DIP packaging gold wire pressure welding matrix clamp

Abstract

The utility model relates to a pressure welding clamp, in particular to a DIP packaging gold wire pressure welding matrix clamp. Comprising a base, and a plurality of mounting grooves evenly distributed in the width direction of the base are formed in the upper surface of the base; a pull rod is installed on the base in the width direction of the base in a sliding mode, a gear block is arranged at one end of the pull rod, and a reset piece is arranged between the gear block and the base. Pull blocks are arranged at the other ends of the pull rods; a strip-shaped through hole is formed in one side of the mounting groove, a positioning plate is arranged in the strip-shaped through hole, and the positioning plate is connected with the pull rod; and a clamping area is formed between the side wall of the positioning plate and the side wall of the mounting groove. Compared with an existing clamp in which a fastening block is driven by a threaded rod to slide in a mounting groove so as to clamp a substrate, the clamping speed is higher, and the bonding efficiency of the bonding machine can be improved.

Description

Technical Field

[0001] This utility model relates to pressure welding fixtures, specifically to a DIP package gold wire pressure welding matrix fixture. Background Technology

[0002] Bonding machines use fine metal wires to tightly bond metal leads to pads on a substrate or frame, enabling electrical interconnection between chips and substrates and information exchange between chips.

[0003] During bonding, the fully automatic aluminum wire bonding machine uses a fixture to hold the substrate and a pneumatic device to close the upper and lower pressure plates to achieve bonding between the substrate and the chip. However, the existing fixtures can only hold one substrate at a time, which affects the bonding efficiency of the bonding machine. Moreover, the existing fixtures use a threaded rod to drive the fastening block to slide in the mounting slot to clamp the substrate, which has low installation efficiency and is not conducive to improving the bonding process efficiency. Utility Model Content

[0004] The purpose of this invention is to solve the technical problem that the existing fixtures have low installation efficiency and are not conducive to improving bonding processing efficiency, and to provide a DIP package gold wire bonding matrix fixture.

[0005] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows:

[0006] A DIP package gold wire bonding matrix fixture includes a base, and a plurality of mounting slots are evenly distributed along the width direction on the upper surface of the base.

[0007] A pull rod is slidably mounted on the base along the width direction of the base. One end of the pull rod is provided with a stop block, and a reset component is provided between the stop block and the base. The other end of the pull rod is provided with a pull block.

[0008] A strip-shaped through hole is provided on one side of the mounting groove, and a positioning plate is provided inside the strip-shaped through hole. The positioning plate is connected to the pull rod.

[0009] A clamping area is formed between the side wall of the positioning plate and the side wall of the mounting groove.

[0010] Furthermore, the reset component is a compression spring, which is sleeved on the pull rod, and both ends of the compression spring are connected to the stop block and the base, respectively.

[0011] Furthermore, a buckle is provided on the lower surface of the base.

[0012] Furthermore, the pull rod is a threaded rod; the positioning plate and the stop block are threadedly installed on the pull rod.

[0013] Furthermore, a threaded hole is provided on the upper surface of the base.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] 1. The DIP packaged gold wire bonding matrix fixture provided by this utility model, by setting a pull rod, a positioning plate and a reset component, allows for quick clamping of the DIP packaged circuit when installing it. Simply pull the pull rod to allow the positioning plate and the mounting slot to accommodate the DIP packaged circuit, place the DIP packaged circuit between them, and release the pull rod. The positioning plate, under the action of the reset component, will clamp the DIP packaged circuit in the mounting slot, achieving quick clamping of the DIP packaged circuit. Compared with the existing fixtures that use a threaded rod to drive the fastening block to slide in the mounting slot to clamp the substrate, the clamping speed is faster, which helps to improve the bonding efficiency of the bonding machine.

[0016] 2. The DIP packaged gold wire bonding matrix fixture provided by this utility model, by setting multiple mounting slots and having a pull rod pass through each mounting slot, can realize the simultaneous installation and bonding of multiple DIP packaged circuits, which helps to improve bonding efficiency. Attached Figure Description

[0017] Figure 1 This is a structural schematic diagram of an embodiment of the present utility model.

[0018] Explanation of reference numerals in the attached drawings: 1-base, 2-mounting groove, 3-pull rod, 4-stop block, 5-compression spring, 6-pull block, 7-strip through hole, 8-positioning plate, 9-buckle, 10-threaded hole. Detailed Implementation

[0019] The technical solutions of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0020] like Figure 1 As shown, a DIP packaged gold wire bonding matrix fixture includes a base 1. Multiple mounting slots 2 are evenly distributed along the width direction on the upper surface of the base 1. A pull rod 3 is slidably mounted on the base 1 along the width direction of the base 1. A stop block 4 is provided at one end of the pull rod 3. A compression spring 5 is provided between the stop block 4 and the base 1. The compression spring 5 is sleeved on the pull rod 3, and both ends of the compression spring 5 are connected to the stop block 4 and the base 1 respectively.

[0021] The other end of the pull rod 3 is provided with a pull block 6; a strip-shaped through hole 7 is provided on one side of the mounting groove 2, and a positioning plate 8 is provided in the strip-shaped through hole 7, and the positioning plate 8 is connected to the pull rod 3; a clamping area is formed between the side wall of the positioning plate 8 and the side wall of the mounting groove 2.

[0022] like Figure 1 As shown, in this embodiment, when installing the DIP packaged circuit, the pull rod 3 is pulled, and the compression spring 5 is compressed under the action of the pull rod 3 and the stop block 4. At the same time, the positioning plate 8 located in the strip-shaped through hole 7 moves along the pulling direction of the pull rod 3. After the DIP packaged circuit can be installed in the clamping area between the positioning plate 8 and the mounting groove 2, the DIP packaged circuit is installed in the clamping area. The pull rod 3 is released, and under the reaction force of the compression spring 5, the positioning plate 8 clamps the DIP packaged circuit in the clamping area.

[0023] like Figure 1 As shown, in order to facilitate the installation of the base 1 on the worktable of the bonding machine, a buckle 9 is provided on the lower surface of the base 1, and the base 1 is installed on the worktable of the bonding machine through the buckle 9.

[0024] To facilitate the fixing of the positioning plate 8 and the gear block 4 on the pull rod 3, and to facilitate disassembly and maintenance, the pull rod 3 is a threaded rod; the positioning plate 8 and the gear block 4 are threadedly installed on the pull rod 3.

[0025] Because the bonding process generates a lot of heat, the workbench and base 1 of mounting base 1 become quite hot. To facilitate the handling of base 1, such as... Figure 1 As shown, a threaded hole 10 is provided on the upper surface of the base 1; this facilitates the use of a long screw to screw into the threaded hole 10 to remove or place the base 1 on the workbench.

[0026] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A DIP packaged gold wire bonding matrix fixture, characterized in that: Includes a base (1), and the upper surface of the base (1) is provided with a plurality of mounting grooves (2) evenly distributed along its width direction; A pull rod (3) is slidably installed on the base (1) along the width direction of the base (1). One end of the pull rod (3) is provided with a stop block (4), and a reset member is provided between the stop block (4) and the base (1). The other end of the pull rod (3) is provided with a pull block (6). A strip-shaped through hole (7) is provided on one side of the mounting groove (2), and a positioning plate (8) is provided in the strip-shaped through hole (7), and the positioning plate (8) is connected to the pull rod (3); The side wall of the positioning plate (8) and the side wall of the mounting groove (2) form a clamping area.

2. The DIP package gold wire bonding matrix fixture according to claim 1, characterized in that: The reset component is a compression spring (5), which is sleeved on the pull rod (3), and the two ends of the compression spring (5) are connected to the stop block (4) and the base (1) respectively.

3. The DIP package gold wire bonding matrix fixture according to claim 1, characterized in that: The lower surface of the base (1) is provided with a buckle (9).

4. The DIP package gold wire bonding matrix fixture according to claim 1, characterized in that: The pull rod (3) is a threaded rod; The positioning plate (8) and the stop block (4) are threaded onto the pull rod (3).

5. The DIP package gold wire bonding matrix fixture according to claim 1, characterized in that: The upper surface of the base (1) is provided with a threaded hole (10).

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