Automatic packaging device for electronic components
By using a cooling fan and a cylinder-driven pusher plate for material ejection in an automated packaging device for electronic components, the problem of slow glue solidification was solved, achieving rapid cooling and efficient production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU VOCATIONAL & TECHNICAL UNIVERSITY OF ARCHITECTURE
- Filing Date
- 2025-05-26
- Publication Date
- 2026-05-12
AI Technical Summary
In existing technologies, electronic components cannot be effectively cooled after being potted, resulting in a long curing time for the adhesive and affecting the progress of the work.
A cooling fan is used to dissipate heat from the packaging mold, and a cylinder drives the push plate to automatically discharge the material. Combined with a scraper to clean up excess glue, the work efficiency is improved.
It accelerated the curing speed of the adhesive, simplified the cleaning process, and improved work efficiency and production progress.
Smart Images
Figure CN224224326U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a packaging device, and more particularly to an automatic packaging device for electronic components. Background Technology
[0002] Electronic components are the building blocks of electronic parts and small machines and instruments. They are usually composed of several parts and can be used interchangeably in similar products. Electronic components must be isolated from the outside world to prevent impurities in the air from corroding the internal structure of the electronic components. Therefore, electronic components need to be packaged.
[0003] The patent with patent publication number CN216936804U discloses a three-axis linkage automatic dispensing machine for electronic component packaging. The patent proposes that the height of the moving plate can be adjusted by the cooperation of the lowering frame and the moving column. However, the patent still has some shortcomings in actual use. Since the patent cannot cool down the electronic components after dispensing, it is necessary to wait for the glue to solidify naturally after dispensing. However, the solidification time of the glue is long, which leads to a slow overall work process.
[0004] Therefore, there is a need for an automated encapsulation device for electronic components that can cool adhesive. Utility Model Content
[0005] To overcome the shortcomings of existing patents that cannot cool down the glue after potting electronic components, requiring the glue to solidify naturally, which results in a long solidification time and slow overall progress, this utility model provides an automatic encapsulation device for electronic components that can cool the glue.
[0006] This utility model is achieved through the following technical means: an automatic packaging device for electronic components, including a support frame, a support plate, a packaging mold, a glue delivery tube, a storage tank, and a cylinder. The support plate is fixedly connected to the upper part of the support frame, and a cylinder is installed in the middle of the support plate. The packaging mold is fixedly connected to the telescopic rod of the cylinder. The same packaging mold is fixedly connected to the bottom of the support frame. The two packaging molds are in contact. The storage tank is fixedly connected to the top left side of the support plate. A glue delivery tube is connected between the storage tank and the adjacent packaging mold. The device also includes a heat dissipation fan. Heat dissipation fans are installed on both the left and right sides of the support plate.
[0007] In one embodiment, the support frame further includes a scraper, a first fixed plate, a first guide rod, and a first elastic element. The first fixed plate is fixedly connected to both the left and right sides of the lower part of the support frame. The first guide rod is fixedly connected to the top of the first fixed plate. The scraper is slidably arranged between the two first guide rods. The first elastic element is sleeved on the first guide rod. The two ends of the first elastic element are respectively connected to the first fixed plate and the scraper.
[0008] In one embodiment, the system further includes a push plate, a fixed block, a slider, a limiting rod, a second elastic element, a slide rail, a pressure plate, a second fixed plate, a second guide rod, a third elastic element, a support block, a push plate, a third guide rod, and a fourth elastic element. Push plates are slidably mounted on both the left and right sides of the support plate, and the push plates contact adjacent packaging molds. Fixed blocks are symmetrically fixed to the top of the support frame, and sliders are slidably mounted inside the fixed blocks, contacting the push plates. Limiting rods are symmetrically fixed to the rear side of the fixed blocks, and the sliders slide on two adjacent limiting rods. Second elastic elements are sleeved on the limiting rods, and the two ends of the second elastic elements are respectively connected to the slider and the fixed block. The support frame has slide rails fixed to both sides of the rear interior. A pressure plate is slidably installed in the slide rail and contacts the slider. A second fixed plate is fixed to both sides of the rear interior of the support frame. A second guide rod is fixed to the pressure plate and slides in the second fixed plate. A third elastic element is sleeved on the second guide rod. The two ends of the third elastic element are connected to the fixed plate and the pressure plate, respectively. A third guide rod is symmetrically fixed to the lower interior of the support frame. A pusher plate is slidably installed between the two third guide rods. The pusher plate is located behind the packaging mold and contacts the pressure plate. A fourth elastic element is sleeved on the third guide rod. The two ends of the fourth elastic element are connected to the third guide rod and the pusher plate, respectively.
[0009] In one embodiment, a protective pad is also included, with the protective pad embedded in the front side of the pusher plate.
[0010] In one embodiment, a collection box is also included, which is slidably disposed in the lower part of the support frame.
[0011] In one embodiment, a hand sealant is also included, with the material collection bin covered with the hand sealant.
[0012] Based on the above description of the structure of this utility model, the design starting point, concept, and advantages of this utility model are as follows:
[0013] 1. By starting the cooling fan, the fan blades rotate, which dissipates heat and cools the packaging mold, accelerating the solidification speed of the packaging adhesive and thus speeding up the work process.
[0014] 2. By releasing the scraper, the first elastic element drives the scraper to move downward, thereby scraping off the glue overflowing between the two packaging molds, making it easier for workers to clean up.
[0015] 3. The extension rod of the cylinder retracts, causing the push plate to move upward. The upward movement of the push plate compresses the slider to move backward, compressing the pressure plate to move downward. The downward movement of the pressure plate compresses the pusher plate to move forward, thereby automatically pushing out the packaged electronic components, thus speeding up the work efficiency. Attached Figure Description
[0016] Figure 1This is a three-dimensional structural diagram of the present invention.
[0017] Figure 2 This is a three-dimensional cross-sectional view of the scraper, cylinder, and cylinder structure of this utility model.
[0018] Figure 3 This is a three-dimensional sectional view of the push plate, fixing block and slider of this utility model.
[0019] Figure 4 This utility model Figure 3 Enlarged view of point A in the middle.
[0020] The components in the diagram are labeled as follows: 1-Support frame, 2-Support plate, 201-Cooling fan, 3-Encapsulation mold, 4-Glue delivery pipe, 5-Storage bucket, 6-Cylinder, 7-Scraper, 8-First fixed plate, 9-First guide rod, 10-First elastic element, 11-Push plate, 12-Fixing block, 13-Slider, 14-Limit rod, 15-Second elastic element, 16-Slide rail, 17-Pressure plate, 18-Second fixed plate, 19-Second guide rod, 20-Third elastic element, 22-Push plate, 23-Third guide rod, 24-Fourth elastic element, 25-Protective pad, 26-Collection box, 27-Hand glue. Detailed Implementation
[0021] The present invention will be further described below with reference to the embodiments shown in the accompanying drawings.
[0022] Example 1: An automated packaging device for electronic components, see [link / reference] Figures 1-3 As shown, the device includes a support frame 1, a support plate 2, a packaging mold 3, a glue delivery tube 4, a storage bucket 5, a cylinder 6, a collection box 26, and a hand glue 27. The support plate 2 is fixedly attached to the upper part of the support frame 1. The cylinder 6 is bolted to the middle of the support plate 2. The packaging mold 3 is fixedly attached to the telescopic rod of the cylinder 6. The same packaging mold 3 is fixedly attached to the bottom of the support frame 1. The two packaging molds 3 are in contact. The storage bucket 5 is fixedly attached to the top left side of the support plate 2. The glue delivery tube 4 connects the storage bucket 5 and the adjacent packaging mold 3. The collection box 26 is slidably installed in the lower part of the support frame 1. The staff places the packaged electronic components into the collection box 26, which facilitates the collection of electronic components. The collection box 26 is covered with a hand glue 27, which increases the friction between the staff's hand and the collection box 26, making it easier for the staff to pull the collection box 26. It also includes a cooling fan 201, which is installed on both the left and right sides of the support plate 2.
[0023] When using this device, the operator places the electronic component into the lower packaging mold 3. Then, the operator activates cylinder 6, which extends the telescopic rod, causing the upper packaging mold 3 to move downwards, bringing the two packaging molds 3 into contact. The operator then pours an appropriate amount of packaging adhesive into the storage tank 5. The adhesive enters between the two packaging molds 3 through the adhesive delivery pipe 4, sealing and cooling the electronic component. The operator then activates the cooling fan 201, causing its blades to rotate, thus dissipating heat from the packaging molds 3 and accelerating the curing speed of the adhesive, thereby speeding up the work process. After the adhesive has cured, the operator controls the telescopic rod of cylinder 6 to retract, causing the upper packaging mold 3 to move upwards back to its original position. The operator then closes cylinder 6 and removes the packaged electronic component. Once the collection box 26 is full, the operator pulls out the collection box 26 to store the electronic component.
[0024] Example 2: Based on Example 1, refer to Figure 2 As shown, it also includes a scraper 7, a first fixed plate 8, a first guide rod 9, and a first elastic element 10. The first fixed plate 8 is fixedly connected to the left and right sides of the lower part of the support frame 1. The first guide rod 9 is provided on the top of the first fixed plate 8 by welding. The scraper 7 is slidably arranged between the two first guide rods 9. The first elastic element 10 is sleeved on the first guide rod 9. The two ends of the first elastic element 10 are respectively connected to the first fixed plate 8 and the scraper 7.
[0025] After the electronic components in the packaging mold 3 are filled with glue, the worker pulls the scraper 7 upward, and the first elastic element 10 is stretched accordingly. The first guide rod 9 plays a guiding role. The worker then releases the scraper 7, and the first elastic element 10 drives the scraper 7 to move downward, thereby scraping off the glue overflowing between the two packaging molds 3, which makes it easier for the worker to clean. Repeating the above operation can scrape off the overflowing glue again.
[0026] See Figure 3 and Figure 4As shown, it also includes a push plate 11, a fixing block 12, a slider 13, a limiting rod 14, a second elastic element 15, a slide rail 16, a pressure plate 17, a second fixing plate 18, a second guide rod 19, a third elastic element 20, a support block, a push plate 22, a third guide rod 23, a fourth elastic element 24, and a protective pad 25. Push plates 11 are slidably mounted on both the left and right sides of the support plate 2, and the push plates 11 contact the adjacent packaging mold 3. Fixing blocks 12 are symmetrically fixed to the top of the support frame 1, and sliders 13 are slidably mounted inside the fixing blocks 12, contacting the push plates 11. Limiting rods 14 are symmetrically fixed to the rear side of the fixing blocks 12, and sliders 13 slide on the two adjacent limiting rods 14. Second elastic elements 15 are sleeved on the limiting rods 14, and the two ends of the second elastic elements 15 are respectively connected to the slider 13 and the fixing block 12. Slide rails 16 are fixed to both the left and right sides of the rear part of the support frame 1, and slides 16 are slidably mounted inside the slide rails 16. There is a pressure plate 17, which contacts the slider 13. The second fixed plate 18 is fixedly connected to the left and right sides of the rear part of the support frame. The pressure plate 17 is provided with a second guide rod 19 by welding. The second guide rod 19 slides in the second fixed plate 18. A third elastic element 20 is sleeved on the second guide rod 19. The two ends of the third elastic element 20 are connected to the fixed plate and the pressure plate 17 respectively. The lower part of the support frame 1 is symmetrically fixed with third guide rods 23. A pusher plate 22 is slidably arranged between the two third guide rods 23. The pusher plate 22 is located behind the packaging mold 3 and contacts the pressure plate 17. A fourth elastic element 24 is sleeved on the third guide rod 23. The two ends of the fourth elastic element 24 are connected to the third guide rod 23 and the pusher plate 22 respectively. A protective pad 25 is embedded in the front side of the pusher plate 22. The protective pad 25 reduces the pressure between the pusher plate 22 and the electronic components, thereby preventing the electronic components from being worn.
[0027] During material discharge, the telescopic rod of cylinder 6 retracts, causing push plate 11 to move upward. Push plate 11 moves upward, pressing slider 13 to move backward. Second elastic element 15 is stretched accordingly. Limiting rod 14 acts as a guide. Sliding slider 13 moves backward, pressing pressure plate 17 to move downward. Third elastic element 20 is stretched accordingly. Second guide rod 19 acts as a guide. Pressure plate 17 moves downward, pressing pusher plate 22 to move forward. Fourth elastic element 24 is stretched accordingly. Third guide rod 23 acts as a guide. This allows for automatic ejection of packaged electronic components, achieving automatic material discharge and increasing work efficiency. When re-encapsulation is required, when the two encapsulation molds 3 contact, second elastic element 15 causes slider 13 to move forward and reset, disengaging slider 13 from pressure plate 17. Third elastic element 20 causes pressure plate 17 to move upward and reset, disengaging pressure plate 17 from pusher plate 22. Fourth elastic element 24 causes pusher plate 22 to move backward and reset.
[0028] The above embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Therefore, all equivalent changes made based on the content described in the claims of the present utility model should be included within the scope of the claims of the present utility model.
Claims
1. An automatic packaging device for electronic components, comprising a support frame (1), a support plate (2), a packaging mold (3), a glue delivery tube (4), a storage tank (5), and a cylinder (6), wherein the support plate (2) is fixedly connected to the support frame (1), the cylinder (6) is mounted on the support plate (2), the packaging mold (3) is fixedly connected to the telescopic rod of the cylinder (6), the same packaging mold (3) is fixedly connected inside the support frame (1), the two packaging molds (3) are in contact, the storage tank (5) is fixedly connected to the support plate (2), and the glue delivery tube (4) connects the storage tank (5) to the adjacent packaging mold (3), characterized in that, It also includes a cooling fan (201), and two cooling fans (201) are installed on the support plate (2).
2. The automatic packaging device for electronic components as described in claim 1, characterized in that, It also includes a scraper (7), a first fixed plate (8), a first guide rod (9) and a first elastic element (10). Two first fixed plates (8) are fixedly connected to the support frame (1). A first guide rod (9) is fixedly connected to the first fixed plate (8). A scraper (7) is slidably arranged between the two first guide rods (9). A first elastic element (10) is sleeved on the first guide rod (9). The two ends of the first elastic element (10) are respectively connected to the first fixed plate (8) and the scraper (7).
3. The automatic packaging device for electronic components as described in claim 2, characterized in that, It also includes a push plate (11), a fixing block (12), a slider (13), a limiting rod (14), a second elastic element (15), a slide rail (16), a pressure plate (17), a second fixing plate (18), a second guide rod (19), a third elastic element (20), a support block, a push plate (22), a third guide rod (23), and a fourth elastic element (24). Two push plates (11) are slidably arranged on the support plate (2). The push plates (11) are connected to the adjacent packaging mold. With (3) contact, two fixed blocks (12) are fixedly connected to the support frame (1), and a slider (13) is slidably arranged inside the fixed block (12). The slider (13) contacts the push plate (11). Two limiting rods (14) are fixedly connected to the fixed block (12). The slider (13) slides on the two adjacent limiting rods (14). A second elastic element (15) is sleeved on the limiting rod (14). The two ends of the second elastic element (15) are respectively connected to the slider (13) and the fixed block (11). 12) Connection: Two slide rails (16) are fixedly connected inside the support frame (1). A pressure plate (17) is slidably installed inside the slide rail (16). The pressure plate (17) contacts the slider (13). Two second fixed plates (18) are fixedly connected to the support frame. A second guide rod (19) is fixedly connected inside the pressure plate (17). The second guide rod (19) slides inside the second fixed plate (18). A third elastic element (20) is sleeved on the second guide rod (19). The two ends of the third elastic element (20) The support frame (1) is connected to the fixed plate and the pressure plate (17) respectively. Two third guide rods (23) are fixedly connected inside the support frame (1). A pusher plate (22) is slidably arranged between the two third guide rods (23). The pusher plate (22) is located behind the packaging mold (3). The pusher plate (22) is in contact with the pressure plate (17). A fourth elastic element (24) is sleeved on the third guide rod (23). The two ends of the fourth elastic element (24) are connected to the third guide rod (23) and the pusher plate (22) respectively.
4. An automatic packaging device for electronic components as described in claim 3, characterized in that, It also includes a protective pad (25), which is embedded in the pusher plate (22).
5. An automatic packaging device for electronic components as described in claim 4, characterized in that, It also includes a collection box (26), which is slidably installed inside the support frame (1).
6. An automatic packaging device for electronic components as described in claim 5, characterized in that, It also includes hand glue (27), and the collection box (26) is covered with hand glue (27).