Wafer transfer mechanism and automatic alignment transfer system

Abstract

The utility model relates to a wafer transfer mechanism and an automatic alignment transfer system. The wafer transfer mechanism comprises a substrate, an alignment plate and an annular rotary table, the base plate is used for being in sliding connection with a bottom rack in the first direction. The alignment plate is arranged above the base plate and is in relative sliding connection with the base plate along a second direction; the annular rotary table is arranged in the middle of the alignment plate and connected with the alignment plate in a relatively rotating mode. The annular rotary table is provided with an adsorption assembly used for adsorbing a wafer, the adsorption assembly comprises a plurality of suction nozzles, and at least the suction nozzles corresponding to the edge cutting position of the wafer can be independently controlled to be switched on and off. According to the wafer transfer mechanism and the automatic alignment transfer system, flexible adjustment of the positions of the wafers in multiple directions is achieved, the wafer transfer mechanism and the automatic alignment transfer system can flexibly adapt to the wafers with different trimming orientations, the complex alignment requirements of the wafers in the feeding and transferring processes can be met, and the wafer transferring precision is improved.

Description

Technical Field

[0001] This application relates to the field of wafer testing technology, specifically to a wafer transfer mechanism and an automated alignment transfer system. Background Technology

[0002] In the wafer aging test process, loading is a crucial step. To ensure that the wafer can be accurately and stably transferred from the lifting position to the clamping position and loaded into the aging fixture, a specialized wafer transfer device is required.

[0003] Existing wafer transfer devices often struggle to achieve stable and accurate wafer transfer, fail to precisely align wafers, affect subsequent wafer clamping accuracy, and are prone to damaging wafers. Utility Model Content

[0004] To address the problem that existing positioning devices struggle to achieve stable and accurate wafer transfer, affecting subsequent wafer clamping accuracy and potentially causing damage to the wafer.

[0005] This application provides a wafer transfer mechanism, including a substrate, an alignment plate, and a ring turntable;

[0006] The substrate is slidably connected to the bottom frame along a first direction; the alignment plate is disposed above the substrate and is slidably connected to the substrate along a second direction; the annular turntable is disposed in the middle of the alignment plate and is rotatably connected to the alignment plate.

[0007] The annular turntable is equipped with an adsorption assembly for adsorbing wafers. The adsorption assembly includes multiple suction nozzles, wherein at least the suction nozzle corresponding to the wafer cutting edge can be independently controlled to open and close.

[0008] Furthermore, multiple suction nozzles are evenly distributed on the inner wall of the annular turntable, with the suction direction of the nozzles facing downwards towards the annular turntable, for adsorbing the upper surface of the wafer.

[0009] Furthermore, the adsorption assembly includes six nozzles, which are divided into three groups. Each group includes two nozzles that are arranged in a corresponding manner around the annular turntable. The nozzles in the group corresponding to the wafer cutting edge can be independently controlled to open and close.

[0010] Furthermore, the three sets of nozzles are respectively a horizontal axis pair, a 45° oblique axis pair and a 135° oblique axis pair forming a 45° angle with the horizontal line.

[0011] Furthermore, it includes a drive assembly and an arc-shaped toothed plate, the arc-shaped toothed plate being connected to the annular turntable, and the drive assembly being used to drive the arc-shaped toothed plate to rotate the annular turntable.

[0012] Furthermore, a first slider group is provided below the substrate. The first slider group is used to cooperate with a first guide rail on the bottom frame to drive the transfer mechanism to move between the alignment point and the clamping point along the first guide rail.

[0013] Furthermore, two second guide rails are symmetrically arranged above the substrate, and the second guide rails cooperate with a second slider group located below the alignment plate so that the alignment plate can slide along the second guide rails.

[0014] Furthermore, an air blowing mechanism is provided above the annular turntable for blowing air toward the upper surface of the wafer.

[0015] This application also provides an automated wafer alignment and transfer system, including an alignment mechanism and the transfer mechanism, wherein the alignment mechanism is electrically connected to the transfer mechanism;

[0016] The alignment mechanism includes an alignment camera, which is used to connect to the top rack; when the transfer mechanism moves along the bottom rack to the alignment point, the alignment camera is used to acquire the position information of the wafer.

[0017] Furthermore, it includes a re-inspection mechanism, which is electrically connected to the transfer mechanism;

[0018] The re-inspection mechanism includes a re-inspection camera, which is located on one side of the transfer mechanism; the re-inspection camera is used to acquire position information of the wafer after it has been moved to the clamping point and placed in the heat sink.

[0019] Implementing the embodiments of this application has the following beneficial effects:

[0020] This wafer transfer mechanism achieves flexible adjustment of the wafer position in multiple directions through a sliding connection between the substrate and the bottom frame along a first direction, a sliding connection between the alignment plate and the substrate along a second direction, and a relative rotational connection between the annular turntable and the alignment plate. This multi-directional motion adjustment function can meet the complex alignment requirements of wafers during loading and transfer, ensuring that the wafers can accurately reach the target position and greatly improving the accuracy of wafer transfer.

[0021] In the nozzles used to pick up wafers on the annular turntable, at least the nozzle corresponding to the wafer dicing edge can be independently controlled. By flexibly adjusting the on / off state of the corresponding nozzle according to the wafer dicing edge direction in actual applications, precise alignment of the wafer dicing edge can be achieved, flexibly adapting to wafer requirements with different dicing edge orientations, further improving the accuracy of wafer transfer and placement. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0023] Figure 1 This is a schematic diagram of the connection between the transfer mechanism and the bottom frame in an embodiment of this application;

[0024] Figure 2 This is a schematic diagram of the transfer mechanism in the embodiments of this application;

[0025] Figure 3 This is a second-direction sectional view of the transfer mechanism in the embodiments of this application;

[0026] Figure 4 This is a first-direction sectional view of the transfer mechanism in the embodiments of this application;

[0027] Figure 5 This is a schematic diagram of the structure of the annular turntable according to an embodiment of this application;

[0028] Figure 6 This is a schematic diagram of the transfer mechanism at the alignment point in an embodiment of this application;

[0029] Figure 7 This is a schematic diagram of the structure of the re-inspection mechanism in an embodiment of this application;

[0030] Figure 8 This is a schematic diagram of the structure of the automated alignment relay system according to an embodiment of this application.

[0031] In the figure, the corresponding reference numerals are as follows: 1. Transfer mechanism; 11. Base plate; 12. Alignment plate; 13. Circular turntable; 14. Suction nozzle; 15. Drive assembly; 151. Drive motor; 152. Gear; 16. Arc-shaped toothed plate; 17. First slider group; 18. Second guide rail; 19. Second slider group; 3. Alignment mechanism; 31. Alignment camera; 4. Re-inspection mechanism; 41. Re-inspection camera; 5. Bottom frame; 51. First guide rail; 6. Top frame; 7. Heat sink. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0033] In the description of this application, it should be understood that the terms "upper," "lower," "inner," "outer," "top," and "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or regarding the vertical, perpendicular, or gravitational direction of the component itself. These terms are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0034] Unless otherwise defined, the technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for descriptive purposes only and is not intended to limit the scope of this application. Terms such as “part” or “component” appearing herein can refer to a single part or a combination of multiple parts. Terms such as “installation,” “setup,” and “connection” appearing herein should be interpreted broadly; for example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can indicate that one component is directly attached to another component or that one component is attached to another component via an intermediate component; they can refer to the internal connection of two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. A feature described in one embodiment herein may be applied alone or in combination with other features to another embodiment, unless that feature is not applicable in that other embodiment or is otherwise stated.

[0035] Figure 1 This is a schematic diagram of the connection between the transfer mechanism and the bottom frame in an embodiment of this application; Figure 2 This is a schematic diagram of the transfer mechanism in the embodiments of this application; Figure 3 This is a second-direction sectional view of the transfer mechanism in the embodiments of this application; Figure 4 This is a first-direction sectional view of the transfer mechanism in the embodiments of this application; Figure 5 This is a schematic diagram of the structure of the annular turntable according to an embodiment of this application; Figure 6 This is a schematic diagram of the transfer mechanism at the alignment point in an embodiment of this application; Figure 7 This is a schematic diagram of the structure of the re-inspection mechanism in an embodiment of this application; Figure 8 This is a schematic diagram of the structure of the automated alignment relay system according to an embodiment of this application.

[0036] The following combination Figures 1-8This application provides a wafer transfer mechanism, including a substrate 11, an alignment plate 12, and a ring turntable 13.

[0037] The substrate 11 is slidably connected to the bottom frame 5 along the first direction; the alignment plate 12 is disposed above the substrate 11 and is slidably connected to the substrate 11 along the second direction; the annular turntable 13 is disposed in the middle of the alignment plate 12 and is rotatably connected to the alignment plate 12.

[0038] An adsorption assembly for adsorbing wafers is provided on the annular turntable 13. The adsorption assembly includes multiple suction nozzles 14, wherein at least the suction nozzle 14 corresponding to the wafer cutting edge position can be independently controlled to open and close.

[0039] The first direction refers to the direction in which the substrate in the wafer transfer mechanism 1 slides horizontally to the bottom rack 5. This direction is parallel to the ground and perpendicular to the longitudinal centerline of the wafer transfer mechanism 1, and is used to determine the left and right movement position of the transfer mechanism 1 on the horizontal plane to meet the needs of wafer loading, placement, and adjustment at different positions. The second direction refers to the direction in which the alignment plate 12 slides relative to the substrate 11 in a horizontal longitudinal direction perpendicular to the first direction. This direction is also parallel to the ground and perpendicular to the sliding direction of the substrate 11 in the first direction, and is used to realize the forward and backward movement adjustment of the alignment plate 12 on the horizontal plane.

[0040] In this embodiment, the wafer transfer mechanism 1 includes a substrate 11, an alignment plate 12, and a ring turntable 13. The substrate 11 can be slidably connected to the bottom frame 5 along a first direction using a sliding structure such as a linear guide or a ball screw, ensuring that the substrate 11 can move stably and accurately in the first direction. The alignment plate 12 is disposed above the substrate 11 and can also be slidably connected to the substrate 11 along a second direction using a structure such as a linear guide or a ball screw. The ring turntable 13 is installed in the middle of the alignment plate 12 and is rotatably connected to the alignment plate 12 via bearings or a rotary joint.

[0041] Multiple suction nozzles 14 are evenly distributed on the annular inner wall of the annular turntable 13, providing more uniform suction for warped wafers. The suction nozzles 14 are connected to the vacuum generator via air tubes, facilitating control of wafer pick-up and placement operations. To meet diverse needs in practical applications, the direction of the wafer dicing edge can be set to be parallel or perpendicular to the first direction. Therefore, at least the suction nozzle 14 corresponding to the wafer dicing edge position can be independently controlled to open and close. In this way, when the user needs to align the wafer dicing edge to a specific position, the suction nozzle at the aligned position will not contact the wafer, and the suction nozzle 14 at the corresponding position can be easily closed, ensuring operational precision and flexibility.

[0042] During the wafer transfer process, the transfer mechanism 1 first moves to the wafer loading lifting position by sliding the substrate 11 in the first direction. This ensures that the suction nozzle 14 accurately contacts the wafer at the wafer lifting position. Once the suction nozzle 14 contacts the wafer, the corresponding control program is activated, causing the corresponding set of suction nozzles 14 to generate negative pressure, adsorbing the wafer onto the suction nozzle 14. Subsequently, the transfer mechanism 1 moves along the bottom frame 5 in the opposite direction to the lifting position to the alignment point for adjusting the wafer dicing angle; then, it continues to move to the clamping point to place the wafer onto the heat sink 7.

[0043] This wafer transfer mechanism achieves flexible adjustment of the wafer position in multiple directions through a sliding connection between the substrate 11 and the bottom frame 5 along a first direction, a sliding connection between the alignment plate 12 and the substrate 11 along a second direction, and a relative rotational connection between the annular turntable 13 and the alignment plate 12. This multi-directional precision motion control can meet the complex positioning requirements of wafers during loading and transfer, ensuring that the wafers accurately reach their target positions and significantly improving the accuracy of wafer transfer. Among the suction nozzles 14 on the annular turntable 13 used to pick up the wafers, at least the nozzle 14 corresponding to the wafer dicing edge position can be independently controlled. According to the direction of the wafer dicing edge in actual applications, the on / off state of the corresponding nozzle 14 can be flexibly adjusted to achieve precise alignment of the wafer dicing edge position, flexibly adapting to wafer requirements with different dicing edge orientations, further improving the accuracy of wafer transfer and placement.

[0044] Furthermore, multiple suction nozzles 14 are evenly distributed on the inner wall of the annular turntable 13, with the suction direction of the suction nozzles 14 facing downwards towards the annular turntable, for adsorbing the upper surface of the wafer.

[0045] Multiple suction nozzles 14 are evenly distributed on the inner wall of the annular turntable 13, making full use of the turntable space and avoiding mutual interference between nozzles. This ensures that each nozzle can exert maximum adsorption efficiency, resulting in more uniform adsorption force on the wafer. At the same time, this compact layout allows the transfer mechanism to maintain efficient operation while effectively controlling the physical space occupied, ensuring the stability and accuracy of the wafer during transfer, thereby improving transfer efficiency.

[0046] Examples of embodiments in this application, such as Figure 5 As shown, the adsorption assembly includes six suction nozzles 14, which are divided into three groups. Each group includes two suction nozzles 14 that are arranged in a corresponding manner around the annular turntable 13. The suction nozzles 14 in the group corresponding to the wafer cutting edge position can be independently controlled to open and close.

[0047] The three sets of suction nozzles 14 are a horizontal axis pair, a 45° angled axis pair, and a 135° angled axis pair. In one possible implementation, for the two suction nozzles 14 of the horizontal axis pair located on the horizontal central axis, independent control of their on / off states can be achieved by installing independent solenoid valves in the gas path connecting the suction nozzles 14. The corresponding solenoid valves can control the negative pressure on / off state of the two suction nozzles 14 on the horizontal axis according to instructions from the control system, thereby achieving independent control. The two suction nozzles 14 of the 45° and 135° angled axis pairs can be controlled synchronously, i.e., controlled by the same solenoid valve or control signal. The arrangement of the suction nozzles 14 enables the adsorption of wafers with cutting edges parallel or perpendicular to the first direction. When the cutting edge direction is perpendicular to the first direction, the corresponding suction nozzle 14 on the horizontal axis opposite to the cutting edge remains closed, and the other suction nozzle 14 performs adsorption, avoiding wafer position shift due to uneven adsorption force, thereby improving the accuracy of wafer adsorption and positioning, ensuring the stability and safety of the wafer during the transfer process, and effectively reducing the risk of wafer damage that may be caused by improper adsorption.

[0048] Furthermore, the transfer mechanism 1 includes a drive assembly 15 and an arc-shaped toothed plate 16. The arc-shaped toothed plate 16 is connected to the annular turntable 13, and the drive assembly 15 is used to drive the arc-shaped toothed plate 16 to rotate the annular turntable 13.

[0049] The drive assembly 15 includes a drive motor 151 and a gear 152. The drive motor 151 serves as a power source, providing rotational power, such as a direct drive motor. The drive motor 151 is located below the alignment plate 12 and near its edge. The gear 152 is connected to the output end of the drive motor 151, serving as a transmission component to transmit the output power of the drive motor 151 to the arc-shaped toothed plate 16 located above the alignment plate 12. In other possible embodiments, a chain, belt, or other transmission component may also be used.

[0050] The arc-shaped toothed plate 16 is a plate-like structure with a certain curvature. One side surface of the plate has teeth that match the gear 152, and the arc-shaped toothed plate 16 meshes with the gear 152. The curvature of the arc-shaped toothed plate 16 is adapted to the rotatable angle and range of the annular turntable 13, ensuring that the annular turntable 13 can rotate within a certain angle range. The arc-shaped toothed plate 16 is firmly connected to the edge of the annular turntable 13 by bolts or other connection methods, ensuring the synchronization and stability between the two during rotation.

[0051] This application achieves precise control of the rotation angle of the annular turntable 13 through the cooperation of the drive assembly 15 and the arc-shaped toothed plate 16. During rotation, the adsorption assembly on the annular turntable 13 rotates accordingly, enabling adjustment of the wafer at different angular positions. Gear transmission features accurate transmission ratio and high transmission efficiency, ensuring a precise correspondence between the movement of the arc-shaped toothed plate 16 and the rotation angle of the drive motor's output shaft, thereby achieving high-precision control of the rotation angle of the annular turntable 13. This high-precision rotation control is crucial for positioning and adjustment during wafer transfer, ensuring the wafer's positional accuracy in each operational stage, improving product quality and production efficiency.

[0052] The connection between the drive assembly 15 and the arc-shaped toothed plate 16, along with the rational layout of each component, gives the entire transmission system good rigidity and stability. During rotation, it effectively resists external interference and load changes, reducing vibration and swaying, and ensuring the smooth rotation of the annular turntable 13. This prevents displacement or damage to the wafers adsorbed on the annular turntable 13 due to vibration.

[0053] Furthermore, a first slider group 17 is provided below the substrate 11. The first slider group 17 is used to cooperate with the first guide rail 51 on the bottom frame 5 to drive the transfer mechanism 1 to move along the first guide rail 51 between the alignment point and the clamping point.

[0054] In some possible implementations, the first slider group 17 may consist of multiple sliders evenly distributed below the substrate 11. Each slider typically has one or more tracks that mate with a guide rail. The shape and size of the tracks match the guide rail to ensure a tight fit and smooth sliding. For example, the slider tracks may be dovetail or rectangular, and the corresponding guide rails have corresponding shapes. The first guide rail 51 on the bottom frame 5 can be designed according to the layout of the first slider group 17, and is generally two or more parallel linear guide rails evenly distributed along the entire movement path.

[0055] In this embodiment, the bottom frame 5 is provided with two parallel first guide rails 51. A first slider assembly 17 is securely mounted below the base plate 11 using bolts, nuts, or other connectors. The first slider assembly 17 includes at least two sliders that respectively mate with the two first guide rails 51. Through the precise fit between the first slider assembly 17 and the first guide rails 51, this application provides stable and reliable guiding support for the transfer mechanism 1, enabling the transfer mechanism 1 to move along the first guide rails 51 in a first direction between the lifting position, the alignment point, and the clamping point. During movement, the large contact area between the sliders and the guide rails and the uniform friction effectively reduce slider swaying and offset, ensuring that the transfer mechanism 1 moves smoothly along a predetermined straight path.

[0056] In some possible implementations, to prevent the transfer mechanism 1 from exceeding its predetermined range during movement, limiting devices can be installed at both ends or key locations of the first guide rail 51. These limiting devices can be mechanical limit blocks, electronic limit switches, etc. When the slider contacts the limiting device, the drive source automatically stops operating, thereby preventing the slider and guide rail from being subjected to excessive impact and damage.

[0057] Furthermore, two second guide rails 18 are symmetrically arranged above the substrate 11. The second guide rails 18 cooperate with the second slider group 19 located below the alignment plate 12 so that the alignment plate 12 can slide along the second guide rails 18.

[0058] The second guide rails 18 are symmetrically arranged on the substrate 11 and are fixed to the upper surface of the substrate 11 by bolts, welding, or other reliable connection methods. The cross-sectional shape of the guide rails can be common forms such as dovetail, rectangle, or circle. The second slider group 19 consists of multiple sliders, evenly distributed below the alignment plate 12, and mates with the corresponding second guide rails 18. The bottom surface of each slider usually has a groove that matches the cross-sectional shape of the guide rail, which tightly engages with the guide rail to achieve guiding and support functions. The alignment plate 12 is slidably connected to the substrate 11 along a second direction via the second slider group 19 and the second guide rails 18.

[0059] The precise cooperation between the second guide rail 18 and the second slider group 19 provides a stable and precisely guided motion foundation for the alignment plate 12, which can effectively limit the lateral offset and sway of the alignment plate 12 during the movement process, and ensure that its movement direction in the plane remains consistent, thereby significantly improving the positional accuracy and stability of the alignment plate 12.

[0060] Furthermore, an air blowing mechanism (not shown in the figure) is provided above the annular turntable 13 for blowing air toward the upper surface of the wafer.

[0061] In one possible implementation, the air blowing mechanism (not shown in the figure) is fixed to a support structure above the annular turntable 13, or fixed to one side of the annular turntable 13, but the air nozzle is located above the wafer. By setting the air blowing mechanism above the annular turntable 13, air can be blown onto the upper surface of the wafer after it is placed on the heat sink, which can smooth the wafer and promptly remove dust, particles and other contaminants that may be adsorbed on the wafer surface.

[0062] This application also provides an automated wafer alignment and transfer system, such as Figures 6-8 As shown, it includes a positioning mechanism 3 and a transfer mechanism 1, with the positioning mechanism 3 and the transfer mechanism 1 electrically connected.

[0063] The alignment mechanism 3 includes an alignment camera 31, which is used to connect to the top rack 6; when the transfer mechanism 1 moves along the bottom rack 5 to the alignment point, the alignment camera 31 is used to acquire the position information of the wafer.

[0064] The alignment mechanism 3 and the transfer mechanism 1 communicate and control each other via electrical connections such as Ethernet, CAN bus, or USB interface. The alignment camera 31 is securely mounted on the top rack 6 using bolts, brackets, or other fastening devices to ensure no shaking or displacement occurs during wafer alignment. When the transfer mechanism 1 moves the wafer along the bottom rack 5 to the preset alignment point, the alignment camera 31 activates and captures an image of the wafer. Using an image recognition algorithm, the wafer's position information is extracted, including its coordinates, orientation angle, and the position and angle of the dicing edge. Based on the acquired position information, the control system controls the transfer mechanism 1 to fine-tune the wafer's position and / or angle to ensure precise alignment between the wafer and the target position in subsequent processes.

[0065] By acquiring wafer position information through a high-precision alignment camera 31 and combining it with advanced image processing algorithms and precise control strategies, rapid and accurate wafer alignment can be achieved. The electrical connection between the alignment mechanism 3 and the transfer mechanism 1, along with the automated alignment process, gives the entire wafer automated alignment and transfer system a high degree of automation. The system can automatically complete wafer position detection, information processing, and position adjustment operations, improving production efficiency and continuity.

[0066] Furthermore, the automated alignment transfer system also includes a re-inspection mechanism 4, which is electrically connected to the transfer mechanism 1.

[0067] The re-inspection mechanism 4 includes a re-inspection camera 41, which is located on one side of the transfer mechanism 1. The re-inspection camera 41 is used to acquire position information of the wafer after it is moved to the clamping point and placed in the heat sink 7.

[0068] The re-inspection unit 4 and the transfer unit 1 communicate and control information via electrical connections such as industrial Ethernet, CAN bus, or USB interface. The re-inspection camera 41 is installed on one side of the transfer unit 1, and its position and angle need to be precisely adjusted according to the placement method of the wafer on the heat sink 7 and the distribution of feature points to ensure that the camera lens can clearly capture all or key feature points of the wafer after it is placed in the heat sink 7.

[0069] Once the transfer mechanism 1 moves the wafer to the clamping point and places it on the heat sink 7, the re-inspection camera 41 is activated and captures an image of the wafer. Through image recognition algorithms, it acquires wafer position information such as the location of feature points on the wafer, the wafer's coordinates, orientation angle, the position and angle of the dicing edge, and the relative position of the wafer to the heat sink. This information is used to confirm whether the wafer is placed in its theoretical position and whether fine-tuning is needed. If the wafer position is off, the transfer mechanism 1 is controlled to pick up the wafer and readjust it.

[0070] The working steps of the automated alignment relay system in this application are as follows:

[0071] The transfer mechanism 1 picks up the wafer from the wafer lifting and loading process using an adsorption component; the transfer mechanism 1 moves along the bottom rack 5 to the preset alignment point; the alignment camera 31 of the alignment mechanism 3 is activated and captures an image of the wafer to obtain its position information; based on the acquired position information, the system controls the transfer mechanism 1 to fine-tune the wafer's position angle to ensure that the wafer is precisely aligned with the target position in subsequent processes; the transfer mechanism 1 moves along the bottom rack 5 to the clamping point and places the wafer on the heat sink; the re-inspection camera 41 of the re-inspection mechanism 4 is activated and captures an image of the wafer to obtain its position information on the heat sink; based on the position information acquired by the re-inspection camera 41, the system determines whether the wafer is placed in the correct position; if fine-tuning is required, the transfer mechanism 1 is controlled to adsorb the wafer and perform re-alignment adjustment; the heat sink is closed for further clamping of the wafer.

[0072] Obviously, the embodiments described above are merely some, not all, of the embodiments in this specification. Based on the embodiments in this specification, those skilled in the art can make other variations or modifications without creative effort, and all such variations should fall within the scope of protection of the embodiments in this specification. The specification and embodiments are considered exemplary only, and the true scope and spirit of the embodiments in this specification are indicated by the appended claims.

Claims

1. A wafer transfer mechanism, characterized in that, Includes a substrate, an alignment plate, and a circular turntable; The substrate is slidably connected to the bottom frame along a first direction; the alignment plate is disposed above the substrate and is slidably connected to the substrate along a second direction; the annular turntable is disposed in the middle of the alignment plate and is rotatably connected to the alignment plate. The annular turntable is equipped with an adsorption assembly for adsorbing wafers. The adsorption assembly includes multiple suction nozzles, wherein at least the suction nozzle corresponding to the wafer cutting edge can be independently controlled to open and close.

2. The wafer transfer mechanism according to claim 1, characterized in that, Multiple suction nozzles are evenly distributed on the inner wall of the annular turntable, with the suction direction of the nozzles facing downwards towards the annular turntable, for adsorbing the upper surface of the wafer.

3. A wafer transfer mechanism according to claim 2, characterized in that, The adsorption assembly includes six nozzles divided into three groups. Each group includes two nozzles that are arranged in a corresponding manner around the annular turntable. The nozzle group corresponding to the wafer cutting edge position can be independently controlled to open and close.

4. The wafer transfer mechanism according to claim 3, characterized in that, The three sets of nozzles are a horizontal axis pair, a 45° angled axis pair and a 135° angled axis pair, which are at a 45° angle to the horizontal line.

5. The wafer transfer mechanism according to claim 1, characterized in that, It includes a drive assembly and an arc-shaped toothed plate, the arc-shaped toothed plate being connected to the annular turntable, and the drive assembly being used to drive the arc-shaped toothed plate to rotate the annular turntable.

6. The wafer transfer mechanism according to claim 5, characterized in that, A first slider group is provided below the substrate. The first slider group is used to cooperate with the first guide rail (51) on the bottom frame to drive the transfer mechanism to move between the alignment point and the clamping point along the first guide rail.

7. The wafer transfer mechanism according to claim 6, characterized in that, Two second guide rails are symmetrically arranged above the substrate. The second guide rails cooperate with the second slider group (19) located below the alignment plate so that the alignment plate can slide along the second guide rails.

8. The wafer transfer mechanism according to claim 1, characterized in that, An air blowing mechanism is provided above the annular turntable for blowing air toward the upper surface of the wafer.

9. An automated wafer alignment and transfer system, characterized in that, Includes an alignment mechanism and a transfer mechanism as described in any one of claims 1-8, wherein the alignment mechanism is electrically connected to the transfer mechanism; The alignment mechanism includes an alignment camera, which is used to connect to the top rack; when the transfer mechanism moves along the bottom rack to the alignment point, the alignment camera is used to acquire the position information of the wafer.

10. The automated wafer alignment and transfer system according to claim 9, characterized in that, It includes a re-inspection mechanism, which is electrically connected to the transfer mechanism; The re-inspection mechanism includes a re-inspection camera, which is located on one side of the transfer mechanism; the re-inspection camera is used to acquire position information of the wafer after it has been moved to the clamping point and placed in the heat sink.

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