Irregular hard and brittle material surface polishing equipment
By combining laser and mechanical polishing equipment, the problem of polishing irregular, hard, and brittle material surfaces has been solved, achieving efficient and precise polishing results, reducing the risk of breakage, and improving polishing accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- INNO LASER TECH CORP LTD
- Filing Date
- 2025-05-06
- Publication Date
- 2026-05-12
AI Technical Summary
In existing technologies, it is difficult to achieve efficient laser polishing and mechanical polishing simultaneously on irregular, hard, and brittle material surfaces. Laser polishing results in insufficient roughness, while mechanical polishing carries the risk of breakage.
By employing equipment that combines laser polishing and mechanical polishing, and utilizing a laser processing displacement platform, a laser processing device, a measuring station stage, and a mechanical polishing device, the surface height is optimized using a height measuring device to achieve efficient and precise polishing.
It reduces the risk of breakage during the polishing process of irregular, hard, and brittle materials, improves polishing efficiency and precision, and meets the requirements of mechanical polishing.
Smart Images
Figure CN224223239U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of polishing technology for hard and brittle materials, and specifically relates to a polishing device for the surface of irregular hard and brittle materials. Background Technology
[0002] Irregular hard and brittle materials include those that fracture under minimal deformation when subjected to external forces, exhibiting brittle characteristics. Current techniques for processing the surfaces of irregular hard and brittle materials (such as diamond) employ only mechanical polishing or laser polishing. However, laser polishing alone rarely achieves satisfactory surface roughness; and for irregular hard and brittle material surfaces, mechanical polishing alone carries the risk of sample breakage due to the irregularity, unevenness, and large undulations of the surface. Utility Model Content
[0003] The purpose of this invention is to provide a polishing device for irregular, hard, and brittle material surfaces to solve the aforementioned technical problems.
[0004] This application provides a polishing device for the surface of irregular hard and brittle materials, comprising:
[0005] Laser processing displacement platform, used to place products;
[0006] A laser processing device, positioned above a laser processing displacement platform, is used to perform laser processing on products;
[0007] The measuring station stage is set on one side of the laser processing displacement platform;
[0008] A height measuring device, positioned above the measuring station stage, is used to acquire the surface height of the product on the measuring station stage; and
[0009] Mechanical polishing equipment is used to mechanically polish products after laser processing.
[0010] In one embodiment of this application, the laser processing apparatus includes: a laser, several mirrors, and a scanning galvanometer.
[0011] In one embodiment of this application, the surface polishing equipment for irregular hard and brittle materials further includes a first conveying device and a second conveying device;
[0012] The first conveying device is used to move products between the laser processing displacement platform and the measuring station stage;
[0013] The second conveying device is used to move products between the measuring station stage and the mechanical polishing device.
[0014] In one embodiment of this application, the first handling device and the second handling device are robotic arms.
[0015] In one embodiment of this application, the height measuring device includes: a white light interferometer, a laser altimeter, a confocal microscope, or a contact altimeter probe.
[0016] In one embodiment of this application, the product includes silicon carbide, silicon nitride, diamond, or sapphire.
[0017] In one embodiment of this application, the mechanical polishing apparatus includes: a worktable, a polishing head, a polishing fluid delivery pipe, and a grinding head.
[0018] The beneficial effects of this utility model are:
[0019] Unlike existing technologies, this application provides a surface polishing device for irregular, hard, and brittle materials. This device includes: a laser processing displacement platform and a laser processing unit for laser processing of the product; a measuring station stage and a height measuring device for acquiring the surface height of the product on the measuring station stage; and a mechanical polishing device for mechanically polishing the laser-processed product. By combining laser polishing and mechanical polishing into a single device, it combines the high efficiency of laser polishing with the high precision of mechanical polishing, reducing the risk of breakage during the polishing process of irregular, hard, and brittle samples. The height measuring device can be used to acquire the surface height of the product on the measuring station stage, and high points can be repeatedly polished with a laser to remove them, thus meeting the requirements of mechanical polishing.
[0020] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.
[0021] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0022] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0023] Figure 1 This is a schematic diagram of a preferred embodiment of a surface polishing device for irregular hard and brittle materials.
[0024] In the picture:
[0025] Product 100, Control Module 200, Laser Processing Displacement Platform 1, Laser Processing Device 2, Laser 21, Reflector 22, Scanning Galvanometer 23, Measuring Station Stage 3, Height Measuring Device 4, Mechanical Polishing Device 5, Worktable 51, Grinding Head 52, Polishing Fluid Delivery Pipe 53, Grinding Head 54, First Transport Device 6, Second Transport Device 7. Detailed Implementation
[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0027] Current technologies for processing irregular, hard, and brittle materials (such as diamond) involve only mechanical polishing or laser polishing. However, laser polishing alone is unlikely to achieve a very high surface roughness; and for irregular, hard, and brittle material surfaces, mechanical polishing alone carries the risk of sample breakage due to the irregularity and unevenness of the surface.
[0028] This application provides a polishing device for irregular, hard, and brittle material surfaces. By combining laser polishing and mechanical polishing into one device, it combines the high efficiency of laser polishing with the high precision of mechanical polishing, reducing the risk of breakage during the polishing process of irregular, hard, and brittle samples. A height measuring device can be used to obtain the surface height of the product on the measuring station platform. The highest point can be repeatedly polished with a laser to meet the requirements of mechanical polishing. Detailed descriptions are provided below. It should be noted that the order of description in the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.
[0029] See Figure 1 In one embodiment, the surface polishing equipment for irregular hard and brittle materials includes: a laser processing displacement platform 1 for placing a product 100; a laser processing device 2 disposed above the laser processing displacement platform 1 for laser processing the product 100; a measuring station stage 3 disposed on one side of the laser processing displacement platform 1; a height measuring device 4 disposed above the measuring station stage 3 for obtaining the surface height of the product 100 on the measuring station stage 3; and a mechanical polishing device 5 for mechanically polishing the laser-processed product 100.
[0030] Specifically, the laser processing device 2 may include: a laser 21, several reflectors 22, and a scanning galvanometer 23. The wavelength of the laser 21 may include ultraviolet, green, or infrared light, and the pulse width may include nanoseconds, picoseconds, and femtoseconds. The several reflectors 22 can be configured to adjust the laser propagation direction as needed. The scanning galvanometer may be, but is not limited to, general-purpose scanning galvanometers such as Scanlab, Reno, and Raytron. The control module 200 may be a computer, which can be used to control the laser 21, the laser processing displacement platform 1, and the scanning galvanometer 23.
[0031] Optionally, the surface polishing equipment for irregular hard and brittle materials further includes a first transport device 6 and a second transport device 7; the first transport device 6 is used to transport the product 100 between the laser processing displacement platform 1 and the measuring station stage 3; the second transport device 7 is used to transport the product 100 between the measuring station stage 3 and the mechanical polishing device 5.
[0032] Optionally, the first handling device 6 and the second handling device 7 are robotic arms.
[0033] Of course, in some other embodiments, manual handling may also be used.
[0034] Optionally, the height measuring device 4 can be, but is not limited to, a white light interferometer, a laser altimeter, a confocal microscope, or a contact height probe, etc., used for measuring height or distance. The height measuring device 4 can measure the surface height of the product, generate a surface height map, and send it to the control module 200. The control module 200 can then control the laser 21, the laser processing displacement platform 1, and the scanning galvanometer 23 to perform laser polishing based on the product's surface height. It should be noted that this application does not modify the software or program described herein; those skilled in the art can fully implement the above control process based on existing technology. This application aims to improve the composition and arrangement of the equipment.
[0035] Optionally, the product 100 includes silicon carbide, silicon nitride, diamond, or sapphire.
[0036] In this embodiment, the mechanical polishing device 5 can be a commercially available mechanical polishing equipment, such as the mechanical polishing equipment from Xike Industrial. In one application scenario, the mechanical polishing device 5 may include: a worktable 51, a grinding head 52, a polishing slurry delivery pipe 53, and a grinding head 54.
[0037] In one application scenario, the working process of a polishing device for irregular, hard, and brittle material surfaces is as follows:
[0038] 1. Measurement: The product 100 to be polished obtains a surface height map through the height measuring device 4. Then, the product 100 is transferred to the laser processing displacement platform 1 through the first conveying device 6.
[0039] 2. Laser Polishing: Based on the measurement results of the height measuring device 4, the laser is controlled to perform directional laser removal on areas of excessive height on the surface of product 100. After laser removal, the first conveying device 6 moves product 100 back to the measuring station platform 3. The height of the product 100 surface is measured by the height measuring device 4. If the height difference of the product 100 surface does not meet the requirements of the mechanical polishing device 5, the laser polishing process will be repeated until the required height difference for mechanical polishing is achieved.
[0040] 3. Mechanical Polishing: After the laser scanning polishing of the product surface reaches the standard for mechanical polishing, it is transferred to the mechanical polishing device 5 via the second transport device 7 for mechanical polishing. Mechanical polishing completes the entire polishing process.
[0041] It should be noted that all the devices (parts whose specific structures are not specified) selected in this application are general standard parts or parts known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.
[0042] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0043] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0044] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification.
Claims
1. A polishing device for the surface of irregular, hard, and brittle materials, characterized in that, include: A laser processing displacement platform (1) is used to place the product (100); A laser processing device (2) is set above the laser processing displacement platform (1) and is used to perform laser processing on the product (100); The measuring station stage (3) is set on one side of the laser processing displacement platform (1); A height measuring device (4) is installed above the measuring station platform (3) to obtain the surface height of the product (100) on the measuring station platform (3); and Mechanical polishing device (5) is used to mechanically polish the laser-processed product (100).
2. The surface polishing equipment for irregular hard and brittle materials according to claim 1, characterized in that, The laser processing device (2) includes: a laser (21), several mirrors (22) and a scanning galvanometer (23).
3. The surface polishing equipment for irregular hard and brittle materials according to claim 1, characterized in that, The surface polishing equipment for irregular hard and brittle materials also includes a first handling device (6) and a second handling device (7); The first conveying device (6) is used to convey the product (100) between the laser processing displacement platform (1) and the measuring station stage (3); The second conveying device (7) is used to convey the product (100) between the measuring station stage (3) and the mechanical polishing device (5).
4. The surface polishing equipment for irregular hard and brittle materials according to claim 3, characterized in that, The first handling device (6) and the second handling device (7) are robotic arms.
5. The surface polishing equipment for irregular hard and brittle materials according to claim 1, characterized in that, The height measuring device (4) includes: a white light interferometer, a laser altimeter, a confocal microscope, or a contact height measuring probe.
6. The surface polishing equipment for irregular hard and brittle materials according to claim 1, characterized in that, The product (100) includes silicon carbide, silicon nitride, diamond, or sapphire.
7. The surface polishing equipment for irregular hard and brittle materials according to claim 1, characterized in that, The mechanical polishing device (5) includes: a worktable (51), a polishing head (52), a polishing liquid delivery pipe (53), and a grinding head (54).