Box body assembly, battery device and power utilization device

Abstract

The utility model discloses a box body assembly, a battery device and a power utilization device. The battery device comprises a box body assembly, the box body assembly comprises a first electric conductor, a second electric conductor and an equipotential piece, and the first electric conductor is provided with a first through hole penetrating through the surfaces of the two opposite sides of the first electric conductor; the second conductor is provided with a second through hole penetrating through two opposite side surfaces of the second conductor, and the first through hole and the second through hole are correspondingly arranged; the equipotential piece comprises a first fixing part, a second fixing part and a first connecting part, the first connecting part is connected with the first fixing part and the second fixing part, at least part of the first connecting part is arranged in the first through hole and the second through hole, and the first fixing part abuts against the side, away from the second electric conductor, of the first electric conductor. The second fixing part abuts against the side, away from the first electric conductor, of the second electric conductor so that the second fixing part can be electrically connected with the second electric conductor. The first electric conductor and the second electric conductor can realize equipotential on the basis of not directly contacting with each other.

Description

Technical Field

[0001] This application relates to the field of battery technology, and in particular to a housing assembly, a battery device, and an electrical device. Background Technology

[0002] Energy conservation and emission reduction are key to sustainable development, which in turn promotes the adjustment of the energy structure and drives the development and application of battery technology. The key to the development of battery technology lies in electrochemical energy storage technology. Due to its advantages such as high energy density, good cycle capability, high operating voltage, environmental friendliness, and low self-discharge, it has been widely used in portable electronics, electric vehicles, and energy storage systems.

[0003] A battery device includes a battery box and individual battery cells located inside the battery box. The battery box typically includes multiple interconnected conductive components. There are potential differences between different conductive components. How to achieve equipotential bonding between different conductive components has become a technical problem that urgently needs to be solved. Utility Model Content

[0004] The main objective of this application is to provide a housing assembly, a battery device, and an electrical device, which aim to solve the aforementioned technical problems existing in the prior art.

[0005] To address the aforementioned problems, this application provides a battery device comprising a housing assembly and a battery cell assembly. The housing assembly accommodates the battery cell assembly and includes a first conductor, a second conductor, and an equipotential bonding member. The first conductor has a first through-hole penetrating both opposite surfaces of the first conductor; the second conductor has a second through-hole penetrating both opposite surfaces of the second conductor, with the first and second through-holes corresponding to each other. The equipotential bonding member includes a first fixing portion, a second fixing portion, and a first connecting portion. The first connecting portion connects to both the first and second fixing portions, and is at least partially disposed within the first and second through-holes. The first fixing portion abuts against the side of the first conductor opposite to the second conductor, thereby electrically connecting the first fixing portion and the first conductor. The second fixing portion abuts against the side of the second conductor opposite to the first conductor, thereby electrically connecting the second fixing portion and the second conductor. With the above-described embodiments, the first through hole and the second through hole are correspondingly arranged, which facilitates the simultaneous insertion of the first connecting part into the first through hole and the second through hole. The first fixing part is connected to the first connecting part and abuts against the side of the first conductor away from the second conductor. The second fixing part is connected to the first connecting part and abuts against the side of the second conductor away from the first conductor. This enables the first conductor and the second conductor to be electrically connected through an equipotential bonding device without direct contact, thereby achieving equipotential between the first conductor and the second conductor. At the same time, the equipotential bonding device can also reduce the risk of failure of the equipotential connection between the first conductor and the second conductor.

[0006] In some embodiments, the battery device includes an insulating layer disposed between the first conductor and the second conductor. Therefore, the insulating layer, located between the first and second conductors, can reduce the risk of corrosion caused by direct contact between the first and second conductors.

[0007] In some embodiments, the isolation layer includes an insulating layer; and / or, the isolation layer includes a metallic isolation layer, the potential of which is located between the potential of the first conductor and the potential of the second conductor. Thus, by providing an insulating layer between the first and second conductors, electrical insulation is achieved between them; or by providing a metallic isolation layer between the first and second conductors, with the potential of the metallic isolation layer located between the potentials of the first and second conductors, the risk of corrosion due to direct contact between the first and second conductors is reduced.

[0008] In some embodiments, the potential of the equipotential bonding element is located between the potential of the first conductor and the potential of the second conductor. Therefore, by having the potential of the equipotential bonding element between the potential of the first conductor and the potential of the second conductor, the risk of corrosion caused by direct contact between the equipotential bonding element and the first and second conductors can be reduced.

[0009] In some embodiments, the potential difference between the equipotential bonding element and the first conductor is less than 25 mV, and / or the potential difference between the equipotential bonding element and the second conductor is less than 25 mV. Therefore, having a potential difference of less than 25 mV between the equipotential bonding element and the first conductor, and / or a potential difference of less than 25 mV between the equipotential bonding element and the second conductor, can further reduce the risk of corrosion caused by direct contact between the equipotential bonding element and the first and second conductors.

[0010] In some embodiments, a metallic conductive layer is plated on the surface of the equipotential bonding element that contacts the first and second conductors, and the potential of the metallic conductive layer is located between the potentials of the first and second conductors. Therefore, by plating a metallic conductive layer on the surface of the equipotential bonding element that contacts the first and second conductors, it is easier to control the potential difference between the equipotential bonding element and the first and second conductors, reducing the risk of corrosion caused by direct contact between the equipotential bonding element and the first and second conductors, and also reducing the molding difficulty of the equipotential bonding element.

[0011] In some embodiments, the battery box includes a third conductor that contacts the side of the second fixing portion opposite to the second conductor, thereby electrically connecting the third conductor to at least one of the first and second conductors. Thus, the contact between the third conductor and the side of the second fixing portion opposite to the second conductor allows the first, second, and third conductors to be electrically connected via an equipotential bonding element without direct contact, achieving equipotentiality among the first, second, and third conductors.

[0012] In some embodiments, the equipotential bonding element includes a second connecting portion and a third fixing portion. The third conductor has a third through hole penetrating both opposite surfaces of the third conductor. The first connecting portion and the second connecting portion are connected, and the third fixing portion abuts against the side of the third conductor opposite to the second fixing portion. Thus, the first connecting portion and the second connecting portion are connected, and the third fixing portion abuts against the side of the third conductor opposite to the second fixing portion. This allows the first, second, and third conductors to achieve equipotential bonding without direct contact, and also reduces the risk of equipotential bonding failure between the third conductor and the first and / or second conductors.

[0013] In some embodiments, the third conductor includes a reinforcing plate. This facilitates the simultaneous fixation of the reinforcing plate by an equipotential bonding element and the equipotential bonding between the reinforcing plate and the first and / or second conductors.

[0014] In some embodiments, the first conductor includes a module mounting beam for fixing the battery cell assembly. This facilitates equipotential bonding between the module mounting beam and the second conductor while simultaneously fixing the module mounting beam with an equipotential bonding element.

[0015] In some embodiments, the second conductor includes a housing base plate and a thermal management component. This facilitates the simultaneous fixation of the housing base plate and thermal management component using an equipotential bonding element, while simultaneously achieving an equipotential connection between the housing base plate, the thermal management component, and the first conductor.

[0016] To address the aforementioned problems, this application provides a housing assembly comprising a first conductor, a second conductor, and an equipotential bonding member. The first conductor has a first through-hole penetrating both opposite surfaces of the first conductor; the second conductor has a second through-hole penetrating both opposite surfaces of the second conductor, with the first and second through-holes correspondingly disposed. The equipotential bonding member comprises a first fixing portion, a second fixing portion, and a first connecting portion. The first connecting portion is connected to both the first and second fixing portions, and is at least partially disposed within the first and second through-holes. The first fixing portion abuts against the side of the first conductor opposite to the second conductor, thereby electrically connecting the first fixing portion and the first conductor. The second fixing portion abuts against the side of the second conductor opposite to the first conductor, thereby electrically connecting the second fixing portion and the second conductor.

[0017] To address the aforementioned problems, this application provides an electrical device, which includes the battery device described above. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a structural schematic diagram of a vehicle according to one or more embodiments;

[0020] Figure 2 This is an exploded structural diagram of a battery device according to one or more embodiments;

[0021] Figure 3 This is a first structural schematic diagram of a housing assembly according to one or more embodiments of this application;

[0022] Figure 4 This is a second structural schematic diagram of a housing assembly according to one or more embodiments of this application;

[0023] Figure 5 This is a third structural schematic diagram of a housing assembly according to one or more embodiments of this application;

[0024] Figure 6 This is a first-view view of a housing assembly according to one or more embodiments;

[0025] Figure 7 This is a second view of a housing assembly according to one or more embodiments;

[0026] Figure 8 yes Figure 6 The diagram shows a cross-sectional view of the housing assembly along the AA direction.

[0027] Figure 9 yes Figure 6 The diagram shows a cross-sectional view of the housing assembly along the BB direction.

[0028] Reference numerals: Vehicle 1; Battery unit 2; Controller 3; Motor 4; Housing assembly 10; Battery cell 20; First conductor 100; First through hole 110; Module mounting beam 120; Second conductor 200; Second through hole 210; Thermal management plate 220; Equipotential bonding element 300; First fixing part 310; Second fixing part 320; First connecting part 330; Third fixing part 340; Second connecting part 350; Insulating layer 400; Metal conductive layer 500; Third conductor 600; Third through hole 610; Reinforcing plate 620. Detailed Implementation

[0029] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0031] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0032] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0033] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0034] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0035] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0036] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0037] Energy conservation and emission reduction are key to sustainable development, which in turn promotes the adjustment of the energy structure and drives the development and application of battery technology. The key to the development of battery technology lies in electrochemical energy storage technology. Due to its advantages such as high energy density, good cycle capability, high operating voltage, environmental friendliness, and low self-discharge, it has been widely used in portable electronics, electric vehicles, and energy storage systems.

[0038] Currently, judging from market trends, battery applications are becoming increasingly widespread. Batteries are not only used in energy storage systems such as hydropower, thermal power, wind power, and solar power plants, but also extensively in electric vehicles such as electric bicycles, electric motorcycles, and electric cars, as well as in aerospace and other fields. With the continuous expansion of battery applications, market demand is also constantly increasing.

[0039] In related technologies, battery devices include a housing assembly and individual battery cells located inside the housing assembly. The housing assembly typically includes multiple interconnected conductor components, and there is a potential difference between the different conductor components. How to achieve equipotential connection between the different conductor components has become an urgent technical problem to be solved.

[0040] To address the technical problems existing in related technologies, this application provides a housing assembly, a battery device, and an electrical device. The housing assembly includes multiple conductors with different potentials, which are electrically connected to each other through an equipotential bonding device. This enables the conductors with different potentials to achieve equipotentiality through the equipotential bonding device, and also reduces the risk of equipotential connection failure between conductors with different potentials.

[0041] Specifically, this application provides an electrical device, which may include, but is not limited to, mobile phones, tablets, laptops, electric toys, power tools, electric vehicles, electric cars, ships, spacecraft, etc. Electric toys may include stationary or mobile electric toys, such as game consoles, electric car toys, electric ship toys, and electric airplane toys, etc. Spacecraft may include airplanes, rockets, space shuttles, and spacecraft, etc. The electrical device may include a battery device, which can provide electrical energy to achieve its corresponding functions.

[0042] This application also provides an electric vehicle that may include a battery device.

[0043] Reference Figure 1 , Figure 1 This is a structural schematic diagram of a vehicle according to one or more embodiments.

[0044] Vehicle 1 can be a gasoline-powered vehicle, a natural gas-powered vehicle, or a new energy vehicle. New energy vehicles can be pure electric vehicles, hybrid electric vehicles, or range-extended electric vehicles, etc. A battery device 2 is installed inside vehicle 1, and the battery device 2 can be located at the bottom, front, or rear of vehicle 1. The battery device 2 can be used to power vehicle 1; for example, it can serve as the operating power source for vehicle 1. Vehicle 1 may also include a controller 3 and a motor 4. The controller 3 controls the battery device 2 to supply power to the motor 4, for example, to meet the power needs of vehicle 1 during starting, navigation, and driving.

[0045] In some embodiments of this application, the battery device 2 can not only serve as the operating power source for the vehicle 1, but also as the driving power source for the vehicle 1, replacing or partially replacing fuel or natural gas to provide driving power for the vehicle 1.

[0046] To improve the performance of electrical devices, this application also provides a battery device, see [link to relevant documentation]. Figure 2 , Figure 2This is an exploded structural diagram of a battery device according to one or more embodiments.

[0047] The shape of the battery device 2 may include, but is not limited to, a square, cylindrical or other arbitrary shapes.

[0048] In some embodiments, the battery device 2 may include a housing assembly 10 and a battery cell assembly, the battery cell assembly being housed within the housing assembly 10. The housing assembly 10 provides a receiving space for the battery cell assembly, and the housing assembly 10 may employ various structures. In some embodiments, the housing assembly 10 may include a first portion and a second portion, the first portion and the second portion overlapping each other, the first portion and the second portion together defining a receiving space for accommodating the battery cell assembly. The second portion may be a hollow structure with one open end, and the first portion may be a plate-like structure, the first portion covering the open side of the second portion so that the first portion and the second portion together define the receiving space; the first portion and the second portion may also be hollow structures, both open on one side, the open side of the first portion covering the open side of the second portion.

[0049] In the battery device 2, the battery cell assembly may include multiple battery cells 20, which can be connected in series, parallel, or in a mixed manner. A mixed connection means that some of the battery cells 20 are connected in series and others in parallel. The multiple battery cells 20 can be directly connected in series, parallel, or in a mixed manner, and then the entire assembly of the multiple battery cells 20 is housed within the housing assembly 10. Alternatively, the battery device 2 can also consist of multiple battery cells 20 first connected in series, parallel, or in a mixed manner to form battery modules, and then these battery modules are connected in series, parallel, or in a mixed manner to form a whole, which is also housed within the housing assembly 10. The battery device 2 may also include other structures; for example, it may include a busbar component for electrical connection between the multiple battery cells 20.

[0050] See Figure 3 , Figure 3 This is a first structural schematic diagram of a housing assembly according to one or more embodiments of this application.

[0051] The housing assembly 10 includes a first conductor 100, a second conductor 200, and an equipotential bonding member 300. The first conductor 100 has a first through hole 110 penetrating both opposite surfaces of the first conductor 100. The second conductor 200 has a second through hole 210 penetrating both opposite surfaces of the second conductor 200. The first through hole 110 and the second through hole 210 are correspondingly arranged. The equipotential bonding member 300 includes a first fixing part 310, a second fixing part 320, and a first connecting part 330. The first connecting part 330 is connected to the first fixing part 310 and the second fixing part 320 respectively. The first connecting part 330 is at least partially disposed in the first through hole 110 and the second through hole 210. The first fixing part 310 abuts against the side of the first conductor 100 away from the second conductor 200 to electrically connect the first fixing part 310 and the first conductor 100. The second fixing part 320 abuts against the side of the second conductor 200 away from the first conductor 100 to electrically connect the second fixing part 320 and the second conductor 200.

[0052] The first conductor 100 and the second conductor 200 can be any two conductor structures in the housing assembly 10. The first conductor 100 and the second conductor 200 have different potentials. For example, one of the first conductor 100 and the second conductor 200 may be made of steel, and the other of aluminum. When the first conductor 100 and the second conductor 200 are not electrically connected, a potential difference exists between them. In some practical applications, one of the first conductor 100 and the second conductor 200 may include the lower housing of the housing assembly 10, and the other may include the upper cover of the housing assembly 10; or one of the first conductor 100 and the second conductor 200 may include a beam structure of the lower housing of the housing assembly 10, and the other may include the bottom plate structure of the lower housing of the housing assembly 10, etc. The first conductor 100 may be at least partially flat, and the first through hole 110 penetrates the opposite sides of the portion. The second conductor 200 may be at least partially flat, and the second through hole 210 penetrates the opposite sides of the portion. The first conductor 100 and the second conductor 200 may be stacked on top of each other, so that the first through hole 110 and the second through hole 210 are connected.

[0053] The equipotential bonding element 300 is a conductive structure. It can connect to the first conductor 100 and the second conductor 200, thereby electrically connecting them and achieving equipotentiality. The first fixing portion 310, the second fixing portion 320, and the first connecting portion 330 of the equipotential bonding element 300 can be integrally formed. For example, the equipotential bonding element 300 may include a rivet bolt, which is inserted into the first through hole 110 and the second through hole 210, and then riveted to form the first fixing portion 310, the second fixing portion 320, and the first connecting portion 330. The first fixing part 310 and the second fixing part 320 can be connected to the end or middle of the first connecting part 330. For example, both the first fixing part 310 and the second fixing part 320 are connected to the end of the first connecting part 330, thereby forming an H-shaped structure together. Alternatively, one of the first fixing part 310 and the second fixing part 320 can be connected to the end of the first connecting part 330, and the other can be connected to the middle of the first connecting part 330 to form a T-shaped structure. The first fixing part 310 abuts against the side of the first conductor 100 away from the second conductor 200, and the second fixing part 320 abuts against the side of the second conductor 200 away from the first conductor 100. The first conductor 100 and the second conductor 200 can be fixed by the equipotential member 300, and the first conductor 100 and the second conductor 200 can also be electrically connected by the equipotential member 300.

[0054] In the above-described embodiments, the first through hole 110 and the second through hole 210 are correspondingly provided, which facilitates the simultaneous insertion of the first connecting part 330 into the first through hole 110 and the second through hole 210. The first fixing part 310 is connected to the first connecting part 330 and abuts against the side of the first conductor 100 away from the second conductor 200. The second fixing part 320 is connected to the first connecting part 330 and abuts against the side of the second conductor 200 away from the first conductor 100. This allows the first conductor 100 and the second conductor 200 to be electrically connected through the equipotential bonding member 300 without direct contact, thereby achieving equipotential between the first conductor 100 and the second conductor 200. At the same time, the equipotential bonding member 300 can also reduce the risk of failure of the equipotential connection between the first conductor 100 and the second conductor 200.

[0055] In some embodiments, the potential of the equipotential bonding element 300 is located between the potential of the first conductor 100 and the potential of the second conductor 200. This location reduces the risk of corrosion caused by direct contact between the equipotential bonding element 300 and the first and second conductors 100. The potentials at different locations of the equipotential bonding element 300 can be the same or different. The potentials at different locations can be matched according to the magnitudes of the potentials of the first and second conductors 100. For example, if the potential of the first conductor 100 is greater than the potential of the second conductor 200, the potential of the equipotential bonding element 300 can be configured such that the potential of the first fixing portion 310 is greater than the potential of the first connecting portion 330, which in turn is greater than the potential of the second fixing portion 320.

[0056] Furthermore, the potential difference between the equipotential member 300 and the first conductor 100 is less than 25 mV, and / or the potential difference between the equipotential member 300 and the second conductor 200 is less than 25 mV. The potential difference between the equipotential member 300 and the first conductor 100 can be understood as the potential difference between the first fixing part 310 and the first conductor 100, and the potential difference between the equipotential member 300 and the second conductor 200 can be understood as the potential difference between the second fixing part 320 and the second conductor 200. Specifically, the potential difference between the equipotential member 300 and the first conductor 100 can be 0, 5 mV, 10 mV, 15 mV, 20 mV, or 25 mV, etc., and the potential difference between the equipotential member 300 and the first conductor 100 can be greater than 0 and less than 25 mV, greater than and less than 25 mV, greater than 10 mV and less than 25 mV, greater than 15 mV and less than 25 mV, greater than 10 mV and less than 15 mV, etc. The potential difference between the equipotential bonding element 300 and the second conductor 200 can be 0, 5mV, 10mV, 15mV, 20mV, or 25mV, etc. The potential difference between the equipotential bonding element 300 and the second conductor 200 can be greater than 0 and less than 25mV, greater than and less than 25mV, greater than 10mV and less than 25mV, greater than 15mV and less than 25mV, greater than 10mV and less than 15mV, etc. Therefore, the potential difference between the equipotential bonding element 300 and the first conductor 100 is less than 25mV, and / or the potential difference between the equipotential bonding element 300 and the second conductor 200 is less than 25mV, which can further reduce the risk of corrosion caused by direct contact between the equipotential bonding element 300 and the first conductor 100 and the second conductor 200.

[0057] See Figure 4 , Figure 4 This is a second structural schematic diagram of the housing assembly 10 according to one or more embodiments of this application.

[0058] A metal conductive layer 500 is plated on the surface of the equipotential bonding element 300 that contacts the first conductor 100 and the second conductor 200. The potential of the metal conductive layer 500 is located between the potential of the first conductor 100 and the potential of the second conductor 200. The metal conductive layer 500 may include, but is not limited to, zinc, zinc-nickel, or zinc-aluminum-magnesium alloys. By plating a metal conductive layer 500 on the surface of the equipotential bonding element 300 that contacts the first conductor 100 and the second conductor 200, it is easier to control the potential difference between the equipotential bonding element 300 and the first conductor 100 and the second conductor 200, reducing the risk of corrosion caused by direct contact between the equipotential bonding element 300 and the first conductor 100 and the second conductor 200, and also reducing the molding difficulty of the equipotential bonding element 300. In some other embodiments, the equipotential bonding element 300 may include a two-layer structure. The potential of the main structure in the middle of the equipotential bonding element 300 can be arbitrarily set. It is only necessary to plate a metal conductive layer 500 on the outer layer, and the potential of the metal conductive layer 500 is located between the potential of the first conductor 100 and the potential of the second conductor 200. Thus, the first conductor 100 and the second conductor 200 can be electrically connected through the metal conductive layer 500.

[0059] In some embodiments, the housing assembly 10 includes an insulating layer 400 disposed between the first conductor 100 and the second conductor 200. The material of the insulating layer 400 can be set according to actual conditions. The insulating layer 400 can be pressed by the first conductor 100 and the second conductor 200, thereby preventing the first conductor 100 and the second conductor 200 from direct contact. There can be two insulating layers 400: one insulating layer 400 can be attached to the side of the first conductor 100 facing the second conductor 200, and the other insulating layer 400 can be attached to the side of the second conductor 200 facing the first conductor 100. Thus, the insulating layer 400, disposed between the first conductor 100 and the second conductor 200, can reduce the risk of corrosion caused by direct contact between the first conductor 100 and the second conductor 200.

[0060] Furthermore, the isolation layer 400 includes an insulating layer. The insulating layer may include, but is not limited to, an electrophoretic layer, a powder coating, an adhesive layer, etc. By providing an insulating layer between the first conductor 100 and the second conductor 200, electrical insulation is achieved between the first conductor 100 and the second conductor 200, reducing the risk of corrosion caused by direct contact between the first conductor 100 and the second conductor 200.

[0061] And / or, the insulating layer 400 includes a metal insulating layer 400, the potential of which is located between the potential of the first conductor 100 and the potential of the second conductor 200. The metal insulating layer 400 may be conductive, and being disposed between the first conductor 100 and the second conductor 200, it allows the first conductor 100 and the second conductor 200 to be electrically connected through the metal insulating layer 400. Furthermore, because the potential of the metal insulating layer 400 is located between the potential of the first conductor 100 and the second conductor 200, the risk of corrosion caused by direct contact between the first conductor 100 and the second conductor 200 can also be reduced.

[0062] See Figure 5 , Figure 5 This is a third structural schematic diagram of the housing assembly 10 according to one or more embodiments of this application.

[0063] The housing assembly 10 includes a third conductor 600, which contacts the side of the second fixing part 320 opposite to the second conductor 200, so that the third conductor 600 is electrically connected to at least one of the first conductor 100 and the second conductor 200. The third conductor 600 can be any conductor structure in the housing assembly 10. The third conductor 600 has a different potential from at least one of the first conductor 100 and the second conductor 200. When the first conductor 100, the second conductor 200 and the third conductor 600 are not electrically connected, at least two of them have a potential difference. For example, the first conductor 100 and the third conductor 600 are made of steel and the second conductor 200 is made of aluminum, or the first conductor 100 is made of steel and the second conductor 200 and the third conductor 600 are made of aluminum, etc. The third conductor 600 contacts the side of the second fixing part 320 away from the second conductor 200, so that the first conductor 100, the second conductor 200 and the third conductor 600 can be electrically connected through the equipotential member 300 without direct contact, so that the first conductor 100, the second conductor 200 and the third conductor 600 can achieve equipotentiality.

[0064] Furthermore, the equipotential bonding member 300 includes a second connecting portion 350 and a third fixing portion 340. The third conductor 600 has a third through hole 610 penetrating both opposite surfaces of the third conductor 600. The first connecting portion 330 and the second connecting portion 350 are connected, and the third fixing portion 340 abuts against the side of the third conductor 600 opposite to the second fixing portion 320. The third conductor 600 may at least partially be plate-shaped, and the third through hole 610 penetrates both opposite surfaces of this portion. The first through hole 110, the second through hole 210, and the third through hole 610 can be correspondingly connected. The second connecting part 350 and the third fixing part 340 can be integrally formed. For example, the equipotential member 300 may include a rivet bolt. By inserting the rivet bolt into the first through hole 110 and the second through hole 210, and then riveting to form the first fixing part 310, the second fixing part 320 and the first connecting part 330, and then connecting the second connecting part 350 to the second connecting part 350, the first fixing part 310, the second fixing part 320, the first connecting part 330, the second connecting part 350 and the third fixing part 340 can be electrically connected. In some practical applications, after fixing the first conductor 100 and the second conductor 200 with the first fixing part 310, the second fixing part 320 and the first connecting part 330, the third conductor 600 can be placed on the side of the second fixing part 320 away from the second conductor 200. Then, the second connecting part 350 can be passed through the third through hole 610 from the side of the second fixing part 320 away from the third conductor 600, so that the first connecting part 330 is connected to the second connecting part 350, and the third fixing part 340 abuts against the side of the third conductor 600 away from the second fixing part 320. Thus, the equipotential bonding member 300 can enable the first conductor 100, the second conductor 200 and the third conductor 600 to achieve equipotential connection without direct contact. At the same time, the equipotential bonding member 300 can reduce the risk of failure of the equipotential connection between the third conductor 600 and the first conductor 100 and / or the second conductor 200.

[0065] See Figures 6 to 9 , Figure 6 This is a first-view view of the housing assembly 10 according to one or more embodiments. Figure 7 This is a second view of the housing assembly 10 according to one or more embodiments. Figure 8 yes Figure 6 The diagram shows a cross-sectional view of the housing assembly 10 along the AA direction. Figure 9 yes Figure 6 The diagram shows a cross-sectional view of the housing assembly 10 along the BB direction.

[0066] The first conductor 100 includes a module mounting beam 120 for fixing and mounting battery cell assemblies. The module mounting beam 120 may be a hollow strip structure, and may be made of aluminum. The module mounting beam 120 may be located on the bottom wall and / or side wall of the housing assembly 10. For example, the housing assembly 10 may be a square structure, and one or more module mounting beams 120 may be installed on each side wall and the bottom wall of the housing assembly 10. When the battery cell assemblies are installed inside the housing assembly 10, the module mounting beams 120 abut against the battery cell assemblies, thereby fixing the battery cell assemblies. This facilitates the simultaneous fixing of the module mounting beams 120 by the equipotential bonding element 300 and the equipotential connection between the module mounting beams 120 and the second conductor 200.

[0067] In some embodiments, the second conductor 200 includes a housing base plate and a thermal management component 220. For example, the housing assembly 10 may include a lower housing and a top cover. The lower housing has a groove, and the top cover is disposed at the opening of the groove. The side of the lower housing away from the top cover can be defined as the housing base plate, which may be made of steel. In some practical applications, the first conductor 100 may be located inside the housing assembly 10 and disposed on the housing base plate. The equipotential bonding element 300 passes through both the first conductor 100 and the housing base plate, thus electrically connecting the first conductor 100 and the housing base plate. The thermal management component 220 may have a liquid flow channel for coolant to flow in. The thermal management component 220 may be installed on the side wall or bottom wall of the housing assembly 10. The first conductor 100 may be installed at a position corresponding to the thermal management component 220, so that the equipotential bonding element 300 passes through both the first conductor 100 and the thermal management component 220, thus electrically connecting the first conductor 100 and the thermal management component 220. This facilitates the simultaneous fixation of the enclosure base plate and thermal management component 220 by the equipotential bonding element 300, and the equipotential bonding between the enclosure base plate, thermal management component 220, and the first conductor 100.

[0068] In some embodiments, the third conductor 600 includes a reinforcing plate 620. The reinforcing plate 620 may be made of steel or aluminum and may be located on the outer wall of the housing assembly 10. For example, the housing assembly 10 may include a lower housing and a top cover. The lower housing has a groove, and the top cover is disposed at the opening of the groove to form a receiving space for accommodating a battery cell assembly. When the first conductor 100 includes a module mounting beam 120 and the second conductor 200 includes a housing bottom plate, the module mounting beam 120 may be located within the receiving space and in contact with the housing bottom plate, and the reinforcing plate 620 may be located outside the receiving space and in contact with the position of the housing bottom plate corresponding to the module mounting beam 120. The equipotential bonding element 300 passes through the module mounting beam 120, the housing bottom plate, and the reinforcing plate 620 simultaneously, so that the three are electrically connected. For example, when the first conductor 100 includes a module mounting beam 120 and the second conductor 200 includes a thermal management component 220, the module mounting beam 120 may be disposed on one side surface of the thermal management component 220, and the reinforcing plate 620 may be disposed on the side of the thermal management component 220 away from the module mounting beam 120 and at a position corresponding to the module mounting beam 120. The equipotential bonding member 300 passes through the module mounting beam 120, the thermal management component 220 and the reinforcing plate 620 simultaneously, so that the three are electrically connected.

[0069] In summary, the first through hole 110 and the second through hole 210 are correspondingly arranged to facilitate the simultaneous insertion of the first connecting part 330 into the first through hole 110 and the second through hole 210. The first fixing part 310 connects to the first connecting part 330 and abuts against the side of the first conductor 100 away from the second conductor 200. The second fixing part 320 connects to the first connecting part 330 and abuts against the side of the second conductor 200 away from the first conductor 100. This allows the first conductor 100 and the second conductor 200 to be electrically connected through the equipotential bonding member 300 without direct contact, achieving equipotentiality between the first conductor 100 and the second conductor 200. At the same time, the equipotential bonding member 300 can reduce the risk of failure of the equipotential connection between the first conductor 100 and the second conductor 200.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A battery device, characterized in that, The battery device includes: A housing assembly and a battery cell assembly, the housing assembly being used to house the battery cell assembly, the housing assembly comprising: The first conductor has a first through hole penetrating the opposite surfaces of the first conductor. The second conductor has a second through hole penetrating the opposite surfaces of the second conductor, and the first through hole and the second through hole are correspondingly provided; An equipotential bonding device includes a first fixing part, a second fixing part, and a first connecting part. The first connecting part is connected to the first fixing part and the second fixing part respectively. The first connecting part is at least partially disposed in the first through hole and the second through hole. The first fixing part abuts against the side of the first conductor away from the second conductor to make the first fixing part and the first conductor electrically connected. The second fixing part abuts against the side of the second conductor away from the first conductor to make the second fixing part and the second conductor electrically connected.

2. The battery device according to claim 1, characterized in that, The battery device includes an insulating layer disposed between the first conductor and the second conductor.

3. The battery device according to claim 2, characterized in that, The isolation layer includes an insulating layer; And / or, the isolation layer includes a metal isolation layer, the potential of which is located between the potential of the first conductor and the potential of the second conductor.

4. The battery device according to any one of claims 1 to 3, characterized in that, The potential of the equipotential element is located between the potential of the first conductor and the potential of the second conductor.

5. The battery device according to claim 4, characterized in that, The potential difference between the equipotential element and the first conductor is less than 25mV, and / or the potential difference between the equipotential element and the second conductor is less than 25mV.

6. The battery device according to claim 4, characterized in that, The surface of the equipotential bonding element that contacts the first conductor and the second conductor is plated with a metal conductive layer, and the potential of the metal conductive layer is located between the potential of the first conductor and the potential of the second conductor.

7. The battery device according to any one of claims 1 to 6, characterized in that, The battery device includes a third conductor that contacts the side of the second fixing portion away from the second conductor, so that the third conductor is electrically connected to at least one of the first conductor and the second conductor.

8. The battery device according to claim 7, characterized in that, The equipotential bonding element includes a second connecting portion and a third fixing portion. The third conductor has a third through hole penetrating the opposite surfaces of the third conductor. The first connecting portion and the second connecting portion are connected, and the third fixing portion abuts against the side of the third conductor away from the second fixing portion.

9. The battery device according to claim 7 or 8, characterized in that, The third conductor includes a reinforcing plate.

10. The battery device according to any one of claims 1 to 9, characterized in that, The first conductor includes a module mounting beam, which is used to fix and mount the battery cell assembly.

11. The battery device according to any one of claims 1 to 10, characterized in that, The second conductor includes a base plate of the housing and a thermal management component.

12. A housing assembly, characterized in that, The enclosure assembly includes: The first conductor has a first through hole penetrating the opposite surfaces of the first conductor. The second conductor has a second through hole penetrating the opposite surfaces of the second conductor, and the first through hole and the second through hole are correspondingly provided; An equipotential bonding device includes a first fixing part, a second fixing part, and a first connecting part. The first connecting part is connected to the first fixing part and the second fixing part respectively. The first connecting part is at least partially disposed in the first through hole and the second through hole. The first fixing part abuts against the side of the first conductor away from the second conductor to make the first fixing part and the first conductor electrically connected. The second fixing part abuts against the side of the second conductor away from the first conductor to make the second fixing part and the second conductor electrically connected.

13. An electrical appliance, characterized in that, The electrical device includes the battery device as described in any one of claims 1 to 11.

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