Multi-Site test mass production board applied to mass production test of radio frequency front-end chips

Abstract

The utility model discloses a multi-Site test mass production board applied to mass production test of radio frequency front-end chips. The multi-Site test mass production board comprises a plurality of single Site test mass production boards and a substrate, wherein the plurality of single Site test mass production boards are arranged on the substrate in an array form; the single-Site test mass production board comprises a board body, and the board body is provided with a clamp used for clamping a radio frequency front-end chip to be tested; a first onboard single-pole multi-throw radio frequency switch, a second onboard single-pole multi-throw radio frequency switch, a third onboard single-pole multi-throw radio frequency switch and a fourth onboard single-pole multi-throw radio frequency switch. According to the utility model, the radio frequency interfaces of the radio frequency front-end chip are combined into three radio frequency interfaces to be connected with the ATE through the single-board knife-loaded multi-throw radio frequency switches, so that the test resource utilization rate of the ATE is greatly reduced, the building difficulty of a mass production test environment is effectively reduced, and the test cost is reduced; the signal source interface of the ATE is prevented from being frequently switched, the test time is shortened, and the test efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and more specifically, to a multi-site test production board for mass production testing of radio frequency front-end chips. Background Technology

[0002] Currently, radio frequency (RF) front-end chips are widely used in various electronic devices, such as mobile phones, tablets, and routers. Each RF front-end chip undergoes rigorous mass production testing before shipment to ensure its quality and performance meet customer requirements. As RF front-end systems support more and more communication frequency bands and their designs become increasingly complex, modularization of RF front-end chips has become an inevitable trend, resulting in a proliferation of interfaces.

[0003] Mass production testing of RF front-end chips is conducted using ATE (Automatic Test Equipment). Each ATE has limited RF resources. As the complexity of RF front-end chips increases, a chip with too many RF interfaces will consume a significant amount of ATE testing resources, leading to resource shortages. Furthermore, to improve testing efficiency, multi-site testing is typically employed, which requires even more RF resources.

[0004] Figure 4 The illustration shows an RF PA product with 18 external RF interfaces. Taking a common RF test suite, PAx RD, as an example, it only has 32 RF resources. Traditional testing methods can only perform single-site testing, not multi-site testing. If a reusable switch matrix is ​​used externally to connect similar interfaces together to reduce ATE resource usage, it requires very complex RF wiring and switch matrix power supply wiring during mass production environment setup. Furthermore, reusable switch matrices are typically expensive.

[0005] The information disclosed in the background section of this utility model is intended only to enhance the understanding of the general background of this utility model, and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0006] The purpose of this invention is to propose a multi-site test production board for mass production testing of RF front-end chips. This board addresses the problems of insufficient test resources and complex mass production environment setup in RF chip mass production testing. It effectively reduces the ATE RF test resources occupied by the same station, improves the resource reuse rate of the ATE, effectively reduces the difficulty of setting up the mass production test environment, and lowers the test cost. It also saves ATE RF test resources, enabling one ATE to perform tests on more sites, avoids frequent switching of ATE signal source interfaces, reduces test time, and improves test efficiency.

[0007] To achieve the above objectives, this utility model proposes a multi-site test production board for mass production testing of RF front-end chips, comprising:

[0008] Multiple single-site test production boards and substrates, with the multiple single-site test production boards arranged in an array on the substrate;

[0009] The single-site test production board includes:

[0010] The plate body, wherein the plate body is provided with:

[0011] A clamp for holding an RF front-end chip under test, the clamp having a first pin corresponding to the signal input port of the RF front-end chip, a second pin corresponding to the first signal output port of the RF front-end chip, a third pin corresponding to the second signal output port of the RF front-end chip, and a fourth pin corresponding to the signal input and output ports of the RF front-end chip.

[0012] The first onboard single-pole multi-throw RF switch is connected to the first pin via an inter-board bus.

[0013] The second onboard single-pole multi-throw RF switch is connected to the first onboard single-pole multi-throw RF switch via an inter-board bus.

[0014] The third onboard single-pole multi-throw RF switch is connected to the second onboard single-pole multi-throw RF switch and the second pin via an interboard bus.

[0015] The fourth onboard single-pole multi-throw (SPMD) RF switch is connected to the fourth pin and the second onboard SPMD RF switch via an inter-board bus.

[0016] Optionally, the single-site test production board further includes:

[0017] The first SMA interface is connected to the first onboard single-pole multi-throw RF switch via an inter-board bus.

[0018] The second SMA interface is connected to the third onboard single-pole multi-throw RF switch via an inter-board bus.

[0019] The third SMA interface is connected to the third pin via an inter-board bus.

[0020] The single-site test production board is connected to the integrated circuit automatic test machine through the first SMA interface, the second SMA interface, and the third SMA interface.

[0021] Optionally, the number of pins of the first onboard single-pole multiple-throw RF switch is greater than or equal to the sum of the number of the first pins and the number of the first SMA interface;

[0022] The number of pins of the second onboard single-pole multi-throw RF switch is greater than or equal to the sum of the number of the first, third, and fourth onboard single-pole multi-throw RF switches;

[0023] The number of pins of the third onboard single-pole multi-throw RF switch is greater than or equal to the sum of the number of pins of the second onboard single-pole multi-throw RF switch, the second pin, and the second SMA interface;

[0024] The number of pins of the fourth onboard single-pole multi-throw RF switch is greater than or equal to the sum of the number of the fourth pin and the number of the second onboard single-pole multi-throw RF switch.

[0025] Optionally, the clamp further includes:

[0026] The first interface corresponding to the DC pin of the radio frequency front-end chip;

[0027] A second interface corresponding to the digital pins of the radio frequency front-end chip.

[0028] Optionally, the plate body has a plurality of evenly distributed first mounting holes in the middle;

[0029] The single-site test production board is mounted on the substrate through the first mounting hole.

[0030] Optionally, the upper left corner of the board is provided with a plurality of second mounting holes corresponding to the grounding pins of the first SMA interface;

[0031] The upper right corner of the board is provided with multiple third mounting holes corresponding to the grounding pins of the third SMA interface;

[0032] The lower right corner of the board is provided with multiple fourth mounting holes corresponding to the grounding pins of the second SMA interface.

[0033] The first SMA interface, the third SMA interface, and the second SMA interface are fixed to the single-site test production board through the second mounting hole, the third mounting hole, and the fourth mounting hole, respectively.

[0034] Optionally, the plate further includes:

[0035] The first DC interface is located in the lower left corner of the board, and the first DC interface is connected to the first interface via an inter-board bus.

[0036] The first digital interface is located in the lower left corner of the board, and the first digital interface is connected to the second interface via an inter-board bus.

[0037] The fifth pin is connected to the first interface via the board bus;

[0038] The sixth pin is connected to the second interface via an inter-board bus.

[0039] Optionally, the substrate further includes:

[0040] Multiple third interfaces, corresponding to the fifth pin;

[0041] Multiple fourth interfaces, corresponding to the sixth pin;

[0042] Multiple second DC interfaces, each of which is connected to a predetermined number of the third interfaces via an inter-board bus;

[0043] Multiple second digital interfaces, each of which is connected to a predetermined number of the fourth interfaces via an inter-board bus.

[0044] Optionally, the clamp further includes:

[0045] The grounding interface corresponding to the grounding pin of the radio frequency front-end chip.

[0046] Optionally, one pin of the second onboard single-pole multi-throw RF switch is connected to one pin of the first onboard single-pole multi-throw RF switch via an inter-board bus.

[0047] One pin of the third onboard single-pole multi-throw RF switch is connected to one pin of the second onboard single-pole multi-throw RF switch via an inter-board bus.

[0048] One pin of the fourth onboard single-pole multi-throw RF switch is connected to one pin of the second onboard single-pole multi-throw RF switch via an inter-board bus.

[0049] The first SMA interface is connected to one pin of the first onboard single-pole multi-throw RF switch via an inter-board bus;

[0050] The second SMA interface is connected to one pin of the third onboard single-pole multi-throw RF switch via an inter-board bus.

[0051] The beneficial effects of this invention are as follows: By arranging multiple single-site test production boards in an array on a substrate, the signal input ports of the RF front-end chip are combined together by a first onboard single-pole multi-throw (SPMW) RF switch, and the signal input and output ports of the RF front-end chip are combined together by a fourth onboard SPMW RF switch. A second onboard SPMW RF switch is connected to the first, second, and third onboard SPMW RF switches respectively, thus merging the RF interfaces of the RF front-end chip into three RF interfaces connected to the ATE (Automatic Test Equipment). This significantly reduces the utilization rate of ATE test resources, effectively reduces the ATE RF test resources occupied at the same site, and improves the ATE resource reuse rate; it effectively reduces the difficulty of setting up a mass production test environment and lowers test costs; it saves ATE RF test resources, enabling one ATE to perform tests on more sites, avoids frequent switching of ATE signal source interfaces, reduces test time, and improves test efficiency.

[0052] The device of this invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description

[0053] The above and other objects, features and advantages of the present invention will become more apparent from the more detailed description of exemplary embodiments of the present invention in conjunction with the accompanying drawings, in which the same reference numerals generally represent the same components.

[0054] Figure 1 A schematic diagram of a multi-site test production board for mass production testing of radio frequency front-end chips is shown in one embodiment.

[0055] Figure 2 A schematic diagram of the connection between a single-site test production board and the RF front-end chip under test is shown in one embodiment.

[0056] Figure 3 A schematic diagram of a single-site test production board according to an embodiment is shown.

[0057] Figure 4 A schematic diagram of a prior art radio frequency PA product is shown. Detailed Implementation

[0058] The present invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.

[0059] Example

[0060] like Figure 1 As shown, this embodiment provides a multi-site test production board for mass production testing of RF front-end chips, including:

[0061] Multiple single-site test production boards 1 and substrate 2, with the multiple single-site test production boards 1 arranged in an array on the substrate 2;

[0062] Single Site Test Production Board 1 includes:

[0063] Plate 3, wherein the plate is provided with:

[0064] The clamp 4 is used to hold the radio frequency front-end chip under test. The clamp 4 is provided with a first pin corresponding to the signal input port of the radio frequency front-end chip, a second pin corresponding to the first signal output port of the radio frequency front-end chip, a third pin corresponding to the second signal output port of the radio frequency front-end chip, and a fourth pin corresponding to the signal input and output ports of the radio frequency front-end chip.

[0065] The first onboard single-pole multi-throw RF switch SW1 is connected to the first pin via an inter-board bus.

[0066] The second onboard single-pole multi-throw RF switch SW2 is connected to the first onboard single-pole multi-throw RF switch SW1 via an inter-board bus.

[0067] The third board-mounted single-pole multi-throw RF switch SW3 is connected to the second board-mounted single-pole multi-throw RF switch SW2 and the second pin via the inter-board bus.

[0068] The fourth onboard single-pole multi-throw RF switch SW4 is connected to the fourth pin and the second onboard single-pole multi-throw RF switch SW2 via the inter-board bus.

[0069] Specifically, such as Figure 1 and Figure 2As shown, the multi-site test production board of this embodiment includes multiple single-site test production boards 1 and a substrate 2. The multiple single-site test production boards 1 are arranged in an array on the substrate 2. This array layout design not only helps to achieve efficient use of space, but also improves the overall compactness and systematicness of the test to a certain extent, facilitating subsequent unified management and operation. The single-site test production board 1 includes a board body 3, on which a clamp 4 is provided to hold the RF front-end chip under test. Its main function is to firmly clamp the RF front-end chip under test. It also includes a first onboard single-pole multi-throw RF switch SW1, a second onboard single-pole multi-throw RF switch SW2, a third onboard single-pole multi-throw RF switch SW3, and a fourth onboard single-pole multi-throw RF switch SW4. All ports of the RF front-end chip are divided into signal input ports, a first signal output port, a second signal output port, and a third signal output port. The fixture 4 has a first pin corresponding to the signal input port of the RF front-end chip. This pin is responsible for accurately transmitting the externally input signal to the chip, providing the necessary signal source for the chip's normal operation. The second pin, corresponding to the first signal output port of the RF front-end chip, is responsible for outputting one signal processed by the chip to the subsequent testing stage. The third pin, corresponding to the second signal output port of the RF front-end chip, is used to output another signal processed by the chip, meeting the testing requirements for multiple signal outputs of the chip under different testing scenarios. The fourth pin, corresponding to the signal input port of the RF front-end chip, has the ability to transmit signals bidirectionally. It can both receive external signals input to the chip and output signals processed by the chip, greatly enhancing the flexibility and comprehensiveness of the test.The first onboard single-pole multi-throw (SPMD) RF switch SW1 is connected to the first pin via an inter-board bus. This connection allows the signal input from the first pin to be flexibly routed through the first onboard SPMD RF switch SW1, directing the signal to different paths according to test requirements, providing diverse options for subsequent signal processing and testing. The second onboard SPMD RF switch SW2 is connected to the first onboard SPMD RF switch SW1 via an inter-board bus. The third onboard SPMD RF switch SW3 is connected to the second onboard SPMD RF switch SW2 and the second pin via an inter-board bus, respectively. The fourth onboard SPMD RF switch SW4 is connected to the second onboard SPMD RF switch SW2 and the second pin via an inter-board bus, respectively. The fourth pin and the second onboard single-pole multi-throw (SPMWP) RF switch SW2 are connected via an inter-board bus. The first onboard SPMWP RF switch SW1 and its first pin combine the signal input ports TX-HB-IN and TX-LB-IN of the RF front-end chip. The fourth onboard SPMWP RF switch SW4 and its fourth pin combine the signal input / output ports TRX1-TRX14 of the RF front-end chip. The second onboard SPMWP RF switch SW2 is connected to the first onboard SPMWP RF switch SW1, the second onboard SPMWP RF switch SW2, and the third onboard SPMWP RF switch SW3, respectively, thus connecting the RF ports of the RF front-end chip. The signals are combined into RF ports PORT1, PORT2, and PORT3 and connected to the ATE. Specifically, the first onboard single-pole multi-throw (SPMD) RF switch SW1 is a single-pole triple-throw (SPMD) RF switch; the second onboard SPMD RF switch SW2 is a single-pole triple-throw (SPMD) RF switch; the third onboard SPMD RF switch SW3 is a single-pole triple-throw (SPMD) RF switch; and the fourth onboard SPMD RF switch SW4 is a 1-to-14 splitter onboard RF switch. The first onboard SPMD RF switch SW1 combines the chip's signal input ports Tx_HB_IN and Tx_LB_IN with the second onboard SPMD RF switch SW2 into RF port Port. 1. Connect the chip's input / output ports TRx1-TRx14 to the second onboard single-pole multi-throw (SPMWF) RF switch SW2 via the fourth onboard SPMWF RF switch SW4. Connect the third onboard SPMWF RF switch SW1 and the fourth onboard SPMWF RF switch SW4 to the third onboard SPMWF RF switch SW3 via the second onboard SPMWF RF switch SW2. Combine the first signal output port CPL and the second onboard SPMWF RF switch SW2 to RF port Port2 via the third onboard SPMWF RF switch SW3. Since the second signal output port ANT has a high output power, it can be directly connected to port Port3. It should be noted that during implementation, the number of N-pole N-throw switches is not limited to the above number, as long as the test requirements are met. For example, the above 1-to-14 onboard RF switch can be modified to a 1-to-16 RF switch, in which case the remaining two ports need to be kept idle.The above solution allows the product's 18 RF ports to be combined into 3 RF ports for connection to the ATE. This means that single-site testing of the product only requires 3 RF test resources from the ATE, significantly reducing the ATE's test resource utilization rate, effectively reducing the ATE RF test resources occupied at the same site, and improving the ATE's resource reuse rate. It also effectively reduces the difficulty of setting up a mass production test environment and lowers testing costs. Furthermore, it saves ATE RF test resources, enabling one ATE to perform tests on more sites, avoiding frequent switching of the ATE's signal source interface, reducing testing time, and improving testing efficiency.

[0070] In this embodiment, the single-site test production board 1 further includes:

[0071] The first SMA interface 5 is connected to the first onboard single-pole multi-throw RF switch SW1 via an inter-board bus.

[0072] The second SMA interface 6 is connected to the third onboard single-pole multi-throw RF switch SW3 via an inter-board bus.

[0073] The third SMA interface 7 is connected to the third pin via the inter-board bus;

[0074] The single-site test production board 1 is connected to the integrated circuit automatic test machine through the first SMA interface 5, the second SMA interface 6 and the third SMA interface 7.

[0075] Specifically, the first SMA interface 5 plays a crucial role in the signal input of the entire test system. It establishes a robust connection with the first onboard single-pole multi-throw (SPMWT) RF switch SW1 via the inter-board bus. Through this connection, the test signal from the automated integrated circuit tester can smoothly enter the first onboard SPMWT RF switch SW1 via the first SMA interface 5, and then, through the signal routing function of SW1, transmit the signal to the subsequent test link to achieve relevant tests on the signal input port of the RF front-end chip. The second SMA interface 6 also performs an indispensable function, and it is closely connected to the third onboard SPMWT RF switch SW3 via the inter-board bus. This connection architecture allows the signal switched and processed by the third onboard SPMWT RF switch SW3 to interact with the automated integrated circuit tester through the second SMA interface 6. This interface can effectively transmit the test signal related to the chip's first signal output port CPL to the automated integrated circuit tester. The third SMA interface 7 is specifically connected to the third pin via the inter-board bus. Since the third pin corresponds to the second signal output port ANT of the RF front-end chip, the function of the third SMA interface 7 is to effectively transmit the signal output from the second signal output port ANT of the chip to the integrated circuit automated test machine. The single-site test production board 1 achieves seamless connection with the integrated circuit automated test machine through these three SMA interfaces: the first SMA interface 5, the second SMA interface 6, and the third SMA interface 7. This connection method constructs a complete and efficient test system, enabling the integrated circuit automated test machine to perform accurate and comprehensive testing of each signal port of the RF front-end chip using the various components on the single-site test production board 1. This tightly collaborative connection architecture greatly improves the efficiency and accuracy of RF front-end chip mass production testing, providing a solid guarantee for ensuring high-quality chip production.

[0076] In this embodiment, the number of pins of the first onboard single-pole multi-throw RF switch SW1 is greater than or equal to the sum of the number of the first pins and the number of the first SMA interface 5;

[0077] The number of pins of the second onboard single-pole multi-throw RF switch SW2 is greater than or equal to the sum of the number of the first onboard single-pole multi-throw RF switch SW1, the third onboard single-pole multi-throw RF switch SW3, and the fourth onboard single-pole multi-throw RF switch SW4.

[0078] The number of pins of the third onboard single-pole multi-throw RF switch SW3 is greater than or equal to the sum of the number of the second onboard single-pole multi-throw RF switch SW2, the number of the second pin, and the number of the second SMA interface 6.

[0079] The number of pins of the fourth onboard single-pole multi-throw RF switch SW4 is greater than or equal to the sum of the number of the fourth pin and the number of the second onboard single-pole multi-throw RF switch SW2.

[0080] Specifically, the first onboard single-pole multi-throw (SPMWP) RF switch SW1 has a specific lower limit requirement for the number of pins, namely, it must be greater than or equal to the sum of the number of the first pin and the number of the first SMA interface 5. The first pin is responsible for connecting to the signal input ports Tx_HB_IN and Tx_LB_IN of the RF front-end chip, while the first SMA interface 5 is used for signal interaction with external test equipment. As a key node for signal entry into the test link, the first onboard SPMWP RF switch SW1 has a sufficient number of pins to ensure that it can easily handle signal input from different directions and accurately switch the signal to the corresponding output path according to the test requirements, providing diverse signal routing options for subsequent test processes. The second onboard SPMWP RF switch SW2 must have a number of pins greater than or equal to the sum of the number of the first onboard SPMWP RF switch SW1, the third onboard SPMWP RF switch SW3, and the fourth onboard SPMWP RF switch SW4. The second onboard single-pole multi-throw (SPMD) RF switch SW2 occupies a crucial, pivotal position in the entire signal transmission network. It receives signals from both the first onboard SPMD RF switch SW1 and the fourth onboard SPMD RF switch SW4, and also distributes signals to the third onboard SPMD RF switch SW3 and the fourth onboard SPMD RF switch SW4. Therefore, a sufficient number of pins is essential to ensure effective integration of various signals and to guide signals appropriately to other RF switches according to different test scenarios, ensuring smooth and efficient signal flow throughout the entire test link. The third onboard SPMD RF switch SW3 must have a pin count greater than or equal to the sum of the pin counts of the second onboard SPMD RF switch SW2, the second pin, and the second SMA interface 6. The second pin connects to the first signal output port CPL of the RF front-end chip, and the second SMA interface 6 is responsible for signal interaction with the integrated circuit automated test machine. The third onboard single-pole multi-throw (SPMWP) RF switch SW3 serves as a crucial hub for the chip's first signal output port CPL, disconnecting input / output signals from TRX1-TRX14, and transmitting related signals to input signal ports Tx_HB_IN and Tx_LB_IN. Its sufficient pin count allows for precise control of signal transmission to the second SMA interface 6, ultimately outputting to the test equipment. The fourth onboard SPMWP RF switch SW4 has a pin count greater than or equal to the sum of the fourth pin and the second onboard SPMWP RF switch SW2. The fourth pin corresponds to the chip's signal input / output port and features bidirectional signal transmission. Utilizing its ample pin count, the fourth onboard SPMWP RF switch SW4, in conjunction with the second onboard SPMWP RF switch SW2, flexibly switches the bidirectional signal transmission on the fourth pin, meeting the complex and diverse testing requirements of the chip's signal input / output ports and providing robust hardware support for comprehensive performance testing of this port.This design strategy regarding the number of pins of each onboard single-pole multi-throw RF switch closely aligns with the testing requirements of each signal port of the RF front-end chip and the connection relationships between each component. This ensures that the single-site test production board 1 can stably and efficiently complete various testing tasks of the chip in a complex testing environment, providing a reliable hardware foundation for the mass production testing of RF front-end chips.

[0081] In this embodiment, the clamp 4 further includes:

[0082] The first interface corresponding to the DC pin of the RF front-end chip;

[0083] A second interface corresponding to the digital pins of the RF front-end chip.

[0084] In one example, the plate 3 has a plurality of evenly distributed first mounting holes 8 in the middle;

[0085] The single-site test production board 1 is mounted on the substrate 2 through the first mounting hole 8.

[0086] Specifically, in addition to the pins corresponding to the signal ports of the RF front-end chip, fixture 4 further improves the connection design with other key functional pins of the chip. Specifically, fixture 4 adds a first interface corresponding to the DC pins of the RF front-end chip. This interface provides a stable DC power input channel for the chip, ensuring a reliable power supply during testing and guaranteeing the normal operation of all chip functions. Simultaneously, fixture 4 also has a second interface corresponding to the digital pins of the RF front-end chip. This interface bridges the gap for the chip's digital signal transmission, enabling smooth data interaction between the chip and external digital signal processing equipment, facilitating comprehensive testing of the chip's digital signal processing capabilities.

[0087] The design of board 3 is ingenious in assembling the single-site test production board 1 with the substrate 2. Multiple evenly distributed first mounting holes 8 are located in the center of board 3. This even distribution design ensures that the single-site test production board 1 receives balanced support when mounted onto the substrate 2, avoiding problems such as poor contact or mechanical deformation caused by uneven force. Through these first mounting holes 8, suitable connectors such as screws and rivets can be used to securely mount the single-site test production board 1 onto the substrate 2. This design not only ensures the stability of multiple single-site test production boards 1 arranged in an array on the substrate 2, but also facilitates the disassembly, replacement, or maintenance of individual test boards during mass production testing, providing convenient conditions for the efficient operation of the entire multi-site test production board system. From the comprehensive compatibility of the fixture 4 with various chip pins to the careful consideration of the mounting stability of the first mounting holes 8 on board 3, every detail fully reflects the scientific and practical design of this test board, providing a solid and reliable hardware platform for the mass production testing of RF front-end chips.

[0088] In this embodiment, the upper left corner of the board 3 is provided with a plurality of second mounting holes 9 corresponding to the grounding pins of the first SMA interface 5;

[0089] The upper right corner of the board has multiple third mounting holes 10 corresponding to the grounding pins of the third SMA interface 7;

[0090] The lower right corner of the board has multiple fourth mounting holes 11 corresponding to the grounding pins of the second SMA interface 6.

[0091] The first SMA interface 5, the third SMA interface 6, and the second SMA interface 7 are fixed to the single-site test production board 1 through the second mounting hole 9, the third mounting hole 10, and the fourth mounting hole 11, respectively.

[0092] Specifically, multiple second mounting holes 9 are provided in the upper left corner of board 3. These mounting holes precisely correspond to the grounding pins of the first SMA interface 5. As an important interface for signal transmission, the stability of the grounding of the SMA interface has a crucial impact on signal quality. The second mounting holes 9 allow for the use of specific fixing devices, such as screws, to securely fix the first SMA interface 5 to board 3, ensuring good contact between its grounding pins and board 3, effectively reducing electromagnetic interference during signal transmission and guaranteeing signal purity and stability. In the upper right corner of board 3, multiple third mounting holes 10 are distributed, corresponding to the grounding pins of the third SMA interface 7. Similarly, the third SMA interface 7 is responsible for transmitting signals related to the chip's second signal output port, and the reliability of its grounding directly affects the transmission quality of this signal. The third mounting holes 10 ensure that the third SMA interface 7 can be securely mounted on board 3 and achieve a good grounding connection, providing a stable and reliable signal transmission environment for testing the chip's second signal output port. In the lower right corner of board 3, multiple fourth mounting holes 11 are provided, corresponding to the grounding pins of the second SMA interface 6. The second SMA interface 6 plays a crucial role in the entire test system by transmitting test signals related to the chip's first signal output port to the integrated circuit automatic test machine. Fixing and grounding the second SMA interface 6 through the fourth mounting holes 11 ensures the stability and reliability of the interface during signal transmission, avoiding signal distortion or interference caused by poor grounding, thus guaranteeing the accuracy of the chip's first signal output performance test. The second mounting hole 9, third mounting hole 10, and fourth mounting hole 11 respectively ensure the stable fixing and good grounding of the first SMA interface 5, the third SMA interface 7, and the second SMA interface 6 on the single-site test production board 1. This carefully designed layout, from a hardware perspective, guarantees the stability and reliability of each SMA interface during signal transmission, further improving the accuracy and stability of the single-site test production board 1 for testing RF front-end chips, laying a solid foundation for the efficient operation of the entire RF front-end chip mass production test system.

[0093] In this embodiment, as Figure 3 As shown, plate 1 also includes:

[0094] The first DC interface 14 is located in the lower left corner of the board, and the first DC interface 14 is connected to the first interface via an inter-board bus.

[0095] The first digital interface 15 is located in the lower left corner of the board, and the first digital interface 15 is connected to the second interface through the board bus.

[0096] The fifth pin is connected to the first interface via the board bus;

[0097] The sixth pin is connected to the second interface via the board bus.

[0098] Specifically, in the structure of board 3 of the single-site test production board 1, to achieve more comprehensive and efficient testing support for the RF front-end chip, its interface and pin configuration has been further enriched. Two key interfaces have been added to the lower left corner of board 3: a first DC interface 14 and a first digital interface 15. The first DC interface 14 is specifically designed for connecting an external DC power supply. It connects to the first interface on fixture 4 corresponding to the DC pins of the RF front-end chip via the inter-board bus. This connection establishes a stable DC power transmission link, ensuring that the RF front-end chip receives a stable and suitable DC power supply during testing, providing a solid energy guarantee for the normal operation of the chip's various functions. Meanwhile, the first digital interface 15 is also located in the lower left corner of board 3. This interface connects to the second interface on fixture 4 corresponding to the digital pins of the RF front-end chip via the inter-board bus, establishing a communication bridge between the chip and external digital signal processing equipment. Through this connection, the chip's digital signals can be smoothly transmitted to external devices for analysis and processing. Simultaneously, external devices can send digital control signals to the chip, enabling comprehensive testing and verification of the chip's digital signal processing capabilities. Furthermore, board 3 also features a fifth and a sixth pin. The fifth pin is connected to the first interface via the inter-board bus, further strengthening the transmission path for DC power-related signals. This may be used for transmitting auxiliary power signals or providing additional power connection points to meet the chip's diverse power supply needs in different testing scenarios. The sixth pin is connected to the second interface via the inter-board bus. This may be to expand the digital signal transmission channel or provide a backup digital signal connection path to ensure stable transmission and interaction of the chip's digital signals in complex testing environments, thereby comprehensively improving the testing capabilities and flexibility of the RF front-end chip. These newly added interfaces and pins further enhance the functional architecture of the single-site test production board 1, enabling it to better meet the power supply and digital signal processing needs of the RF front-end chip in different testing scenarios, providing more comprehensive and reliable hardware support for chip mass production testing.

[0099] In this embodiment, as Figure 1 As shown, substrate 2 also includes:

[0100] Multiple third interfaces, corresponding to the fifth pin;

[0101] Multiple fourth interfaces, corresponding to the sixth pin;

[0102] Multiple second DC interfaces 12, each second DC interface 12 is connected to a set number of third interfaces via an inter-board bus;

[0103] Multiple second digital interfaces 13, each of which is connected to a set number of fourth interfaces via an inter-board bus.

[0104] Specifically, substrate 2 is equipped with multiple third interfaces, each corresponding to a fifth pin on the body 3 of the single-site test production board 1. The fifth pin is connected to a first interface on fixture 4, which connects to the DC pins of the chips, via an inter-board bus. Therefore, the third interfaces on substrate 2 are likely used to integrate the relevant DC power auxiliary signals of multiple single-site test production boards 1 for unified management or distribution, meeting the diverse power supply needs of chips in different testing scenarios. Simultaneously, substrate 2 also has multiple fourth interfaces, corresponding to a sixth pin on the body 3 of the single-site test production board 1. The sixth pin is connected to a second interface on fixture 4, which connects to the digital pins of the chips, via an inter-board bus. This means the fourth interfaces are likely used to aggregate the digital signal transmission paths of multiple single-site test production boards 1, facilitating centralized processing and interaction of digital signals from multiple chips. Furthermore, substrate 2 has multiple second DC interfaces 12. Each second DC interface 12 is connected to a predetermined number of third interfaces via an inter-board bus, forming a DC power distribution network. After an external DC power supply is connected to the second DC interface 12, the power signal can be precisely distributed to each connected third interface via the inter-board bus, thereby providing a stable DC power supply to the corresponding single-site test production board 1 and its RF front-end chips. This distributed power distribution design allows for flexible adjustment of the power supply to different single-site test production boards 1, meeting the varying power requirements of simultaneous testing of multiple chips. Similarly, multiple second digital interfaces 13 are provided on the substrate 2. Each second digital interface 13 is connected to a set number of fourth interfaces via the inter-board bus, constructing a digital signal processing network. This enables external digital signal processing equipment to efficiently interact with chips on multiple single-site test production boards 1 through the second digital interfaces 13. This centralized digital signal management architecture facilitates more convenient synchronous testing and management of the digital signal processing functions of multiple chips, significantly improving testing efficiency and data processing accuracy. In summary, these design features of substrate 2, through close cooperation with single-site test production board 1, greatly optimize the testing process of the entire multi-site test production board system for RF front-end chips, improve the flexibility and efficiency of testing, and provide a solid and reliable hardware platform for large-scale mass production testing of RF front-end chips.

[0105] In this embodiment, the clamp 4 further includes:

[0106] The grounding interface corresponding to the grounding pin of the RF front-end chip.

[0107] In one example, a pin of the second onboard single-pole multiple-throw RF switch SW2 is connected to a pin of the first onboard single-pole multiple-throw RF switch SW1 via an inter-board bus.

[0108] One pin of the third onboard single-pole multi-throw RF switch SW3 is connected to one pin of the second onboard single-pole multi-throw RF switch SW2 via the inter-board bus.

[0109] One pin of the fourth onboard single-pole multi-throw RF switch SW4 is connected to one pin of the second onboard single-pole multi-throw RF switch SW2 via an inter-board bus.

[0110] The first SMA interface is connected to one pin of the first onboard single-pole multi-throw RF switch SW1 via an inter-board bus.

[0111] The second SMA interface is connected to one pin of the third onboard single-pole multi-throw RF switch SW3 via an inter-board bus.

[0112] Specifically, fixture 4 adds a grounding interface corresponding to the grounding pins of the RF front-end chip. This grounding interface plays a crucial role in the entire test system, ensuring that the RF front-end chip maintains a good grounding state during testing. Good grounding helps eliminate electrostatic interference, ensures the normal operation of the chip, and prevents chip damage due to static electricity accumulation, providing a stable electrical environment for testing. The components are connected via an inter-board bus, which not only simplifies wiring and reduces circuit complexity but also facilitates system adjustments and expansions. For example, when new functions need to be added or signal transmission paths modified, this can be easily achieved through the inter-board bus, and it also facilitates troubleshooting and repairing faulty circuits. In this embodiment, multiple single-site test production boards 1 are arranged in an array on substrate 2, allowing simultaneous testing of multiple RF front-end chips, greatly improving the efficiency of mass production testing. This parallel testing method can process more chips per unit time, shortening the overall test cycle and saving significant time costs for large-scale chip mass production testing. By integrating fixture 4, multiple onboard single-pole multi-throw RF switches (SW1, SW2, SW3, SW4), and various interfaces (SMA interface, DC interface, digital interface, etc.) onto a single-site test production board 1, and combining this with the layout of substrate 2, a high degree of integration of the test system is achieved. This avoids the frequent connection and switching operations caused by scattered test equipment, reduces test preparation and operation time, and makes the testing process smoother and more efficient. When a single-site test production board 1 malfunctions or requires maintenance, it can be easily replaced or repaired without affecting the operation of the entire test system, reducing maintenance costs and difficulty. It provides an efficient, flexible, stable, reliable, easy-to-maintain, and expandable test solution for chip mass production testing, helping to ensure high-quality production of RF front-end chips and the accuracy of test results.

[0113] The various embodiments of the present invention have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments.

Claims

1. A multi-site test production board for mass production testing of RF front-end chips, characterized in that, include: Multiple single-site test production boards and substrates, with the multiple single-site test production boards arranged in an array on the substrate; The single-site test production board includes: The plate body, wherein the plate body is provided with: A clamp for holding an RF front-end chip under test, the clamp having a first pin corresponding to the signal input port of the RF front-end chip, a second pin corresponding to the first signal output port of the RF front-end chip, a third pin corresponding to the second signal output port of the RF front-end chip, and a fourth pin corresponding to the signal input and output ports of the RF front-end chip. The first onboard single-pole multi-throw RF switch is connected to the first pin via an inter-board bus. The second onboard single-pole multi-throw RF switch is connected to the first onboard single-pole multi-throw RF switch via an inter-board bus. The third onboard single-pole multi-throw RF switch is connected to the second onboard single-pole multi-throw RF switch and the second pin via an interboard bus. The fourth onboard single-pole multi-throw (SPMD) RF switch is connected to the fourth pin and the second onboard SPMD RF switch via an inter-board bus.

2. The multi-site test production board for mass production testing of RF front-end chips according to claim 1, characterized in that, The single-site test production board also includes: The first SMA interface is connected to the first onboard single-pole multi-throw RF switch via an inter-board bus. The second SMA interface is connected to the third onboard single-pole multi-throw RF switch via an inter-board bus. The third SMA interface is connected to the third pin via an inter-board bus. The single-site test production board is connected to the integrated circuit automatic test machine through the first SMA interface, the second SMA interface, and the third SMA interface.

3. The multi-site test production board for mass production testing of RF front-end chips according to claim 2, characterized in that, The number of pins of the first onboard single-pole multi-throw RF switch is greater than or equal to the sum of the number of the first pins and the number of the first SMA interface; The number of pins of the second onboard single-pole multi-throw RF switch is greater than or equal to the sum of the number of the first, third, and fourth onboard single-pole multi-throw RF switches; The number of pins of the third onboard single-pole multi-throw RF switch is greater than or equal to the sum of the number of pins of the second onboard single-pole multi-throw RF switch, the second pin, and the second SMA interface; The number of pins of the fourth onboard single-pole multi-throw RF switch is greater than or equal to the sum of the number of the fourth pin and the number of the second onboard single-pole multi-throw RF switch.

4. The multi-site test production board for mass production testing of RF front-end chips according to claim 1, characterized in that, The clamp also includes: The first interface corresponding to the DC pin of the radio frequency front-end chip; A second interface corresponding to the digital pins of the radio frequency front-end chip.

5. The multi-site test production board for mass production testing of RF front-end chips according to claim 1, characterized in that, The plate has multiple evenly distributed first mounting holes in the middle. The single-site test production board is mounted on the substrate through the first mounting hole.

6. The multi-site test production board for mass production testing of RF front-end chips according to claim 2, characterized in that, The upper left corner of the board is provided with multiple second mounting holes corresponding to the grounding pins of the first SMA interface; The upper right corner of the board is provided with multiple third mounting holes corresponding to the grounding pins of the third SMA interface; The lower right corner of the board is provided with multiple fourth mounting holes corresponding to the grounding pins of the second SMA interface; The first SMA interface, the third SMA interface, and the second SMA interface are fixed to the single-site test production board through the second mounting hole, the third mounting hole, and the fourth mounting hole, respectively.

7. The multi-site test production board for mass production testing of RF front-end chips according to claim 4, characterized in that, The plate also includes: The first DC interface is located in the lower left corner of the board, and the first DC interface is connected to the first interface via an inter-board bus. The first digital interface is located in the lower left corner of the board, and the first digital interface is connected to the second interface via an inter-board bus. The fifth pin is connected to the first interface via the board bus; The sixth pin is connected to the second interface via an inter-board bus.

8. The multi-site test production board for mass production testing of RF front-end chips according to claim 7, characterized in that, The substrate further includes: Multiple third interfaces, corresponding to the fifth pin; Multiple fourth interfaces, corresponding to the sixth pin; Multiple second DC interfaces, each of which is connected to a predetermined number of the third interfaces via an inter-board bus; Multiple second digital interfaces, each of which is connected to a predetermined number of the fourth interfaces via an inter-board bus.

9. The multi-site test production board for mass production testing of RF front-end chips according to claim 7, characterized in that, The clamp also includes: The grounding interface corresponding to the grounding pin of the radio frequency front-end chip.

10. The multi-site test production board for mass production testing of RF front-end chips according to claim 2, characterized in that, One pin of the second onboard single-pole multi-throw RF switch is connected to one pin of the first onboard single-pole multi-throw RF switch via an inter-board bus. One pin of the third onboard single-pole multi-throw RF switch is connected to one pin of the second onboard single-pole multi-throw RF switch via an inter-board bus. One pin of the fourth onboard single-pole multi-throw RF switch is connected to one pin of the second onboard single-pole multi-throw RF switch via an inter-board bus. The first SMA interface is connected to one pin of the first onboard single-pole multi-throw RF switch via an inter-board bus; The second SMA interface is connected to one pin of the third onboard single-pole multi-throw RF switch via an inter-board bus.

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