Adsorption device, bearing platform and laser processing equipment

Abstract

The utility model relates to an adsorption device, a bearing platform and laser processing equipment, the adsorption device is used for adsorbing a circuit board, the adsorption device comprises an adsorption mechanism, and the adsorption mechanism comprises a base; the bearing plate is arranged on the base, a vacuum cavity is defined by the bearing plate and the base, and a plurality of vacuum holes communicated with the vacuum cavity are formed in the bearing plate; and the adsorption plate is arranged on the bearing plate, the adsorption plate is provided with a plurality of adsorption holes which are communicated with the vacuum holes and are used for adsorbing the circuit board, the aperture of the adsorption holes is smaller than that of the vacuum holes, and the distribution density of the adsorption holes is higher than that of the vacuum holes. When a thin circuit board is adsorbed on the adsorption plate, all parts of the circuit board are uniformly stressed, so that warping and concave-convex deformation of the circuit board are effectively avoided, and the flatness of the circuit board is improved. Therefore, in the process of processing the circuit board by using the processing equipment, the processing precision of the circuit board is greatly improved.

Description

Technical Field

[0001] This application relates to the field of circuit board processing technology, and in particular to an adsorption device, a support platform, and laser processing equipment. Background Technology

[0002] Circuit boards have a wide range of applications in the field of electronic manufacturing technology. As electronic products develop towards miniaturization and high performance, thin circuit boards have emerged.

[0003] In the processing of thin circuit boards, an adsorption device is usually needed to adsorb and fix the thin circuit board for purposes such as accurate positioning.

[0004] However, with traditional adsorption devices, when the thin circuit board is in an adsorption state, it is prone to deformation, which affects the flatness of the thin circuit board and ultimately affects the processing accuracy of the thin circuit board. Utility Model Content

[0005] One of the technical problems addressed by this application is how to improve the processing precision of circuit boards.

[0006] An adsorption device for adsorbing circuit boards, the adsorption device comprising an adsorption mechanism, the adsorption mechanism comprising:

[0007] Base;

[0008] A support plate is disposed on the base, the support plate and the base forming a vacuum cavity, and the support plate has multiple vacuum holes communicating with the vacuum cavity; and

[0009] An adsorption plate is disposed on the support plate. The adsorption plate has multiple adsorption holes that communicate with the vacuum holes and are used to adsorb the circuit board. The diameter of the adsorption holes is smaller than the diameter of the vacuum holes, and the distribution density of the adsorption holes is higher than the distribution density of the vacuum holes.

[0010] In one embodiment, the adsorption plate has a mounting surface and an adsorption surface that are arranged opposite to each other in the thickness direction. The mounting surface contacts the carrier plate, and the adsorption surface is used to contact the circuit board. A plurality of first grooves are recessed on the mounting surface and spaced apart. The first grooves are spaced apart from the adsorption surface by a set distance, and the adsorption holes are formed on the bottom wall surface of the first grooves.

[0011] In one embodiment, the mounting surface is further recessed to form a plurality of spaced second grooves, the second grooves being intersected and connected to each other, the second grooves being spaced a certain distance from the adsorption surface, and the adsorption holes being formed on the bottom wall surface of the second grooves.

[0012] In one embodiment, the area of ​​the adsorption plate covered by the circuit board is referred to as the coverage area, and the adsorption hole located at the outermost edge of the coverage area is referred to as the edge hole. The diameter of the edge hole is larger than the diameter of the adsorption holes at other locations within the coverage area.

[0013] In one embodiment, the adsorption mechanism further includes a pressing unit connected to the support plate and used to press the circuit board against the adsorption plate along the thickness direction of the adsorption plate.

[0014] In one embodiment, the adsorption mechanism includes at least two pressing units, which are spaced apart and are used to press the two opposite ends of the circuit board against the adsorption plate along the thickness direction of the adsorption plate.

[0015] In one embodiment, the clamping unit includes a rotating shaft and a clamping member. The rotating shaft is rotatably connected to the bearing plate, and the clamping member is fixedly mounted on the rotating shaft and used to press against the circuit board.

[0016] In one embodiment, at least one of the following schemes is also included:

[0017] The two clamping units are respectively referred to as the first clamping unit and the second clamping unit. The rotating shaft of the first clamping unit is referred to as the first rotating shaft, and the rotating shaft of the second clamping unit is referred to as the second rotating shaft. The first clamping unit also includes two fixing members, which are fixedly disposed on the support plate and rotatably connected to the first rotating shaft. The second clamping unit also includes a first moving member and a second moving member, which are rotatably connected to the second rotating shaft. The first moving member is slidably connected to the support plate. The support plate has a plurality of spaced mounting holes, and the second moving member can be fixed through different mounting holes.

[0018] The clamping unit further includes a mounting frame, a driving component, a first connecting component, a second connecting component, and a swinging component. The mounting frame is connected to the base. The driving component is disposed on the mounting frame and connected to the first connecting component. The first connecting component is slidably disposed on the mounting frame along the thickness direction of the adsorption plate. The two ends of the second connecting component are rotatably connected to the first connecting component and the swinging component, respectively. The swinging component is rotatably connected to the rotating shaft.

[0019] In one embodiment, at least one of the following schemes is also included:

[0020] It also includes a sliding member, which is fixedly connected to the surface of the base on the two adsorption mechanisms facing away from the adsorption plate;

[0021] The adsorption mechanism further includes a first fastener. The support plate has a first surface and a second surface in the thickness direction. The first surface contacts the base, and the second surface contacts the adsorption plate. A fastening hole is formed on the first surface at a predetermined distance from the second surface. The first fastener passes through the base and engages with the fastening hole.

[0022] The adsorption mechanism further includes a second fastener, a filler, and a slider. The slider is disposed on the surface of the base facing away from the support plate. The support plate has a through hole on its surface facing the adsorption plate. The second fastener passes through the through hole and fixes the base and the slider together. The filler engages with the through hole, and the end face of the filler is flush with the surface of the support plate facing the adsorption plate.

[0023] A support platform includes a support body and an adsorption device as described above, wherein the adsorption device is disposed on the support body.

[0024] A laser processing device includes a processing apparatus and the aforementioned support platform, wherein the processing apparatus is used to process circuit boards.

[0025] One technical advantage of one embodiment of this application is that, given the adsorption plate on the carrier plate, the circuit board is attached to the adsorption plate rather than the carrier plate, and the pore size of the adsorption holes is smaller than that of the vacuum holes, resulting in a higher distribution density of the adsorption holes than the vacuum holes, when a thin circuit board is adsorbed onto the adsorption plate, the circuit board will be subjected to uniform force, effectively preventing warping and uneven deformation, thereby improving the flatness of the circuit board. Therefore, during the processing of the circuit board using processing equipment, the processing accuracy of the circuit board will be significantly improved. Attached Figure Description

[0026] Figure 1 This is a three-dimensional structural schematic diagram of an adsorption device provided in one embodiment.

[0027] Figure 2 for Figure 1 The diagram shows a three-dimensional structure of the adsorption device from another perspective.

[0028] Figure 3 for Figure 1 A three-dimensional cross-sectional view of the adsorption device shown.

[0029] Figure 4 for Figure 1 A partial three-dimensional structural diagram of the adsorption plate in the adsorption device shown.

[0030] Figure 5 for Figure 1A partial planar structural diagram of the adsorption plate in the adsorption device shown.

[0031] Figure 6 for Figure 1 A schematic diagram of the exploded structure of the adsorption device shown.

[0032] Figure 7 for Figure 6 Enlarged structural diagram at point A in the middle.

[0033] Figure 8 for Figure 6 Enlarged structural diagram at point B.

[0034] Reference numerals: Adsorption device 10, Adsorption mechanism 11, Sliding member 12, Circuit board 20, Base 100, Vacuum chamber 110, Bearing plate 200, Vacuum hole 210, Mounting hole 220, First surface 230, Fastening hole 231, Second surface 240, Alternating hole 241, Adsorption plate 300, Adsorption hole 310, Edge hole 311, Mounting surface 320, First groove 321, Second groove 322, Adsorption surface 330, Pressing unit 400, Rotating shaft 410, Pressing member 420, Mounting bracket 430, Driving member 440, First connecting member 451, Second connecting member 452, Swinging member 460, First pressing unit 401, First rotating shaft 411, Fixing member 401a, Second pressing unit 402, Second rotating shaft 412, First moving member 402a, Second moving member 402b, Second fastener 510, Filler 520. Detailed Implementation

[0035] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0036] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0037] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0038] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0039] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0040] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0041] See Figure 1 , Figure 2 and Figure 3An adsorption device 10 provided in one embodiment of this application is used to attach a circuit board 20 to be processed. The circuit board 20 is relatively thin, with a thickness of approximately 0.05 mm. The adsorption device 10 includes an adsorption mechanism 11, which includes a base 100, a support plate 200, and an adsorption plate 300. The support plate 200 is disposed on the base 100, and the support plate 200 and the base 100 form a vacuum cavity 110. Vacuum holes 210 are formed on the support plate 200, and there are multiple vacuum holes 210, all of which are in fluid communication with the vacuum cavity 110. The adsorption plate 300 is disposed on the support plate 200, and there are multiple adsorption holes 310, which are in fluid communication with the vacuum holes 210. The circuit board 20 is adsorbed onto the adsorption plate 300 through the adsorption holes 310. The pore size of the adsorption pore 310 is smaller than that of the vacuum pore 210, and the distribution density of the adsorption pore 310 is higher than that of the vacuum pore 210. The so-called distribution density can be understood as the number of pores per unit area.

[0042] If the thin circuit board 20 is directly adsorbed onto the carrier plate 200, given the large aperture and low density of the vacuum holes 210, the thin circuit board 20 will easily experience stress imbalance when adsorbed onto the carrier plate 200. This can lead to warping and uneven deformation of the circuit board 20, affecting its flatness. Furthermore, this will affect the processing accuracy of the circuit board 20 during manufacturing.

[0043] See Figure 1 , Figure 2 and Figure 3 Regarding the adsorption device 10 in the above embodiments, since an adsorption plate 300 is additionally provided on the support plate 200, and the circuit board 20 is attached to the adsorption plate 300 instead of the support plate 200, and the pore size of the adsorption holes 310 is smaller than that of the vacuum holes 210, the distribution density of the adsorption holes 310 is higher than that of the vacuum holes 210, when the thin circuit board 20 is adsorbed onto the adsorption plate 300, the circuit board 20 will be subjected to uniform force, effectively preventing warping and uneven deformation of the circuit board 20, thereby improving the flatness of the circuit board 20. Therefore, the processing accuracy of the circuit board 20 will be greatly improved during the processing of the circuit board 20 using processing equipment.

[0044] See Figure 1 , Figure 2 and Figure 3In some embodiments, the pore size of the adsorption pore 310 is 0.2 mm to 0.3 mm, for example, the pore size of the adsorption pore 310 can be 0.2 mm, 0.25 mm or 0.3 mm. The spacing between any two adjacent adsorption pores 310 is 2 mm to 0.3 mm, for example, the spacing between any two adjacent adsorption pores 310 can be 2 mm, 2.5 mm or 3 mm, etc. The spacing between any two adjacent adsorption pores 310 can be smaller than the spacing between any two adjacent vacuum pores 210, so that the distribution density of the adsorption pores 310 is higher than the distribution density of the vacuum pores 210.

[0045] See Figure 4 , Figure 5 and Figure 6 In some embodiments, the adsorption plate 300 has a mounting surface 320 and an adsorption surface 330. The mounting surface 320 and the adsorption surface 330 are two surfaces that are arranged opposite each other in the thickness direction of the adsorption plate 300. The mounting surface 320 contacts the support plate 200, and the adsorption surface 330 is used to contact the circuit board 20. Taking a first direction and a second direction that are perpendicular to each other as a reference, the first direction can be the length direction of the adsorption plate 300, and the second direction can be the width direction of the adsorption plate 300. A first groove 321 is recessed in the mounting surface 320. The first groove 321 can extend along the first direction, and there are multiple first grooves 321, which are spaced apart along the second direction. The first groove 321 is a blind groove, so that the first groove 321 is spaced apart from the adsorption surface 330 by a certain distance. An adsorption hole 310 is formed on the bottom wall surface of the first groove 321. By setting the first groove 321, on the one hand, the supporting plate 200 can avoid blocking some of the adsorption holes 310, so that the vacuum generated by the vacuum hole 210 can be conducted to all the adsorption holes 310 through the first groove 321, ensuring that the circuit board 20 is subjected to uniform force and preventing the circuit board 20 from deforming during the adsorption process, which would affect the processing accuracy. On the other hand, it can improve the flatness of the adsorption plate 300, thereby further improving the flatness and processing accuracy of the circuit board 20.

[0046] See Figure 4 , Figure 5 and Figure 6In some embodiments, a second groove 322 is recessed on the mounting surface 320. The second groove 322 can extend along a second direction, and there are multiple second grooves 322. These multiple second grooves 322 are spaced apart along a first direction, so that the second grooves 322 are intersecting and connected to each other. The second groove 322 is a blind groove, so that the second groove 322 is spaced apart from the adsorption surface 330 by a certain distance. Adsorption holes 310 are also formed on the bottom wall of the second groove 322. By setting the second groove 322, on the one hand, the blocking effect of the support plate 200 on some of the adsorption holes 310 can be avoided, so that the vacuum generated by the vacuum hole 210 can be more easily conducted to all the adsorption holes 310 through the first groove 321 and the second groove 322, ensuring that the circuit board 20 is subjected to uniform force and avoiding deformation of the circuit board 20 during adsorption, which would affect the processing accuracy. On the other hand, it can improve the flatness of the adsorption plate 300, thereby further improving the flatness and processing accuracy of the circuit board 20.

[0047] See Figure 4 , Figure 5 and Figure 6 In some embodiments, the width of both the first groove 321 and the second groove 322 is 0.5 mm to 1.5 mm, for example, the width of both the first groove 321 and the second groove 322 can be 0.5 mm, 1 mm, or 1.5 mm, etc. The depth of both the first groove 321 and the second groove 322 is 0.4 mm to 0.8 mm. For example, the depth of both the first groove 321 and the second groove 322 can be 0.4 mm, 0.6 mm, or 0.8 mm, etc.

[0048] See Figure 4 , Figure 5 and Figure 6 In some embodiments, the adsorption plate 300 has a coverage area covered by the circuit board 20. The adsorption hole 310 located at the outermost edge of the coverage area is designated as the edge hole 311. The diameter of the edge hole 311 is larger than that of the adsorption holes 310 at other locations within the coverage area. By setting the diameter of the edge hole 311 to be relatively large, the adsorption force of the edge hole 311 on the edge of the circuit board 20 can be reasonably improved, thereby preventing warping or folding of the edge of the circuit board 20. This improves the flatness and processing accuracy of the circuit board 20.

[0049] See Figure 1 and Figure 6In some embodiments, the adsorption mechanism 11 further includes a pressing unit 400, which is connected to the support plate 200 and applies a force to the circuit board 20 along the thickness direction of the adsorption plate 300. For example, the number of pressing units 400 can be one or more. When there are two pressing units 400, the two pressing units 400 are connected to the support plate 200 and are spaced apart along a first direction or a second direction. The pressing units 400 can apply a force to the circuit board 20 along the thickness direction of the adsorption plate 300, so that the circuit board 20 is pressed and sandwiched between the pressing units 400 and the adsorption plate 300. For example, the two pressing units 400 press the two ends of the circuit board 20 that are opposite to each other in the first direction or the second direction against the adsorption plate 300. During the processing of circuit board 20, the dust removal mechanism generates negative pressure to remove dust generated during processing on the surface of circuit board 20. Meanwhile, the laser processing equipment can create through holes in circuit board 20, extending along its thickness and penetrating the entire circuit board 20. These through holes weaken the vacuum adsorption force of the adsorption plate 300 on circuit board 20. However, due to the presence of the clamping unit 400, the reduced vacuum adsorption force of the adsorption plate 300 on circuit board 20 effectively prevents the negative pressure generated by the dust removal mechanism from overcoming the vacuum adsorption force of the adsorption plate 300, thus preventing circuit board 20 from detaching from the adsorption plate 300 and ensuring the normal processing of circuit board 20.

[0050] In other embodiments, the number of clamping units 400 can be four, and the four clamping units 400 are respectively disposed at the ends of the support plate 200 that are disposed opposite each other in the length direction and the width direction.

[0051] See Figure 6 , Figure 7 and Figure 8In some embodiments, the clamping unit 400 includes a rotating shaft 410 and a clamping member 420. The rotating shaft 410 is rotatably connected to the support plate 200, and the extending direction of the rotating shaft 410 may be parallel to the adsorption surface 330. The clamping member 420 is fixedly disposed on the rotating shaft 410 and is used to press against the circuit board 20. When the rotating shaft 410 rotates in the forward direction and the clamping member 420 contacts the circuit board 20, the clamping member 420 can apply a clamping force to the circuit board 20. When the rotating shaft 410 rotates in the reverse direction at a certain angle and the clamping member 420 disengages from the circuit board 20, the clamping effect of the clamping member 420 on the circuit board 20 can be released. This can avoid interference from the clamping member 420, and the circuit board 20 can be unloaded from the adsorption plate 300 or placed on the adsorption plate 300. In other embodiments, the clamping member 420 can be slidably connected to the adsorption plate 300 along the thickness direction of the adsorption plate 300. When the clamping member 420 moves downward toward the adsorption plate 300, it can apply a clamping force to the circuit board 20. When the clamping member 420 moves downward away from the adsorption plate 300 by a set distance, it can avoid interference from the clamping member 420 and smoothly realize the loading and unloading of the circuit board 20 relative to the adsorption plate 300.

[0052] See Figure 6 , Figure 7 and Figure 8In some embodiments, when there are two clamping units 400, the two clamping units 400 are respectively referred to as the first clamping unit 401 and the second clamping unit 402. The rotating shaft 410 of the first clamping unit 401 is referred to as the first rotating shaft 411, and the rotating shaft 410 of the second clamping unit 402 is referred to as the second rotating shaft 412. The first clamping unit 401 also includes two fixing members 401a, which are fixedly mounted on the support plate 200. The first rotating shaft 411 is rotatably connected to the two fixing members 401a, and the two fixing members 401a are spaced apart along the axial direction of the first rotating shaft 411. The second clamping unit 402 also includes a first moving member 402a and a second moving member 402b, both of which are rotatably connected to the second rotating shaft 412, and the first moving member 402a and the second moving member 402b are spaced apart along the axial direction of the second rotating shaft 412. With the interval between the first rotating shaft 411 and the second rotating shaft 412 as a reference direction, the first moving member 402a is slidably connected to the adsorption plate 300 along this reference direction. The support plate 200 has multiple mounting holes 220, which are spaced apart along the reference direction. The second moving member 402b can be fixed through different mounting holes 220. For example, the second moving member 402b can be fixedly connected to the support member by bolts passing through the mounting holes 220. When the bolts are engaged with different mounting holes 220, the installation position of the second moving member 402b on the support member along the reference direction can be changed. Therefore, by fixing the second moving member 402b to the adsorption plate 300 through different mounting holes 220, the installation position of the second moving member 402b on the support plate 200 along the reference direction can be changed, and the first moving member 402a can slide relative to the support plate 200, thereby changing the installation position of the first moving member 402a on the support plate 200 along the reference direction. Therefore, the first rotating shaft 411 can be fixed in position in the reference direction, while the second rotating shaft 412 can be adjusted in position along the reference direction, thereby changing the distance between the second rotating shaft 412 and the first rotating shaft 411 along the reference direction, so that the first pressing unit 401 and the second pressing unit 402 can be adapted to circuit boards 20 of different sizes.

[0053] See Figure 6 , Figure 7 and Figure 8In some embodiments, the pressing unit 400 further includes a mounting frame 430, a driving member 440, a first connecting member 451, a second connecting member 452, and a swing member 460. The mounting frame 430 is connected to the base 100. The driving member 440 is disposed on the mounting frame 430 and connected to the first connecting member 451. The first connecting member 451 is slidably disposed on the mounting frame 430 along the thickness direction of the adsorption plate 300, so that the driving member 440 can drive the first connecting member 451 to slide back and forth along the thickness direction of the adsorption plate 300. The two ends of the second connecting member 452 are rotatably connected to the first connecting member 451 and the swing member 460, respectively. The swing member 460 is rotatably connected to the rotating shaft 410. The axes around which the second connecting member 452 and the swing member 460 rotate can both be parallel to the adsorption surface 330. When the first connecting member 451 moves, it will drive the rotating shaft 410 to rotate through the second connecting member 452 and the swing member 460. In other embodiments, the shaft 410 can be directly driven by a motor or hydraulic cylinder to generate rotation.

[0054] See Figure 2 and Figure 3 In some embodiments, the adsorption device 10 further includes a slider 12, which is fixedly connected to the surface of the base 100 on the two adsorption mechanisms 11 facing away from the adsorption plate 300. That is, the slider 12 fixes the two bases 100 on the two adsorption mechanisms 11, and the two bases 100 share one slider 12. When the slider 12 is driven by the driver, the two adsorption mechanisms 11 can follow the slider 12 to generate synchronous movement.

[0055] See Figure 2 and Figure 3 In some embodiments, the adsorption mechanism 11 further includes a first fastener. The support plate 200 has a first surface 230 and a second surface 240, which are two surfaces opposite to each other in the thickness direction of the support plate 200. The first surface 230 contacts the base 100, and the second surface 240 contacts the adsorption plate 300. A fastening hole 231 is provided on the first surface 230, and the fastening hole 231 is spaced apart from the second surface 240 by a certain distance, i.e., the fastening hole 231 is a blind hole. The first fastener passes through the base 100 and cooperates with the fastening hole 231, thus realizing the fixed connection between the support plate 200 and the base 100. The first fastener can be a bolt, etc., and the fastening hole 231 can be a threaded hole. Since the fastening hole 231 is a blind hole, i.e., the fastening hole 231 does not penetrate the second surface 240, the fastening hole 231 can avoid affecting the flatness of the adsorption plate 300, thereby improving the processing accuracy of the circuit board 20.

[0056] See Figure 2 and Figure 3In some embodiments, the adsorption mechanism 11 further includes a second fastener 510 and a filler 520. A slider 12 is disposed on the surface of the base 100 facing away from the support plate 200. A clearance hole 241 is formed on the second surface 240 of the support plate 200, obviously facing the adsorption plate 300. The diameter of the clearance hole 241 is larger than the cross-sectional size of the second fastener 510, allowing the second fastener 510 to pass through it. The clearance hole 241 is a through hole, thus penetrating both the first surface 230 and the second surface 240. The second fastener 510 passes through the clearance hole 241 and securely connects the base 100 and the slider 12. The second fastener 510 can be a bolt, etc. The filler 520 cooperates with the clearance hole 241 to seal the clearance hole 241. The filler 520 has good wear resistance, and the end face of the filler 520 is flush with the second surface 240 of the support plate 200. This can prevent the clearance hole 241 from affecting the flatness of the adsorption plate 300, thereby improving the processing accuracy of the circuit board 20.

[0057] See Figure 2 and Figure 3 During assembly, the support plate 200 and the base 100 can be fixedly connected by the first fastener, and then the base 100 with the support plate 200 fixed thereon can be fixedly connected to the sliding member 12 by the second fastener 510. After the base 100 and the sliding member 12 are fixed, the filler 520 can be placed in the clearance hole 241 to seal the clearance hole 241.

[0058] It is understandable that when the circuit board 20 is thin, it needs to be placed on the adsorption plate 300 to prevent deformation, thereby ensuring the subsequent processing accuracy of the circuit board 20. For circuit boards 20 that are thicker and less prone to deformation, the adsorption plate 300 can be omitted, and the thicker circuit board 20 can be directly placed and adsorbed onto the support plate 20 for processing. Therefore, this adsorption mechanism 11 can process not only thin circuit boards 20 but also thick circuit boards 20, allowing the same adsorption device 10 to process various types of circuit boards 20 to ensure processing accuracy. This improves the applicability of the adsorption device 10 to various working conditions and ultimately enhances the versatility of the entire adsorption device 10.

[0059] This application also provides a support platform, which includes a support body and the aforementioned adsorption device 10. The adsorption device 10 is disposed on the support body, so that the support body can support the adsorption device, thereby facilitating the processing of the circuit board 20.

[0060] This application also provides a laser processing device, which includes a processing apparatus and the aforementioned support platform. The processing apparatus is used to process the circuit board 20. Since the circuit board 20 is adsorbed on the adsorption apparatus 10, the flatness of the circuit board 20 can be improved, thereby improving the processing accuracy of the processing apparatus on the circuit board 20.

[0061] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0062] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An adsorption device for adsorbing circuit boards, characterized in that, The adsorption device includes an adsorption mechanism, which includes: Base; A support plate is disposed on the base, the support plate and the base forming a vacuum cavity, and the support plate has multiple vacuum holes communicating with the vacuum cavity; and An adsorption plate is disposed on the support plate. The adsorption plate has multiple adsorption holes that communicate with the vacuum holes and are used to adsorb the circuit board. The diameter of the adsorption holes is smaller than the diameter of the vacuum holes, and the distribution density of the adsorption holes is higher than the distribution density of the vacuum holes.

2. The adsorption device according to claim 1, characterized in that, The adsorption plate has a mounting surface and an adsorption surface that are arranged opposite to each other in the thickness direction. The mounting surface is in contact with the support plate, and the adsorption surface is used to contact the circuit board. A plurality of first grooves are recessed on the mounting surface and spaced apart. The first grooves are spaced apart from the adsorption surface by a set distance. The adsorption holes are formed on the bottom wall surface of the first grooves.

3. The adsorption device according to claim 2, characterized in that, The mounting surface is also recessed to form a plurality of second grooves spaced apart. The second grooves are intersected and connected to each other. The second grooves are spaced apart from the adsorption surface by a set distance. The bottom wall of the second groove is provided with the adsorption hole.

4. The adsorption device according to claim 1, characterized in that, The area of ​​the adsorption plate covered by the circuit board is called the covered area, and the adsorption hole located at the outermost edge of the covered area is called the edge hole. The diameter of the edge hole is larger than the diameter of the adsorption hole at other locations within the covered area.

5. The adsorption device according to claim 1, characterized in that, The adsorption mechanism further includes a pressing unit, which is connected to the support plate and is used to press the circuit board against the adsorption plate along the thickness direction of the adsorption plate.

6. The adsorption device according to claim 5, characterized in that, The adsorption mechanism includes at least two pressing units, which are spaced apart and are used to press the two opposite ends of the circuit board against the adsorption plate along the thickness direction of the adsorption plate.

7. The adsorption device according to claim 6, characterized in that, The clamping unit includes a rotating shaft and a clamping component. The rotating shaft is rotatably connected to the bearing plate, and the clamping component is fixedly mounted on the rotating shaft and used to press against the circuit board.

8. The adsorption device according to claim 7, characterized in that, It also includes at least one of the following options: The two clamping units are respectively referred to as the first clamping unit and the second clamping unit. The rotating shaft of the first clamping unit is referred to as the first rotating shaft, and the rotating shaft of the second clamping unit is referred to as the second rotating shaft. The first clamping unit also includes two fixing members, which are fixedly disposed on the support plate and rotatably connected to the first rotating shaft. The second clamping unit also includes a first moving member and a second moving member, which are rotatably connected to the second rotating shaft. The first moving member is slidably connected to the support plate. The support plate has a plurality of spaced mounting holes, and the second moving member can be fixed through different mounting holes. The clamping unit further includes a mounting frame, a driving component, a first connecting component, a second connecting component, and a swinging component. The mounting frame is connected to the base. The driving component is disposed on the mounting frame and connected to the first connecting component. The first connecting component is slidably disposed on the mounting frame along the thickness direction of the adsorption plate. The two ends of the second connecting component are rotatably connected to the first connecting component and the swinging component, respectively. The swinging component is rotatably connected to the rotating shaft.

9. The adsorption device according to claim 1, characterized in that, It also includes at least one of the following options: It also includes a sliding member, which is fixedly connected to the surface of the base on the two adsorption mechanisms facing away from the adsorption plate; The adsorption mechanism further includes a first fastener. The support plate has a first surface and a second surface in the thickness direction. The first surface contacts the base, and the second surface contacts the adsorption plate. A fastening hole is formed on the first surface at a predetermined distance from the second surface. The first fastener passes through the base and engages with the fastening hole. The adsorption mechanism further includes a second fastener, a filler, and a slider. The slider is disposed on the surface of the base facing away from the support plate. The support plate has a through hole on its surface facing the adsorption plate. The second fastener passes through the through hole and fixes the base and the slider together. The filler engages with the through hole, and the end face of the filler is flush with the surface of the support plate facing the adsorption plate.

10. A carrying platform, characterized in that, It includes a support body and an adsorption device according to any one of claims 1 to 9, wherein the adsorption device is disposed on the support body.

11. A laser processing device, characterized in that, It includes a processing device and a support platform as described in claim 10, wherein the processing device is used to process circuit boards.

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