Plastic mold cooling mechanism

Abstract

The utility model discloses a plastic mold cooling mechanism which comprises a frame, a switch is fixedly installed on the inner wall of the frame, a box body is fixedly connected to the top of the inner side of the frame, a conveying pump is fixedly installed on the outer side of the box body, a semiconductor refrigeration assembly is arranged, and a plurality of heat conduction net plates make contact with cooling liquid to conduct heat exchange refrigeration operation. Then fan blades are driven by two motors to rotate, a heat conducting plate is used for conducting auxiliary heat dissipation operation on heat generated in the operation process of the semiconductor refrigeration assembly, and cooling liquid completing refrigeration operation in the box body is further conveyed into a coil pipe through a conveying pump and a guide pipe; and cold air in the cooling liquid exchanges heat with heat generated by operation of the lower mold through a heat conduction rectangular frame, so that cooling operation of the plastic mold is completed, meanwhile, a conveying pump, a semiconductor refrigeration assembly and a motor are continuously operated, and therefore the device can continuously conduct circulating cooling operation on the plastic mold; and the cooling effect of the plastic mold is further improved.

Description

Technical Field

[0001] This utility model relates to the technical field of plastic molds, specifically a cooling mechanism for plastic molds. Background Technology

[0002] Plastic mold is a type of combined mold used for compression molding, extrusion molding, injection molding, blow molding, and low-foaming molding. The coordinated changes of the mold's punch, die, and auxiliary molding system can produce a series of plastic parts of different shapes and sizes.

[0003] A search revealed a patent with patent application number 202322485771.1, which discloses a plastic mold cooling mechanism. The mechanism includes a mold base with support columns fixed on both sides above it. A lower mold is positioned above the mold base, and a heat-conducting plate is installed above it. Heat dissipation fins are positioned below the heat-conducting plate, and a cooling pipe is installed on one side of each fin. One end of the cooling pipe has a water inlet pipe, and the other end has a water outlet pipe. A first flange is installed on one side of the water inlet pipe. This plastic mold cooling mechanism, through the coordinated use of the heat-conducting plate, heat dissipation fins, cooling pipe, water outlet pipe, water inlet pipe, water tank, and water pump, allows the heat generated by the lower mold to be conducted through the heat-conducting plate. The heat is then transferred to the heat dissipation fins, where heat exchange occurs between the fins and the cooling pipes, cooling the lower mold effectively. The water tank and water pump facilitate the circulation of water in the cooling pipes, reducing the operating cost of the device. The above-mentioned patent also has the following shortcomings: the cooling mechanism described above performs heat exchange and cooling operation by directly contacting the bottom of the lower mold with the heat-conducting plate installed above the mold base. However, due to the limited contact area between the heat-conducting plate and the lower mold, the cooling effect of the mold is not good. Therefore, a plastic mold cooling mechanism is proposed to optimize and solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a plastic mold cooling mechanism to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A plastic mold cooling mechanism includes a frame, a switch fixedly installed on the inner wall of the frame, a box fixedly connected to the top inner side of the frame, a delivery pump fixedly installed on the outer side of the box, a semiconductor cooling component embedded through the bottom of the box, multiple heat-conducting mesh plates fixedly connected at equal intervals after one side of the semiconductor cooling component extends into the box, a heat-conducting plate fixedly connected to the outer side of the other side of the semiconductor cooling component, two fixed brackets symmetrically connected to the bottom of the heat-conducting plate, a motor fixedly installed inside the fixed brackets by a fixed rod, a fan blade fixedly connected to the output shaft of the motor, a mold base fixedly connected to the top of the frame, a channel penetrating through the center of the mold base, a mounting plate slidably connected in the channel, an electric push rod disposed inside the channel on the mold base, a heat-conducting rectangular frame fixedly embedded in the inner wall of the channel on the mold base, and a coil fixedly embedded in the mold base.

[0007] As a further embodiment of this utility model: an inlet pipe is fixedly connected to the liquid inlet on the front surface of the box, and a valve is provided on the inlet pipe; an outlet pipe is fixedly connected to the liquid outlet on the front surface of the box, and a valve is provided on the outlet pipe.

[0008] As a further improvement of this utility model: the housing has an opening for the fixed embedding of the semiconductor cooling component, and the heat-conducting plate is fixedly connected to the bottom of the housing by a fixing rod.

[0009] As a further embodiment of this utility model: the mounting plate has a mounting through hole, the electric push rod is fixedly mounted on the top of the frame, and the push rod end of the electric push rod is fixedly connected to the bottom of the mounting plate.

[0010] As a further embodiment of this utility model: the groove on the mold base is provided with a groove for fixing and embedding the heat-conducting rectangular frame, the mold base is provided with a channel for embedding and connecting the coil, the outer side of the coil is tightly fitted with the outer side of the heat-conducting rectangular frame, the liquid outlet of the coil is fixedly connected to the liquid inlet of the box through a conduit, the liquid inlet of the coil is fixedly connected to the liquid outlet of the delivery pump through a conduit, and the liquid inlet of the delivery pump is fixedly connected to the liquid outlet of the box through a conduit.

[0011] As a further embodiment of this utility model: the delivery pump, semiconductor cooling component, motor and electric push rod are electrically connected to a switch via wires, and the switch is electrically connected to an external power source via wires.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] By setting up a semiconductor cooling component, multiple heat-conducting mesh plates are used to contact the coolant for heat exchange and cooling. Subsequently, two motors drive the fan blades to rotate, and the heat-conducting plates assist in dissipating the heat generated during the operation of the semiconductor cooling component. Furthermore, the coolant that has completed the cooling operation in the box is transported to the coil through a conduit by a delivery pump. Then, the cool air in the coolant exchanges heat with the heat generated by the lower mold operation through a heat-conducting rectangular frame, thereby completing the cooling operation of the plastic mold. At the same time, the delivery pump, semiconductor cooling component, and motors continue to operate, so that the device can continuously circulate and cool the plastic mold, further improving the cooling effect of the plastic mold. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the cooling mechanism for a plastic mold.

[0015] Figure 2 This is a top view schematic diagram of a partial structure in the cooling mechanism of a plastic mold.

[0016] Figure 3 This is a front view of the cooling mechanism for a plastic mold.

[0017] The following components are shown in the figure: Frame 1, Switch 2, Housing 3, Delivery Pump 4, Semiconductor Cooling Component 5, Heat Conducting Mesh Plate 6, Heat Conducting Plate 7, Fixing Frame 8, Motor 9, Fan Blade 10, Mold Base 11, Mounting Plate 12, Electric Push Rod 13, Heat Conducting Rectangular Frame 14, and Coil 15. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figures 1-3In this embodiment of the utility model, a plastic mold cooling mechanism includes a frame 1, a switch 2, a housing 3, a delivery pump 4, a semiconductor cooling component 5, a heat-conducting mesh plate 6, a heat-conducting plate 7, a fixing frame 8, a motor 9, a fan blade 10, a mold base 11, a mounting plate 12, an electric push rod 13, a heat-conducting rectangular frame 14, and a coil 15. The switch 2 is fixedly installed on the inner wall of the frame 1. The housing 3 is fixedly connected to the top inner side of the frame 1. An inlet pipe is fixedly connected to the liquid inlet on the front surface of the housing 3, and a valve is installed on the inlet pipe. An outlet pipe is fixedly connected to the liquid outlet on the front surface of the housing 3, and a valve is installed on the outlet pipe. A delivery pump 4 is fixedly installed on the outside of the body 3. A semiconductor cooling component 5 is embedded through the bottom of the body 3. An opening is provided on the body 3 for the semiconductor cooling component 5 to be fixedly embedded through. After one side of the semiconductor cooling component 5 extends into the body 3, multiple heat-conducting mesh plates 6 are fixedly connected at equal intervals. A heat-conducting plate 7 is fixedly connected to the outside of the other side of the semiconductor cooling component 5. The heat-conducting plate 7 is fixedly connected to the bottom of the body 3 by a fixing rod. Two fixing brackets 8 are symmetrically connected to the bottom of the heat-conducting plate 7. A motor 9 is fixedly installed inside the fixing bracket 8 by a fixing rod. A fan blade 10 is fixedly connected to the output shaft of the motor 9.

[0020] A mold base 11 is fixedly connected to the top of the frame 1. A channel is formed through the center of the mold base 11, and a mounting plate 12 is slidably connected within the channel. The mounting plate 12 has a mounting through hole. An electric push rod 13 is installed inside the channel on the mold base 11. The electric push rod 13 is fixedly installed on the top of the frame 1, and the push rod end of the electric push rod 13 is fixedly connected to the bottom of the mounting plate 12. A heat-conducting rectangular frame 14 is fixedly embedded in the inner wall of the channel on the mold base 11. A groove is formed in the channel on the mold base 11 for fixing the heat-conducting rectangular frame 14. A coil 15 is fixedly embedded in the base 11. The base 11 has a channel for the coil 15 to be embedded and connected. The outer side of the coil 15 is tightly fitted to the outer side of the heat-conducting rectangular frame 14. The liquid outlet of the coil 15 is fixedly connected to the liquid inlet of the box 3 through a conduit. The liquid inlet of the coil 15 is fixedly connected to the liquid outlet of the delivery pump 4 through a conduit. The liquid inlet of the delivery pump 4 is fixedly connected to the liquid outlet of the box 3 through a conduit. The delivery pump 4, the semiconductor cooling component 5, the motor 9 and the electric push rod 13 are electrically connected to the switch 2 through wires. The switch 2 is electrically connected to an external power supply through wires.

[0021] The working principle of this utility model is as follows:

[0022] When the plastic mold cooling mechanism is needed, the operator first connects switch 2 to an external power source, then fixes the lower mold to the mounting plate 12 with fixing bolts, introduces coolant into the housing 3 through the inlet pipe, and then activates the semiconductor cooling component 5 to exchange heat with the coolant using multiple heat-conducting mesh plates 6, thereby cooling the coolant in the housing 3. Next, the operator activates two motors 9 to drive the fan blades 10 and uses the heat-conducting plates 7 to assist in dissipating the heat generated by the semiconductor cooling component 5 during operation. Finally, the operator activates the output... Pump 4 delivers the coolant that has completed the cooling operation in the housing 3 to the coil 15 through a conduit. Then, the heat-conducting rectangular frame 14 exchanges the cold air in the coolant with the heat generated by the lower mold operation, thereby completing the cooling operation of the plastic mold. At the same time, by continuously starting the delivery pump 4, the semiconductor cooling component 5 and the motor 9, the device can continuously circulate and cool the plastic mold. Furthermore, by starting the electric push rod 13, the mounting plate 12 can be moved upward until the lower mold on the mounting plate 12 is pushed out of the mold base 11, so that personnel can easily remove and replace the plastic mold.

[0023] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A plastic mold cooling mechanism, comprising a frame (1), characterized in that: A switch (2) is fixedly installed on the inner wall of the frame (1). A box (3) is fixedly connected to the top of the inner side of the frame (1). A delivery pump (4) is fixedly installed on the outer side of the box (3). A semiconductor cooling component (5) is embedded through the bottom of the box (3). Multiple heat-conducting mesh plates (6) are fixedly connected at equal intervals after one side of the semiconductor cooling component (5) extends into the box (3). A heat-conducting plate (7) is fixedly connected to the outer side of the other side of the semiconductor cooling component (5). Two fixing brackets (8) are symmetrically connected to the bottom of the heat-conducting plate (7). The fixed frame (8) is fixedly installed with a motor (9) by a fixed rod. The output shaft of the motor (9) is fixedly connected with a fan blade (10). The top of the frame (1) is fixedly connected with a mold base (11). A channel is opened through the center of the mold base (11). An installation plate (12) is slidably connected in the channel. An electric push rod (13) is set inside the channel on the mold base (11). A heat-conducting rectangular frame (14) is fixedly embedded in the inner wall of the channel on the mold base (11). A coil (15) is fixedly embedded in the mold base (11).

2. The plastic mold cooling mechanism according to claim 1, characterized in that: A liquid inlet pipe is fixedly connected to the liquid inlet on the front surface of the box (3), and a valve is provided on the liquid inlet pipe. A liquid outlet pipe is fixedly connected to the liquid outlet on the front surface of the box (3), and a valve is provided on the liquid outlet pipe.

3. The plastic mold cooling mechanism according to claim 1, characterized in that: The housing (3) has an opening for the semiconductor cooling component (5) to be fixedly embedded through it, and the heat-conducting plate (7) is fixedly connected to the bottom of the housing (3) by a fixing rod.

4. The plastic mold cooling mechanism according to claim 1, characterized in that: The mounting plate (12) has a mounting through hole, and the electric push rod (13) is fixedly installed on the top of the frame (1). The push rod end of the electric push rod (13) is fixedly connected to the bottom of the mounting plate (12).

5. The plastic mold cooling mechanism according to claim 1, characterized in that: The groove on the mold base (11) is provided with a groove for fixing and embedding the heat-conducting rectangular frame (14). The mold base (11) is provided with a channel for embedding and connecting the coil (15). The outer side of the coil (15) is closely fitted with the outer side of the heat-conducting rectangular frame (14). The liquid outlet of the coil (15) is fixedly connected to the liquid inlet of the box (3) through a conduit. The liquid inlet of the coil (15) is fixedly connected to the liquid outlet of the delivery pump (4) through a conduit. The liquid inlet of the delivery pump (4) is fixedly connected to the liquid outlet of the box (3) through a conduit.

6. The plastic mold cooling mechanism according to claim 1, characterized in that: The delivery pump (4), semiconductor cooling component (5), motor (9) and electric push rod (13) are electrically connected to switch (2) via wires, and switch (2) is electrically connected to an external power source via wires.

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