Chip packaging structure with metal shielding layer

Abstract

The utility model relates to the technical field of chip packaging, in particular to a chip packaging structure with a metal shielding layer, which comprises a substrate, the top of the substrate is fixedly connected with a chip, the top of the substrate is fixedly connected with a shielding cover, the periphery of the shielding cover is fixedly connected with radiating fins, one side of each radiating fin is fixedly connected with a heat conducting plate, and the other side of each radiating fin is fixedly connected with a metal shielding layer. The other side of the heat conducting plate is fixedly connected with a heat conducting gasket, a first shielding layer is arranged on the inner wall of the shielding cover, and a second shielding layer is arranged on the outer surface of the shielding cover. Heat generated by working of the chip is conducted to the heat conducting plate through the heat conducting gasket, the heat conducting plate transmits the heat to the shielding cover and the heat is dissipated by the heat dissipation fins, internal electromagnetic waves generated by the chip are absorbed by the first shielding layer, and external electromagnetic waves are further attenuated by the second shielding layer after being blocked by the reflecting layer. Through cooperation of the heat dissipation structure and the shielding structure, the heat dissipation efficiency and the electromagnetic compatibility of the packaging structure are improved.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to a chip packaging structure with a metal shielding layer. Background Technology

[0002] Chip packaging is a key step in the semiconductor manufacturing process. Its main functions are to provide basic functions such as mechanical support, environmental protection, electrical connection and thermal management for the chip. The packaging structure can protect the chip from external factors such as temperature changes, physical shocks and chemical pollution, while establishing a signal transmission path between the internal circuit of the chip and the external system. As electronic devices develop towards higher integration and higher frequency, the thermal management and electromagnetic compatibility performance of the packaging structure have become important factors affecting the reliability of the chip and the stability of the system.

[0003] In terms of electromagnetic shielding, the packaging structure usually needs to set a shielding layer to prevent external electromagnetic interference from affecting the normal operation of the chip, while suppressing the electromagnetic radiation generated by the chip itself from interfering with external circuits. Traditional electromagnetic shielding solutions mainly rely on metal shielding covers. However, relying on a single metal shielding layer has obvious shortcomings: for external incident electromagnetic waves, the absorption effect of a thin metal layer is limited. For electromagnetic noise generated inside the chip, it is difficult to effectively suppress multiple reflections within the cavity by relying solely on a metal shielding cover, resulting in a decrease in shielding effectiveness.

[0004] In terms of heat dissipation management, existing chip packages mostly use thermal grease in conjunction with an external fan for heat dissipation. This heat dissipation solution has the following drawbacks: the interface thermal resistance between the thermal grease and the heat sink is high, and the heat conduction efficiency is limited.

[0005] Existing chip packaging structures have room for improvement in both heat dissipation efficiency and electromagnetic shielding performance. Relying solely on a shielding cover is insufficient to effectively address the dual requirements of internal electromagnetic wave absorption and external electromagnetic wave reflection. Furthermore, the traditional heat dissipation method using thermal grease and a fan has a high thermal resistance path, limiting its effectiveness. Therefore, it is necessary to design a chip packaging structure that can help improve both heat dissipation and electromagnetic shielding performance, thereby addressing the technical problems of low heat dissipation efficiency and insufficient electromagnetic shielding in existing technologies. Utility Model Content

[0006] The purpose of this invention is to provide a chip packaging structure with a metal shielding layer. By setting heat dissipation fins and a first shielding layer, the invention solves the problems of low heat dissipation efficiency and insufficient electromagnetic shielding effect in existing chip packaging structures.

[0007] The technical solution of this utility model is as follows: a chip packaging structure with a metal shielding layer, including a substrate, a chip fixedly connected to the top of the substrate, a shielding cover fixedly connected to the top of the substrate, heat dissipation fins fixedly connected to all four sides of the shielding cover, a heat-conducting plate fixedly connected to one side of the heat dissipation fins, a heat-conducting pad fixedly connected to the other side of the heat-conducting plate, a first shielding layer provided on the inner wall of the shielding cover, a second shielding layer provided on the outer surface of the shielding cover, and a reflective layer provided on the outer surface of the second shielding layer.

[0008] Preferably, the shielding cover has extension grooves around its perimeter that are adapted to the heat-conducting plate, the heat-conducting plate extends into the shielding cover from the side away from the heat dissipation fins, and the heat-conducting plate is fixed to the shielding cover by welding.

[0009] Preferably, the shielding cover is made of copper alloy, the heat dissipation fins are made of aluminum alloy, the heat-conducting plate is made of copper plate, and the heat-conducting pad is made of high-performance thermally conductive silicone pad.

[0010] Preferably, the first shielding layer is made of a magnetic powder composite absorbing material, and the first shielding layer is directly coated onto the inner wall of the shielding cover by spraying.

[0011] Preferably, the second shielding layer is made of a highly conductive metal coating, and the metal layer and the copper alloy shielding cover are metallurgically bonded by electroplating.

[0012] Preferably, the reflective layer is made of epoxy resin composite film, and the reflective layer is coated on the outer surface of the second shielding layer by direct coating.

[0013] The beneficial effects of this utility model are as follows: the heat generated by the chip during operation is conducted to the heat-conducting plate through the heat-conducting pad, the heat-conducting plate transfers the heat to the shielding cover and is dissipated by the heat dissipation fins, the internal electromagnetic waves generated by the chip are absorbed by the first shielding layer, and the external electromagnetic waves are further attenuated by the second shielding layer after being blocked by the reflective layer. Through the synergistic cooperation of heat dissipation and shielding structure, the heat dissipation efficiency and electromagnetic compatibility performance of the packaging structure are improved. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0015] Figure 1 A three-dimensional view of a chip packaging structure with a metal shielding layer;

[0016] Figure 2 This is an overall rendering of a chip packaging structure with a metal shielding layer.

[0017] Figure 3 A cross-sectional view of a shielding cover in a chip packaging structure with a metal shielding layer;

[0018] Figure 4 This is a schematic diagram showing the separation of the heat-conducting plate and the heat-conducting pad in a chip packaging structure with a metal shielding layer.

[0019] Figure 5 This is a diagram illustrating the distribution of the first and second shielding layers in a chip packaging structure with a metal shielding layer.

[0020] Explanation of reference numerals in the attached drawings: 1. Substrate; 2. Chip; 3. Shielding cover; 4. Heat sink fins; 5. Heat-conducting plate; 6. Heat-conducting pad; 7. First shielding layer; 8. Second shielding layer; 9. Reflective layer. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. The described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Example 1

[0023] Please see Figures 1-5 This is the first embodiment of the present invention. This embodiment provides a chip packaging structure with a metal shielding layer, including a substrate 1, a chip 2 fixedly connected to the top of the substrate 1, a shielding cover 3 fixedly connected to the top of the substrate 1, heat dissipation fins 4 fixedly connected to all four sides of the shielding cover 3, a heat-conducting plate 5 fixedly connected to one side of the heat dissipation fins 4, a heat-conducting pad 6 fixedly connected to the other side of the heat-conducting plate 5, a first shielding layer 7 provided on the inner wall of the shielding cover 3, a second shielding layer 8 provided on the outer surface of the shielding cover 3, a reflective layer 9 provided on the outer surface of the second shielding layer 8, the shielding cover 3 being made of copper alloy, the heat dissipation fins 4 being made of aluminum alloy, the heat-conducting plate 5 being made of copper plate, and the heat-conducting pad 6 being made of high-performance thermally conductive silicone pad.

[0024] The copper alloy shield 3 serves as the main structure, playing a dual role in electromagnetic shielding and heat conduction. Its excellent electrical conductivity can effectively block electromagnetic interference, while its high thermal conductivity can quickly conduct the heat generated by the chip 2 to the heat dissipation structure. The aluminum alloy heat dissipation fins 4 are fixed around the shield 3, which increases the heat dissipation area. Utilizing the lightweight properties and good thermal conductivity of aluminum alloy, the heat conducted by the shield 3 is quickly dissipated to the surrounding environment, improving the overall heat dissipation efficiency.

[0025] The copper heat-conducting plate 5 connects to the heat dissipation fins 4 and extends into the shield 3, serving as a heat transfer channel. Utilizing the high thermal conductivity of copper, the heat collected by the heat-conducting pad 6 from the chip 2 is efficiently transferred to the shield 3 and the heat dissipation fins 4, reducing heat accumulation in the transmission path. The high-performance thermally conductive silicone pad 6 is placed between the heat-conducting plate 5 and the chip 2, serving as a thermal interface filler. Its soft material properties allow it to conform to the surface of the chip 2, reducing contact thermal resistance and effectively collecting and conducting the heat generated by the chip 2 to the heat-conducting plate 5.

[0026] During operation, the heat generated by chip 2 is conducted to heat conduction plate 5 through thermal pad 6. Heat conduction plate 5 transfers heat to shield 3 which is fixedly connected to it. Heat dissipation fins 4 connected around shield 3 increase the heat dissipation area and dissipate heat to the surrounding environment. Heat conduction plate 5 and shield 3 are fixed by welding, forming a continuous metal connection interface. Heat can be directly conducted at this interface, reducing heat loss during the heat transfer process.

[0027] When chip 2 is working, the internal electromagnetic waves generated are absorbed by the first shielding layer 7 on the inner wall of the shielding cover 3. The first shielding layer 7 converts electromagnetic energy into heat energy and consumes it. Electromagnetic waves in the external environment are first blocked by the reflective layer 9. The reflective layer 9 reflects the incident electromagnetic waves. When the remaining electromagnetic waves reach the second shielding layer 8, they are further reflected and attenuated. Through the cooperation of the first shielding layer 7, the second shielding layer 8 and the reflective layer 9, the leakage of internal electromagnetic waves to the outside and the interference of external electromagnetic waves to the inside are reduced.

[0028] Example 2

[0029] Please see Figures 2-4 This is the second embodiment of the present invention, which is based on the previous embodiment.

[0030] Specifically, the shielding cover 3 has extension slots around its perimeter that are adapted to the heat-conducting plate 5. The heat-conducting plate 5 extends into the interior of the shielding cover 3 from the side away from the heat dissipation fins 4. The heat-conducting plate 5 and the shielding cover 3 are fixed together by welding to seal the extension slots and restore the structural integrity of the shielding cover 3. Through welding, a continuous metal-grade interface is formed between the heat-conducting plate 5 and the shielding cover 3. This bonding method effectively eliminates the microscopic gaps caused by mechanical contact and the interfacial thermal resistance formed by air in the gaps. Based on the principle of solid thermal conductivity, the welding interface constructs a continuous low-resistance heat conduction path, so that the heat flow conduction area is maximized during the process of heat transfer from the chip 2 to the shielding cover 3 and the heat dissipation fins 4 via the heat-conducting plate 5. The overall thermal resistance is significantly reduced compared to the non-welded physical overlap state, thereby achieving more efficient passive heat dissipation performance.

[0031] Example 3

[0032] Please see Figure 5This is the third embodiment of the present invention, which is based on the first two embodiments.

[0033] Specifically, the first shielding layer 7 is made of a magnetic powder composite absorbing material. The first shielding layer 7 is directly coated onto the inner wall of the shielding cover 3 by spraying. The magnetic powder composite absorbing material can convert electromagnetic energy into heat energy and dissipate it, thereby achieving internal electromagnetic wave absorption. This absorption-based mechanism can avoid repeated reflection of internal electromagnetic waves in the shielding cavity, which would cause the shielding effectiveness to decrease.

[0034] The second shielding layer 8 is made of a highly conductive metal coating. The second shielding layer 8 is made by electroplating to achieve metallurgical bonding between the metal layer and the copper alloy shielding cover 3. The highly conductive metal coating has high conductivity and is easy to form eddy current field when it encounters high frequency electromagnetic waves, which reverses the interference and pushes away the incoming electromagnetic waves.

[0035] The reflective layer 9 is made of epoxy resin composite film. The reflective layer 9 is coated on the outer surface of the second shielding layer 8 by direct coating. The epoxy resin composite film has excellent electromagnetic wave reflection capability. The dense network formed by its conductive filler can achieve efficient reflection of incident electromagnetic waves in a wide frequency range. At the same time, the epoxy resin matrix gives the coating good mechanical strength, weather resistance and adhesion, which can effectively protect the internal shielding layer. Moreover, the direct coating process can achieve seamless coverage, ensuring the integrity and consistency of the reflective layer 9.

[0036] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A chip packaging structure with a metal shielding layer, comprising a substrate (1), a chip (2) fixedly connected to the top of the substrate (1), and a shielding cover (3) fixedly connected to the top of the substrate (1), characterized in that: The shield (3) is fixedly connected to heat dissipation fins (4) on all four sides. A heat-conducting plate (5) is fixedly connected to one side of the heat dissipation fins (4), and a heat-conducting pad (6) is fixedly connected to the other side of the heat-conducting plate (5). A first shielding layer (7) is provided on the inner wall of the shield (3), and a second shielding layer (8) is provided on the outer surface of the shield (3). A reflective layer (9) is provided on the outer surface of the second shielding layer (8).

2. The chip packaging structure with a metal shielding layer according to claim 1, characterized in that: The shield (3) has extension grooves around its perimeter that are compatible with the heat-conducting plate (5). The heat-conducting plate (5) extends into the shield (3) from the side away from the heat dissipation fins (4), and the heat-conducting plate (5) and the shield (3) are fixed together by welding.

3. The chip packaging structure with a metal shielding layer according to claim 1, characterized in that: The shielding cover (3) is made of copper alloy, the heat dissipation fins (4) are made of aluminum alloy, the heat-conducting plate (5) is made of copper plate, and the heat-conducting pad (6) is made of high-performance thermally conductive silicone pad.

4. The chip packaging structure with a metal shielding layer according to claim 1, characterized in that: The first shielding layer (7) is made of a magnetic powder composite absorbing material, and the first shielding layer (7) is directly coated on the inner wall of the shielding cover (3) by spraying.

5. The chip packaging structure with a metal shielding layer according to claim 1, characterized in that: The second shielding layer (8) is made of a highly conductive metal coating. The second shielding layer (8) is made by electroplating to achieve metallurgical bonding between the metal layer and the copper alloy shielding cover (3).

6. The chip packaging structure with a metal shielding layer according to claim 1, characterized in that: The reflective layer (9) is made of epoxy resin composite film and is coated on the outer surface of the second shielding layer (8) by direct coating.

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