11.

[0036] The first electrode layer 22 is mounted on the mounting boss 12. The first electrode layer 22 is a key part of the electrical signal transmission between the chip body 21 and the substrate 11. It is responsible for receiving the electrical signals generated by the chip body 21 and transmitting these signals. The mounting boss 12 provides stable support for the first electrode layer 22, enabling the first electrode layer 22 to maintain a proper relative position with the chip body 21 and the substrate 11, ensuring the accurate establishment of the electrical signal transmission path, and laying the foundation for the effective conduction of subsequent electrical signals.

[0037] Two sets of symmetrical conductive pillars 24 are provided on the first electrode layer 22. The conductive pillars 24 are an important structure for realizing the conduction of electrical signals. The two sets of symmetrical arrangement can make the conduction of electrical signals more balanced and stable. They penetrate the first electrode layer 22, forming an electrical channel connecting the chip body 21 and the substrate 11. Through the conductive pillars 24, the electrical signals on the first electrode layer 22 can be transmitted smoothly, avoiding loss or distortion of electrical signals due to poor path during transmission.

[0038] The top of the conductive post 24 is inserted inside the chip body 21, and the bottom is connected to the copper foil circuitry on the substrate 11. The top of the conductive post 24 is connected to the interior of the chip body 21, allowing it to directly receive electrical signals generated by the chip body 21; the bottom is connected to the copper foil circuitry on the substrate 11, which is the circuit structure on the substrate 11 used for electrical signal transmission and processing. This connection method tightly links the chip body 21, the first electrode layer 22, and the substrate 11 together, constructing a complete electrical signal transmission link. The electrical signals generated by the chip body 21 are transmitted from the first electrode layer 22 to the copper foil circuitry on the substrate 11 via the conductive post 24, and then transmitted to subsequent circuits for processing, realizing the complete process of microphone electrical signals from generation to output. The first electrode layer 22 is connected to the substrate 11 via the conductive post 24. This connection allows the first electrode layer 22 to play a crucial role in the entire microphone structure, both receiving electrical signals from the chip body 21 and transmitting them to the substrate 11. The conductive post 24 serves as a connection medium, ensuring a stable electrical connection between the first electrode layer 22 and the substrate 11. This enables reliable transmission of electrical signals from the chip body 21 to the substrate 11, guaranteeing the effective output and subsequent processing of the electrical signals after the microphone's acoustic-to-electrical conversion.

[0039] The connector includes a flexible arm 41, which serves as the connection medium between the support frame 31 and the chip body 21, providing both support and cushioning. The flexible arm 41 is made of a deformable material, allowing it to bend and relieve mechanical stress during external vibration transmission, reducing vibration transmission problems caused by rigid connections and thus minimizing microphone mechanical noise. The support frame 31 has four sets of mounting slots 35, evenly distributed diagonally. These slots provide mounting points for the flexible arm 41, and their shape matches the ends of the flexible arm 41, ensuring a secure connection. The diagonal layout distributes the support force to the four corners of the frame, improving the overall structural balance and preventing component misalignment or damage caused by excessive force at a single point.

[0040] The chip body 21 has a mounting slot 25 corresponding to the mounting groove 35, forming a mating structure with the mounting groove 35. The function of the mounting slot 25 is to fix the other end of the elastic arm 41, connecting the chip body 21 and the elastic arm 41 through a snap-fit ​​method. This corresponding arrangement allows the support frame 31 and the chip body 21 to form a flexible connection system through the elastic arm 41. The gap between the two provides space for the deformation of the elastic arm 41, while avoiding friction or stress accumulation caused by direct contact. The elastic arm 41 is U-shaped, with the opening facing the center of the support frame 31. The U-shaped structure gives the elastic arm 41 bidirectional deformation capability. When subjected to sound waves or external vibrations, it can bend symmetrically along the opening direction, effectively absorbing vibration energy from different directions. Compared with a straight structure, the U-shaped design increases the arm length within a limited space, improves the elastic deformation efficiency, and enhances the buffering effect against high-frequency vibrations.

[0041] The contact surface between the elastic arm 41 and the chip body 21 is chamfered. This chamfering reduces stress concentration at the contact edges, preventing material wear or structural damage caused by sharp angles. During the reciprocating deformation of the elastic arm 41, the chamfered structure ensures more even force distribution on the contact surface, reducing frictional resistance, ensuring long-term stable operation of the connection, and extending the microphone's lifespan.

[0042] The support frame 31 is made of low-stress silicon nitride. Silicon nitride itself has high hardness and strength, which can provide a stable support foundation for the back electrode assembly and ensure that the microphone maintains its structural integrity during use. The low-stress characteristic avoids deformation or cracking during processing or use due to excessive internal stress of the material, reducing the impact on other internal components of the microphone, such as the diaphragm 23 and the second electrode layer 32, and providing a stable physical environment for the normal operation of the microphone.

[0043] Anchor points are provided at all four corners of the diaphragm 23, which are connected to the chip body 21 through multiple sets of anchor points. The anchor points serve to fix the diaphragm 23, stably mounting it on the chip body 21. This allows the diaphragm 23 to vibrate under fixed boundary conditions when subjected to sound waves, ensuring the consistency and predictability of the vibration. Simultaneously, the grooves 26 on the chip body 21 form cavities upon contact with the diaphragm 23. These cavities provide space for the diaphragm 23 to vibrate, allowing it to move freely under the drive of sound waves. This helps improve the diaphragm 23's response sensitivity to sound waves and enhances the microphone's acoustic-to-electrical conversion effect.

[0044] One set of acoustic hole slots 33 intersects with the acoustic hole slots 33 of the adjacent acoustic hole sets, and the strip-shaped acoustic holes 34 at the center of the two sets of acoustic hole slots 33 also intersect. This intersecting layout of the acoustic hole slots 33 and strip-shaped acoustic holes 34 changes the path of sound waves entering the microphone. When sound waves pass through the intersecting acoustic hole slots 33 and strip-shaped acoustic holes 34, their propagation direction changes, causing the sound waves to disperse more evenly within the back electrode assembly and act more uniformly on the diaphragm 23. In this way, the reflection and interference of sound waves inside are reduced, allowing the diaphragm 23 to more accurately sense the vibration information of the sound waves, thereby improving the comprehensiveness and accuracy of the microphone's sound signal acquisition.

[0045] The surface of the second electrode layer 32 is covered with an anti-stick coating, which is a diamond-like carbon film. During microphone operation, the diaphragm 23 vibrates continuously, and the distance between it and the second electrode layer 32 changes accordingly. Without the anti-stick coating, the diaphragm 23 may stick to the second electrode layer 32 during vibration, affecting the normal vibration of the diaphragm 23 and even causing microphone failure. The diamond-like carbon film has a low surface energy, which can effectively reduce the adhesion between the diaphragm 23 and the second electrode layer 32, prevent them from sticking together, ensure the free vibration of the diaphragm 23, and maintain the stable acoustic-electric conversion performance of the microphone.

[0046] A packaging shell 42 is provided on top of the substrate 11. Multiple sets of solder pads 43 on the packaging shell 42 are connected to the substrate 11, forming a packaging cavity between them. The back electrode assembly and the chip body 21 are both placed within this packaging cavity. The packaging shell 42 provides physical protection, isolating the core components inside the microphone from the external environment, preventing dust, moisture, and other impurities from entering and affecting component performance, thus extending the microphone's lifespan. The solder pads 43 serve as a bridge connecting the microphone to external circuitry. Through the solder pads 43, the microphone transmits the converted electrical signals to the external circuitry for further processing, and also receives operating voltage and other signals from the external circuitry, enabling the microphone to function normally.

[0047] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments.

Claims

1. A microphone, comprising a substrate (11) and a chip body (21), characterized in that: The chip body (21) is located above the substrate (11), and a first electrode layer (22) is provided on the side of the chip body (21) facing the substrate (11), and the first electrode layer (22) is connected to the substrate (11). A back electrode assembly is disposed above the substrate (11). The back electrode assembly includes a support frame (31). The support frame (31) is connected to the chip body (21) through a connector. The chip body (21) is located between the support frame (31) and the substrate (11). The support frame (31) has a second electrode layer (32) on the side facing the chip body (21), and a diaphragm (23) is provided on the top of the chip body (21). A variable capacitor is formed between the diaphragm (23) and the second electrode layer (32). The support frame (31) is provided with a plurality of sound hole groups, the sound hole group including a sound hole groove (33) opened on the support frame (31), and a plurality of strip-shaped sound holes (34) are opened in the sound hole groove (33).

2. A microphone according to claim 1, characterized in that: The substrate (11) has a mounting boss (12) at its center. The first electrode layer (22) is mounted on the mounting boss (12). Two sets of symmetrical conductive pillars (24) are provided on the first electrode layer (22). The top of the conductive pillars (24) is inserted into the chip body (21). The bottom of the conductive pillars (24) is connected to the copper foil circuit on the substrate (11). The first electrode layer (22) is connected to the substrate (11) through the conductive pillars (24).

3. A microphone according to claim 2, characterized in that: The connector includes an elastic arm (41), and the support frame (31) has four sets of mounting slots (35). The mounting slots (35) are located at opposite corners of the support frame (31). The chip body (21) has mounting slots (25) corresponding to the mounting slots (35). One end of the elastic arm (41) is engaged in the mounting slot (35), and the other end is engaged in the mounting slot (25). A gap is formed between the support frame (31) and the chip body (21). The elastic arm (41) is U-shaped, with its opening facing the center of the support frame (31), and the contact surface between the elastic arm (41) and the chip body (21) is chamfered.

4. A microphone according to claim 3, characterized in that: The support frame (31) is made of low-stress silicon nitride.

5. A microphone according to claim 1, characterized in that: Anchor points are provided at all four corners of the diaphragm (23), and the diaphragm (23) is connected to the chip body (21) through multiple sets of anchor points; The chip body (21) has a groove (26) and the diaphragm (23) is in contact with the chip body (21), forming a cavity through the groove (26).

6. A microphone according to claim 4, characterized in that: One of the acoustic hole groups has an acoustic hole groove (33) that intersects with the acoustic hole groove (33) of the adjacent acoustic hole group, wherein the strip-shaped acoustic hole (34) at the center of the two acoustic hole grooves (33) intersects.

7. A microphone according to claim 1, characterized in that: The surface of the second electrode layer (32) is provided with an anti-stick coating, which is a diamond-like carbon film.

8. A microphone according to claim 1, characterized in that: A packaging shell (42) is provided above the substrate (11). The packaging shell (42) is provided with multiple sets of pad pins (43). The pad pins (43) are connected to the substrate (11). A packaging cavity is formed between the packaging shell (42) and the substrate (11). The back electrode assembly and the chip body (21) are both located in the packaging cavity.

9. An electronic device, characterized in that: Includes the microphone as described in any one of claims 1-8.

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