Mini pc circuit control board

Abstract

The utility model discloses a mini pc circuit control board which comprises a main board and a heat dissipation device, the right front end of the main board is electrically connected with an on / off control board used for welding an on / off module, the on / off module is matched with a port at the front end of a mini pc shell to be connected with an on / off button, and all I / O modules are welded at the right rear end of the main board to be matched with a port at the rear end of the mini pc shell to be connected with peripheral equipment. A fixing frame is welded to the right rear end of the main board and used for fixing an antenna, one end of the antenna is in communication connection with a wifi card, and the wifi card is in communication connection with a wifi slot welded to the main board. An ssd installation area is reserved in the side face position of the main board, a memory slot and a clamping groove are welded to the edge of the main board, at least one connecting base is arranged at each end corner of the four corners of the main board, and a heat dissipation device is fixed to the main board.

Description

Technical Field

[0001] This utility model belongs to the field of computer technology, and in particular relates to a mini PC circuit control board. Background Technology

[0002] Desktop mini PC motherboards typically have their I / O modules distributed at the front and rear of the circuit board. This allows high-frequency plug-and-play external devices to use the front ports, while non-high-frequency plug-and-play devices use the rear ports. Since the rear of a desktop mini PC is usually designed as a heat dissipation vent for hot air to dissipate, and the sides are designed with mesh-like holes to draw in cool air, the front of the PC with its I / O module ports means that when the PC is running, the cool air will carry dust and be drawn into the mini PC, affecting the machine's performance.

[0003] On mini PC motherboards, electronic components are densely soldered, and heat dissipation components, storage components, and I / O modules occupy most of the motherboard area. It is difficult to find unused area to add SSDs for expansion. The common method is to stack two SSDs one on top of the other, which is not good for the heat dissipation of SSDs and causes local overheating. Utility Model Content

[0004] To address the technical problems mentioned in the background section, this invention places only the on / off module at the front end of the circuit board and places all the I / O modules at the rear end of the circuit board to prevent dust from being sucked in from the I / O modules. Two SSDs are placed parallel to the circuit board on both sides of the circuit board. The added SSDs are hot-swappable and perpendicular to the circuit board to solve the problems in the background section.

[0005] This invention is implemented as follows: A mini PC circuit control board includes a motherboard and a heat dissipation device. A power switch control board is electrically connected to the front end of the motherboard for soldering an on / off module that mates with a port on the front of the mini PC casing for connecting a power switch button. Various I / O modules are soldered to the rear end of the motherboard and mate with ports on the rear end of the mini PC casing for connecting peripherals. A mounting bracket is soldered to the rear end of the motherboard for fixing an antenna. One end of the antenna is communicatively connected to a Wi-Fi card, and the Wi-Fi card is communicatively connected to a Wi-Fi slot soldered to the motherboard. An SSD installation area is reserved on the side of the motherboard. Memory slots and card slots are soldered along the edges of the motherboard. At least one connector is provided at each of the four corners of the motherboard. A heat dissipation device is fixed on the motherboard.

[0006] Preferably, the motherboard and the power-on / off control board are electrically connected via a ribbon cable inserted into a connector.

[0007] Preferably, one SSD mounting area is reserved on each side of the motherboard and the reserved areas are symmetrical. The SSD mounting area on the front of the motherboard is fixed with a heat sink and a first slot for inserting an SSD, and the SSD mounting area on the back of the motherboard is fixed with a second slot for inserting an SSD.

[0008] Preferably, an SSD control board is inserted into the card slot, and an SSD slot is extended on the SSD control board to add an SSD.

[0009] Preferably, the shape and number of pins of the connector are not fixed.

[0010] Preferably, the heat dissipation device is disposed on the central processing unit on the front side of the motherboard 1, and the heat dissipation device includes a fixing plate, a heat pipe, a support, heat dissipation fins and a fan.

[0011] Preferably, the fixing plate presses one end of the heat pipe tightly against the surface of the central processing unit, the other end of the heat pipe extends to the bottom of the heat dissipation fins, and the air outlet of the fan faces the heat dissipation fins.

[0012] Preferably, the support is fixed below the heat pipe to support the heat pipe, and the heat pipe has a ring-shaped design.

[0013] Preferably, the fan is fixed to the heat pipe by fasteners.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] This invention electrically connects a power switch control board to the front of the motherboard for soldering on / off modules, which are then connected to the ports on the front of the miniPC casing for connecting the power switch button. The I / O modules are soldered to the rear of the motherboard and connected to the ports on the rear of the miniPC casing for connecting peripherals. The ports on the rear of the casing are used to dissipate hot air. The absence of any ports on the front of the casing enhances the simplicity and aesthetics of the PC. This design also prevents dust from being drawn into the circuit board from the front I / O ports.

[0016] The motherboard has a reserved SSD installation area on its side. The back of the motherboard only has this SSD installation area, with no other components soldered on, which is beneficial for SSD heat dissipation. The slot soldered along the edge of the motherboard is designed for the additional SSD. Unlike the SSDs in the reserved SSD installation area, which are installed parallel to the motherboard, this SSD is installed perpendicular to the motherboard, reducing the significant space occupied on the motherboard. Since this SSD is directly plugged into the SSD controller board, it is not obstructed by the dense components on the motherboard, which is also beneficial for heat dissipation. Attached Figure Description

[0017] Figure 1 This is a top view of the front of an embodiment of the present invention. Figure 1 ;

[0018] Figure 2 This is a top view of the front of an embodiment of the present invention. Figure 2 ;

[0019] Figure 3 This is a top view of the rear of an embodiment of this utility model;

[0020] In the diagram: 1. Motherboard, 2. Card slot, 3. Memory slot, 4. Power on / off control board, 5. Connector, 6. First slot, 7. Heatsink, 8. Mounting bracket, 9. Mounting plate, 10. Support, 11. Heat pipe, 12. Fastener, 13. Fan, 14. Heatsink fins, 15. Second slot, 16. Antenna. Detailed Implementation

[0021] The technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0022] Please refer to Figure 1-3 The mini PC circuit control board includes a motherboard (1) and a heat dissipation device. A power switch control board 4 is electrically connected to the front of the motherboard 1 for soldering an on / off module that mates with a port on the front of the mini PC casing to connect a power switch button. Various I / O modules are soldered to the rear of the motherboard 1 and mate with ports on the rear of the mini PC casing to connect peripherals. The ports on the rear of the casing are used to dissipate heat. The absence of any ports on the front of the casing enhances the simplicity and aesthetics of the PC. This design prevents dust from being drawn into the circuit board from the front I / O ports. A mounting bracket 8 is soldered to the rear of the motherboard 1 to fix an antenna 16. One end of the antenna 16 is connected to a Wi-Fi card, which is connected to a Wi-Fi slot soldered to the motherboard 1. The external antenna 16 enhances signal transmission and reception capabilities. An SSD installation area is reserved on the side of the motherboard 1. Figure 1 and Figure 3The area marked with a dotted line is the SSD installation area. The SSD installation area on the back of the motherboard is the only designated area for the SSD, with no other components soldered on, which facilitates heat dissipation for the SSD. Memory slots 3 and card slots 2 are soldered along the edge of motherboard 1. Card slot 2 is designed for adding an SSD. Unlike the SSDs in the pre-installed SSD installation area, which are installed parallel to motherboard 1, this SSD is installed perpendicular to motherboard 1, reducing the significant space occupied on the motherboard. Since this SSD is directly plugged into the SSD controller board, it is not obstructed by the dense components on motherboard 1, which also facilitates heat dissipation. Each of the four corners of motherboard 1 has at least one connector 5. The size, shape, and number of pins of these connectors 5 can be varied to accommodate various connector types. A heat dissipation device is fixed on motherboard 1.

[0023] The motherboard 1 and the power on / off control board 4 are electrically connected via a ribbon cable inserted into connector 5. The PC's power button is directly connected to the power on / off control board 4 and installed in conjunction with the port on the front of the mini PC casing.

[0024] One SSD mounting area is reserved on each side of the motherboard 1, and they are symmetrically positioned. The SSD mounting area on the front of the motherboard 1 has a heatsink 7 and a first slot 6 for inserting the SSD. The SSD mounting area on the back of the motherboard 1 has a second slot 15 for inserting the SSD. The heatsink 7 conducts heat to dissipate heat from the SSD mounted on the front of the motherboard 1.

[0025] SSD control board is inserted into slot 2. An SSD slot is added on the SSD control board to expand the storage space of the mini PC.

[0026] The shape and number of pins of connector 5 are not fixed.

[0027] The heat dissipation device is located on the central processing unit on the front of the motherboard 1. The heat dissipation device includes a mounting plate 9, a heat pipe 11, a support 10, heat sink fins 14, and a fan 13. The heat dissipation device is used to dissipate heat from the central processing unit. Hot air is dissipated through the heat dissipation vents at the rear of the mini PC casing, while cool air is drawn in through the mesh holes on both sides of the casing to reduce the temperature inside the entire PC.

[0028] The fixing plate 9 presses one end of the heat pipe 11 tightly against the surface of the central processing unit, and the other end of the heat pipe 11 extends to the bottom of the heat sink 14. The air outlet of the fan 13 is directly facing the heat sink 14.

[0029] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A mini PC circuit control board, comprising a motherboard (1) and a heat dissipation device, characterized in that, The power switch control board (4) is electrically connected to the front end of the motherboard (1) for soldering the on / off module and the port at the front end of the mini PC shell for connecting the power switch button. The I / O modules are soldered to the rear end of the motherboard (1) and the port at the rear end of the mini PC shell for connecting peripherals. A mounting bracket (8) is soldered to the rear end of the motherboard (1) for fixing the antenna (16). One end of the antenna (16) is connected to the WiFi card. The WiFi card is connected to the WiFi slot soldered on the motherboard (1). An SSD installation area is reserved on the side of the motherboard (1). A memory slot (3) and a card slot (2) are soldered to the edge of the motherboard (1). At least one connector (5) is provided at each of the four corners of the motherboard (1). A heat dissipation device is fixed on the motherboard (1).

2. The mini PC circuit control board according to claim 1, characterized in that, The mainboard (1) and the power on / off control board (4) are electrically connected via a ribbon cable inserted into the connector (5).

3. The mini PC circuit control board according to claim 1, characterized in that, The SSD installation area is reserved on both sides of the motherboard (1) and is reserved in a symmetrical position. The SSD installation area on the front of the motherboard (1) is fixed with a heat sink (7) and a first slot (6) for inserting an SSD. The SSD installation area on the back of the motherboard (1) is fixed with a second slot (15) for inserting an SSD.

4. The mini PC circuit control board according to claim 1, characterized in that, An SSD control board is inserted into the card slot (2), and an SSD slot is extended on the SSD control board to add an SSD.

5. The mini PC circuit control board according to claim 1, characterized in that, The shape and number of pins of the connector (5) are not fixed.

6. The mini PC circuit control board according to claim 1, characterized in that, The heat dissipation device is located on the central processing unit on the front of the motherboard (1). The heat dissipation device includes a fixing plate (9), a heat pipe (11), a support (10), heat dissipation fins (14), and a fan (13).

7. The mini PC circuit control board according to claim 6, characterized in that, The fixing plate (9) presses one end of the heat pipe (11) tightly against the surface of the central processing unit, and the other end of the heat pipe (11) extends to the bottom of the heat sink fin (14). The air outlet of the fan (13) is directly opposite the heat sink fin (14).

8. The mini PC circuit control board according to claim 6, characterized in that, The support (10) is fixed below the heat pipe (11) to support the heat pipe (11), which is a ring-shaped design.

9. The mini PC circuit control board according to claim 6, characterized in that, The fan (13) is fixed to the heat pipe (11) by fasteners (12).

Images