Intelligent voice box

Abstract

The utility model relates to the technical field of intelligent voice box electromagnetic shielding, and provides an intelligent voice box which comprises a box body and a power module, a signal module and a power amplifier module which are arranged in the box body, a cover plate capable of sealing the upper end of the box body is arranged on the box body, and the power amplifier module and the signal module are electrically connected through a signal line. A metal partition plate is arranged between the signal module and the power amplifier module, the power supply module and the power amplifier module are electrically connected through a first conductor wire, and the signal module and the power supply module are electrically connected through a second conductor wire; and the signal line and the first conductive line respectively penetrate through the metal partition plate. In the technical scheme provided by the invention, the metal partition plate is arranged between the signal module and the power amplifier module, and the metal partition plate can partition the magnetic field generated by the power amplifier module, thereby reducing signal interference to the signal module, improving the stability of the output audio signal, and reducing sound distortion.

Description

Technical Field

[0001] This application relates to the field of electromagnetic shielding technology for smart voice boxes, and more specifically, to a smart voice box. Background Technology

[0002] The content in this section provides only background information related to this application and may not constitute prior art.

[0003] A smart voice box is a device that can output sound based on feedback information. It can work in various ways. Generally, it can receive voice information through a wireless module and then play it out through a power amplifier module; it can also support direct playback of recorded sound; and it can also have a built-in language processing model to automatically generate and play voice information.

[0004] Structurally, a smart voice box typically comprises three core modules: a power module, a power amplifier module, and a signal module. The power module provides power to both the power amplifier and signal modules; the power amplifier module's primary function is to emit sound; and the signal module generates signals to control the power amplifier module's operation.

[0005] Specifically, the power amplifier module mainly consists of a power supply, a controller, and a speaker. The speaker comprises a coil and a sounder. The power controller adjusts the magnitude and direction of the current in the coil, causing the coil to generate a changing magnetic force when energized. As the magnitude and direction of the current change, the strength and direction of the coil's magnetic field also change accordingly, thereby driving the sounder to vibrate and produce sound. The audio signal generated by the signal module is input to the power controller, which modulates the current parameters to the required specifications.

[0006] In actual operation, a large current needs to flow through the coil to produce a sufficiently loud sound from the power amplifier module. However, as the coil current increases, magnetic field leakage intensifies. Since the signal module transmits only weak current signals, this magnetic field interference causes distortion in the audio signal output by the signal module. Simultaneously, a stable voltage source is required to amplify the audio signal properly. When the power amplifier module produces high-decibel sound, it generates significant mechanical vibrations. These vibrations cause deformation in the circuit structure connecting the power supply module and the power amplifier module, leading to fluctuations in the resistance of the connection. Consequently, the power supply voltage to the power amplifier module fluctuates, resulting in distortion of the amplified audio signal due to these voltage fluctuations.

[0007] Therefore, in practical applications, the greater the volume of the loudspeaker, the more obvious the sound distortion becomes. Utility Model Content

[0008] In view of this, the purpose of this application is to provide an intelligent voice box that can solve the technical problems raised in the background art.

[0009] The objective of this application is achieved through the following technical solution:

[0010] A smart voice box includes a box body and a power module, a signal module, and a power amplifier module disposed within the box body. A cover plate is provided on the box body to close the top of the box body. The power amplifier module and the signal module are electrically connected via signal lines. A metal partition plate is provided between the signal module and the power amplifier module. The power module and the power amplifier module are electrically connected via a first conductive line, and the signal module and the power module are electrically connected via a second conductive line. The signal line and the first conductive line respectively pass through the metal partition plate.

[0011] The power module provides power to the power amplifier module and the signal module. The signal module generates audio signals, and the power amplifier module amplifies the audio signals and converts them into sound.

[0012] The power amplifier module includes a signal amplification unit, which includes a voltage regulator circuit and a signal amplification circuit. The input terminal of the voltage regulator circuit is connected to the first conductive line, and the output terminal is connected to the signal amplification circuit.

[0013] The voltage regulator circuit includes a P-MOSFET, a voltage comparator, a comparison voltage source, a first resistor, and a second resistor. The source of the P-MOSFET is connected to the first conductive line, the drain is connected to the signal amplification circuit through the first resistor, and the gate is connected to the output of the voltage comparator. The positive input of the voltage comparator is connected between the first and second resistors, and the negative input is connected to the stable output of the comparison voltage source.

[0014] In the technical solution provided in this application, a metal partition plate is provided between the signal module and the power amplifier module. This metal partition plate can isolate the magnetic field generated by the power amplifier module, reducing signal interference to the signal module, increasing the stability of the output audio signal, and reducing sound distortion. Simultaneously, the connection directions of the first conductive line and the second conductive line are perpendicular to each other, and the side where the high-voltage port is located is perpendicular to the side where the high-voltage port is located. This allows the power module, signal module, and power amplifier module to be arranged closely while avoiding the parallel arrangement of the first conductive line and the second conductive line, ensuring a stable supply current to the signal module, reducing the impact of the strong current in the first conductive line on the signal module, and further increasing the stability of the audio signal. Furthermore, a voltage regulator circuit is introduced into the power amplifier module, using a P-MOSFET transistor to achieve intelligent voltage equalization adjustment. When the voltage input to the signal amplification circuit increases, the conduction of the P-MOSFET transistor decreases, reducing the drain output voltage; when the voltage input to the signal circuit decreases, the conduction of the P-MOSFET transistor increases, increasing the drain output voltage. Therefore, the voltage regulator circuit can intelligently and dynamically adjust the voltage to provide a stable operating voltage to the signal amplifier circuit, thereby avoiding signal distortion caused by unstable power supply voltage during audio amplification.

[0015] Furthermore, the power module is located on one side of the signal module, the power amplifier module is located on the other side of the connection between the power module and the signal module, and the metal partition plate is connected to one side of the power module; the connection direction of the first conductive line is perpendicular to the connection direction of the second conductive line; the first conductive line is connected to the high voltage port of the power module, and the second conductive line is connected to the low voltage port of the power module; the side where the high voltage port is located is perpendicular to the side where the high voltage port is located.

[0016] Furthermore, the signal line includes a first contact, a second contact, and a ribbon cable; the first and second contacts are connected to the first and second contacts respectively; the first contact is connected to the signal module, the second contact is connected to the power amplifier module, and a through slot is provided on the metal partition plate for the ribbon cable to pass through.

[0017] In the technical solution provided in this application, the signal line passes through the metal partition plate, which can separate the signal module and the power amplifier module as much as possible and reduce electromagnetic leakage.

[0018] Furthermore, the metal partition plate includes an upper fixing part and a lower fixing part. The upper fixing part is connected to the cover plate, and the lower fixing part is connected to the box body. Corresponding slots are provided on both the upper fixing part and the lower fixing part. When the cover plate is installed in place, the slots on the upper fixing part and the lower fixing part are aligned to form a through slot for the signal line to pass through.

[0019] In the technical solution provided in this application, the through slot is formed by splicing together the upper and lower fixing parts. Therefore, when installing the signal line, the signal line can be connected to the power amplifier module and the signal module first, and then the signal line can be placed into the lower slot before the cover plate is installed to close it, which reduces the assembly difficulty.

[0020] Furthermore, a guide block is provided on the cover plate, and a guide groove that matches the guide block is provided on the box body. When the cover plate is fastened to the box body, the guide block and the guide groove cooperate to align the upper and lower fixed parts.

[0021] Furthermore, the power amplifier module also includes a sound release unit. The power supply module is connected to the power amplifier module through the first conductive line to provide voltage to the signal amplification unit. The signal module is connected to the signal amplification unit through the signal line to provide audio signals. The output terminal of the signal amplification unit is connected to the sound release unit.

[0022] Furthermore, the signal amplification circuit includes: an NPN transistor, a third resistor, and a fourth resistor; the collector of the NPN transistor is connected to the fourth resistor and the sound release unit, the emitter is grounded, and the base is connected to the third resistor and the signal line; the fourth resistor is connected to the drain of the P-MOSFET.

[0023] Furthermore, one end of the third resistor is connected to the drain of the P-MOSFET and the other end is connected to the collector of the NPN transistor; one end of the fourth resistor is connected to the drain of the P-MOSFET and the other end is connected to the base of the NPN transistor; the sound release unit and the third resistor are both connected to the collector of the NPN transistor, and the signal line is connected to the base of the NPN transistor.

[0024] Furthermore, the output terminal of the signal amplification circuit is connected to the sound release unit, the control terminal of the signal amplification circuit is connected to the signal line, the resistance value of the first resistor is 62kΩ, the resistance value of the second resistor is 10kΩ, the output of the comparison voltage source is 3.3V, and the rated operating voltage of the signal amplification circuit is 24V.

[0025] After adopting the above technical solution, this utility model has the following beneficial effects:

[0026] The power supply module, signal module, and power amplifier module are designed as separate units, connected by wires to effectively separate the high-voltage and low-voltage components, reducing audio signal distortion caused by high-voltage interference. Simultaneously, to mitigate voltage instability caused by the wire connections, a voltage regulator circuit stabilizes the voltage input to the signal amplification unit, ensuring that the signal amplification unit can amplify the audio signal by the same factor, thereby improving the final sound quality of the power amplifier module's output. Attached Figure Description

[0027] Figure 1This is a schematic diagram of the structure of the smart voice box in Example 1.

[0028] Figure 2 This is a top view of the smart voice box in Example 1 after the cover has been removed.

[0029] Figure 3 This is a perspective view of the smart voice box in Example 1 after the cover plate has been removed.

[0030] Figure 4 This is an exploded view of the smart voice box in Example 1.

[0031] Figure 5 This is a schematic diagram of the structure near the groove in the metal partition plate.

[0032] Figure 6 This is a block diagram of the circuit structure of the smart voice box in Example 2.

[0033] Figure 7 This is a schematic diagram of the internal structure of the power amplifier module in Example 2.

[0034] Figure 8 A schematic diagram of the circuit structure in Example 2.

[0035] In the diagram: 101, housing; 1011, guide groove; 102, cover plate; 1021, guide block; 103, metal partition plate; 103a, slot; 1031, upper fixing part; 1032, lower fixing part; 2, power module; 21, first conductive wire; 22, second conductive wire; 3, signal module; 31, signal line; 4, power amplifier module; 1a, P-MOSFET transistor; 2a, voltage comparator; 3a, comparison voltage source; 4a, first resistor; 5a, second resistor; 1b, NPN transistor; 2b, third resistor; 3b, fourth resistor; Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments. The same reference numerals in the accompanying drawings represent the same components. It should be noted that the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the described embodiments of this application without creative effort are within the scope of protection of this application.

[0037] Example 1:

[0038] This application provides a smart voice box that can amplify pre-recorded voice signals or voice signals transmitted via a wireless network to play high-decibel, high-definition sound. To avoid the influence of the speaker's internal coil on the voice signal, the following technical solution is provided:

[0039] refer to Figure 1 and Figure 2 The smart voice box includes a housing 101, a cover 102, a power module 2, a signal module 3, and a power amplifier module 4. The housing 101 is made of high-strength engineering plastic and is rectangular in shape. The power module 2, signal module 3, and power amplifier module 4 are installed inside the housing 101. The power amplifier module 4 and signal module 3 are electrically connected via a signal cable 31. A metal partition 103 is provided between the signal module 3 and the power amplifier module 4, and the signal cable 31 passes through the metal partition 103. The signal cable 31 is used to transmit audio signals, which are low-voltage signals. The power amplifier module 4 amplifies the audio signals and converts them into high-decibel, high-definition sound. The cover 102 covers the top of the housing 101 and is used to enclose the walls of the housing 101. The cover 102 is made of aluminum alloy and is tightly connected to the housing 101 by screws at its four corners, ensuring that the interior of the housing 101 forms a closed space.

[0040] The power module 2 is located on one side of the signal module 3, the power amplifier module 4 is located on the other side of the connection between the power module 2 and the signal module 3, and the metal partition plate 103 is connected to one side of the power module 2.

[0041] Specifically: Power module 2 is located to the right of signal module 3, and power amplifier module 4 is located behind the connection between power module 2 and signal module 3. The lower ends of power module 2, signal module 3, and power amplifier module 4 are all fixed to the bottom plate of housing 101, and they are roughly at the same height. This layout maximizes the distance between the three modules and reduces mutual interference.

[0042] The power supply module 2 and the power amplifier module 4 are connected by a first conductive wire 21, which has a cross-sectional area of ​​2.5 mm². 2 The multi-strand copper core wire. The first conductive wire 21 is led out from the high-voltage port of the power module 2, passes through another through slot on the metal partition plate 103, and then connects to the power amplifier module 4.

[0043] Signal module 3 and power module 2 are connected via a second conductive wire 22, which has a cross-sectional area of ​​0.75 mm². 2 The shielded wire is led out from the low-voltage port of the power module 2 and connected horizontally to the power input interface of the signal module 3. The connection directions of the first conductive wire 21 and the second conductive wire 22 are perpendicular to each other, and the high-voltage port and the low-voltage port are located on two sides of the power module 2, respectively, which further reduces the interference of high-voltage signals to low-voltage signals.

[0044] Furthermore, signal line 31 adopts a flat ribbon cable design, with gold-plated first and second contacts crimped to both ends. The ribbon cable is 6mm wide and 0.5mm thick. The ribbon cable extends from the output interface of signal module 3, passes through the slot 103a on the metal partition plate 103, and connects to the input interface of power amplifier module 4. To further reduce electromagnetic interference, the ribbon cable is wrapped with an aluminum foil shielding layer, with both ends of the shielding layer grounded to the metal partition plate 103 and the metal casing of signal module 3, respectively.

[0045] The metal partition 103 is made of cold-rolled steel plate with a thickness of 1.5mm. The metal partition 103 is fixedly connected to the bottom of the housing 101. The metal partition 103 is located between the signal module 3 and the power amplifier module 4, extending from between the signal module 3 and the power amplifier module 4 to one side of the power supply module 2. The signal module 3 and the power supply module 2 are located on the same side of the metal partition 103, and the power amplifier module 4 is located on the opposite side of the signal module 3.

[0046] refer to Figure 3 , Figure 4 as well as Figure 5 The metal partition plate 103 includes an upper fixing part 1031 and a lower fixing part 1032. The upper fixing part 1031 is connected to the cover plate 102, and the lower fixing part 1032 is connected to the box body 101. The upper fixing part 1031 of the metal partition plate 103 is fixedly connected to the cover plate 102, and the lower fixing part 1032 is fixedly connected to the bottom of the box body 101 by welding. Both the upper fixing part 1031 and the lower fixing part 1032 are provided with slots 103a. When the cover plate 102 is installed in place, these slots 103a are aligned to form a through slot for the signal line 31 to pass through.

[0047] refer to Figure 4 Furthermore, a guide block 1021 is provided on the cover plate 102, and a guide groove 1011 is provided on the box body 101. When the cover plate 102 covers the box body 101, the guide block 1021 and the guide groove 1011 cooperate to ensure that the upper fixing part 1031 and the lower fixing part 1032 are stably aligned, thus preventing the upper fixing part 1031 from damaging the signal line 31.

[0048] Example 2:

[0049] refer to Figure 6Embodiment 2 provides a specific circuit design for the intelligent voice box based on Embodiment 1. Since the intelligent voice box needs to play high-decibel, high-definition sound, a higher operating voltage is required for the power amplifier module 4. However, when the power amplifier module 4 receives a high voltage through the first conductive line 21, the voltage stability is affected by the resistance of the first conductive line 21. The resistance of the first conductive line 21 changes over time, especially under sound wave vibration, causing resonance at its contact points, leading to changes in contact point resistance, and consequently, unstable input voltage to the power amplifier module 4. This unstable input voltage affects the stability of audio signal amplification. Therefore, this application addresses this problem through Embodiment 2.

[0050] The power amplifier module 4 includes a signal amplification unit and a sound release unit; the sound release unit is a speaker that can generate corresponding sound after receiving a power amplifier signal. The first conductive line 21 is connected to the signal amplification unit to provide voltage; the signal line 31 is connected to the signal amplification unit; the output terminal of the signal amplification unit is connected to the sound release unit.

[0051] The first conductive line 21 is the power supply line from the power module 2 to the power amplifier module 4. The power module 2 can provide a 24V operating voltage. The audio signal received or generated by the signal module 3 is transmitted to the signal amplification unit through the signal line 31. The signal amplification unit amplifies the audio signal to obtain the power amplifier signal, which is then sent to the sound release unit to emit sound.

[0052] refer to Figure 7 The signal amplification unit includes a voltage regulator circuit and a signal amplification circuit. Because the power supply module 2 is connected to the power amplifier module 4 through the first conductive line 21, the resistance of the first conductive line 21 will change due to aging, vibration and other factors during operation, so the voltage provided by the first conductive line 21 is not stable.

[0053] To address this, this application provides a voltage regulator circuit to stabilize the voltage delivered by the first conductive line 21. The voltage regulator circuit is a component of the signal amplification unit, and its input is the DC voltage output from the first conductive line 21; in this application, the voltage output from the first conductive line 21 is 24V. The output of the voltage regulator circuit serves as the input to the signal amplification circuit for amplifying audio signals.

[0054] refer to Figure 8Specifically, the voltage regulator circuit includes: a P-MOSFET 1a, a voltage comparator 2a, a comparison voltage source 3a, a first resistor 4a, and a second resistor 5a. The core component of the voltage regulator circuit is the P-MOSFET. The source (S) of the P-MOSFET is connected to the high-voltage output terminal of the power module 2 via the first conductive line 21. The source of the P-MOSFET is used to receive the high voltage output by the power module 2. The drain (D) of the P-MOSFET is connected to the power input terminal of the signal amplification circuit, and the gate (G) of the P-MOSFET is connected to the output terminal of the voltage comparator 2a.

[0055] The positive input of voltage comparator 2a is connected to the drain (D) of P-MOSFET 1a, and also to the voltage divider point between the first resistor 4a and the second resistor 5a. The inverting input of voltage comparator 2a is connected to a 3.3V comparison voltage source 3a. This comparison voltage source 3a is provided by a TL431 precision reference source and is capable of generating a stable 3.3V reference voltage.

[0056] When the connection point of the first conductive wire 21 becomes loose or corroded, the conductive area of ​​the connection point of the first conductive wire 21 decreases, the resistance of the first conductive wire 21 increases, and the first conductive wire 21 and the voltage regulator circuit are connected in series. The increased resistance of the first conductive wire 21, due to the voltage division effect of the series connection, increases the voltage that the first conductive wire 21 can receive, and consequently, the voltage input from the first conductive wire 21 to the voltage regulator circuit decreases.

[0057] When the first conductive wire 21 is adjusted from a loose state to a better connection state due to vibration, the conductive area of ​​the connection point of the first conductive wire 21 increases, the resistance of the first conductive wire 21 decreases, the voltage that the first conductive wire 21 can receive decreases, and thus the voltage input to the voltage regulator circuit by the first conductive wire 21 increases.

[0058] When the input voltage of the first conductive line 21 increases, the source input voltage of the P-MOSFET 1a increases, the corresponding drain output voltage of the P-MOSFET 1a increases, and the voltage at the voltage divider point between the first resistor 4a and the second resistor 5a increases.

[0059] When the input voltage of the first conductive line 21 decreases, the drain output voltage of the P-MOSFET 1a decreases, and the voltage at the voltage divider point between the first resistor 4a and the second resistor 5a decreases.

[0060] When the voltage at the voltage divider point between the first resistor 4a and the second resistor 5a increases, the voltage comparator 2a outputs a high level, which increases the gate voltage of the P-MOSFET 1a, weakens its conduction, and thus reduces the drain output voltage.

[0061] Conversely, when the voltage between the first resistor 4a and the second resistor 5a decreases, the output of voltage comparator 2a decreases, increasing the conduction level of P-MOSFET 1a and raising the drain output voltage. Through this negative feedback mechanism, the voltage regulator circuit can stabilize the output voltage at 24V.

[0062] Specifically: In order for the voltage regulator circuit to output a stable 24V voltage, the specific implementation method of this application is as follows: the resistance value of the first resistor 4a is 62kΩ, the resistance value of the second resistor 5a is 10kΩ, the stable voltage output by the comparison voltage source 3a is 3.3V, and the first conductive line 21 outputs a 24V voltage. At this time, the drain of the P-MOSFET 1a can automatically balance the voltage magnitude and output a stable 24V voltage.

[0063] The principle of the circuit is as follows:

[0064] The drain of P-MOSFET 1a outputs a voltage of 24V. A voltage of 24V is also applied across the terminals of the first resistor 4a and the second resistor 5a. The resistance of the first resistor 4a is 62kΩ, and the resistance of the second resistor 5a is 10kΩ. According to the principle of series voltage division, the voltage at the voltage divider point between the first resistor 4a and the second resistor 5a is approximately 24 × 10 / (10 + 62) ≈ 3.3V.

[0065] Therefore, with 3.3V input to both the positive and negative input terminals of voltage comparator 2a, the output of voltage comparator 2a is a constant value α. At this time, the P-MOSFET will not amplify or reduce the voltage to the drain voltage. Therefore, the output voltage of the P-MOSFET is stable at 24V.

[0066] When the voltage output by the first conductive line 21 is higher than 24V, the voltage output by the drain of the P-MOSFET will also exceed 24V. At this time, the voltage divided at the voltage divider point between the first resistor 4a and the second resistor 5a will also be greater than 3.3V. Consequently, the positive input terminal of the voltage comparator 2a is greater than the negative input terminal, and the voltage comparator 2a outputs a high level, which increases the gate voltage of the P-MOSFET 1a and weakens its conduction, thereby reducing the drain output voltage. As a result, the drain voltage of the P-MOSFET will drop to 24V.

[0067] Conversely, when the voltage output of the first conductive line 21 is lower than 24V, the voltage output of the drain of the P-MOSFET will be lower than 24V. At this time, the voltage divided at the voltage divider point between the first resistor 4a and the second resistor 5a is less than 3.3V. Consequently, the positive input terminal of the voltage comparator 2a is lower than the negative input terminal, and the voltage comparator 2a outputs a low level, causing the gate voltage of the P-MOSFET 1a to decrease and the conduction degree to increase, thereby increasing the drain output voltage. As a result, the drain voltage of the P-MOSFET will increase to 24V.

[0068] Therefore, the voltage regulator circuit in this application can stabilize the voltage output from the drain of the P-MOSFET at 24V.

[0069] The voltage regulator circuit can stabilize the voltage output from the first conductive line 21 at 24V. The voltage regulator circuit is actually the power supply for the signal amplifier circuit.

[0070] The signal amplification circuit includes: an NPN transistor 1b, a third resistor 2b, and a fourth resistor 3b. The collector (C) of the NPN transistor 1b is connected to the third resistor 2b and the sound release unit, the emitter (E) of the NPN transistor 1b is grounded, and the base (B) of the NPN transistor 1b is connected to the fourth resistor 2b and signal line 31; the fourth resistor 3b is connected to the drain of the P-MOSFET 1a (the output of the voltage regulator circuit). The 24V voltage output from the voltage regulator circuit is input to the fourth resistor 3b and the third resistor 2b.

[0071] Specifically: one end of the third resistor 2b is connected to the drain of the P-MOSFET 1a, and the other end is connected to the collector of the NPN transistor 1b. One end of the fourth resistor 3b is connected to the drain of the P-MOSFET 1a, and the other end is connected to the base of the NPN transistor 1b. One end of both the third resistor 2b and the fourth resistor 3b is connected to the drain of the P-MOSFET 1a. The sound release unit and the third resistor 2b are both connected to the collector of the NPN transistor 1b, and the signal line 31 is connected to the base of the NPN transistor 1b.

[0072] Among them, signal line 31 is used to output audio signal i(t). The audio signal i(t) is a small current signal. If it is sent to the sound release unit, the sound produced is very small, so it needs to be amplified by NPN transistor 1b.

[0073] The principle is as follows: When the audio signal i(t) is input to the base of the NPN transistor 1b, the collector current of the NPN transistor 1b is β times the audio signal i(t). Therefore, the formula for calculating the collector output voltage U of the NPN transistor 1b is as follows: U(t) = i(t)βR3, where R3 represents the resistance value of the third resistor 2b. In this way, the NPN transistor 1b can amplify the small audio signal i(t) by a factor of βR3.

[0074] For NPN transistor 1b to amplify, its base needs to be conducting. This requires a sufficient voltage input to the base. However, the audio signal i(t) is weak and cannot provide enough voltage to turn on the base. Therefore, this solution uses the voltage divider effect of the third resistor 2b and the fourth resistor 3b. The node where the fourth resistor 3b is connected to the base of NPN transistor 1b can stably provide a high voltage. The magnitude of this high voltage depends on the ratio of the resistance values ​​of the third resistor 2b and the fourth resistor 3b. Thus, by controlling the resistance ratio of the third resistor 2b and the fourth resistor 3b, the base of NPN transistor 1b can be kept in a conducting state at all times.

[0075] The principle of this application is as follows: When the power amplifier module 4 needs to output a high-decibel, high-definition audio signal: the power supply module 2 provides 24V power to the power amplifier module 4 through the first conductive line 21, and provides power to the signal module 3 through the second conductive line 22. The signal module 3 generates the original audio signal i(t), and the audio signal i(t) is input to the power amplifier module 4 through the signal line 31.

[0076] In power amplifier module 4: the signal amplification unit receives the 24V power supply provided by the first conductive line 21 and the audio signal i(t) provided by the signal line 31. The 24V power supply provided by the first conductive line 21 is input to the voltage regulator circuit, and after being regulated by the voltage regulator circuit, a stable 24V is output to the signal amplification circuit. The audio signal i(t) is input to the signal amplification circuit, which amplifies the audio signal i(t) by a factor of βR3, and then sends it to the sound release unit.

[0077] Thus, the circuit design provided in this application can stably amplify the audio signal i(t) by βR3 times without distortion due to voltage instability during the amplification process. Simultaneously, when the audio signal i(t) is generated internally by the signal module, it is not affected by the power amplifier module. When the audio signal is transmitted to the power amplifier module, the signal line 31 and the first conductive line 21 use different paths, reducing crosstalk between lines. The original audio signal i(t) has high stability and is less prone to distortion after amplification by βR3 times.

[0078] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A smart voice box, comprising a box body and a power module, a signal module, and a power amplifier module disposed within the box body, wherein a cover plate capable of sealing the upper end of the box body is provided on the box body, the power amplifier module and the signal module are electrically connected via signal lines, a metal partition plate is provided between the signal module and the power amplifier module, the power module and the power amplifier module are electrically connected via a first conductive line, and the signal module and the power module are electrically connected via a second conductive line; the signal line and the first conductive line respectively pass through the metal partition plate; The power module provides power to the power amplifier module and the signal module. The signal module generates audio signals, and the power amplifier module amplifies the audio signals and converts them into sound. Its features are: The power amplifier module includes a signal amplification unit, which includes a voltage regulator circuit and a signal amplification circuit. The input terminal of the voltage regulator circuit is connected to the first conductive line, and the output terminal is connected to the signal amplification circuit. The voltage regulator circuit includes a P-MOSFET, a voltage comparator, a comparison voltage source, a first resistor, and a second resistor. The source of the P-MOSFET is connected to the first conductive line, the drain is connected to the signal amplification circuit through the first resistor, and the gate is connected to the output of the voltage comparator. The positive input of the voltage comparator is connected between the first and second resistors, and the negative input is connected to the stable output of the comparison voltage source.

2. The intelligent voice box according to claim 1, characterized in that: The power module is located on one side of the signal module, and the power amplifier module is located on the other side of the connection between the power module and the signal module. A metal partition plate is connected to one side of the power module. The connection direction of the first conductive wire is perpendicular to the connection direction of the second conductive wire. The first conductive wire is connected to the high voltage port of the power module, and the second conductive wire is connected to the low voltage port of the power module. The side of the high voltage port is perpendicular to the side of the high voltage port.

3. The intelligent voice box according to claim 1, characterized in that: The signal line includes a first contact, a second contact, and a ribbon cable; the first and second contacts are connected to the first and second contacts respectively; the first contact is connected to the signal module, and the second contact is connected to the power amplifier module; a through slot is provided on the metal partition plate for the ribbon cable to pass through.

4. The intelligent voice box according to claim 3, characterized in that: The metal partition plate includes an upper fixing part and a lower fixing part. The upper fixing part is connected to the cover plate, and the lower fixing part is connected to the box body. Corresponding slots are opened on both the upper fixing part and the lower fixing part. When the cover plate is installed in place, the slots opened on the upper fixing part and the lower fixing part are aligned to form a through slot for signal lines to pass through.

5. The intelligent voice box according to claim 4, characterized in that: A guide block is provided on the cover plate, and a guide groove that matches the guide block is provided on the box body. When the cover plate is fastened to the box body, the guide block and the guide groove cooperate to align the upper and lower fixed parts.

6. The intelligent voice box according to any one of claims 1 to 5, characterized in that: The power amplifier module also includes a sound release unit. The power supply module is connected to the power amplifier module via a first conductive line, and the signal module is connected to the signal amplification unit via a signal line to provide audio signals. The output of the signal amplification unit is connected to the sound release unit.

7. The intelligent voice box according to claim 6, characterized in that: The signal amplification circuit includes an NPN transistor, a third resistor, and a fourth resistor; the collector of the NPN transistor is connected to the fourth resistor and the sound release unit, the emitter is grounded, and the base is connected to the third resistor and the signal line; the fourth resistor is connected to the drain of the P-MOSFET.

8. The intelligent voice box according to claim 7, characterized in that: One end of the third resistor is connected to the drain of the P-MOSFET and the other end is connected to the collector of the NPN transistor; one end of the fourth resistor is connected to the drain of the P-MOSFET and the other end is connected to the base of the NPN transistor. The sound release unit and the third resistor are both connected to the collector of the NPN transistor, and the signal line is connected to the base of the NPN transistor.

9. The intelligent voice box according to claim 7, characterized in that: The output of the signal amplifier circuit is connected to the sound release unit, the control terminal of the signal amplifier circuit is connected to the signal line, the resistance of the first resistor is 62kΩ, the resistance of the second resistor is 10kΩ, the output of the comparison voltage source is 3.3V, and the rated operating voltage of the signal amplifier circuit is 24V.

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