Rotatable wire cutting machine for silicon ingot

Abstract

The utility model provides a silicon ingot rotatable wire cutting machine which comprises a machine frame, a bearing table and a wire cutting mechanism, and a Z-direction feeding mechanism drives the wire cutting mechanism to ascend and descend in the height direction to cut a silicon ingot on the bearing table. The X-direction feeding mechanism comprises an X-direction linear guide rail, an X-direction sliding block and a rotary working table, the rotary working table comprises a working table base and a rotary driving mechanism, the working table base is fixed to the X-direction sliding block, and the bearing table is arranged on the working table base and driven by the rotary driving mechanism to rotate on the horizontal plane. The silicon ingot cutting device is reasonable in structural design, and the Z-direction feeding mechanism is utilized in the height direction to cut silicon ingots up and down. According to the silicon ingot cutting machine, cutting and partitioning of a silicon ingot can be achieved, meanwhile, face and shape modifying operation can be conducted on the silicon ingot in the circumferential direction, cutting and shape modifying are integrated in the same machine, the operation machining procedure is effectively simplified, when the same silicon ingot is machined, machining errors caused by multiple times of disassembly and assembly can be reduced, and the cutting precision is further improved.

Description

Technical Field

[0001] This utility model relates to the field of wire cutting machine technology, and in particular to a silicon ingot rotatable wire cutting machine. Background Technology

[0002] In silicon material processing, silicon ingots grown using processes such as the Czochralski method or directional solidification often have irregular cylindrical shapes, with possible crystal edges on the outer surface and tapered ends at both the head and tail. This irregular shape is not conducive to subsequent silicon wafer cutting and processing. By squaring, silicon ingots can be cut into regular shapes, such as rectangles or squares, making them more suitable for subsequent processing requirements.

[0003] Existing silicon ingot wire cutting machines use the high-speed reciprocating motion of metal wires (such as steel wire) to bring abrasives into the semiconductor processing area for grinding, thereby cutting the silicon ingots. Typically, the silicon ingot is placed on a support platform, and a drive motor and cutting wire assembly work together to precisely cut the ingot. Existing wire cutting machines are usually large-scale cutting equipment, such as multi-wire cutting machines, which are designed with multiple wire assemblies working simultaneously to complete the cutting operation of large silicon ingots. Multi-wire cutting machines, operated by a Z-axis feed mechanism, complete the cutting operation of the silicon ingot in the vertical direction.

[0004] This squaring operation is typically performed on large silicon ingots, but it is insufficient for the fine cutting of silicon ingots. Furthermore, during the formation of silicon ingots, the outer surface has irregularities. When cutting with existing wire cutters, it is necessary to first use the wire cutter to trim the surface of the silicon ingot, or after squaring, to further shape each of the smaller squared ingots. The operation process is quite cumbersome and still has room for improvement. Utility Model Content

[0005] The technical problem to be solved by this utility model is: in order to overcome the shortcomings of the prior art, this utility model provides a silicon ingot rotatable wire cutting machine, which can drive the wire cutting mechanism to cut the silicon ingot in the height direction. At the same time, the silicon ingot can be fed linearly and rotated horizontally as needed in the horizontal direction, thereby realizing the silicon ingot feeding and circumferential rotation, which facilitates the cutting and circumferential surface finishing of the silicon ingot.

[0006] The technical solution adopted by this utility model to solve its technical problem is: a silicon ingot rotatable wire cutting machine for cutting silicon ingots, including a frame, a support platform, and a cutting mechanism. The silicon ingot is loaded and placed on the support platform. The frame is respectively provided with an X-axis feeding mechanism and a Z-axis feeding mechanism. The cutting mechanism includes a cutting metal wire, a first active guide wheel, and a second active guide wheel. The cutting metal wire passes through the first and second active guide wheels and forms a cutting line parallel to the horizontal direction. The Z-axis feeding mechanism drives the cutting mechanism to move up and down in the height direction to cut the silicon ingot on the support platform. The X-axis feeding mechanism includes an X-axis linear guide rail, an X-axis slider, and a rotary worktable. The X-axis linear guide rails are distributed in pairs along the horizontal direction on the frame, and an X-axis slider is slidably provided on each X-axis linear guide rail. The rotary worktable includes a worktable base and a rotary drive mechanism. The worktable base is fixed on the X-axis slider, and the support platform is set on the worktable base and driven by the rotary drive mechanism to rotate on the horizontal plane.

[0007] In the above scheme, the silicon ingot on the carrier platform is cut by raising and lowering the tangent mechanism driven by the Z-axis feed mechanism. In the X-axis feed mechanism, the silicon ingot can be fed linearly in the horizontal direction by the cooperation of the X-axis linear guide and the X-axis slider. At the same time, by setting up a rotary table, a rotary feed can be provided on the basis of the horizontal linear feed, so that the silicon ingot can be rotated accordingly, thereby cutting the silicon ingot after it has been rotated.

[0008] Furthermore, the frame is provided with a Z-axis linear guide rail along the height direction, a Z-axis slider is slidably provided on the Z-axis linear guide rail, a Z-axis lifting worktable is fixed on the Z-axis slider, and the Z-axis feed mechanism drives the Z-axis slider to move along the Z-axis linear guide rail; the active guide wheel of the tangent mechanism is rotatably mounted on the Z-axis lifting worktable.

[0009] Furthermore, the tangent mechanism is equipped with a first take-up / unwinding mechanism, a first tensioning mechanism, and a first auxiliary guide wheel corresponding to the first active guide wheel; the tangent mechanism is equipped with a second take-up / unwinding mechanism, a second tensioning mechanism, and a second auxiliary guide wheel corresponding to the second active guide wheel. The initial segment of the metal wire being cut is unwound through the first take-up / unwinding mechanism, enters the first tensioning mechanism, passes around the first auxiliary guide wheel, goes through the first active guide wheel, the second active guide wheel, the second auxiliary guide wheel, and the second tensioning mechanism, and is then wound up by the first take-up / unwinding mechanism. Through the design of the take-up / unwinding mechanism, the tensioning mechanism, and the auxiliary guide wheel, the two active guide wheels can be provided with auxiliary actions for winding and tensioning the metal wire, thereby ensuring the continuous movement and tension of the metal wire during the cutting process, thus guaranteeing cutting efficiency and cutting effect.

[0010] Furthermore, the first and second tensioning mechanisms have identical structures, both including a tensioning guide wheel, a tension arm rocker arm, and a tensioning servo motor. The tensioning servo motor is fixed to the frame, one end of the tension arm rocker arm is fixed to the output end of the tensioning servo motor, and the other end is rotatably equipped with a tensioning guide wheel. By rotating the tension arm rocker arm driven by the tensioning servo motor, the position of the tensioning guide wheel can be adjusted relative to the corresponding side guide wheel, thereby tensioning the cutting metal wire.

[0011] Furthermore, the first and second winding mechanisms have the same structure, both including a winding motor, a winding drum, and a winding guide wheel assembly. The winding drum is driven at the output end of the winding motor. One end of the cutting metal wire is fixed to the winding drum and wound onto it, while the other end passes through the winding guide wheel assembly and is connected to the corresponding tension guide wheel for winding.

[0012] Preferably, the take-up and unwind guide roller assembly includes an upper longitudinal guide roller, a lower longitudinal guide roller, and a transverse guide roller arranged sequentially. The upper longitudinal guide roller, lower longitudinal guide roller, and transverse guide roller are arranged from top to bottom in the height direction, and the cross-section of the cut metal wire between adjacent guide rollers is distributed at 90°. Through the positioning of each guide roller, the cut metal wire connected between the take-up and unwind cable storage drum and the auxiliary guide roller can be effectively received and unwound, and the position can be rotated from the take-up and unwind mechanism side to the Z-axis lifting worktable.

[0013] Preferably, a correction device is also provided between the take-up and unwinding mechanism on each side and the take-up and unwinding guide wheel assembly. The correction device includes a correction wheel, and the cutting metal wire between the take-up and unwinding storage drum and the upper longitudinal guide wheel contacts the correction wheel and is guided and supported by the correction wheel.

[0014] Furthermore, the X-axis feed mechanism also includes an X-axis servo motor and a horizontally moving ball screw. The horizontally moving ball screw is mounted on the frame parallel to the X-axis linear guide rail via a support base. The X-axis servo motor is mounted on the frame and its output end is connected to the horizontally moving ball screw for transmission. The X-axis slider is configured to cooperate with the horizontally moving ball screw. The X-axis servo motor provides power to the horizontally moving ball screw, causing the horizontally moving ball screw to rotate, thereby driving the X-axis slider to perform a linear feed motion along the X-axis linear guide rail.

[0015] Furthermore, the rotary drive mechanism includes a rotary motor, a drive gear, and a rotating gear. The rotary motor is fixed to the worktable base, and the rotating gear and drive gear are rotatably mounted on the worktable base. The output end of the rotary motor is connected to the drive gear and drives the drive gear to rotate. The drive gear is also connected to the rotating gear. The support platform is fixed to the upper surface of the rotating gear. By driving the rotary motor, the drive gear and rotating gear can be rotated relative to the worktable base, and the rotating gear drives the support platform above it to rotate.

[0016] Furthermore, the surface of the support platform is rectangular, and each side of the rectangle has a cutting groove parallel to that side. The rectangular plane also has at least one set of cross-shaped grooves, each set including two slitting grooves arranged at a 90° angle. The cutting grooves provide operating space for the cutting metal wire to cut the silicon ingot circumferentially. The cross-shaped grooves provide operating space for the cutting metal wire to cross-divide the silicon ingot.

[0017] The beneficial effects of this utility model are that the silicon ingot rotatable wire cutting machine provided by this utility model has a reasonable structural design. It uses a Z-axis feed mechanism in conjunction with a tangent mechanism to perform vertical cutting motions on the silicon ingot in the height direction. At the same time, by utilizing the X-axis feed mechanism in conjunction with a rotary worktable, the silicon ingot can be driven to perform linear translational motion and horizontal rotational motion in the horizontal direction relative to the tangent mechanism. In conjunction with the Z-axis feed mechanism, not only can the silicon ingot be cut into blocks, but it can also perform circumferential surface trimming and shaping operations on the silicon ingot. Cutting and shaping are integrated into the same machine, which effectively simplifies the operation and processing procedures. When processing the same silicon ingot, it can reduce the processing errors caused by multiple disassembly and assembly, and further improve the cutting accuracy. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] Figure 1 This is the front view of this utility model.

[0020] Figure 2 This is a rear view of the present invention.

[0021] Figure 3 This is a side view of the present invention.

[0022] Figure 4 yes Figure 3 Sectional view of AA.

[0023] Figure 5 yes Figure 3 A cross-sectional view of BB.

[0024] Figure 6 This is a perspective view of the support platform in this utility model.

[0025] In the diagram: 1. Z-axis feed mechanism; 2. Tensioning guide wheel; 3. Gantry frame; 4. Z-axis linear guide rail; 5. First auxiliary guide wheel; 6. Lifting worktable; 7. First active guide wheel; 8. Bearing platform; 9. Worktable base; 10. X-axis slider; 11. X-axis linear guide rail; 12. Box base; 13. Second active guide wheel; 14. Rotary motor; 15. Correcting wheel; 16. Winding and unwinding storage drum; 17. Winding and unwinding motor; 18. Active gear; 19. Rotary gear; 20. X-axis servo motor; 21. Horizontal moving ball screw; 22. Cutting groove; 23. Sliding groove; 24. Second auxiliary guide wheel; 25. Cutting metal wire; 26. Support seat; 27. Tension arm rocker; 28. Tensioning servo motor; 29. ​​Upper longitudinal guide wheel; 30. Lower longitudinal guide wheel; 31. Transverse guide wheel. Detailed Implementation

[0026] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention. Therefore, they only show the components relevant to the present invention. Orientations and references (e.g., up, down, left, right, etc.) are only used to aid in the description of the features in the drawings. Therefore, the following specific embodiments are not intended to be restrictive, and the scope of the claimed subject matter is defined solely by the appended claims and their equivalents.

[0027] Example 1:

[0028] like Figures 1 to 5 The silicon ingot rotatable wire cutting machine shown is an embodiment of this utility model.

[0029] This small wire cutter is used to cut silicon ingots. The cutter includes a frame, a support platform 8, and a wire cutting mechanism.

[0030] The frame includes a housing base 12 and a gantry frame 3 fixed on the housing base 12. A long slot is provided on the housing base 12 below the gantry frame 3, and an X-axis feed mechanism is located at this slot. A Z-axis feed mechanism 1 and a tangent mechanism are respectively provided on the gantry frame 3.

[0031] The wire cutting mechanism includes a cutting metal wire 25, a first drive guide wheel 7, and a second drive guide wheel 13. The cutting metal wire 25 passes through the first drive guide wheel 7 and the second drive guide wheel 13, forming a cutting line parallel to the horizontal direction. Corresponding to the winding, unwinding, and tensioning of the cutting metal wire 25, the gantry frame 3 is equipped with a first winding / unwinding mechanism, a first tensioning mechanism, and a first auxiliary guide wheel 5 corresponding to the first drive guide wheel 7, and a second winding / unwinding mechanism, a second tensioning mechanism, and a second auxiliary guide wheel 24 corresponding to the second drive guide wheel 13.

[0032] The initial segment of the cutting metal wire 25 is unwound by the first take-up / unwind mechanism, enters the first tensioning mechanism, passes around the first auxiliary guide wheel 5, then through the first active guide wheel 7, the second active guide wheel 13, the second auxiliary guide wheel 24, and the second tensioning mechanism, before being wound up by the first take-up / unwind mechanism. The design of the take-up / unwind mechanism, tensioning mechanism, and auxiliary guide wheels provides auxiliary actions for winding and tensioning the cutting metal wire 25 to the two active guide wheels respectively. During the cutting operation, the movement of the cutting metal wire 25, from unwinding by the first take-up / unwind mechanism to winding by the second take-up / unwind mechanism, forms a shearing operation on the silicon ingot. Based on the length of the cutting metal wire 25, after completing a directional length of movement, the second take-up / unwind mechanism unwinds the wire, and the first take-up / unwind mechanism winds it up. The first and second take-up / unwind mechanisms then move in opposite directions, thus completing a continuous cutting operation.

[0033] The cable exit section of the tensioning guide wheel 2 located on the side of the first active guide wheel 7 is parallel to the cable inlet section of the first auxiliary guide wheel 5, and the cable exit section of the first auxiliary guide wheel 5 is parallel to the cable inlet section of the first active guide wheel 7; the cable inlet section of the tensioning guide wheel 2 located on the side of the second active guide wheel 13 is parallel to the cable exit section of the second auxiliary guide wheel 24, and the cable exit section of the second active guide wheel 13 is parallel to the cable inlet section of the second auxiliary guide wheel 24; the cable exit section of the first active guide wheel 7 is parallel to the cable inlet section of the second active guide wheel 13.

[0034] The initial segment of the cutting metal wire 25 is unwound by the first winding / unwinding mechanism, enters the first tensioning mechanism, passes around the first auxiliary guide wheel 5, then through the first active guide wheel 7, the second active guide wheel 13, the second auxiliary guide wheel 24, and the second tensioning mechanism, before being wound up by the first winding / unwinding mechanism. Through the design of the winding / unwinding mechanism, the tensioning mechanism, and the auxiliary guide wheels, auxiliary actions for winding and tensioning of the cutting metal wire 25 can be provided to the two active guide wheels respectively, thereby ensuring the continuous movement and tension of the cutting metal wire 25 during the cutting process, thus guaranteeing cutting efficiency and cutting effect.

[0035] In the winding and unwinding of the cut steel wire, the first and second winding and unwinding mechanisms have the same structure, both including a winding and unwinding motor 17, a winding and unwinding storage drum 16, and a winding and unwinding guide wheel assembly. The winding and unwinding storage drum 16 is driven at the output end of the winding and unwinding motor 17. One end of the cut metal wire 25 is fixed to the winding and unwinding storage drum 16 and wound on it. The other end passes through the winding and unwinding guide wheel assembly and is connected to the corresponding tension guide wheel 2 on the same side for winding. The winding and unwinding guide wheel assembly includes an upper longitudinal guide wheel 29, a lower longitudinal guide wheel 30, and a transverse guide wheel 31 arranged sequentially. The upper longitudinal guide wheel 29, the lower longitudinal guide wheel 30, and the transverse guide wheel 31 are arranged from top to bottom in the height direction, and the cross-section of the cut metal wire 25 between adjacent guide wheels is distributed at 90°. By setting the positions of each guide wheel, the cut metal wire 25 connected between the take-up and untake-up winding drum 16 and the auxiliary guide wheel can be effectively received or unwound, and the position can be turned from the take-up and untake-up mechanism side to the Z-axis lifting worktable 6.

[0036] A correction device is also provided between the take-up and unwinding mechanism on each side and the take-up and unwinding guide wheel assembly. The correction device includes a correction wheel 15. The cutting metal wire 25 between the take-up and unwinding storage drum 16 and the upper longitudinal guide wheel contacts the correction wheel 15 and is guided and supported by the correction wheel 15.

[0037] After the cutting wire is wound and unwound, it enters the auxiliary wheel and drive wheel to form the cutting line. A tensioning mechanism is then needed to provide tension to the cutting wire. In this embodiment, the first and second tensioning mechanisms have the same structure, both including a tensioning guide wheel 2, a tension arm rocker arm 27, and a tensioning servo motor 28. The tensioning servo motor 28 is fixed to the gantry frame 3. One end of the tension arm rocker arm 27 is fixed to the output end of the tensioning servo motor 28, and the other end is rotatably equipped with the tensioning guide wheel 2. By rotating the tension arm rocker arm 27 driven by the tensioning servo motor 28, the position of the tensioning guide wheel 2 can be adjusted relative to the corresponding side guide wheel, thereby tensioning the cutting metal wire 25.

[0038] The Z-axis feed mechanism 1 drives the tangent mechanism to move up and down in the height direction to cut the silicon ingot on the support platform 8. The gantry 3 is provided with a Z-axis linear guide 4 along the height direction, and a Z-axis slider is slidably mounted on the Z-axis linear guide 4. A Z-axis lifting worktable 6 is fixed on the Z-axis slider. The Z-axis feed mechanism 1 drives the Z-axis slider to move along the Z-axis linear guide 4. The drive guide wheel of the tangent mechanism is rotated and mounted on the Z-axis lifting worktable 6.

[0039] The X-axis feed mechanism includes an X-axis linear guide 11, an X-axis slider 10, and a rotary table. The X-axis linear guides 11 are arranged in pairs along the horizontal direction on the housing base 12, and an X-axis slider 10 is slidably mounted on each X-axis linear guide 11. The X-axis feed mechanism also includes an X-axis servo motor 20 and a horizontally moving ball screw 21. The horizontally moving ball screw 21 is mounted on the housing base 12 parallel to the X-axis linear guides 11 via a support base 26. The X-axis servo motor 20 is mounted on the housing base 12, and its output end is connected to the horizontally moving ball screw 21 for transmission. The X-axis slider 10 is configured to cooperate with the horizontally moving ball screw 21. The X-axis servo motor 20 provides power to the horizontally moving ball screw 21, causing it to rotate and thus driving the X-axis slider 10 to perform a linear feed motion along the X-axis linear guide 11.

[0040] The rotary table includes a table base 9 and a rotary drive mechanism. The table base 9 is fixed to the X-axis slider 10, and the support platform 8 is mounted on the table base 9 and rotated on the horizontal plane by the rotary drive mechanism. Specifically, the rotary drive mechanism includes a rotary motor 14, a drive gear 18, and a rotary gear 19. The rotary motor 14 is fixed to the table base 9, and the rotary gear 19 and drive gear 18 are rotatably mounted on the table base 9. The output end of the rotary motor 14 is connected to the drive gear 18 and drives the drive gear 18 to rotate. The drive gear 18 and the rotary gear 19 are connected by a transmission method, which can be, but is not limited to, meshing transmission or transmission methods such as belts and sprockets. The support platform 8 is fixed to the upper surface of the rotary gear 19 by bolts. When the support platform 8 needs to rotate, the rotary motor 14 operates, driving the drive gear 18 to rotate relative to the table base 9. The rotary gear 19, which is connected to the drive gear 18, rotates accordingly, driving the support platform 8 above it to rotate, thus completing the operation of rotating the silicon ingot on the horizontal plane.

[0041] During operation, the Z-axis feed mechanism 1 drives the tangent mechanism to rise and fall, cutting the silicon ingot on the support table 8. When linear feed is required, the X-axis feed mechanism, through the cooperation of the X-axis linear guide 11 and the X-axis slider 10, can drive the silicon ingot to feed linearly in the horizontal direction. The tangent mechanism and the Z-axis feed mechanism 1 work together to complete the cutting action of the silicon ingot in the X direction. When the rotary table drives the silicon ingot to rotate a certain angle, a further rotational feed is provided on the basis of the horizontal linear feed, thereby cutting the silicon ingot after it has turned. This action, combined with different rotation angles and different horizontal linear feed positions, can complete the circumferential side cutting and slitting operations of the silicon ingot.

[0042] Example 2:

[0043] like Figure 1 and Figure 6 The silicon ingot rotatable wire cutting machine shown is a second embodiment of this utility model.

[0044] Based on Example 1, Example 2 further improves the structure of the support platform 8 to meet the requirements of the wire cutting machine for cutting and slitting.

[0045] Specifically, the surface of the support platform 8 is rectangular, and each side of the rectangle has a cutting groove 22 parallel to that side. In embodiment two, the cutting groove 22 has the same side distance as its corresponding rectangular side, that is, the thickness of the cut skin is the same.

[0046] The rectangular plane also has a set of cross-shaped grooves, each set of cross-shaped grooves including two slitting grooves 23, which are arranged at 90° intersections. The cross-shaped grooves divide the rectangular plane into four equal parts, and correspondingly divide the silicon ingot into four equal parts.

[0047] The design of the slicing groove 22 provides operating space for the cutting metal wire 25 to slice the silicon ingot circumferentially. The cross-shaped groove provides operating space for the cutting metal wire 25 to cross-divide the silicon ingot. In the specific groove depth design, the groove depth of the slicing groove 22 and the cross-shaped groove can use the same depth data, and the groove width can also use the same width data. This depth data and width must be greater than the sum of the diameter of the cutting metal wire 25 and the fluctuation generated during the cutting process, that is, to ensure that the cutting metal wire 25 will not interfere with the slicing groove 22 and the cross-shaped groove during cutting.

[0048] Thus, in the peeling and slitting operations, the peeling groove 22 and the cross-shaped groove can be operated respectively. Cutting and shaping are integrated into the same machine, which effectively simplifies the operation and processing procedures. When processing the same silicon ingot, the processing error caused by multiple disassembly and assembly can be reduced, and the slitting accuracy can be further improved.

[0049] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A silicon ingot rotatable wire cutting machine for cutting silicon ingots, characterized in that: The device includes a frame, a support platform, and a cutting mechanism. The silicon ingot is loaded onto the support platform. The frame is equipped with an X-axis feeding mechanism and a Z-axis feeding mechanism. The cutting mechanism includes a cutting metal wire, a first drive guide wheel, and a second drive guide wheel. The cutting metal wire passes through the first drive guide wheel and the second drive guide wheel to form a cutting line parallel to the horizontal direction. The Z-axis feed mechanism drives the tangent mechanism to move up and down in the height direction to cut the silicon ingot on the support platform; The X-axis feed mechanism includes an X-axis linear guide, an X-axis slider, and a rotary table. The X-axis linear guides are arranged in pairs along the horizontal direction on the frame, and an X-axis slider is slidably mounted on each X-axis linear guide. The rotary worktable includes a worktable base and a rotary drive mechanism. The worktable base is fixed on the X-axis slider, and the support platform is set on the worktable base and driven by the rotary drive mechanism to rotate on the horizontal plane.

2. The silicon ingot rotatable wire cutting machine as described in claim 1, characterized in that: The frame is provided with a Z-axis linear guide rail along the height direction, and a Z-axis slider is slidably provided on the Z-axis linear guide rail. A Z-axis lifting worktable is fixed on the Z-axis slider. The Z-axis feed mechanism drives the Z-axis slider to move along the Z-axis linear guide rail. The active guide wheel of the tangent mechanism is rotated and set on the Z-axis lifting worktable.

3. The silicon ingot rotatable wire cutting machine as described in claim 2, characterized in that: The tangent mechanism is provided with a first take-up / unwinding mechanism, a first tensioning mechanism and a first auxiliary guide wheel corresponding to the first active guide wheel; the tangent mechanism is provided with a second take-up / unwinding mechanism, a second tensioning mechanism and a second auxiliary guide wheel corresponding to the second active guide wheel. The starting segment of the cut metal wire is unwound through the first winding and unwinding mechanism, enters the first tensioning mechanism, passes around the first auxiliary guide wheel, goes through the first active guide wheel, the second active guide wheel, the second auxiliary guide wheel, and the second tensioning mechanism, and is then wound up by the first winding and unwinding mechanism.

4. The silicon ingot rotatable wire cutting machine as described in claim 3, characterized in that: The first tensioning mechanism and the second tensioning mechanism have the same structure, both including a tensioning guide wheel, a tension arm rocker, and a tensioning servo motor. The tensioning servo motor is fixed on the frame, one end of the tension arm rocker is fixed to the output end of the tensioning servo motor, and the other end is rotatably equipped with a tensioning guide wheel.

5. A silicon ingot rotatable wire cutting machine as described in claim 4, characterized in that: The first and second winding mechanisms have the same structure, both including a winding motor, a winding drum, and a winding guide wheel assembly. The winding drum is driven at the output end of the winding motor. One end of the cutting metal wire is fixed to the winding drum and wound onto it, while the other end passes through the winding guide wheel assembly and is connected to the corresponding tension guide wheel for winding.

6. The silicon ingot rotatable wire cutting machine as described in claim 5, characterized in that: The winding and unwinding guide roller assembly includes an upper longitudinal guide roller, a lower longitudinal guide roller, and a transverse guide roller arranged sequentially. The upper longitudinal guide roller, the lower longitudinal guide roller, and the transverse guide roller are arranged from top to bottom in the height direction, and the cutting metal wire cross-section between adjacent guide rollers is distributed at 90°.

7. A silicon ingot rotatable wire cutting machine as described in claim 6, characterized in that: A correction device is also provided between the take-up and unwinding mechanism on each side and the take-up and unwinding guide wheel assembly. The correction device includes a correction wheel. The cutting metal wire between the take-up and unwinding storage drum and the upper longitudinal guide wheel contacts the correction wheel and is guided and supported by the correction wheel.

8. A silicon ingot rotatable wire cutting machine as described in claim 1, characterized in that: The X-axis feed mechanism further includes an X-axis servo motor and a horizontal moving ball screw. The horizontal moving ball screw is mounted on the frame parallel to the X-axis linear guide rail via a support base. The X-axis servo motor is mounted on the frame and its output end is connected to the horizontal moving ball screw for transmission. The X-axis slider is configured to cooperate with the horizontal moving ball screw.

9. A silicon ingot rotatable wire cutting machine as described in claim 1, characterized in that: The rotary drive mechanism includes a rotary motor, a drive gear, and a rotary gear. The rotary motor is fixed on the worktable base. The rotary gear and the drive gear are rotatably mounted on the worktable base. The output end of the rotary motor is connected to the drive gear and drives the drive gear to rotate. The drive gear is connected to the rotary gear. The support platform is fixed on the upper surface of the rotary gear.

10. A silicon ingot rotatable wire cutting machine as described in claim 1, characterized in that: The surface of the support platform is rectangular, and each side of the rectangular plane has a cutting groove parallel to each side. The rectangular plane also has at least one set of cross-shaped grooves, each set of cross-shaped grooves including two cutting grooves, which are arranged at 90° to each other.

Images