Modularized photovoltaic module
By designing modular photovoltaic modules, partial replacement and plug-and-play connection of photovoltaic modules are realized, solving the problems of high operation and maintenance costs and resource waste, and improving fault location efficiency and overall module efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHINA THREE GORGES CORPORATION
- Filing Date
- 2025-06-06
- Publication Date
- 2026-05-12
AI Technical Summary
The inability to partially replace existing photovoltaic modules leads to high operation and maintenance costs, serious waste of resources, and difficulty in quickly locating faulty areas, resulting in poor compatibility and loss of system efficiency.
Adopting a modular design, each photovoltaic submodule includes a battery packaging unit, a submodule frame, a micro optimizer, and a standardized plug-and-play interface, allowing for plug-and-play connections between photovoltaic submodules and real-time monitoring and fault location via RFID chips.
It improves the flexibility of partial replacement of photovoltaic modules, reduces operation and maintenance costs, enhances the reliability and stability between photovoltaic sub-modules, improves fault location and repair efficiency, and improves the overall efficiency of the modules.
Smart Images

Figure CN224233642U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of photovoltaic module technology, specifically to modular photovoltaic modules. Background Technology
[0002] Currently, photovoltaic modules employ an integrated encapsulation design (e.g., 60 or 72 cells series-encapsulated into a 1903mm×1134mm or 2278mm×1134mm module). The cells are connected in series via solder ribbons, with centralized output via junction boxes at the edges. If hot spots, microcracks, or aging appear in a localized area of the module, the entire module must be disassembled and replaced, resulting in high maintenance costs (30%-40% of the total system cost). Furthermore, it's difficult to quickly locate the fault area, and the disassembly process easily causes secondary damage, leading to low repair efficiency. Incompatibility is poor; mixing new and old modules results in system efficiency losses (>5%) due to current-voltage mismatch. Existing technologies typically divide the module into several sub-strings and configure diodes, but this only isolates localized short circuits and cannot replace damaged units. The rigid, indivisible structure of traditional modules leads to high maintenance costs and significant resource waste.
[0003] Therefore, a modular solution for photovoltaic modules that supports partial replacement and has strong compatibility is needed. Utility Model Content
[0004] In view of this, the present invention provides a modular photovoltaic module to solve the problems of inability to partially replace photovoltaic module units, high operation and maintenance costs, and serious waste of resources in related technologies.
[0005] In a first aspect, this utility model provides a modular photovoltaic module, comprising:
[0006] Modular photovoltaic modules consist of multiple arrayed photovoltaic sub-modules;
[0007] Each photovoltaic submodule includes:
[0008] A battery packaging unit; a battery packaging unit comprises several fully packaged and interconnected photovoltaic cells;
[0009] The submodule framework is used to set up battery packaging units and has interconnection circuits for connecting to photovoltaic cells; the submodule framework includes several standardized plug-in interfaces for connecting interconnection circuits; adjacent photovoltaic submodules are electrically and mechanically connected through standardized plug-in interfaces.
[0010] A micro optimizer is located on one side of the battery packaging unit; the micro optimizer is connected to the photovoltaic cell via interconnect circuitry and is suitable for controlling several photovoltaic cells in the battery packaging unit.
[0011] The modular photovoltaic module provided by this utility model has several advantages. First, by setting up multiple arrayed photovoltaic sub-modules, each of which can be partially disassembled and replaced, it overcomes the limitations of the rigid structure of traditional modules that cannot be disassembled, improving the flexibility of partial replacement of photovoltaic modules and shortening fault repair time to within 10 minutes, thus significantly reducing maintenance costs. Second, adjacent photovoltaic sub-modules are electrically and mechanically connected through standardized plug-in interfaces, enabling "plug-and-play" electrical connections between them. The standardized plug-in interfaces have high plug-in life and high reliability, improving the reliability and stability between photovoltaic sub-modules. Third, by setting up a micro-optimizer in each photovoltaic sub-module, the photovoltaic cells in each sub-module can achieve independent MPPT control and integrated DC-DC conversion, enabling independent maximum power point tracking, solving the problem of mismatch in mixed installations, improving the efficiency of each photovoltaic sub-module, and thus improving the overall efficiency of the photovoltaic module. At the same time, it can monitor the working status of each photovoltaic sub-module in real time, automatically isolate faulty units, optimize system output, and reduce the overall system efficiency degradation of the photovoltaic module. Therefore, the modular photovoltaic module provided by this utility model can improve the flexibility of partial replacement of photovoltaic modules, shorten the fault repair time, reduce operation and maintenance costs, improve the reliability and stability between photovoltaic sub-modules, and improve the efficiency of each photovoltaic sub-module, thereby improving the overall efficiency of photovoltaic modules and reducing the overall system efficiency degradation of photovoltaic modules.
[0012] In one alternative implementation, the submodule frame is provided with chip recesses;
[0013] The photovoltaic sub-module also includes an RFID chip, located within a chip recess.
[0014] The modular photovoltaic module provided by this invention features an RFID chip in each photovoltaic submodule. This RFID chip stores information such as the power output and production date of the corresponding photovoltaic submodule. On one hand, the RFID chip in each photovoltaic submodule can be combined with a micro-optimizer to form a micro-maintenance system for each submodule. This system can monitor the operating status of each submodule in real time, automatically isolate faulty units, optimize system output, and reduce the overall efficiency degradation of the photovoltaic module. On the other hand, when a partial fault occurs in the photovoltaic module, the chip identification device can obtain information about each submodule in real time, quickly locating the faulty submodule, improving troubleshooting efficiency, and consequently, improving maintenance and replacement efficiency.
[0015] In one alternative implementation, the standardized plug-in interface includes a socket and a plug;
[0016] The plug is a conductive contact that protrudes from the side edge of the submodule frame, and the plug is made of a conductive material;
[0017] The socket is a slot recessed into the side edge of the submodule frame; a spring pin contact is provided inside the socket, and a metal layer is provided on the surface of the spring pin contact;
[0018] The socket and plug are electrically connected through conductive contacts that make contact with spring pin contacts;
[0019] The plug of the photovoltaic submodule is connected to the socket of the adjacent photovoltaic submodule by a mating connection, forming a set of plug-in connection structures; the two adjacent photovoltaic submodules are electrically and mechanically connected through at least one set of plug-in connection structures.
[0020] The modular photovoltaic module provided by this utility model has corresponding plugs and sockets between two adjacent photovoltaic sub-modules. The plugs are conductive contacts, and the sockets are equipped with spring pin contacts. The two adjacent photovoltaic sub-modules are electrically and mechanically connected through a plug-and-play connection structure consisting of at least one set of plugs and sockets. This can reduce the contact resistance between the photovoltaic cells of adjacent photovoltaic sub-modules, improve the current transmission efficiency, and achieve a "plug-and-play" electrical connection between the two photovoltaic sub-modules. At the same time, the plugs and sockets have a long plug-and-play life, which can improve the stability and reliability of the plug-and-play connection structure, thereby improving the reliability and stability of the modular photovoltaic module.
[0021] In one alternative embodiment, a first magnetic component is provided on the surface of the plug, and a second magnetic component is provided inside the socket.
[0022] The sockets and plugs are adapted to achieve magnetic alignment and fixation via a first magnetic component and a second magnetic component.
[0023] The modular photovoltaic module provided by this utility model achieves magnetic alignment and fixation of the socket and plug through a first magnetic component and a second magnetic component, which can improve the insertion and extraction force of the mechanical fixation of the plug-in connection structure; at the same time, it can realize "plug and play" electrical connection between the socket and plug, improve the alignment efficiency and alignment accuracy of the electrical connection between two adjacent photovoltaic sub-modules, and thus improve the reliability and stability of the modular photovoltaic module.
[0024] In one alternative implementation, the top view of the battery packaging unit is rectangular;
[0025] The rectangle has a length of 5cm to 20cm and a width of 5cm to 20cm;
[0026] The battery packaging unit includes:
[0027] The structure consists of a stacked cover plate layer, a first encapsulating adhesive layer, a sub-module battery layer, a second encapsulating adhesive layer, and a backsheet layer; the sub-module battery layer includes photovoltaic cells.
[0028] The standardized plug-in interface is located on the side of the submodule frame and connects to the photovoltaic cells in the submodule battery layer via interconnect circuits.
[0029] In one alternative implementation, the micro optimizer and the standardized plug-in interface are located on different sides of the battery packaging unit.
[0030] Alternatively: Standardized plug-in interfaces are located on the four sides of the submodule frame; the micro optimizer is located on the side of the battery packaging unit near the backplane layer.
[0031] In one optional implementation, the photovoltaic cells in the submodule battery layer are perovskite cells, TOPCon crystalline silicon cells, or perovskite-crystalline silicon tandem cells.
[0032] Crystalline silicon cells include TOPCon crystalline silicon cells, PERC crystalline silicon cells, HJT crystalline silicon cells, or IBC crystalline silicon cells;
[0033] Perovskite-crystalline silicon tandem solar cells include perovskite-TOPCon crystalline silicon cells, perovskite-PERC crystalline silicon cells, perovskite-HJT crystalline silicon cells, or perovskite-IBC crystalline silicon cells.
[0034] Each photovoltaic submodule includes 1 to 4 photovoltaic cells.
[0035] In one optional implementation, the photovoltaic cells of the submodule battery layer are perovskite-TOPCon crystalline silicon tandem cells.
[0036] The submodule battery layer includes a stacked perovskite battery layer and a TOPCon crystalline silicon battery layer; wherein the perovskite battery layer is closer to the cover plate layer, and the TOPCon crystalline silicon battery layer is closer to the backplate layer; a third encapsulating adhesive layer is also included between the perovskite battery layer and the TOPCon crystalline silicon battery layer.
[0037] Each photovoltaic submodule includes one perovskite-TOPCon crystalline silicon tandem solar cell;
[0038] Standardized plug-in interfaces connect the perovskite solar cell layer and the TOPCon crystalline silicon solar cell layer respectively via interconnect circuits;
[0039] The rectangle is 15cm long and 15cm wide.
[0040] The modular photovoltaic module provided by this utility model includes a sub-module cell layer comprising one perovskite-TOPCon crystalline silicon tandem cell. Standardized plug-in interfaces connect the perovskite cell layer and the TOPCon crystalline silicon cell layer respectively through interconnection circuits, enabling dual-path current transmission. The current of the perovskite cell layer and the TOPCon crystalline silicon cell layer are led out separately. When the perovskite cell layer fails due to damp heat aging, the top perovskite cell layer can be replaced separately, while retaining the function of the bottom crystalline silicon cell. Material waste is reduced by 70%, thus lowering the replacement cost of the photovoltaic module.
[0041] In one optional implementation, the photovoltaic cells in the submodule battery layer are perovskite cells; the submodule battery layer is a perovskite battery layer.
[0042] Each photovoltaic submodule includes two perovskite solar cells;
[0043] Standardized plug-in interfaces connect the perovskite cell layers via interconnect circuitry.
[0044] The rectangle is 10cm long and 10cm wide.
[0045] The cover plate layer is 3.2 mm thick; the first encapsulating adhesive layer is 0.5 mm thick.
[0046] The thickness of the second encapsulating adhesive layer is 0.5 mm; the thickness of the backing layer is 2 mm.
[0047] The modular photovoltaic module consists of 100 photovoltaic sub-modules arranged in a 10×10 array.
[0048] In one alternative embodiment, the protrusion of the plug beyond the side edge of the submodule frame is larger than the recess of the socket within the side edge of the submodule frame.
[0049] When the plugs and sockets of adjacent photovoltaic sub-modules are in maximum complete contact, a gap is formed between the frames of adjacent sub-modules;
[0050] Modular photovoltaic modules also include:
[0051] A silicone light-transmitting layer fills the gaps between adjacent photovoltaic sub-modules;
[0052] The gap width is 1mm to 2mm; the light transmittance of the silicone light-transmitting layer is greater than 95%.
[0053] The modular photovoltaic module provided by this utility model forms a silicone light-transmitting layer through the gap between adjacent photovoltaic sub-modules. The light transmittance of the silicone light-transmitting layer is greater than 95%, which reduces shading loss (efficiency loss <0.5%), reduces light reflection loss, and increases the effective light-receiving area of the module to 99.3%. Under the same area, the module power output is increased by 1.2%. Attached Figure Description
[0054] To more clearly illustrate the technical solutions in the specific embodiments or related technologies of this utility model, the drawings used in the description of the specific embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0055] Figure 1 This is a top view schematic diagram of a modular photovoltaic module according to an embodiment of the present utility model.
[0056] Figure 2 This is a schematic diagram of the connection between the plugs and sockets of a modular photovoltaic module according to an embodiment of the present utility model.
[0057] Figure 3 This is a top view schematic diagram of the structure of a photovoltaic submodule in a modular photovoltaic module according to an embodiment of the present utility model.
[0058] Figure 4 This is a schematic flowchart of a method for preparing a modular photovoltaic module according to an embodiment of the present invention.
[0059] Figure 5 This is a flowchart illustrating a method for the operation, maintenance, and replacement of a modular photovoltaic module according to an embodiment of the present invention.
[0060] Figure label:
[0061] 100. Photovoltaic submodule; 10. Battery packaging unit; 20. Submodule frame; 30. Standardized plug-in interface; 31. Plug; 32. Socket; 40. Micro optimizer; 200. Photovoltaic bracket. Detailed Implementation
[0062] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.
[0063] Currently, photovoltaic modules employ an integrated encapsulation design (e.g., 60 or 72 cells series-encapsulated into a 1903mm×1134mm or 2278mm×1134mm module). The cells are connected in series via solder ribbons, with centralized output via junction boxes at the edges. If hot spots, microcracks, or aging appear in a localized area of the module, the entire module must be disassembled and replaced, resulting in high maintenance costs (30%-40% of the total system cost). Furthermore, it's difficult to quickly locate the fault area, and the disassembly process easily causes secondary damage, leading to low repair efficiency. Incompatibility is poor; mixing new and old modules results in system efficiency losses (>5%) due to current-voltage mismatch. Existing technologies typically divide the module into several sub-strings and configure diodes, but this only isolates localized short circuits and cannot replace damaged units. The rigid, indivisible structure of traditional modules leads to high maintenance costs and significant resource waste.
[0064] Therefore, a modular solution for photovoltaic modules that supports partial replacement and has strong compatibility is needed.
[0065] like Figure 1 As shown, this embodiment provides a modular photovoltaic module, including:
[0066] The modular photovoltaic module comprises multiple array-distributed photovoltaic sub-modules 100;
[0067] Each photovoltaic submodule 100 includes:
[0068] Battery packaging unit 10; Battery packaging unit 10 includes a plurality of fully packaged and interconnected photovoltaic cells;
[0069] The submodule frame 20 is used to set up the battery packaging unit 10 and is provided with interconnection circuits for connecting to the photovoltaic cells; the submodule frame 20 includes several standardized plug-in interfaces 30 for connecting the interconnection circuits; adjacent photovoltaic submodules 100 are electrically and mechanically connected through the standardized plug-in interfaces 30.
[0070] A micro optimizer 40 is located on one side of the battery packaging unit 10; the micro optimizer 40 is connected to the photovoltaic cell via an interconnection circuit, and the micro optimizer 40 is adapted to control several photovoltaic cells in the battery packaging unit 10.
[0071] In specific implementations, the photovoltaic sub-modules 100, distributed in multiple arrays, are arranged in an M×N array configuration. In some implementations, such as... Figure 1 As shown, the photovoltaic sub-modules 100 array is distributed on the photovoltaic support 200.
[0072] The modular photovoltaic module provided in this embodiment has several advantages. First, by setting up multiple arrayed photovoltaic sub-modules, each of which can be partially disassembled and replaced, it overcomes the rigid structural limitations of traditional modules that cannot be disassembled, improving the flexibility of partial replacement and reducing fault repair time to within 10 minutes, thus significantly reducing maintenance costs. Second, adjacent photovoltaic sub-modules are electrically and mechanically connected through standardized plug-in interfaces, enabling "plug-and-play" electrical connections between them. The standardized plug-in interfaces have high plug-in lifespan and reliability, improving the reliability and stability between photovoltaic sub-modules. Third, by setting up a micro-optimizer in each photovoltaic sub-module, the photovoltaic cells in each sub-module can achieve independent MPPT control and integrated DC-DC conversion, enabling independent maximum power point tracking, solving the problem of mismatch in mixed installations, improving the efficiency of each photovoltaic sub-module, and thus improving the overall efficiency of the photovoltaic module. Simultaneously, it can monitor the working status of each photovoltaic sub-module in real time, automatically isolate faulty units, optimize system output, and reduce the overall system efficiency degradation of the photovoltaic module. Therefore, the modular photovoltaic module provided by this utility model can improve the flexibility of partial replacement of photovoltaic modules, shorten the fault repair time, reduce operation and maintenance costs, improve the reliability and stability between photovoltaic sub-modules, and improve the efficiency of each photovoltaic sub-module, thereby improving the overall efficiency of photovoltaic modules and reducing the overall system efficiency degradation of photovoltaic modules.
[0073] In some alternative implementations, the submodule frame 20 is provided with chip recesses;
[0074] The photovoltaic submodule 100 also includes an RFID chip located in a chip recess.
[0075] In practical implementation, each photovoltaic submodule 100 is equipped with an RFID chip. The RFID chip is suitable for storing information such as the power and production date of the corresponding photovoltaic submodule 100. The faulty unit can be located by identifying the device through the chip. In one example, the faulty photovoltaic submodule 100 can be quickly located by scanning the code with a handheld terminal.
[0076] The modular photovoltaic module provided in this embodiment uses an RFID chip in each photovoltaic submodule. This RFID chip stores information such as the power output and production date of the corresponding photovoltaic submodule. On one hand, the RFID chip in each photovoltaic submodule can be combined with a micro-optimizer to form a micro-maintenance system for each submodule. This system can monitor the operating status of each submodule in real time, automatically isolate faulty units, optimize system output, and reduce the overall efficiency degradation of the photovoltaic module. On the other hand, when a partial fault occurs in the photovoltaic module, the chip identification device can obtain information about each submodule in real time, quickly locating the faulty submodule, improving troubleshooting efficiency, and thus improving maintenance and replacement efficiency.
[0077] In some alternative implementations, such as Figure 2 and Figure 3 As shown, the standardized plug-in interface 30 includes a socket 32 and a plug 31;
[0078] The plug 31 is a conductive contact protruding from the side edge of the submodule frame 20, and the material of the plug 31 is a conductive material;
[0079] The socket 32 is a slot recessed into the side edge of the submodule frame 20; a spring pin contact is provided inside the socket 32, and a metal layer is provided on the surface of the spring pin contact.
[0080] The socket 32 and the plug 31 are electrically connected through conductive contacts contacting the spring pin contacts;
[0081] The plug 31 of the photovoltaic submodule 100 is connected to the socket 32 of the adjacent photovoltaic submodule 100 by a plug-in connection, forming a set of plug-in connection structures; the two adjacent photovoltaic submodules 100 are electrically and mechanically connected through at least one set of plug-in connection structures.
[0082] During electrical connection, the plug 31 in a set of plug-in connection structures is inserted into the socket 32, and the conductive contact contacts the spring pin contact. Due to the metal layer on the surface of the spring pin, the two contacts can achieve electrical connection.
[0083] In some embodiments, the plug 31 can be engaged by adjusting the opening size of the socket 32. The opening size of the socket matches the local radial size of the plug, thereby achieving engagement. Alternatively, the socket and the plug may each be provided with a first engagement structure and a second engagement structure that match their sizes. One of them may be a slot, and the other may be a tenon. The slot and the tenon are sized to match, and when fully engaged, the tenon engages with the slot, thus securing the connection between the two.
[0084] In practical implementation, the contact resistance between the conductive contact and the spring pin contact inside the socket 32 is <0.1Ω, supporting bidirectional current transmission; and the contact resistance stability is improved to within ±2% (compared to ±10% for traditional welded joints). Simultaneously, the plug 31 and socket 32 achieve mechanical fixation through mating connection, with a mating life >1000 cycles (IEC 60068-2-11 standard), resulting in high reliability of the mating connection structure.
[0085] The modular photovoltaic module provided in this embodiment achieves electrical and mechanical connection between adjacent photovoltaic sub-modules by setting corresponding plugs and sockets between each adjacent photovoltaic sub-module. The plugs are conductive contacts, and the sockets are equipped with spring pin contacts. The two adjacent photovoltaic sub-modules are connected by a plug-and-play connection structure consisting of at least one set of plugs and sockets. This can reduce the contact resistance between the photovoltaic cells of adjacent photovoltaic sub-modules, improve the current transmission efficiency, and achieve a "plug-and-play" electrical connection between the two photovoltaic sub-modules. At the same time, the plugs and sockets have a high plug-and-play life, which can improve the stability and reliability of the plug-and-play connection structure, thereby improving the reliability and stability of the modular photovoltaic module.
[0086] In some alternative embodiments, a first magnetic component is provided on the surface of the plug 31, and a second magnetic component is provided inside the socket 32;
[0087] The socket 32 and plug 31 are adapted to achieve magnetic alignment and fixation via a first magnetic component and a second magnetic component.
[0088] During connection, the first and second magnetic components automatically align under magnetic force. Simultaneously, the first and second magnetic components can be designed with a matching mating structure to achieve the mating and fixing of the plug 31 and the socket 32. This mating structure can be, for example, a snap-fit structure, where one of the first and second magnetic components includes a slot and the other a tenon. The slot and tenon mate to achieve a snap-fit connection. When fully connected, the tenon engages with the slot, securing the connection between the two components.
[0089] In practical implementation, the first and second magnetic components can be magnetic sheets. By integrating the standardized plug-in interface 30 with the magnetic connection, a "plug-and-play" electrical connection between the socket 32 and the plug 31 can be achieved, while also improving the insertion and extraction force of the plug-in connection structure. In one example, the photovoltaic submodule 100 integrates magnetic plug-in interfaces (IP67 waterproof rating) on all four sides, and the socket 32 and plug 31 are mechanically fixed by a snap-fit structure and a magnetic sheet structure. The insertion and extraction force of the plug-in connection structure is 5N to 10N, and it can withstand wind pressure ≥2400Pa.
[0090] The modular photovoltaic module provided in this embodiment uses a first magnetic component and a second magnetic component to achieve magnetic alignment and fixation of the socket and plug, which can improve the insertion and extraction force of the mechanical fixation of the plug-in connection structure; at the same time, it can realize "plug and play" electrical connection between the socket and plug, improve the alignment efficiency and alignment accuracy of the electrical connection between two adjacent photovoltaic sub-modules, and thus improve the reliability and stability of the modular photovoltaic module.
[0091] In some alternative embodiments, the top view of the battery packaging unit 10 is rectangular;
[0092] The rectangle has a length of 5cm to 20cm and a width of 5cm to 20cm;
[0093] Battery packaging unit 10 includes:
[0094] The structure consists of a stacked cover plate layer, a first encapsulating adhesive layer, a sub-module battery layer, a second encapsulating adhesive layer, and a backsheet layer; the sub-module battery layer includes photovoltaic cells.
[0095] The standardized plug-in interface 30 is located on the side of the submodule frame 20 and is connected to the photovoltaic cells in the submodule battery layer via interconnect circuits.
[0096] In some alternative implementations, the micro optimizer 40 and the standardized plug-in interface 30 are located on different sides of the battery packaging unit 10.
[0097] Alternatively: Standardized plug-in interfaces 30 are located on the four sides of the submodule frame 20; micro optimizer 40 is located on the side of the battery packaging unit 10 near the backplane layer.
[0098] In practice, the side of the battery encapsulation unit 10 closest to the cover plate layer is the front side, and the side closest to the back plate layer is the back side. The front and back sides of the battery encapsulation unit 10 are the front and back sides of the modular photovoltaic module. Figures 1-3 All are top-down views of the front.
[0099] In one example, the micro-optimizer 40 and the standardized plug-in interface 30 are located on different sides of the battery packaging unit 10. Figure 1 and Figure 2 As shown, in the photovoltaic sub-modules 100 located in the first and last rows, the micro optimizer 40 is located on one side of the battery packaging unit 10, and the standardized plug-in interface 30 is located on the other side of the battery packaging unit 10.
[0100] In another example, standardized plug-in interfaces 30 are located on the four sides of the submodule frame 20, and a micro-optimizer 40 is located on the back of the battery packaging unit 10. For example... Figure 1 and Figure 2As shown, in the photovoltaic sub-module 100 located in the middle row, the standardized plug-in interface 30 is located on the four sides of the battery packaging unit 10; the micro optimizer 40 is located on the back of the battery packaging unit 10.
[0101] It should be noted that the number of rows in the 100-array arrangement of photovoltaic sub-modules is not limited to... Figure 1 The text contains 3 lines, which can be more than 3 lines, such as 5 lines, 10 lines, etc. All lines between the first and last lines are considered middle lines, except for the very first line at the top and the very last line at the bottom.
[0102] In some optional implementations, the photovoltaic cells in the submodule battery layer are perovskite cells, TOPCon crystalline silicon cells, or perovskite-crystalline silicon tandem cells.
[0103] Crystalline silicon cells include TOPCon crystalline silicon cells, PERC crystalline silicon cells, HJT crystalline silicon cells, or IBC crystalline silicon cells;
[0104] Perovskite-crystalline silicon tandem solar cells include perovskite-TOPCon crystalline silicon cells, perovskite-PERC crystalline silicon cells, perovskite-HJT crystalline silicon cells, or perovskite-IBC crystalline silicon cells.
[0105] Each photovoltaic submodule 100 includes 1 to 4 photovoltaic cells.
[0106] exist Figures 1-3 In this system, each photovoltaic submodule 100 includes 4 photovoltaic cells.
[0107] In some optional implementations, the photovoltaic cells of the submodule battery layer are perovskite-TOPCon crystalline silicon tandem cells;
[0108] The submodule battery layer includes a stacked perovskite battery layer and a TOPCon crystalline silicon battery layer; wherein the perovskite battery layer is closer to the cover plate layer, and the TOPCon crystalline silicon battery layer is closer to the backplate layer; a third encapsulating adhesive layer is also included between the perovskite battery layer and the TOPCon crystalline silicon battery layer.
[0109] The standardized plug-in interface 30 connects the perovskite solar cell layer and the TOPCon crystalline silicon solar cell layer respectively through interconnection circuits;
[0110] Each photovoltaic submodule 100 includes one perovskite-TOPCon crystalline silicon tandem solar cell;
[0111] The rectangle is 15cm long and 15cm wide.
[0112] In Example 1, the photovoltaic cells in the submodule battery layer are perovskite-TOPCon crystalline silicon tandem cells. The top view dimensions of each photovoltaic submodule 100 are 15cm × 15cm. Each photovoltaic submodule 100 includes one perovskite-TOPCon crystalline silicon tandem cell. The standardized plug-in interface 30 supports dual-path current transmission, allowing independent output from the perovskite battery layer and the TOPCon crystalline silicon battery layer. This enables perovskite battery layers between adjacent photovoltaic submodules 100 to form one path, and TOPCon crystalline silicon battery layers between adjacent photovoltaic submodules 100 to form another path.
[0113] The modular photovoltaic module provided by this utility model includes a sub-module cell layer comprising one perovskite-TOPCon crystalline silicon tandem cell. Standardized plug-in interfaces connect the perovskite cell layer and the TOPCon crystalline silicon cell layer respectively through interconnection circuits, enabling dual-path current transmission. The current of the perovskite cell layer and the TOPCon crystalline silicon cell layer are led out separately. When the perovskite cell layer fails due to damp heat aging, the top perovskite cell layer can be replaced separately, while retaining the function of the bottom crystalline silicon cell. Material waste is reduced by 70%, thus lowering the replacement cost of the photovoltaic module.
[0114] In some optional implementations, the photovoltaic cells in the submodule battery layer are perovskite cells; the submodule battery layer is a perovskite battery layer.
[0115] Each photovoltaic submodule 100 includes 2 perovskite solar cells;
[0116] The standardized plug-in interface 30 connects to the perovskite cell layer via interconnect circuitry.
[0117] The rectangle is 10cm long and 10cm wide.
[0118] The cover plate layer is 3.2 mm thick; the first encapsulating adhesive layer is 0.5 mm thick.
[0119] The thickness of the second encapsulating adhesive layer is 0.5 mm; the thickness of the backing layer is 2 mm.
[0120] The modular photovoltaic module consists of 100 photovoltaic sub-modules arranged in a 10×10 array.
[0121] In Example 2, the photovoltaic cells in the submodule battery layer are perovskite cells. The top view dimensions of each photovoltaic submodule 100 are 10cm × 10cm. Each photovoltaic submodule 100 includes two perovskite cells. The structure of the battery encapsulation unit 10 is: 3.2mm glass + 0.5mm POE film + perovskite layer + 0.5mm POE film + 2mm composite backplane. Standardized plug-in interfaces 30 are located on the four sides of the submodule frame 20. The standardized plug-in interfaces 30 are IP67 rated magnetic plug-in interfaces (model: TE Connectivity 2137554-1) with gold-plated contacts.
[0122] In some alternative implementations, the plug 31 protrudes beyond the side edge of the submodule frame 20 by a larger dimension than the socket 32 is recessed into the side edge of the submodule frame 20.
[0123] When the plug 31 and socket 32 of adjacent photovoltaic sub-modules 100 are in maximum complete contact, a gap is formed between the frames 20 of adjacent sub-modules;
[0124] Modular photovoltaic modules also include:
[0125] A silicone light-transmitting layer fills the gaps between adjacent photovoltaic sub-modules 100;
[0126] The gap width is 1mm to 2mm; the light transmittance of the silicone light-transmitting layer is greater than 95%.
[0127] In practice, the refractive index of the silicone light-transmitting layer is 1.5.
[0128] The modular photovoltaic module provided by this utility model forms a silicone light-transmitting layer through the gap between adjacent photovoltaic sub-modules. The light transmittance of the silicone light-transmitting layer is greater than 95%, which reduces shading loss (efficiency loss <0.5%), reduces light reflection loss, and increases the effective light-receiving area of the module to 99.3%. Under the same area, the module power output is increased by 1.2%.
[0129] like Figure 4 As shown, this embodiment also provides a method for manufacturing modular photovoltaic modules. It includes:
[0130] Step S101: Form a battery packaging unit 10, which includes a number of fully packaged and interconnected photovoltaic cells.
[0131] In a specific implementation, the battery encapsulation unit 10 includes: a stacked cover layer, a first encapsulating adhesive layer, a sub-module battery layer, a second encapsulating adhesive layer, and a backsheet layer; the sub-module battery layer includes a plurality of photovoltaic cells.
[0132] Step S102: The battery packaging unit 10 is placed on the sub-module frame 20, and the sub-module frame 20 is provided with interconnection circuits for connection with photovoltaic cells.
[0133] Step S103: Several standardized plug-in interfaces 30 are formed in the submodule framework 20; the standardized plug-in interfaces 30 are connected to interconnect circuits.
[0134] In specific implementation, the standardized plug-in interface 30 includes a socket 32 and a plug 31; the plug 31 is a conductive contact protruding from the side edge of the submodule frame 20, and the material of the plug 31 is a conductive material; the socket 32 is a slot recessed into the side edge of the submodule frame 20; a spring pin contact is provided inside the socket 32, and a metal layer is provided on the surface of the spring pin contact.
[0135] Step S104: A chip groove is provided in the sub-module frame 20; and an RFID chip is fixed in the chip groove.
[0136] Step S105: Connect the micro optimizer 40 to one side of the battery packaging unit 10 to form a photovoltaic sub-module 100;
[0137] Step S106: Distribute multiple photovoltaic sub-modules 100 in an array so that adjacent photovoltaic sub-modules 100 are electrically and mechanically connected through standardized plug-in interfaces 30.
[0138] In practice, multiple photovoltaic sub-modules 100 are arrayed on an aluminum alloy bracket. The sockets 32 and plugs 31 of adjacent photovoltaic sub-modules 100 are electrically connected by contacting the spring pin contacts through conductive contacts. The sockets 32 and plugs 31 form a set of plug-in connection structures to achieve mechanical connection.
[0139] Step S107: Silicone is injected into the gap between adjacent photovoltaic sub-modules 100, and after curing, a seamless silicone light-transmitting layer is formed.
[0140] In practice, the gap width is 1mm to 2mm; the light transmittance of the silicone light-transmitting layer is greater than 95%. The silicone can be Dow Corning SE9187, and the refractive index of the silicone light-transmitting layer is 1.5.
[0141] Specifically, the order of steps S102, S103, and S104 can be set according to actual conditions and is not limited to the current order. In one example, a standardized plug-in interface 30 and a chip recess can be formed on the submodule frame 20 first through steps S103 and S104, and then the battery packaging unit 10 can be set on the submodule frame 20 through step S102, so that the standardized plug-in interface 30 is connected to the photovoltaic cell through the interconnection circuit.
[0142] In Example 1, the submodule's battery layer is a perovskite battery layer. The fabrication and testing methods for modular photovoltaic modules include:
[0143] (1) Fabrication of photovoltaic submodule 100: First, a submodule battery layer with a size of 10cm×10cm containing 2 perovskite cells (1.2V / cell) is provided; then, a battery encapsulation unit 10 with a size of 10cm×10cm is formed. The structure of the battery encapsulation unit 10 is a 3.2mm glass upper layer + 0.5mm POE film + perovskite layer + 0.5mm POE film + 2mm composite backplane lower layer; next, the battery encapsulation unit 10 is set on the submodule frame 20. The submodule frame 20 is provided with interconnection circuits for connecting with photovoltaic cells; finally, a standardized plug-in interface 30, a micro optimizer 40 and an RFID chip are installed.
[0144] (2) Component assembly: 100 photovoltaic sub-modules (10×10 array) are arranged on an aluminum alloy bracket and connected by plug-in interface; transparent silicone (Dow Corning SE9187) with a refractive index of 1.5 is injected into the gap between the modules, and after curing, a seamless light-transmitting layer is formed.
[0145] (3) Performance test: ① Partial replacement test: One sub-module was damaged by human error, and the replacement took 8 minutes. The system power was restored to 99.8%; ② Outdoor durability: After 200 thermal cycles (-40℃~85℃), the change in plug-in interface resistance was <1.5%.
[0146] like Figure 5 As shown, this embodiment also provides a method for the operation and maintenance replacement of modular photovoltaic modules. This includes:
[0147] Step S11: Use a handheld terminal to scan and locate the faulty photovoltaic submodule.
[0148] Step S12: Unlock the latch of the standardized plug-in interface and remove the faulty photovoltaic sub-module.
[0149] Step S13: Insert the new photovoltaic sub-module.
[0150] Step S14: The modular photovoltaic modules perform a system self-test.
[0151] In the description of this specification, the terms "this embodiment," "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, those skilled in the art can combine and integrate the different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of the present invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0152] The above description does not provide detailed explanations of the technical aspects of each layer's patterning, etching, etc. However, those skilled in the art should understand that various technical means can be used to form layers and regions of the desired shape. Furthermore, to form the same structure, those skilled in the art can also design methods that are not entirely identical to those described above. Additionally, although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination.
[0153] The above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described above, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention. The protection scope of the present invention is determined by the scope of the appended claims.
Claims
1. A modular photovoltaic module, characterized in that, The modular photovoltaic module includes multiple photovoltaic sub-modules distributed in an array; Each of the photovoltaic sub-modules includes: A battery packaging unit; the battery packaging unit includes several photovoltaic cells that are fully packaged and interconnected; The submodule framework is used to house the battery packaging unit and is equipped with interconnect circuits for connecting to the photovoltaic cell; the submodule framework includes several standardized plug-in interfaces for connecting the interconnect circuits; adjacent photovoltaic submodules are electrically and mechanically connected through the standardized plug-in interfaces. A micro optimizer is located on one side of the battery packaging unit; the micro optimizer is connected to the photovoltaic cell via interconnection circuitry, and the micro optimizer is adapted to control several photovoltaic cells in the battery packaging unit.
2. The modular photovoltaic module according to claim 1, characterized in that, The sub-module frame is provided with chip recesses; The photovoltaic submodule also includes an RFID chip located within the chip recess.
3. The modular photovoltaic module according to claim 1, characterized in that, The standardized plug-in interface includes a socket and a plug; The plug is a conductive contact that protrudes from the side edge of the submodule frame, and the plug is made of a conductive material; The insertion hole is a slot recessed into the side edge of the sub-module frame; a spring pin contact is provided inside the insertion hole, and a metal layer is provided on the surface of the spring pin contact; The socket and the plug are electrically connected through the conductive contact contacting the spring pin contact; The plug of the photovoltaic submodule is connected to the socket of the adjacent photovoltaic submodule by a plug-in connection, forming a set of plug-in connection structures; the two adjacent photovoltaic submodules are electrically and mechanically connected through at least one set of plug-in connection structures.
4. The modular photovoltaic module according to claim 3, characterized in that, The plug surface is provided with a first magnetic component, and the socket is provided with a second magnetic component; The socket and the plug are adapted to achieve magnetic alignment and fixation via the first magnetic component and the second magnetic component.
5. The modular photovoltaic module according to claim 1, characterized in that, The top view of the battery packaging unit is rectangular; The rectangle has a length of 5cm to 20cm and a width of 5cm to 20cm; The battery packaging unit includes: The structure comprises a stacked cover plate layer, a first encapsulating adhesive layer, a sub-module battery layer, a second encapsulating adhesive layer, and a backsheet layer; the sub-module battery layer includes photovoltaic cells. The standardized plug-in interface is located on the side of the submodule frame and is connected to the photovoltaic cells in the submodule battery layer via the interconnect circuit.
6. The modular photovoltaic module according to claim 5, characterized in that, The micro optimizer and the standardized plug-in interface are located on different sides of the battery packaging unit, respectively. Alternatively: the standardized plug-in interfaces are located on the four sides of the submodule frame; the micro optimizer is located on the side of the battery packaging unit near the backplane layer.
7. The modular photovoltaic module according to claim 6, characterized in that, The photovoltaic cells in the submodule battery layer are perovskite cells, crystalline silicon cells, or perovskite-crystalline silicon tandem cells. The crystalline silicon cells include TOPCon crystalline silicon cells, PERC crystalline silicon cells, HJT crystalline silicon cells, or IBC crystalline silicon cells; The perovskite-crystalline silicon tandem solar cell includes perovskite-TOPCon crystalline silicon cell, perovskite-PERC crystalline silicon cell, perovskite-HJT crystalline silicon cell, or perovskite-IBC crystalline silicon cell. Each of the photovoltaic submodules includes 1 to 4 photovoltaic cells.
8. The modular photovoltaic module according to claim 7, characterized in that, The photovoltaic cells in the submodule battery layer are perovskite-TOPCon crystalline silicon tandem cells; The submodule battery layer includes a stacked perovskite battery layer and a TOPCon crystalline silicon battery layer; wherein the perovskite battery layer is closer to the cover plate layer, and the TOPCon crystalline silicon battery layer is closer to the backplate layer; a third encapsulating adhesive layer is also included between the perovskite battery layer and the TOPCon crystalline silicon battery layer. The standardized plug-in interface connects both the perovskite solar cell layer and the TOPCon crystalline silicon solar cell layer through the interconnection circuit. Each of the photovoltaic sub-modules includes one perovskite-TOPCon crystalline silicon tandem solar cell; The rectangle is 15cm long and 15cm wide.
9. The modular photovoltaic module according to claim 7, characterized in that, The photovoltaic cells in the submodule battery layer are perovskite cells; the submodule battery layer is a perovskite cell layer. Each of the photovoltaic sub-modules includes two perovskite solar cells; The standardized plug-in interface is connected to the perovskite solar cell layer via the interconnect circuit. The rectangle is 10cm long and 10cm wide; The thickness of the cover plate layer is 3.2 mm; the thickness of the first encapsulating adhesive layer is 0.5 mm; The thickness of the second encapsulating adhesive layer is 0.5 mm; the thickness of the backing layer is 2 mm; The modular photovoltaic module comprises 100 photovoltaic sub-modules arranged in a 10×10 array.
10. The modular photovoltaic module according to claim 3, characterized in that, The protrusion of the plug beyond the side edge of the submodule frame is larger than the recess of the socket within the side edge of the submodule frame; When the plugs and sockets of adjacent photovoltaic sub-modules are in maximum complete contact, a gap is formed between the frames of adjacent sub-modules; The modular photovoltaic module also includes: A silicone light-transmitting layer fills the gaps between adjacent photovoltaic sub-modules; The width of the gap is 1mm to 2mm; the light transmittance of the silicone light-transmitting layer is greater than 95%.