Semiconductor material suction head

Abstract

The utility model relates to the technical field of semiconductor manufacturing, in particular to a semiconductor material suction head which comprises a mounting plate, a motor is embedded in the top of the mounting plate, an output shaft of the motor is fixedly connected with a pressing cam, the surface of the pressing cam is sleeved with an upper limiting block, and the bottom of the upper limiting block is fixedly connected with a guide rod. The device has the advantages of being compact in structure, good in compatibility and convenient to maintain, the motor, the cam, the guide rod, the precise guide sleeve, the guide mechanism, the adjusting mechanism, the limiting mechanism and the like are integrated on one mounting plate in the actual use process, the structure is compact, the occupied area of the whole device is reduced, and the cost is reduced. The suction head can adapt to a small working space through the arrangement of the lower limiting block, the position of the lower limiting block can be flexibly adjusted through the arrangement of the adjusting mechanism, then accurate adjustment of the lifting stroke of the suction head is achieved, the suction head can adapt to semiconductor materials of different sizes and shapes, and the compatibility of equipment is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, specifically to a suction head for semiconductor materials. Background Technology

[0002] The material handling device of a semiconductor sorting and testing machine is a core component of the equipment. It is mainly used to accurately grasp, transport, and position chips to ensure the stability and efficiency of processes such as testing, sorting, and marking. The material handling device technology of semiconductor sorting and testing machines is developing towards high speed, modularity, and intelligence. Its design needs to take into account accuracy, compatibility, and ease of maintenance.

[0003] Traditional material handling devices mostly use lead screws for lifting. Due to the threaded engagement between the lead screw and nut, this transmission method suffers from inertial delays during start-up and stopping. Furthermore, the lead screw pitch and motor speed limit the lifting speed. In scenarios requiring rapid material handling, the response speed of lead screw lifting cannot meet the demands of high-efficiency production. Lead screw lifting mechanisms typically require long lead screws, large nut seats, as well as bearing seats supporting the lead screw and motors. This combination of components results in the entire material handling device occupying a significant amount of vertical space, making it unsuitable for installation in compact production environments. Therefore, lead screw jacks... The lifting stroke and load capacity of the screw jack mechanism are usually determined during the design phase, making it difficult to adjust flexibly according to actual production needs. For materials of different sizes and weights, it may be necessary to replace the screw and nut with different specifications, which increases the cost and difficulty of equipment modification. During long-term use, wear and dust accumulation are likely to occur between the screw and nut of the screw jack mechanism, resulting in decreased transmission efficiency and increased noise. In order to maintain the normal operation of the equipment, regular maintenance work such as cleaning, lubrication and replacement of the screw and nut is required. However, due to the complex structure of the screw jack mechanism, these maintenance work are often tedious and time-consuming. Utility Model Content

[0004] The purpose of this invention is to provide a pick-up tip for semiconductor materials, which has the advantages of compact structure, good compatibility and convenient maintenance, and solves the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor material suction head, comprising a mounting plate, a motor embedded in the top of the mounting plate, a downward pressing cam fixedly connected to the output shaft of the motor, an upper limit block sleeved on the surface of the downward pressing cam, a guide rod fixedly connected to the bottom of the upper limit block, the bottom end of the guide rod penetrating to the bottom of the mounting plate and fixedly connected to the suction head, a vacuum connection hole opened at the bottom of the surface of the guide rod, a precision guide sleeve sleeved on the surface of the guide rod, the precision guide sleeve being located in the inner cavity of the mounting plate, a compression spring sleeved on the surface of the guide rod, the two ends of the compression spring contacting the upper limit block and the precision guide sleeve respectively, limit grooves opened on both sides of the surface of the guide rod, a moving block slidably connected to the inner cavity of the limit groove, one side of the moving block being fixedly connected to the precision guide sleeve, a cavity opened at the bottom of the mounting plate, a guide mechanism provided in the inner cavity of the cavity, an adjustment mechanism provided at the bottom of the mounting plate, and a limit mechanism provided inside the adjustment mechanism.

[0006] Furthermore, as a preferred embodiment of the present invention, the guiding mechanism includes a guide rod fixedly connected to the inner cavity of the cavity, a guide block and a tension spring are sleeved on the surface of the guide rod, the two ends of the tension spring are fixedly connected to the guide block and the mounting plate respectively, and the top of the guide block extends through the inner cavity of the mounting plate and is fixedly connected to a buffer block.

[0007] Furthermore, as a preferred embodiment of this utility model, the adjustment mechanism includes two protrusions fixedly connected to the bottom of the mounting plate, and an adjustment block is rotatably connected to one side of each of the two protrusions. The top of the adjustment block extends into the inner cavity of the cavity. A guide groove is provided on one side of the adjustment block, and a movable block is slidably connected to the inner cavity of the guide groove. The opposite sides of the two movable blocks are fixedly connected to the guide block, and a lower limit block is fixedly connected to one side of the adjustment block.

[0008] Furthermore, as a preferred embodiment of the present invention, the limiting mechanism includes a sleeve block disposed in the inner cavity of the lower limiting block. Sliding grooves are provided on both sides of the inner cavity of the lower limiting block, and sliders are slidably connected to the inner cavity of the sliding grooves. The opposite sides of the two sliders are fixedly connected to the sleeve block.

[0009] Furthermore, as a preferred embodiment of this invention, the upper limit block and the compression spring form a telescopic structure, and the maximum moving distance of the upper limit block is equal to the deformation of the compression spring.

[0010] Beneficial effects: The technical solution of this application has the following advantages: This utility model has the advantages of compact structure, good compatibility and convenient maintenance. In actual use, by integrating multiple components such as motor, cam, guide rod, precision guide sleeve, guiding mechanism, adjusting mechanism and limiting mechanism into one mounting plate, the structure is compacted, reducing the overall equipment footprint and allowing the suction head to adapt to smaller working spaces. Through the setting of the adjusting mechanism, the position of the lower limit block can be flexibly adjusted, thereby achieving precise adjustment of the suction head lifting stroke, enabling the suction head to adapt to semiconductor materials of different sizes and shapes, improving the compatibility of the equipment. The design of the mounting plate makes each component easy to access and maintain. Maintenance personnel can easily open the mounting plate to check the working status of the internal components and perform necessary cleaning, lubrication or replacement operations. The guiding mechanism, through the cooperation of the guide rod and guide block, provides stable guidance for the movement of the guide rod and related components, ensuring that the suction head remains stable and accurate during lifting.

[0011] It should be understood that all combinations of the foregoing concepts and the additional concepts described in more detail below can be considered as part of the utility model subject matter of this disclosure, provided that such concepts do not contradict each other. Attached Figure Description

[0012] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0014] Figure 2 This is a cross-sectional view of the structure of this utility model;

[0015] Figure 3 This is a schematic diagram of a partial structure of the present invention. Figure 1 ;

[0016] Figure 4 This is a partial structural cross-sectional view of the present invention;

[0017] Figure 5 This is a schematic diagram of a partial structure of the present invention. Figure 2 .

[0018] In the figure, the meanings of the various reference numerals are as follows: 1. Mounting plate; 2. Motor; 3. Lowering cam; 4. Upper limit block; 5. Guide rod; 6. Vacuum connection hole; 7. Precision guide sleeve; 8. Compression spring; 9. Limiting groove; 10. Moving block; 11. Cavity; 12. Guide mechanism; 121. Guide rod; 122. Guide block; 123. Tension spring; 124. Buffer block; 13. Adjustment mechanism; 131. Protrusion; 132. Adjusting block; 133. Guide groove; 134. Moving block; 135. Lower limit block; 14. Limiting mechanism; 141. Sleeve block; 142. Slide groove; 143. Slider; 15. Suction head. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. To better understand the technical content of the present utility model, specific embodiments are provided and described in conjunction with the accompanying drawings. Various aspects of the present utility model are described in this disclosure with reference to the accompanying drawings, which show many illustrative embodiments. It should be understood that the various concepts and embodiments described above, as well as those described in more detail below, can be implemented in any of many ways. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0020] As attached Figure 1 To be continued Figure 5 As shown: This embodiment provides a semiconductor material suction head, including a mounting plate 1. A motor 2 is embedded in the top of the mounting plate 1. The output shaft of the motor 2 is fixedly connected to a downward pressing cam 3. An upper limit block 4 is sleeved on the surface of the downward pressing cam 3. A guide rod 5 is fixedly connected to the bottom of the upper limit block 4. The bottom end of the guide rod 5 extends through to the bottom of the mounting plate 1 and is fixedly connected to a suction head 15. A vacuum connection hole 6 is opened at the bottom of the surface of the guide rod 5. A precision guide sleeve 7 is sleeved on the surface of the guide rod 5. The precision guide sleeve 7 is located in the inner cavity of the mounting plate 1. A compression spring 8 is sleeved on the surface of the guide rod 5. The two ends of the compression spring 8 are in contact with the upper limit block 4 and the precision guide sleeve 7, respectively. Limiting grooves 9 are opened on both sides of the surface of the guide rod 5. A moving block 10 is slidably connected to the inner cavity of the limiting groove 9. One side of the moving block 10 is fixedly connected to the precision guide sleeve 7. A cavity 11 is opened at the bottom of the mounting plate 1. A guiding mechanism 12 is provided in the inner cavity of the cavity 11. An adjustment mechanism 13 is provided at the bottom of the mounting plate 1. A limiting mechanism 14 is provided inside the adjustment mechanism 13.

[0021] Specifically, the guide mechanism 12 includes a guide rod 121 fixedly connected to the inner cavity of the cavity 11. A guide block 122 and a tension spring 123 are sleeved on the surface of the guide rod 121. The two ends of the tension spring 123 are fixedly connected to the guide block 122 and the mounting plate 1, respectively. The top of the guide block 122 extends through the inner cavity of the mounting plate 1 and is fixedly connected to a buffer block 124.

[0022] In this embodiment: the guide mechanism 12 ensures that the buffer block 124 is in close contact with the precision guide sleeve 7, and the rebound force of the tension spring 123 can provide a buffering effect, reducing the impact force between components during movement, reducing wear, and extending the service life of the equipment.

[0023] Specifically, the adjustment mechanism 13 includes two protrusions 131 fixedly connected to the bottom of the mounting plate 1. An adjustment block 132 is rotatably connected to one side of each of the two protrusions 131. The top of the adjustment block 132 extends into the inner cavity of the cavity 11. A guide groove 133 is provided on one side of the adjustment block 132. A movable block 134 is slidably connected to the inner cavity of the guide groove 133. The opposite sides of the two movable blocks 134 are fixedly connected to the guide block 122. A lower limit block 135 is fixedly connected to one side of the adjustment block 132.

[0024] In this embodiment: by setting the adjustment mechanism 13, the adjustment block 132 moves in an arc around the protrusion 131, which can flexibly adjust the position of the lower limit block 135 according to actual needs, thereby realizing the precise adjustment of the lifting stroke of the guide rod 5 and the suction head 15, and meeting the diverse needs of different semiconductor material picking operations.

[0025] Specifically, the limiting mechanism 14 includes a sleeve block 141 disposed in the inner cavity of the lower limiting block 135. Slide grooves 142 are provided on both sides of the inner cavity of the lower limiting block 135. Slide blocks 143 are slidably connected to the inner cavity of the slide grooves 142. The opposite sides of the two slide blocks 143 are fixedly connected to the sleeve block 141.

[0026] In this embodiment: by setting the limiting mechanism 14, the slider 143 slides in the slide groove 142, driving the sleeve block 141 to move, thereby limiting the guide rod 5, ensuring that the guide rod 5 remains stable during the lifting process, preventing it from shaking or deviating, and ensuring that the suction head 15 can accurately reach the designated position for suction operation.

[0027] Specifically, the upper limit block 4 and the compression spring 8 form a telescopic structure, and the maximum moving distance of the upper limit block 4 is equal to the deformation of the compression spring 8.

[0028] In this embodiment: during the lifting and lowering of the guide rod 5 and the suction head 15, the compression spring 8 can provide elastic support, making the movement process smoother and reducing the impact force caused by sudden start or stop.

[0029] The working principle and usage process of this utility model are as follows: The user starts the motor 2, and the output shaft of the motor 2 drives the downward cam 3 to rotate. The downward cam 3 drives the upper limit block 4 to rotate. The upper limit block 4 drives the guide rod 5 to rotate in the inner cavity of the slider 143. The guide rod 5 drives the precision guide sleeve 7 to rotate through the moving block 10. When the precision guide sleeve 7 rotates, the tension spring 123 will rebound. The tension spring 123 drives the guide block 122 to move. The guide block 122 drives the buffer block 124 to move, so that the buffer block 124 can make close contact with the precision guide sleeve 7. When the guide block 122 moves, it will drive the movable block 134 to slide in the inner cavity of the guide groove 133. When block 134 slides, it causes adjusting block 132 to move in an arc around protrusion 131. Adjusting block 132 drives lower limit block 135 to adjust. When lower limit block 135 is adjusted, slider 143 slides in the inner cavity of slide groove 142. Slider 143 drives sleeve block 141 to move. Sleeve block 141 drives guide rod 5 to move downward. When guide rod 5 moves downward, it drives upper limit block 4 to move downward. Upper limit block 4 drives lower cam 3 to stretch. When upper limit block 4 moves, it drives compression spring 8 to compress. At the same time, when guide rod 5 moves downward, it also drives suction head 15 to move, thus realizing the lifting and lowering of suction head 15.

[0030] It should be noted that in this paper, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0031] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this invention shall be determined by the claims.

Claims

1. A pick-up tip for semiconductor materials, comprising a mounting plate (1), characterized in that: A motor (2) is embedded in the top of the mounting plate (1). The output shaft of the motor (2) is fixedly connected to a pressing cam (3). An upper limit block (4) is fitted on the surface of the pressing cam (3). A guide rod (5) is fixedly connected to the bottom of the upper limit block (4). The bottom end of the guide rod (5) extends through to the bottom of the mounting plate (1) and is fixedly connected to a suction head (15). A vacuum connection hole (6) is opened at the bottom of the surface of the guide rod (5). A precision guide sleeve (7) is fitted on the surface of the guide rod (5). The precision guide sleeve (7) is located in the inner cavity of the mounting plate (1). The surface of the guide rod (5) is fitted with... A compression spring (8) is provided, with its two ends in contact with an upper limit block (4) and a precision guide sleeve (7) respectively. Limiting grooves (9) are provided on both sides of the surface of the guide rod (5). A moving block (10) is slidably connected to the inner cavity of the limiting groove (9). One side of the moving block (10) is fixedly connected to the precision guide sleeve (7). A cavity (11) is provided at the bottom of the mounting plate (1). A guide mechanism (12) is provided in the inner cavity of the cavity (11). An adjustment mechanism (13) is provided at the bottom of the mounting plate (1). A limiting mechanism (14) is provided inside the adjustment mechanism (13).

2. The semiconductor material suction head according to claim 1, characterized in that: The guiding mechanism (12) includes a guide rod (121) fixedly connected to the inner cavity of the cavity (11). The surface of the guide rod (121) is fitted with a guide block (122) and a tension spring (123). The two ends of the tension spring (123) are fixedly connected to the guide block (122) and the mounting plate (1) respectively. The top of the guide block (122) extends through the inner cavity of the mounting plate (1) and is fixedly connected with a buffer block (124).

3. The semiconductor material suction tip according to claim 2, characterized in that: The adjustment mechanism (13) includes two protrusions (131) fixedly connected to the bottom of the mounting plate (1). An adjustment block (132) is rotatably connected to one side of each of the two protrusions (131). The top of the adjustment block (132) extends into the inner cavity of the cavity (11). A guide groove (133) is provided on one side of the adjustment block (132). A movable block (134) is slidably connected to the inner cavity of the guide groove (133). The opposite sides of the two movable blocks (134) are fixedly connected to the guide block (122). A lower limit block (135) is fixedly connected to one side of the adjustment block (132).

4. The semiconductor material suction head according to claim 3, characterized in that: The limiting mechanism (14) includes a sleeve block (141) disposed in the inner cavity of the lower limiting block (135). Slide grooves (142) are provided on both sides of the inner cavity of the lower limiting block (135). Slide blocks (143) are slidably connected to the inner cavity of the slide grooves (142). The opposite sides of the two slide blocks (143) are fixedly connected to the sleeve block (141).

5. The pick-up tip for semiconductor materials according to claim 1, characterized in that: The upper limit block (4) and the compression spring (8) form a telescopic structure, and the maximum moving distance of the upper limit block (4) is equal to the deformation of the compression spring (8).

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