Receiving structure of laser radar and laser radar

Abstract

The utility model provides a receiving structure of a laser radar and the laser radar. The receiving structure comprises a circuit board; the receiving chip is located on the circuit board, the receiving chip comprises a light inlet, and echoes of the laser radar enter the receiving chip through the light inlet; the receiving chip outputs an electric signal in response to the echo; the packaging part is located on the surface of the receiving chip and extends to the surface of the circuit board; the protective cover plate is configured to protect the light inlet; the protective cover plate comprises a light-transmitting cover, and the light-transmitting cover covers the light inlet of the receiving chip; the light-transmitting cover allows light of the wave band where the echo is located to transmit; and the protective cover plate is in contact with the packaging part. According to the technical scheme, the receiving structure can be effectively protected, the probability that the light-transmitting cover is damaged and cracked is reduced, and the reliability of the receiving structure is improved.

Description

Technical Field

[0001] This disclosure relates to the field of lidar, and particularly to a lidar receiving structure and a lidar. Background Technology

[0002] LiDAR is a commonly used ranging sensor, characterized by its long detection range, high resolution, and low susceptibility to environmental interference. It is widely used in fields such as autonomous driving, intelligent robots, and drones. In recent years, with the rapid development of autonomous driving technology, LiDAR, as a core sensor for distance perception, has become indispensable.

[0003] A lidar system includes a receiver structure, which is a key component of lidar. Ensuring the reliability of the receiver structure is a crucial factor in ensuring the performance of the lidar. Utility Model Content

[0004] The problem addressed in this disclosure is how to improve the reliability of the receiving structure of a lidar system.

[0005] To address the aforementioned problems, this disclosure provides a receiving structure for a lidar, comprising:

[0006] Circuit board; receiver chip, located on the circuit board, the receiver chip includes a light inlet, through which the echo from the lidar enters the receiver chip; the receiver chip outputs an electrical signal in response to the echo; package, located on the surface of the receiver chip and extending to the surface of the circuit board; protective cover, configured to protect the light inlet; the protective cover includes a light-transmitting cover, which covers the light inlet of the receiver chip; the light-transmitting cover allows light of the wavelength band of the echo to pass through; the protective cover is in contact with the package.

[0007] Optionally, the protective cover may also include a buffer section located between the light-transmitting cover and the encapsulation section.

[0008] Optionally, the stiffness of the buffer section is less than that of the encapsulation section.

[0009] Optionally, the cushioning part is made of soft rubber.

[0010] Optionally, the cushioning adhesive is at least one of silicone, soft polyvinyl chloride adhesive, ethylene-vinyl acetate copolymer adhesive, polyolefin elastomer adhesive, and thermoplastic elastomer vulcanized rubber adhesive.

[0011] Optionally, the encapsulation portion surrounds the light-transmitting cover; the buffer portion is located in the gap between the encapsulation portion and the light-transmitting cover.

[0012] Optionally, a buffer section is also located between the light-transmitting cover and the receiving chip.

[0013] Optionally, the buffer section is circumferentially disposed on the outside of the light inlet of the receiving chip.

[0014] Optionally, the protective cover may also include: a bracket located above the receiving chip, the bracket having a through hole corresponding to the light inlet; a light-transmitting cover covering the through hole; and a buffer located between the receiving chip and the bracket.

[0015] Optionally, the light-transmitting cover is attached to the surface of the bracket facing away from the receiving chip.

[0016] Optionally, the transmittance of light in the echo band is greater than the transmittance of light outside the echo band in the light-transmitting cover.

[0017] Optionally, it also includes: a fastener located between the bracket and the circuit board.

[0018] Optional, the light-transmitting cover is made of glass.

[0019] Optionally, the receiving structure includes at least two light-transmitting covers, each corresponding to a light inlet.

[0020] In addition, this disclosure also provides a lidar, including:

[0021] The receiving structure is configured to receive echoes. The receiving structure includes a circuit board, a receiving chip, a package, and a protective cover. The receiving chip is located on the circuit board and includes a light inlet. The echo from the lidar is incident on the receiving chip through the light inlet. The receiving chip outputs an electrical signal in response to the echo. The package is located on the surface of the receiving chip and extends to the surface of the circuit board. The protective cover includes a light-transmitting cover that covers the light inlet of the receiving chip. The light-transmitting cover allows light in the wavelength band of the echo to pass through. The protective cover is in contact with the package.

[0022] Accordingly, this disclosure also provides a lidar, including:

[0023] The receiving structure is configured to receive echoes. The receiving structure includes a circuit board, a receiving chip, a package, and a protective cover. The receiving chip is located on the circuit board and includes a light inlet. The echo from the lidar is incident on the receiving chip through the light inlet. The receiving chip outputs an electrical signal in response to the echo. The package is located on the surface of the receiving chip and extends to the surface of the circuit board. The protective cover includes a light-transmitting cover that covers the light inlet of the receiving chip. The light-transmitting cover allows light in the wavelength band of the echo to pass through. The protective cover is in contact with the package.

[0024] Compared with the prior art, the technical solution disclosed herein has the following advantages:

[0025] In this disclosed technical solution, the protective cover configured to protect the light inlet includes a light-transmitting cover that covers the light inlet of the receiving chip; the light-transmitting cover allows light in the echo band to pass through; the protective cover is in contact with the packaging section. This disclosed technical solution can effectively protect the receiving structure, reduce the probability of damage or cracking of the light-transmitting cover, and improve the reliability of the receiving structure. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be introduced by way of example below. Obviously, the drawings described below are merely embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort. The drawings are used to provide a further understanding of this disclosure and constitute a part of the specification. They are used together with the embodiments of this disclosure to explain this disclosure and do not constitute a limitation of this disclosure. In the drawings:

[0027] Figure 1 A cross-sectional schematic diagram of an exemplary lidar receiving structure consistent with some embodiments of this disclosure is shown.

[0028] Figure 2 A cross-sectional schematic diagram of an exemplary lidar receiving structure consistent with some embodiments of this disclosure is shown.

[0029] Figure 3 A top view schematic diagram of an exemplary lidar receiving structure consistent with some embodiments of this disclosure is shown.

[0030] Figure 4 A cross-sectional view of an exemplary lidar receiving structure consistent with some embodiments of this disclosure is shown.

[0031] Figure 5 Another cross-sectional view of an exemplary lidar receiving structure consistent with some embodiments of this disclosure is shown.

[0032] Figure 6 A three-dimensional structural schematic diagram of an exemplary lidar receiving structure consistent with some embodiments of the present disclosure is shown.

[0033] Figure 7 A cross-sectional schematic diagram of an exemplary lidar receiving structure consistent with some embodiments of this disclosure is shown.

[0034] Figure 8 A three-dimensional structural schematic diagram of an exemplary lidar receiving structure consistent with some embodiments of the present disclosure is shown.

[0035] Figure 9 A top view schematic diagram of an exemplary lidar receiving structure consistent with some embodiments of this disclosure is shown. Detailed Implementation

[0036] In the following description, only certain exemplary embodiments are shown. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this disclosure. Therefore, the drawings and description are to be considered exemplary in nature and not restrictive.

[0037] In the description of this disclosure, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this disclosure, "a plurality of" means two or more, unless otherwise explicitly specified.

[0038] In the description of this disclosure, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or connections that allow for communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0039] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0040] The following disclosure provides numerous different embodiments or examples for implementing various structures of this disclosure. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this disclosure. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this disclosure, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0041] Figure 1 A cross-sectional schematic diagram of an exemplary lidar receiving structure consistent with some embodiments of this disclosure is shown.

[0042] In some embodiments, such as Figure 1 As shown, the receiving structure of the lidar includes a circuit board 10, a receiving chip 11, a light-transmitting cover 12, and an encapsulation part. The receiving chip 11 is fixed on the circuit board 10. The light-transmitting cover 12 covers the light entrance of the receiving chip 11. The encapsulation part 13 can directly contact the light-transmitting cover 12. The encapsulation part 13 can be made of encapsulating adhesive.

[0043] The materials of the light-transmitting cover and the encapsulation part exhibit a mismatch in their coefficients of thermal expansion (CTE), with a significant difference between them. During drastic temperature changes, the thermal expansion and contraction of the materials can easily cause damage and cracking to the light-transmitting cover. LiDAR systems are often required to operate over a wide temperature range, such as -40°C to 120°C. Reducing the probability of damage to the light-transmitting cover in the LiDAR receiving structure can improve the reliability of the receiving structure.

[0044] In some embodiments, the receiving structure may include: a circuit board, a receiving chip, a package, and a protective cover. The receiving chip is located on the circuit board. The receiving chip includes a light inlet port through which the echo from the lidar can enter the receiving chip. The receiving chip can output an electrical signal in response to the echo. The package is located on the surface of the receiving chip and extends to the surface of the circuit board. The protective cover protects the light inlet port. The protective cover includes a light-transmitting cover that covers the light inlet port of the receiving chip. The light-transmitting cover allows light of the wavelength band of the echo to pass through. The protective cover is in contact with the package.

[0045] Figure 2 A cross-sectional schematic diagram of an exemplary lidar receiving structure consistent with some embodiments of this disclosure is shown.

[0046] refer to Figure 2 The receiving structure includes: a circuit board 100, a receiving chip 110, a package 130, and a protective cover (not shown in the figure). The protective cover protects the light inlet 111. The receiving chip 110 can be located on the circuit board 100. The receiving chip 110 may include the light inlet 111. The echo from the lidar can enter the receiving chip 110 through the light inlet 111. The receiving chip 110 can output an electrical signal in response to the echo. The protective cover includes a light-transmitting cover 121. The light-transmitting cover 121 covers the light inlet 111 of the receiving chip 110. The light-transmitting cover 121 allows light of the wavelength band of the echo to pass through. The protective cover is in contact with the package 130.

[0047] In some embodiments, the encapsulation portion may be made of an encapsulating adhesive. For example, the encapsulating adhesive may include epoxy resin and various additives. For example, additives may include one or more of curing agents, modifiers, release agents, colorants, and flame retardants.

[0048] In some embodiments, the light-transmitting cover can be glass. In other embodiments, the light-transmitting cover can also be made of light-transmitting materials such as acrylic glass, sapphire, or plastic.

[0049] In some embodiments, the size of the light-transmitting cover may be comparable to the size of the light-inlet area. For example, the area of ​​the light-transmitting cover may be equal to or slightly larger than the area of ​​the light-inlet area. For example, such as... Figure 2 As shown, the projection of the light-transmitting cover 121 onto the surface of the receiving chip 110 roughly coincides with, or is slightly larger than, the light-inlet 111. Figure 2The light inlet 111 is shown in bold red lines. The light-transmitting cover 121 does not cover most or all of the area of ​​the receiving chip 11 other than the light inlet 11. The package portion 130 may be located on a portion of the surface of the receiving chip 110; for example, the package portion 130 may be located on the surface of the receiving chip 11 other than the area covered by the light-transmitting cover 121, and extend from the surface of the receiving chip 110 to the surface of the circuit board 100. By controlling the size of the light-transmitting cover, the stress caused by the mismatch of thermal expansion coefficients is reduced, thereby avoiding cracking of the light-transmitting cover and reducing damage to the protective cover plate. By significantly reducing the size of the light-transmitting cover, the possibility of cracking or damage to the light-transmitting cover 121 can be effectively reduced.

[0050] In some embodiments, the protective cover may further include a buffer portion. The buffer portion may be located between the light-transmitting cover and the encapsulation portion. The buffer portion located between the light-transmitting cover and the encapsulation portion can prevent direct contact between the light-transmitting cover and the encapsulation portion, and can effectively prevent cracking of the light-transmitting cover and damage to the protective cover caused by stress due to mismatch in thermal expansion coefficients.

[0051] Figure 3 A top view schematic diagram of an exemplary lidar receiving structure consistent with some embodiments of this disclosure is shown. Figure 4 A cross-sectional view of an exemplary lidar receiving structure consistent with some embodiments of this disclosure is shown. Figure 5 This diagram illustrates another cross-sectional view of an exemplary lidar receiving structure consistent with some embodiments of this disclosure. For example, such as... Figure 3 and Figure 4 As shown, the protective cover 220 also includes a buffer portion 222, which is located between the light-transmitting cover 221 and the encapsulation portion 230.

[0052] In some embodiments, the stiffness of the buffer portion can be less than that of the encapsulation portion. Under external force, the buffer portion is more prone to deformation than the encapsulation portion, and the degree of deformation that can occur is greater. During drastic temperature changes, the buffer portion can effectively mitigate the difference in deformation between the encapsulation portion and the light-transmitting cover, effectively reducing the occurrence of problems such as cracking of the light-transmitting cover and damage to the protective cover plate.

[0053] In some embodiments, the cushioning portion is made of soft rubber. For example, the cushioning adhesive may be at least one of silicone, polyvinyl chloride adhesive (PVC), ethylene vinyl acetate copolymer adhesive (EVA), polyolefin elastomer adhesive (POE), and thermoplastic elastomer vulcanizate adhesive (TPES).

[0054] In some embodiments, the buffer portion may surround the light-transmitting cover. The buffer portion may be located in the gap between the encapsulation portion and the light-transmitting cover. For example, the buffer portion may be continuously arranged around the circumference of the light-transmitting cover. This provides a buffering structure throughout the entire circumference of the light-transmitting cover. In some embodiments, the buffer portion may also be discontinuously arranged in the gap between the light-transmitting cover and the encapsulation portion.

[0055] In some embodiments, the encapsulation portion may form an opening on the surface of the receiving chip. The opening area may correspond to the area of ​​the light inlet. The size of the opening is larger than the size of the light inlet. The bottom of the opening may expose the light inlet. A light-transmitting cover may be located inside the opening. The area of ​​the light-transmitting cover may be smaller than the area of ​​the opening. A gap may exist between the sidewall of the light-transmitting cover and the sidewall of the opening. A buffer portion may be located in the gap.

[0056] For example, such as Figures 3 to 5 As shown, the packaging section 230 forms an opening 231 on the surface of the receiving chip 210 (as shown). Figure 4 As shown). Opening 231 is located at light inlet 211 (as shown). Figure 3 The light inlet 211 is shown in bold red. The bottom of the opening 231 is exposed above the light inlet 211. A light-transmitting cover 221 is located inside the opening 231. In a plane parallel to the surface of the receiving chip 210, the area of ​​the light-transmitting cover 221 is smaller than the area of ​​the opening 231. There is a gap between the sidewall of the light-transmitting cover 221 and the sidewall of the opening 231. A buffer portion 222 is located in the gap. The buffer portion 222 continuously surrounds the light-transmitting cover 221.

[0057] In some embodiments, the buffer portion may also be located between the light-transmitting cover and the receiving chip. For example, the light-transmitting cover may be separate from the surface of the receiving chip. There may be a gap between the light-transmitting cover and the receiving chip, and the buffer portion may also be located in this gap. The light-transmitting cover does not directly contact the surface of the receiving chip.

[0058] For example, such as Figures 3 to 5As shown, there is a gap between the light-transmitting cover 221 and the receiving chip 210. The buffer part 222 is also located in the gap between the light-transmitting cover 221 and the receiving chip 210.

[0059] exist Figure 5 In some embodiments shown, the buffer portion 222 includes a first portion 222a and a second portion 222b. The first portion 222a and the second portion 222b are connected. The first portion 222a is located between the light-transmitting cover 221 and the encapsulation portion 230. The second portion 222b is located between the light-transmitting cover 221 and the receiving chip 210. The first portion and the second portion can be integrally formed or separately disposed. The first portion and the second portion can be made of the same material or different materials.

[0060] In some embodiments, the buffer portion is disposed circumferentially outside the light inlet of the receiving chip. For example, the buffer portion extends circumferentially around the light inlet continuously, ensuring the sealing protection of the light inlet. Alternatively, the buffer portion may be disposed discontinuously on the circumferentially outside the light inlet.

[0061] The package can form an opening on the surface of the receiving chip. The opening can be located above the light inlet. The size of the opening is larger than the size of the light inlet. The light inlet can be located within the area projected by the opening onto the surface of the receiving chip. The opening can extend through the package. The bottom of the opening can expose the light inlet. The opening can be located within the area enclosed by the buffer portion.

[0062] Figure 6 A three-dimensional structural schematic diagram of an exemplary lidar receiving structure consistent with some embodiments of the present disclosure is shown. Figure 7 A cross-sectional schematic diagram of an exemplary lidar receiving structure consistent with some embodiments of this disclosure is shown. Figure 8 A three-dimensional structural schematic diagram of an exemplary lidar receiving structure consistent with some embodiments of the present disclosure is shown.

[0063] For example, such as Figures 6 to 8 As shown, the package portion 330 forms an opening 331 on the surface of the receiving chip 310. The opening 331 is located at the light inlet 311 ( Figure 6 The light inlet 311 is shown in bold red line. The bottom of the opening 331 exposes the light inlet 311. On the encapsulation portion 330, a buffer portion 322 extends continuously along the circumference of the light inlet 311 to surround the light inlet 311. The opening 331 is located within the area surrounded by the buffer portion 322.

[0064] In some embodiments, the receiving structure further includes a damming adhesive (not shown). The damming adhesive is located on the receiving chip and surrounds the light entrance port. The encapsulation portion is located on the surface of the receiving chip outside the area encapsulated by the damming adhesive. The damming adhesive can limit the coverage area of ​​the encapsulation portion.

[0065] For example, a damming adhesive can be circumferentially disposed outside the light inlet of the receiver chip. The damming adhesive can form an opening on the receiver chip surface with its bottom exposed above the light inlet. The encapsulation portion is located on the receiver chip surface outside the area enclosed by the damming adhesive and extends to the surface of the circuit board.

[0066] In some embodiments, the protective cover may further include a bracket. The bracket may be located above the receiving chip. A through-hole may be formed on the bracket, corresponding to the light inlet. A light-transmitting cover may cover the through-hole. A buffer may be located between the receiving chip and the bracket. In some embodiments, the bracket may function as an aperture, and the through-hole is the light-transmitting aperture of the aperture.

[0067] For example, the support can be positioned parallel above the entire receiving chip. A through-hole can penetrate the support. The location of the through-hole can correspond to the location of the light inlet. The through-hole exposes the opening formed by the package. The through-hole is connected to the opening, thus exposing the light inlet at the bottom of the opening. The size of the through-hole is not smaller than the size of the light inlet. A light-transmitting cover can be located on the support surface at the location of the through-hole to cover it. A buffer is located between the package and the support, connecting the package and the support. The buffer, in conjunction with the light-transmitting cover, can form a sealed space between the support and the package, thereby achieving sealed protection of the light inlet.

[0068] In some embodiments, the size of the through-hole is between the size of the opening and the size of the light inlet. In the plane of the surface of the parallel support, the projection of the light inlet lies within the area of ​​the through-hole; the through-hole lies within the area of ​​the projection of the opening.

[0069] For example, such as Figure 6 As shown, the bracket 323 is located above the receiving chip 310. A through-hole 324 is formed on the bracket 323, corresponding to the light inlet 311. The through-hole 324 communicates with the buffer portion 322 surrounding area 322a and the opening 331 to expose the light inlet 311 at the bottom of the opening 331. A light-transmitting cover 321 can be attached to the surface of the bracket 323, covering the through-hole 324. In a plane parallel to the surface of the receiving chip 310, the area of ​​the light-transmitting cover 321 is larger than the area of ​​the through-hole 324. The buffer portion 322 is located between the receiving chip 310 and the bracket 323. In a direction perpendicular to the surface of the bracket 323, both sides of the buffer portion 322 contact the receiving chip 310 and the bracket 323, respectively. The buffer portion 322, in conjunction with the light-transmitting cover 321 covering the through-hole 324, forms a sealed space above the light inlet 311.

[0070] In some embodiments, the light-transmitting cover is attached to the surface of the bracket facing away from the receiving chip. The bracket can be located between the light-transmitting cover and the buffer portion. This allows the light-transmitting cover to be fixed above the light inlet while preventing direct contact between the light-transmitting cover and the package portion. For example, the surface of the bracket facing the receiving chip contacts the buffer portion, and the surface of the bracket facing away from the receiving chip is attached to the surface of the light-transmitting cover. For example, such as... Figure 6 and Figure 7 As shown, the light-transmitting cover 321 is attached to the surface of the bracket 323 facing away from the receiving chip 310.

[0071] In some embodiments, the transmittance of light in the echo band through the light-transmitting cover is greater than the transmittance of light outside the echo band through the light-transmitting cover. The light-transmitting cover can filter out stray light, thereby acting as a filter to improve the signal-to-noise ratio of the optical signal received by the receiving chip. For example, such as... Figure 6 and Figure 7 As shown, the transmittance of light in the echo band in the light-transmitting cover 321 is greater than that of light outside the echo band in the light-transmitting cover 321.

[0072] In some embodiments, the receiving structure further includes a fixing member. The fixing member is located between the bracket and the circuit board. The fixing member can ensure the fixing strength of the bracket, and can ensure that the distance between the light-transmitting cover and the light-inlet meets the preset value to meet the optical path design requirements; the fixing member can also pre-fix the bracket during the assembly process to reduce assembly difficulty and improve assembly accuracy.

[0073] For example, such as Figure 7 and Figure 8 As shown, the receiving structure includes a fixing member 325. The fixing member 325 is located between the bracket 323 and the circuit board 300. The fixing member 325 is located on the circuit board 330 not covered by the packaging portion 330. Along the direction perpendicular to the surface of the circuit board 330, both ends of the fixing member 325 contact the circuit board 330 and the bracket 323 respectively, thereby fixing the bracket 323 above the circuit board 330. There can be one or more fixing members. Multiple fixing members can be arranged approximately symmetrically on both sides of the receiving chip.

[0074] In some embodiments, the receiving structure may also have at least two optical input ports.

[0075] Figure 9 A top view schematic diagram of an exemplary lidar receiving structure consistent with some embodiments of this disclosure is shown.

[0076] The similarities to the foregoing embodiments will not be repeated here. The difference from the foregoing embodiments is that the receiving structure has at least two optical inlets.

[0077] In some embodiments, the receiving structure includes at least two light-transmitting covers. Each of the at least two light-transmitting covers corresponds one-to-one with a light-inlet. For example, the receiving structure may include at least two receiver groups, each receiver group having one light-inlet. Each light-inlet is covered by one light-transmitting cover.

[0078] In some embodiments, the receiving structure may include at least two protective covers. The protective covers may employ the same or similar design as those in any of the foregoing embodiments. For example, with... Figures 2-8 Any related embodiments.

[0079] In some embodiments, each protective cover may include one light-transmitting cover. Each light-transmitting cover may be continuously surrounded by a buffer portion.

[0080] In some embodiments, the protective cover includes a bracket, and at least two light-transmitting covers can be mounted on the same bracket.

[0081] For example, such as Figure 9 As shown, the receiving structure includes two protective covers, namely protective cover 420i and protective cover 420j. Protective cover 420i includes a light-transmitting cover 421i and a buffer portion 422i surrounding the light-transmitting cover 421i. Protective cover 420j includes a light-transmitting cover 421j and a buffer portion 422j surrounding the light-transmitting cover 421j.

[0082] On the other hand, the receiving structure includes an input port 411i and an input port 411j. The encapsulation portion 430 forms two openings on the input ports 411i and 411j, respectively. The bottom of one opening exposes the input port 411i, and the bottom of the other opening exposes the input port 411j. Protective covers 420i and 420j cover the output ports 411i and 411j, respectively. Protective cover 420i is located on the output port 411i. Protective cover 420j is located on the output port 411j.

[0083] Specifically, the light-transmitting cover 421i is located within the opening. The area of ​​the light-transmitting cover 421i is smaller than the area of ​​the opening. There is a gap between the sidewall of the light-transmitting cover 421i and the sidewall of the opening. The buffer portion 422i is located within the gap. The buffer portion 422i continuously surrounds the light-transmitting cover 421i. The light-transmitting cover 421j is located within the opening. The area of ​​the light-transmitting cover 421j is smaller than the area of ​​the opening. There is a gap between the sidewall of the light-transmitting cover 421j and the sidewall of the opening. The buffer portion 422j is located within the gap. The buffer portion 422j continuously surrounds the light-transmitting cover 421j.

[0084] In some embodiments, the receiving structure includes at least two receiving chips, each receiving chip including one receiver group; in other embodiments, the receiving chips of the receiving structure may include at least two receiver groups.

[0085] This disclosure also provides a lidar. The lidar includes a receiving structure. The receiving structure is capable of receiving echoes. The receiving structure includes a circuit board, a receiving chip, a package, and a protective cover. The receiving chip is located on the circuit board. The receiving chip includes a light inlet. The echo from the lidar is incident into the receiving chip through the light inlet. The receiving chip outputs an electrical signal in response to the echo. The package is located on the surface of the receiving chip and extends to the surface of the circuit board. The protective cover includes a light-transmitting cover. The light-transmitting cover covers the light inlet of the receiving chip. The light-transmitting cover allows light of the wavelength band of the echo to pass through. The protective cover is in contact with the package.

[0086] In some embodiments, the receiving structure may adopt the receiving structure of any embodiment of this disclosure, for example, referring to... Figures 2 to 9 The receiving structure in any of the described embodiments.

[0087] Using the receiving structure provided in this disclosure, the probability of damage to the light-transmitting cover is small, the possibility of cracking of the light-transmitting cover is small, and the reliability and stability of the lidar are higher.

[0088] While the above disclosure is provided, it is not limited thereto. Any person skilled in the art may make various alterations and modifications without departing from the spirit and scope of this disclosure; therefore, the scope of protection of this disclosure shall be determined by the scope defined in the claims.

Claims

1. A receiving structure for a lidar, characterized in that, include: Circuit board; A receiving chip is located on the circuit board. The receiving chip includes an input port, through which the echo of the lidar is incident into the receiving chip. The receiving chip responds to the echo and outputs an electrical signal; The packaging portion is located on the surface of the receiving chip and extends to the surface of the circuit board; A protective cover plate, the protective cover plate being configured to protect the light inlet port; The protective cover includes a light-transmitting cover that covers the light inlet of the receiving chip; The light-transmitting cover allows light in the wavelength band of the echo to pass through; The protective cover plate is in contact with the encapsulation part.

2. The receiving structure as described in claim 1, characterized in that, The protective cover also includes a buffer section, which is located between the light-transmitting cover and the encapsulation section.

3. The receiving structure as described in claim 2, characterized in that, The stiffness of the buffer section is less than that of the encapsulation section.

4. The receiving structure as described in claim 3, characterized in that, The buffer section is made of soft rubber.

5. The receiving structure as described in claim 4, characterized in that, The buffer portion includes: silicone, soft polyvinyl chloride adhesive, ethylene-vinyl acetate copolymer adhesive, polyolefin elastomer adhesive, or thermoplastic elastomer vulcanized rubber.

6. The receiving structure as described in claim 2, characterized in that, The encapsulation portion surrounds the light-transmitting cover; the buffer portion is located in the gap between the encapsulation portion and the light-transmitting cover.

7. The receiving structure as described in claim 6, characterized in that, The buffer section is also located between the light-transmitting cover and the receiving chip.

8. The receiving structure as described in claim 2, characterized in that, The buffer section is circumferentially disposed on the outside of the light inlet of the receiving chip.

9. The receiving structure as described in claim 2, characterized in that, The protective cover also includes: A bracket is located above the receiving chip, and a through hole is provided on the bracket, the through hole corresponding to the light inlet port; The light-transmitting cover covers the through hole; The buffer section is located between the receiving chip and the bracket.

10. The receiving structure as described in claim 9, characterized in that, The light-transmitting cover is attached to the surface of the bracket facing away from the receiving chip.

11. The receiving structure as described in claim 9, characterized in that, The transmittance of light in the wavelength band of the echo in the light-transmitting cover is greater than the transmittance of light outside the wavelength band of the echo in the light-transmitting cover.

12. The receiving structure as described in claim 9, characterized in that, Also includes: A fastener is located between the bracket and the circuit board.

13. The receiving structure as described in claim 1, characterized in that, The light-transparent cover is made of glass.

14. The receiving structure as described in claim 1, characterized in that, The receiving structure includes at least two light-transmitting covers, each of which corresponds to a light inlet.

15. A lidar, characterized in that, include: A receiving structure configured to receive echoes. The receiving structure includes a circuit board, a receiving chip, a package, and a protective cover. The receiving chip is located on the circuit board. The receiving chip includes a light inlet, through which the echo from the lidar enters the receiving chip. The receiving chip outputs an electrical signal in response to the echo. The package is located on the surface of the receiving chip and extends to the surface of the circuit board. The protective cover includes a light-transmitting cover that covers the light inlet of the receiving chip. The light-transmitting cover allows light in the wavelength band of the echo to pass through. The protective cover is in contact with the package.

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