Pressing mechanism for chip test socket

By designing a clamping mechanism that utilizes the lever principle and auxiliary springs to achieve rapid and stable clamping of the chip, the problem of not being able to test dual-sided pin array chips simultaneously in existing technologies is solved, thus improving testing efficiency and quality.

CN224231818UActive Publication Date: 2026-05-12SUZHOU JUNHEXIN SEMICON TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SUZHOU JUNHEXIN SEMICON TECH CO LTD
Filing Date
2025-05-19
Publication Date
2026-05-12

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Abstract

The utility model relates to a hold-down mechanism for a chip test socket, which comprises a base, the left side and the right side of the base are provided with movable grooves, the movable grooves are internally and movably connected with hold-down frames, springs are connected between the base and the hold-down frames, the movable grooves are internally connected with first rotating shafts, the first rotating shafts are connected with hold-down assemblies, and the hold-down assemblies are connected with second rotating shafts. One side of the pressing assembly makes contact with the product, and the other side of the pressing assembly is connected with the pressing frame through a movable connecting piece. According to the utility model, the stability of products can be improved.
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Description

Technical Field

[0001] This utility model relates to a clamping mechanism for a chip test socket, and more particularly to a clamping mechanism suitable for a BGA297 chip test socket. Background Technology

[0002] With the development of science and technology, electronic chips have been widely used in various electronic products. After mass production of chips, it is necessary to test their conformity to select out unqualified chips and retain qualified ones. However, in the current field of semiconductor chip testing, test sockets mainly consist of a lower test socket body, test probes, and a lower test socket probe holding plate to complete the testing of single-sided pin array chips. While these sockets are designed for testing single-sided pin array chips, for new packaging technologies such as double-sided pin array chips, especially the main chip face of stacked semiconductor chips, these test sockets lack the function of simultaneously testing both the upper and lower sides of the chip.

[0003] A search revealed the patent: "An Aging Test Socket to Assist Chip Heat Dissipation" (CN202222685037.5), which includes an upper pinhole plate, an upper metal clamping plate, a lower metal clamping plate, a lower pinhole plate, and probes. The upper pinhole plate has a test groove on its upper surface, four insulating plates in its center, and a first mounting groove in the center of the test groove. The upper metal clamping plate is fixedly installed inside the first mounting groove. Both the upper and lower metal clamping plates have multiple probe holes on their upper surfaces, and the lower pinhole plate has a second mounting groove on its upper surface. The lower metal clamping plate is fixedly installed inside the second mounting groove. The above structure uses a cover plate to secure the product, requiring manual fixation and reducing work efficiency.

[0004] In view of the above-mentioned shortcomings, the designer actively researched and innovated in order to create a new type of clamping mechanism for chip test sockets, making it more valuable for industrial applications. Utility Model Content

[0005] To solve the above-mentioned technical problems, the purpose of this utility model is to provide a clamping mechanism for chip testing sockets.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A clamping mechanism for a chip test socket includes a base, with movable slots on both the left and right sides of the base. A clamping frame is movably connected within the movable slots, and a spring is connected between the base and the clamping frame. A first rotating shaft is connected within the movable slots, and a clamping assembly is connected to the first rotating shaft. One side of the clamping assembly contacts the product, and the other side is connected to the clamping frame via a movable connector.

[0008] The clamping assembly includes a clamping connecting plate connected to a first rotating shaft. An auxiliary clamping component is connected to one side of the clamping connecting plate that contacts the product. The other end of the clamping connecting plate is connected to a clamping frame via a movable connecting component. A lifting platform is provided on the movable groove. The lifting platform has an inclined structure and is located between the first rotating shaft and the movable connecting component.

[0009] Preferably, in the aforementioned clamping mechanism for a chip test socket, a positioning groove is provided on the lifting platform, and a positioning block corresponding to the positioning groove is connected to the clamping connecting plate.

[0010] Preferably, in the aforementioned clamping mechanism for a chip test socket, a positioning guide groove is provided on the clamping frame, and the positioning guide groove is disposed opposite to the clamping connecting plate.

[0011] Preferably, in the aforementioned clamping mechanism for a chip test socket, the movable connector is a second rotating shaft.

[0012] Preferably, in the aforementioned clamping mechanism for a chip test socket, the auxiliary clamping component includes an auxiliary clamping plate. An auxiliary groove is provided on the clamping connecting plate on the side that contacts the product. A third rotating shaft is connected to the auxiliary groove. The auxiliary clamping plate is movably connected to the third rotating shaft. One side of the auxiliary clamping plate contacts the product, and the other end of the auxiliary clamping plate is located within the auxiliary groove and moves within it. An auxiliary spring is connected between the other side of the auxiliary clamping plate and the auxiliary groove.

[0013] Preferably, in the aforementioned clamping mechanism for a chip test socket, a guide groove is provided on the base, and a guide block that slides within the guide groove is connected to the clamping frame.

[0014] Preferably, in the aforementioned clamping mechanism for a chip test socket, a stop block is connected to the guide groove.

[0015] Preferably, in the chip test socket clamping mechanism, the tilt angle of the lifting platform, which has an inclined structure, is 45°.

[0016] By means of the above solution, this utility model has at least the following advantages:

[0017] This invention enables rapid chip clamping via a clamping component, and further enhances chip clamping stability with auxiliary clamping components, thereby improving testing quality.

[0018] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of this utility model;

[0021] Figure 2 This is a cross-sectional view of the clamping assembly and auxiliary clamping component of this utility model. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0024] Example

[0025] like Figure 1 and Figure 2 As shown, a clamping mechanism for a chip test socket includes a base 1. Movable grooves 2 are provided on both the left and right sides of the base 1. A clamping frame 3 is movably connected in the movable grooves 2. A spring 4 is connected between the base 1 and the clamping frame 3. A first rotating shaft 5 is connected in the movable grooves 2. A clamping component 6 is connected to the first rotating shaft 5. One side of the clamping component 6 contacts the product, and the other side is connected to the clamping frame 3 through a movable connector 7.

[0026] Furthermore, this utility model can achieve product clamping. By rotating the first rotating shaft and lifting the clamping frame with a spring, the clamping component clamps the product through the lever principle. The specific structure is as follows: The clamping component 6 includes a clamping connecting plate 61, which is connected to the first rotating shaft 5. An auxiliary clamping member 62 is connected to one side of the clamping connecting plate 61 that contacts the product. The other end of the clamping connecting plate 61 is connected to the clamping frame 3 through a movable connecting member 7. A lifting platform 63 is provided on the movable groove 2. The lifting platform 63 has an inclined structure and is located between the first rotating shaft 5 and the movable connecting member 7.

[0027] Furthermore, to achieve a more stable clamping of the chip, the structure is as follows: the auxiliary clamping component 62 includes an auxiliary clamping plate 65, and an auxiliary groove 66 is provided on the clamping connecting plate 61 on the side in contact with the product. A third rotating shaft 67 is connected to the auxiliary groove 66, and the auxiliary clamping plate 65 is movably connected to the third rotating shaft 67. One side of the auxiliary clamping plate 65 is in contact with the product, and the other end of the auxiliary clamping plate 65 is located and moves within the auxiliary groove. An auxiliary spring 64 is connected between the other side of the auxiliary clamping plate 65 and the auxiliary groove 66.

[0028] This structure also uses the lever principle to compress the product, and the elastic force of the auxiliary spring will achieve secondary compression of the product.

[0029] Correspondingly, the auxiliary spring 64 allows for a larger opening angle when placing products, almost reaching 90°. Compared to the opening angle of only the clamping connecting plate, which is limited by the clamping frame, the opening angle is still large enough to accommodate the product.

[0030] To open the auxiliary clamping component to a greater angle, the specific operation is as follows: During the pressing down of the clamping frame, the second rotating shaft moves downward together, causing the clamping connecting plate to perform a lever movement. This causes the clamping connecting plate on the side in contact with the product to tilt upward. During the tilting process, the auxiliary clamping plate 65 in the auxiliary clamping component, due to the action of the auxiliary spring 64, is in a tilted structure under the action of the third rotating shaft. During the pressing down of the clamping frame, the tilted auxiliary clamping plate 65 will come into contact with the clamping frame. As the clamping frame continues to move downward, the tilted auxiliary clamping plate 65 is resisted by the clamping frame. Under the action of the third rotating shaft, the auxiliary clamping plate 65 moves towards the clamping frame until the clamping frame is pressed down to the bottom. At this time, the auxiliary clamping plate 65 is fully opened.

[0031] Furthermore, to improve the stability of the movement of the clamping frame, the specific structure includes a positioning guide groove on the clamping frame 3, which is opposite to the clamping connecting plate 61; and / or a guide groove on the base 1, with a guide block connected to the clamping frame 3 that slides within the guide groove.

[0032] The above structure can improve the stability of the clamping frame during the pressing process and ensure the stability of the pressing component.

[0033] Meanwhile, a stop block is connected to the guide groove. The stop block can prevent the clamping frame from being subjected to excessive force from the spring, which would cause it to move out of the movable groove.

[0034] Furthermore, to play a positioning role during the lifting of the clamping assembly and prevent deviation, a positioning groove is provided on the lifting platform 63, and a positioning block corresponding to the positioning groove is connected to the clamping connecting plate 61.

[0035] The movable connector 7 described in this utility model is a second rotating shaft.

[0036] The lifting platform with an inclined structure in this utility model can ensure that the pressing connecting plate is lifted as needed during the pressing process, and the corresponding lifting requirement is that the inclination is 45°.

[0037] The working principle of this utility model is as follows:

[0038] In actual operation, the clamping frame is pressed down to open the clamping component, then the chip is placed into the corresponding product, and then the clamping frame is released, and the product is clamped by the action of the spring.

[0039] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0040] In the description of this application, it should be noted that the terms "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0041] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or vertical, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0042] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0043] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A clamping mechanism for a chip test socket, characterized in that: Includes a base (1), on which movable slots (2) are provided on both the left and right sides. A clamping frame (3) is movably connected in the movable slots (2). A spring (4) is connected between the base (1) and the clamping frame (3). A first rotating shaft (5) is connected in the movable slots (2). A clamping assembly (6) is connected on the first rotating shaft (5). One side of the clamping assembly (6) is in contact with the product, and the other side is connected to the clamping frame (3) through a movable connector (7). The clamping assembly (6) includes a clamping connecting plate (61), which is connected to the first rotating shaft (5). An auxiliary clamping component (62) is connected to one side of the clamping connecting plate (61) that contacts the product. The other end of the clamping connecting plate (61) is connected to the clamping frame (3) through a movable connecting component (7). A lifting platform (63) is provided on the movable groove (2). The lifting platform (63) has an inclined structure and is located between the first rotating shaft (5) and the movable connecting component (7).

2. The clamping mechanism for a chip test socket according to claim 1, characterized in that: The lifting platform (63) is provided with a positioning groove, and the pressing connecting plate (61) is connected with a positioning block corresponding to the positioning groove.

3. The clamping mechanism for a chip test socket according to claim 1, characterized in that: The clamping frame (3) is provided with a positioning guide groove, which is positioned opposite to the clamping connecting plate (61).

4. The clamping mechanism for a chip test socket according to claim 1, characterized in that: The movable connector (7) is the second rotating shaft.

5. The clamping mechanism for a chip test socket according to claim 1, characterized in that: The auxiliary clamping component (62) includes an auxiliary clamping plate (65). An auxiliary groove (66) is provided on the clamping connecting plate (61) on the side that contacts the product. A third rotating shaft (67) is connected to the auxiliary groove (66). The auxiliary clamping plate (65) is movably connected to the third rotating shaft (67). One side of the auxiliary clamping plate (65) contacts the product, and the other end of the auxiliary clamping plate (65) moves within the auxiliary groove. An auxiliary spring (64) is connected between the other side of the auxiliary clamping plate (65) and the auxiliary groove (66).

6. The clamping mechanism for a chip test socket according to claim 1, characterized in that: The base (1) is provided with a guide groove, and the clamping frame (3) is connected with a guide block that slides in the guide groove.

7. The clamping mechanism for a chip test socket according to claim 6, characterized in that: A stop block is connected to the guide groove (8).

8. The clamping mechanism for a chip test socket according to claim 6, characterized in that: The tilt angle of the lifting platform (63), which has an inclined structure, is 45°.