Wafer placement machine

Abstract

The utility model provides a wafer placement machine, which comprises a longitudinal driving mechanism, a first motor and a suction nozzle, the longitudinal driving mechanism is connected with the first motor, the longitudinal driving mechanism is used for driving the first motor to move longitudinally, an output shaft of the first motor is connected with the suction nozzle, and the suction nozzle is used for driving the second motor to move longitudinally. And the suction nozzle is driven to rotate through the rotation of the output shaft of the first motor. The beneficial effects of the utility model are that the suction nozzle is driven by the first motor to rotate, and the die bonding angle can be flexibly adjusted during die bonding, thereby meeting the requirements of users.

Description

Technical Field

[0001] This utility model relates to the field of die bonding technology, and in particular to a wafer mounting machine. Background Technology

[0002] Existing die bonders generally include a swing arm, and a rotation or translation mechanism connected to the swing arm, as well as a swing arm lifting mechanism. Wafer placement machines include a nozzle. When the swing arm swings to the die pick-up position, the nozzle moves downward to pick up the wafer, and then the nozzle is lifted up. When the swing arm swings to the die bonding position, the nozzle moves downward to perform die bonding.

[0003] During the die bonding process, it is sometimes necessary to adjust the die bonding angle of the wafer. However, existing nozzles can only move up and down and pick up and bond the wafer, and cannot adjust the die bonding angle, which cannot meet the needs of users. Summary of the Invention

[0004] To address the technical problem that existing nozzles cannot adjust the die bonding angle, this invention provides a wafer placement machine, including a longitudinal drive mechanism, a first motor, and a nozzle. The longitudinal drive mechanism is connected to the first motor and is used to drive the first motor to move longitudinally. The output shaft of the first motor is connected to the nozzle, and the rotation of the output shaft of the first motor drives the nozzle to rotate.

[0005] As a further improvement of this utility model, the wafer placement machine also includes a second motor for pressure control. The longitudinal drive mechanism is connected to the second motor. The longitudinal drive mechanism is used to drive the second motor and the first motor to move longitudinally. The second motor drives the first motor to move longitudinally through a transmission mechanism.

[0006] As a further improvement of this utility model, the wafer mounting machine also includes a mounting component, and the longitudinal drive mechanism includes a third motor and a first guide module. The third motor and the first guide module are mounted on the mounting component, and the third motor drives the second motor to move longitudinally through the first guide module.

[0007] As a further improvement of this utility model, the first guide module includes a first guide rail and a first slider that slides on the first guide rail. The third motor and the first guide rail are mounted on the mounting component. The output shaft of the third motor is connected to the first slider through a transmission mechanism. The third motor drives the first slider to move through the transmission mechanism. The second motor is connected to the first slider. When the first slider moves, it drives the second motor to move.

[0008] As a further improvement of this utility model, the wafer placement machine further includes a second guiding module. The second guiding module includes a second guide rail and a second slider that slides on the second guide rail. The second guide rail is mounted on the first slider, and the second motor is mounted on the second guide rail. The output shaft of the second motor is connected to the second slider, and the second slider is connected to the first motor.

[0009] As a further improvement of this utility model, the wafer placement machine also includes an encoder, which includes a grating ruler and a reading head, and the grating ruler and the reading head are respectively mounted on the mounting component and the first slider of the first guide module.

[0010] As a further improvement of this utility model, the wafer placement machine also includes an adjustment mechanism for adjusting the mounting angle of the first motor. The adjustment mechanism is mounted on the first motor and is used to adjust the first motor to a position parallel to the wafer, so that the nozzle makes seamless contact with the wafer and picks up the wafer more firmly.

[0011] As a further improvement of this utility model, the adjustment mechanism includes a left and right tilt adjustment component, a pitch adjustment component, a left and right horizontal adjustment screw, and a pitch adjustment screw. The left and right tilt adjustment component and the pitch adjustment component are mounted on the first motor. The second slider is provided with a first mounting hole. One end of the left and right tilt adjustment component is provided with a second mounting hole corresponding to the first mounting hole. There is a gap between the second mounting hole and the screw of the left and right horizontal adjustment screw. The other end of the left and right tilt adjustment component is provided with a third mounting hole. There is a gap between the third mounting hole and the pitch adjustment screw. The tilt angle of the first motor can be adjusted by adjusting the gap between the screw of the left and right horizontal adjustment screw and the second mounting hole and / or adjusting the gap between the screw of the pitch adjustment screw and the third mounting hole.

[0012] As a further improvement of this utility model, the adjustment mechanism includes a mounting block and a first adjusting screw. The mounting block is mounted on the first motor, and a threaded hole is provided below the mounting block. The first adjusting screw is installed in the threaded hole, and a gap is provided between the threaded hole and the screw of the first adjusting screw. The tilt angle of the first motor can be adjusted by adjusting the gap between the first adjusting screw and the threaded hole.

[0013] As a further improvement of this utility model, the number of the first adjusting screw and the number of the threaded holes are four.

[0014] The beneficial effects of this utility model are: 1. This utility model uses a first motor to drive the nozzle to rotate, which allows for flexible adjustment of the die bonding angle during die bonding, thereby meeting the needs of users; 2. This utility model uses an adjustment mechanism to ensure seamless contact between the nozzle and the wafer, resulting in a more secure wafer pick-up. Attached Figure Description

[0015] Figure 1 This is a structural diagram of a wafer mounting machine from one perspective;

[0016] Figure 2 This is a structural diagram of a wafer mounting machine from another perspective;

[0017] Figure 3 This is a structural diagram of the first motor with the left and right tilt adjustment components and the pitch adjustment components installed;

[0018] Figure 4 This is a structural diagram of an integrated left and right tilt adjustment component and a pitch adjustment component;

[0019] Figure label:

[0020] 1-Mounting component, 2-Third motor, 3-First guide module, 4-Encoder, 5-Second guide module, 6-Second motor, 7-First motor, 8-Left and right tilt adjustment component, 9-Pitch tilt adjustment component, 10-Nozzle, 11-Left and right horizontal adjustment screw, 12-Pitch horizontal adjustment screw, 13-Second mounting hole, 14-Third mounting hole; Detailed Implementation

[0021] like Figure 1 As shown, this utility model discloses a wafer placement machine including a longitudinal drive mechanism, a first motor 7, a nozzle 10, and a second motor 6 for pressure control. The longitudinal drive mechanism is connected to the second motor 6 and drives the second motor 6 and the first motor 7 to move longitudinally. The second motor 6 drives the first motor 7 to move longitudinally through a transmission mechanism. The output shaft of the first motor 7 is connected to the nozzle 10. The rotation of the output shaft of the first motor 7 drives the nozzle 10 to rotate. The pressure on the nozzle 10 is controlled by the second motor 6. When the longitudinal drive mechanism drives the second motor 6, the first motor 7, and the nozzle 10 fixed on them to move, when the force from the chip on the nozzle 10 is greater than the force of the second motor 6, the output shaft of the second motor 6 retracts to pick up or place the wafer. The nozzle 10 is used to pick up the wafer at the pick-up position and to place the wafer at the die-bonding position. The wafer placement machine of this utility model drives the nozzle 10 to rotate through the first motor 7. The nozzle 10 adjusts the die-bonding angle by rotating and changing its angle.

[0022] As a further improvement of this utility model, the wafer mounting machine also includes a mounting component 1, and the longitudinal drive mechanism includes a third motor 2 and a first guide module 3. The third motor 2 and the first guide module 3 are mounted on the mounting component 1, and the third motor 2 drives the second motor 6 to move longitudinally through the first guide module 3.

[0023] The first guide module 3 includes a first guide rail and a first slider mounted on the first guide rail and capable of sliding along the first guide rail. The first guide rail is vertically mounted on the mounting component 1. The output shaft of the third motor 2 is connected to the first slider through a transmission mechanism. The third motor 2 drives the first slider to move upward or downward along the longitudinal direction of the first guide rail through the transmission mechanism. The second motor 6 and the first motor 7 are respectively connected to the first slider. When the first slider moves, it drives the second motor 6 to move longitudinally.

[0024] As a further improvement of this utility model, the wafer mounting machine also includes a second guide module 5, which is mounted on the mounting component 1. The second guide module 5 includes a second guide rail and a second slider mounted on the second guide rail and sliding along the second guide rail. The second guide rail is mounted on the first slider. The second motor 6 is mounted on the second guide rail. The output shaft of the second motor 6 is connected to the second slider through a transmission mechanism. The second motor 6 drives the second slider to move upward or downward along the longitudinal direction of the second guide rail through the transmission mechanism. The first motor 7 is connected to the second slider. When the second slider moves, it drives the first motor 7 to move longitudinally.

[0025] As a further improvement of this utility model, the wafer placement machine also includes an encoder 4, which includes a grating ruler and a reading head. The grating ruler and the reading head are respectively mounted on the mounting part 1 and the first slider of the first guide module 3. The encoder 4 is a sensor used to acquire the position of the moving mechanism, and directly converts the measured position and movement into digital signals (high-speed pulse signals).

[0026] As a further improvement of this utility model, the wafer mounting machine also includes an adjustment mechanism for adjusting the mounting angle of the first motor 7. The adjustment mechanism is mounted on the first motor 7 and is used to adjust the first motor 7 to a position parallel to the wafer, so that the nozzle 10 makes seamless contact with the wafer, and the nozzle 10 can pick up the wafer more firmly.

[0027] As a first preferred embodiment, such as Figure 3-4As shown, the adjustment mechanism includes a left and right tilt adjustment component 8 and a pitch adjustment component 9. The left and right tilt adjustment component 8 and the pitch adjustment component 9 are mounted on the first motor 7. The second slider has a first mounting hole. One end of the left and right tilt adjustment component 8 has a second mounting hole 13 corresponding to the first mounting hole. The left and right horizontal adjustment screw 11 passes through the second mounting hole 13 and the first mounting hole in sequence to mount the left and right tilt adjustment component 8 on the second slider. The diameter of the second mounting hole 13 is slightly larger than the outer diameter of the screw of the left and right horizontal adjustment screw 11. The other end of the left and right tilt adjustment component 8 has a third mounting hole 14. The pitch adjustment screw 12 mounts the pitch adjustment component 9 on the first motor 7. The diameter of the third mounting hole 14 is slightly larger than the outer diameter of the screw of the pitch adjustment screw 12. When it is necessary to adjust the position of the first motor 7, the tilt angle of the first motor 7 is adjusted by adjusting the gap between the screw of the left and right horizontal adjustment screw 11 and the second mounting hole 13 and / or adjusting the gap between the screw of the pitch adjustment screw 12 and the third mounting hole 14. The left and right tilt adjustment component 8 and the pitch adjustment component 9 are integrated into one piece, and their shapes can be designed in different ways. Figure 1 , 2 and Figure 3 , 4 The left and right tilt adjustment piece 8 and the pitch adjustment piece 9 are two different types of adjustment pieces.

[0028] In a second preferred embodiment, the adjustment mechanism includes a mounting block fixedly mounted to the first motor 7. A threaded hole is provided at the bottom of the mounting block, and a first adjusting screw is installed in the threaded hole. The clearance of the threaded hole is slightly larger than the outer diameter of the screw's thread. The tilt angle of the first motor 7 is adjusted by adjusting the clearance between the first adjusting screw and the threaded hole. There are four first adjusting screws and four threaded holes, respectively located at the four corners of the mounting block.

[0029] The beneficial effects of this utility model are: 1. This utility model uses a first motor to drive the nozzle to rotate, which allows for flexible adjustment of the die bonding angle during die bonding, thereby meeting the needs of users; 2. This utility model uses an adjustment mechanism to ensure seamless contact between the nozzle and the wafer, resulting in a more secure wafer pick-up.

[0030] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the protection scope of the present invention.

Claims

1. A wafer mounting machine, characterized in that: It includes a longitudinal drive mechanism, a first motor (7), and a suction nozzle (10). The longitudinal drive mechanism is connected to the first motor (7) and is used to drive the first motor (7) to move longitudinally. The output shaft of the first motor (7) is connected to the suction nozzle (10). The suction nozzle (10) is rotated by the rotation of the output shaft of the first motor (7). The wafer mounting machine also includes a second motor (6) for pressure control. The longitudinal drive mechanism is connected to the second motor (6). The longitudinal drive mechanism is used to drive the second motor (6) and the first motor (7) to move longitudinally. The second motor (6) drives the first motor (7) to move longitudinally through a transmission mechanism. The wafer mounting machine also includes an adjustment mechanism for adjusting the mounting angle of the first motor (7). The adjustment mechanism is mounted on the first motor (7) and is used to adjust the first motor (7) to a position parallel to the wafer.

2. The wafer mounting machine according to claim 1, characterized in that: The wafer mounting machine also includes a mounting component (1), and the longitudinal drive mechanism includes a third motor (2) and a first guide module (3). The third motor (2) and the first guide module (3) are mounted on the mounting component (1), and the third motor (2) drives the second motor (6) to move longitudinally through the first guide module (3).

3. The wafer mounting machine according to claim 2, characterized in that: The first guide module (3) includes a first guide rail and a first slider that slides on the first guide rail. The third motor (2) and the first guide rail are mounted on the mounting component (1). The output shaft of the third motor (2) is connected to the first slider through a transmission mechanism. The third motor (2) drives the first slider to move through the transmission mechanism. The second motor (6) is connected to the first slider. When the first slider moves, it drives the second motor (6) to move.

4. The wafer mounting machine according to claim 3, characterized in that: The wafer mounting machine further includes a second guide module (5), which includes a second guide rail and a second slider that slides on the second guide rail. The second guide rail is mounted on the first slider, and the second motor (6) is mounted on the second guide rail. The output shaft of the second motor (6) is connected to the second slider, and the second slider is connected to the first motor (7).

5. The wafer mounting machine according to claim 2, characterized in that: The wafer mounting machine also includes an encoder (4), which includes a grating ruler and a reading head. The grating ruler and the reading head are respectively mounted on the first slider of the mounting component (1) and the first guide module (3).

6. The wafer mounting machine according to claim 4, characterized in that: The adjustment mechanism includes a left and right tilt adjustment component (8), a pitch adjustment component (9), a left and right horizontal adjustment screw (11), and a pitch adjustment screw (12). The left and right tilt adjustment component (8) and the pitch adjustment component (9) are mounted on the first motor (7). The second slider is provided with a first mounting hole. One end of the left and right tilt adjustment component (8) is provided with a second mounting hole (13) corresponding to the first mounting hole. There is a gap between the second mounting hole (13) and the screw of the left and right horizontal adjustment screw (11). The other end of the left and right tilt adjustment component (8) is provided with a third mounting hole (14). There is a gap between the third mounting hole (14) and the pitch adjustment screw (12). The tilt angle of the first motor (7) can be adjusted by adjusting the gap between the screw of the left and right horizontal adjustment screw (11) and the second mounting hole (13) and / or adjusting the gap between the screw of the pitch adjustment screw (12) and the third mounting hole (14).

7. The wafer mounting machine according to claim 6, characterized in that: The adjustment mechanism includes a mounting block and a first adjusting screw. The mounting block is mounted on the first motor (7). A threaded hole is provided below the mounting block. The first adjusting screw is installed in the threaded hole. There is a gap between the threaded hole and the screw of the first adjusting screw. The tilt angle of the first motor (7) can be adjusted by adjusting the gap between the first adjusting screw and the threaded hole.

8. The wafer mounting machine according to claim 7, characterized in that: The number of the first adjusting screw and the number of the threaded holes are four.

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