Power device mounting structure

Abstract

The utility model discloses a power device installation structure, which belongs to the technical field of electronic component installation, and comprises a heat conduction shell, a first insulating layer, a plurality of second insulating layers, a heat conduction layer and a power device, the multiple second insulating layers are distributed on the surface of the side, away from the heat conduction shell, of the first insulating layer at intervals, a mounting space is defined by the multiple second insulating layers, part of the first insulating layer is exposed in the mounting space, and the heat conduction layer is attached to the part, exposed in the mounting space, of the first insulating layer; the power device is located on the surface of the side, away from the first insulating layer, of the heat conduction layer, and the structure achieves the effect of improving the voltage withstanding value between the wiring part of the power device and the heat conduction layer. The first insulating layer and the plurality of second insulating layers form a multi-layer insulating structure, so that current can be effectively blocked, the voltage endurance capability is enhanced, and the problem of insufficient voltage endurance of a low-voltage-grade power device in a high-voltage system is solved.

Description

Technical Field

[0001] This application relates to the technical field of electronic component mounting, and more particularly to a power device mounting structure. Background Technology

[0002] Power devices are electronic components used to control and convert electrical energy. Capable of handling high voltage and high current, they are widely used in power equipment circuits for energy conversion and control, primarily for frequency conversion, voltage transformation, and current conversion. Power devices generate a significant amount of heat during operation. To ensure their proper functioning, they are often mounted on aluminum heat sinks. The excellent heat dissipation properties of aluminum heat sinks effectively reduce the temperature of the power devices, extending their lifespan and thus improving the stability and reliability of the entire electronic system.

[0003] With the development of electronic components, the voltage on power devices is getting higher and higher. However, as the voltage increases, the withstand voltage between the wiring part of the power device and the aluminum heat sink mounting plate does not meet the high withstand voltage requirements. At present, the problem is usually solved by replacing the power device with a higher voltage level. However, due to the high cost of high voltage power devices, the competitiveness of the product decreases. Utility Model Content

[0004] In view of this, this application provides a power device mounting structure to solve the problem that as the voltage increases, the withstand voltage between the power device wiring part and the aluminum heat sink mounting plate does not meet the high withstand voltage requirements. Currently, this problem is usually solved by replacing the power device with a higher voltage level, but the high cost of high voltage power devices leads to a decrease in the competitiveness of the product.

[0005] This application provides a power device mounting structure, including:

[0006] Thermally conductive housing;

[0007] The first insulating layer is attached to one side surface of the heat-conducting housing;

[0008] Multiple second insulating layers are spaced apart on the surface of the first insulating layer away from the heat-conducting housing. The multiple second insulating layers enclose an installation space, and the installation space exposes a portion of the first insulating layer.

[0009] A thermally conductive layer is attached to the exposed portion of the first insulating layer within the installation space;

[0010] The power device is located on the side surface of the thermally conductive layer that is away from the first insulating layer.

[0011] Beneficial effects: Through the multi-layer insulation design of the first insulation layer and multiple second insulation layers, the withstand voltage between the wiring part of the power device and the heat-conducting layer is significantly improved, effectively solving the problem of insufficient withstand voltage of low-voltage power devices in high-voltage systems. At the same time, the heat generated by the power device during operation can be conducted to the heat-conducting shell through the heat-conducting layer, solving the heat dissipation problem of high-power devices, enabling low-voltage power modules to be used safely in high-voltage systems, and enhancing the product's market competitiveness.

[0012] In an alternative embodiment, a third insulating layer is further included, located within the mounting space and between the thermally conductive layer and the first insulating layer.

[0013] Beneficial effects: By setting a third insulation layer within the installation space, between the thermally conductive layer and the first insulation layer, and in conjunction with the first insulation layer and multiple second insulation layers, the multi-layer insulation design is further strengthened. This significantly improves the withstand voltage between the wiring portion of the power device and the thermally conductive layer, effectively solving the problem of insufficient withstand voltage of low-voltage power devices in high-voltage systems. This allows low-voltage power modules to be used safely in high-voltage systems, thereby enhancing the competitiveness of the final product in the market.

[0014] In one alternative implementation, it further includes:

[0015] An insulating limiting member extends into the installation space and abuts against a portion of the first insulating layer within the installation space. The insulating limiting member has a first groove and a second groove that are disposed opposite to each other and are connected. The third insulating layer abuts against the inner wall of the first groove, and the heat-conducting layer abuts against the inner wall of the second groove.

[0016] Beneficial effects: The first and second grooves of the insulating limiting component abut against the third insulating layer and the heat-conducting layer respectively, which can fix the third insulating layer and the heat-conducting layer and improve the structural stability.

[0017] In one alternative implementation, it further includes:

[0018] An insulating pressing member is attached to the surface of the heat-conducting layer opposite to the third insulating layer, and also to the surface of the insulating limiting member opposite to the first insulating layer. The insulating pressing member is fixedly connected to the heat-conducting shell by a first bolt.

[0019] Beneficial effects: The insulating limiting component can play a positioning and supporting role; on this basis, the insulating pressing component is attached to the heat-conducting layer and the insulating limiting component, and then fixedly connected to the heat-conducting shell by the first bolt, which can better fix the heat-conducting layer and enhance the stability of the entire structure.

[0020] In one alternative embodiment, the first insulating layer is fixedly connected to the heat-conducting housing by a second bolt.

[0021] Beneficial effect: The first insulating layer is fixedly connected to the heat-conducting shell by the second bolt, which can stabilize the connection between the first insulating layer and the heat-conducting shell.

[0022] In an alternative embodiment, a plurality of heat dissipation fins are further included, spaced apart on the inner wall of the heat-conducting housing.

[0023] Beneficial effects: By distributing several heat dissipation fins at intervals on the inner wall of the heat-conducting shell, the heat dissipation area of ​​the heat-conducting layer is increased, which helps to quickly guide the heat out of the heat-conducting layer and further improves the heat dissipation efficiency.

[0024] In one alternative implementation, it further includes:

[0025] Liquid supply source;

[0026] The coolant pipe has a first pipe section, which is serpentinely wound inside the heat-conducting shell, and one end of the coolant pipe is connected to the coolant supply source.

[0027] A recovery source is provided, with the other end of the coolant pipe connected to the recovery source.

[0028] The pump body is installed on the coolant pipeline;

[0029] The valve body is installed on the coolant pipeline.

[0030] Beneficial effects: The heat generated by the power devices is conducted to the heat-conducting shell through the heat-conducting layer and the first insulating layer. The first section of the coolant pipe is serpentinely wound inside the heat-conducting shell. The coolant supplied by the liquid source flows into the heat-conducting shell through the coolant pipe to exchange heat with the heat, and is then recovered by the recovery source. The pump body ensures the circulation of coolant, and the valve body can adjust the coolant flow rate. This solves the heat dissipation problem of the power devices, enabling low-voltage power modules to be used safely in high-voltage systems and enhancing the product's market competitiveness.

[0031] In one alternative implementation, it further includes:

[0032] A temperature sensing element, the sensing end of which is located inside the heat-conducting housing, is used to obtain the temperature inside the heat-conducting housing;

[0033] The control unit is electrically connected to the temperature detection element and the valve body, respectively.

[0034] Beneficial effects: The temperature sensing element acquires the temperature inside the heat-conducting housing in real time. The control unit controls the valve body based on the temperature sensing element's detection value, realizing automatic adjustment of the coolant flow rate, improving the automation level and heat dissipation efficiency adjustment capability of the power device mounting structure. The temperature sensor enables real-time monitoring of the temperature changes of the aluminum heat sink, and the detection value facilitates adjustment of the water-cooling pipe's heat dissipation efficiency, helping to ensure the safety of the power components during operation.

[0035] In summary, this application includes at least one of the following beneficial technical effects:

[0036] 1. Through the multi-layer insulation design of the first insulation layer and multiple second insulation layers, the withstand voltage between the wiring part of the power device and the heat-conducting layer is significantly improved, effectively solving the problem of insufficient withstand voltage of low-voltage power components in high-voltage systems;

[0037] 2. The increased heat dissipation area of ​​the heat-conducting layer through several heat dissipation fins facilitates the rapid dissipation of heat from the heat-conducting layer, further improving heat dissipation efficiency. Connected to the coolant supply and recovery sources via coolant pipes, the heat generated by the power devices during operation is rapidly conducted to the coolant pipes by the heat-conducting layer. The circulating coolant in the coolant pipes exchanges heat with the device, carrying away the heat and effectively solving the heat dissipation problem of high-power devices. Attached Figure Description

[0038] Figure 1 This is a top view of the structure of this application;

[0039] Figure 2 This is a side view of this application;

[0040] Figure 3 This is a schematic diagram of the internal structure of the heat sink.

[0041] In the diagram: 1. Heat-conducting housing; 101. Coolant pipe; 2. First insulation layer; 3. Second insulation layer; 4. Insulation limiting component; 5. First bolt; 6. Insulation pressing component; 7. Heat-conducting layer; 8. Power device; 9. Third insulation layer; 10. Temperature detection component; 11. Control unit; 12. Connector; 13. Valve body. Detailed Implementation

[0042] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0043] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0044] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0045] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0046] The following is combined Figures 1 to 3 This describes an embodiment of the mounting structure of the power device 8 in this application.

[0047] This application provides a mounting structure for a power device 8, comprising a heat-conducting housing 1, a first insulating layer 2, multiple second insulating layers 3, a heat-conducting layer 7, and a power device 8. The first insulating layer 2 is attached to one surface of the heat-conducting housing 1. The multiple second insulating layers 3 are spaced apart on the surface of the first insulating layer 2 facing away from the heat-conducting housing 1, forming a mounting space. A portion of the first insulating layer 2 is exposed within the mounting space. The heat-conducting layer 7 is attached to the exposed portion of the first insulating layer 2 within the mounting space. The power device 8 is located on the surface of the heat-conducting layer 7 facing away from the first insulating layer 2. This structure improves the withstand voltage between the wiring portion of the power device 8 and the heat-conducting layer 7. This is because the first insulating layer 2 and the multiple second insulating layers 3 form a multi-layered insulating structure, effectively blocking current and enhancing the withstand voltage, thus solving the problem of insufficient withstand voltage of low-voltage power devices 8 in high-voltage systems.

[0048] Specifically, the heat-conducting housing 1 serves to support and house other components, while also possessing certain thermal conductivity. It is typically made of a metallic material, such as aluminum alloy, which is lightweight and has good thermal conductivity. Alternatively, other metals with good thermal conductivity, such as copper alloy, can also be used. The heat-conducting housing 1 can be manufactured through casting or machining, and its shape and size can be designed according to actual needs.

[0049] The first insulating layer 2 is used to isolate the heat-conducting housing 1 from other components and prevent current conduction. It is generally made of a material with good insulating properties, such as rubber, plastic, or epoxy resin. The first insulating layer 2 can be a sheet structure, which is tightly attached to the heat-conducting housing 1 by means of adhesive bonding or slot connection. Adhesive bonding can use thermally conductive adhesive, which ensures both insulation and enhanced heat conduction; slot connection involves setting slots on the heat-conducting housing 1, with the edge of the first insulating layer 2 embedded in the slot to ensure a secure connection.

[0050] Multiple second insulating layers 3 are spaced apart on the first insulating layer 2. They are also made of insulating material, such as epoxy resin board. The shape of the second insulating layers 3 can be a regular shape such as a cuboid or cube, and they are fixed to the first insulating layer 2 by adhesive or bolts. The mounting space formed by the multiple second insulating layers 3 is used to place the heat-conducting layer 7 and the power device 8. The different shapes and layouts of the second insulating layers 3 can be adjusted according to the size and shape of the power device 8.

[0051] The thermally conductive layer 7 is responsible for conducting away the heat generated by the power device 8. It is generally made of a high thermal conductivity material, such as an aluminum heat sink, which has good thermal conductivity and is relatively inexpensive. The thermally conductive layer 7 is bonded to the exposed portion of the first insulating layer 2 within the mounting space, and the gap between them can be filled with thermally conductive silicone grease to improve heat conduction efficiency.

[0052] The power device 8 is used to realize various electrical functions. It is mounted on the heat-conducting layer 7 and fixed by means of welding, bolting, etc. When the power device 8 is working, it generates heat, which is transferred away through the heat-conducting layer 7 to ensure its normal operation. The power device 8 can be an IGBT, diode, transistor or other common power device 8. In this application, the power device 8 is an IGBT.

[0053] The installation process of the power device 8 mounting structure in this application is as follows: first, the first insulating layer 2 is attached to the heat-conducting housing 1; then, multiple second insulating layers 3 are installed on the first insulating layer 2 to form an installation space; next, the heat-conducting layer 7 is placed in the installation space; and finally, the power device 8 is installed on the heat-conducting layer 7. This combination method enables the components to work together, ensuring both the voltage resistance of the power device 8 and effective heat conduction.

[0054] Specifically, the mounting structure of the power device 8 also includes a third insulating layer 9, located within the mounting space and between the thermally conductive layer 7 and the first insulating layer 2. The third insulating layer 9 further enhances the insulation effect and can be made of insulating materials such as epoxy resin or plastic. Preferably, the material of the third insulating layer 9 is epoxy resin, which has good insulation and high-temperature resistance properties, and is relatively thin, allowing it to be well sandwiched between the thermally conductive layer 7 and the first insulating layer 2. The third insulating layer 9 is bonded to the thermally conductive layer 7 and the first insulating layer 2 by applying insulating adhesive, further improving the reliability of the insulation.

[0055] Specifically, the structure also includes an insulating limiting member 4, which extends into the installation space and abuts against a portion of the first insulating layer 2 within the installation space. The insulating limiting member 4 has a first groove and a second groove that are oppositely arranged and connected. The third insulating layer 9 abuts against the inner wall of the first groove, and the heat-conducting layer 7 abuts against the inner wall of the second groove. The insulating limiting member 4 is made of insulating plastic and its function is to position and fix the third insulating layer 9 and the heat-conducting layer 7. The dimensions of the first groove and the second groove are designed according to the size of the third insulating layer 9 and the heat-conducting layer 7 to ensure that they can fit tightly. The insulating limiting member 4 is connected to the first insulating layer 2 by a snap or glue to ensure its positional stability. Preferably, in this application, the insulating limiting member 4 is rectangular and the cross-section of the first groove and the second groove is rectangular.

[0056] Specifically, the structure also includes an insulating pressing member 6, which is attached to the surface of the heat-conducting layer 7 facing away from the third insulating layer 9, and to the surface of the insulating limiting member 4 facing away from the first insulating layer 2. The insulating pressing member 6 is fixedly connected to the heat-conducting housing 1 by a first bolt 5. The insulating pressing member 6 is made of ceramic material, which has good insulation properties and mechanical strength. Of course, in an alternative embodiment, the insulating pressing member 6 can also be made of epoxy resin. The insulating pressing member 6 is fixed to the heat-conducting housing 1 by the first bolt 5, which can tightly press the heat-conducting layer 7 and the insulating limiting member 4 onto the first insulating layer 2, further enhancing the stability of the structure.

[0057] Specifically, the first insulating layer 2 is fixedly connected to the heat-conducting housing 1 by a second bolt. The second bolt is made of stainless steel, which has corrosion-resistant properties. By tightening the second bolt, the first insulating layer 2 is tightly fitted to the heat-conducting housing 1, ensuring the insulation effect and the structural robustness.

[0058] Specifically, the structure also includes several heat dissipation fins, spaced apart on the inner wall of the heat-conducting housing 1. The heat dissipation fins are made of aluminum alloy and can be in the shape of sheets, needles, etc. The heat dissipation fins increase the heat dissipation area of ​​the heat-conducting housing 1, enabling heat to dissipate more quickly. They are fixed to the inner wall of the heat-conducting housing 1 by welding or embedding.

[0059] Specifically, the structure also includes a coolant supply source, a coolant pipeline 101, a recovery source, a pump body, a connector 12, and a valve body 13. The coolant pipeline 101 has a first section that is serpentinely wound inside the heat-conducting shell 1. One end of the coolant pipeline 101 is connected to the coolant supply source via the connector 12, and the other end is connected to the recovery source. The pump body and valve body 13 are mounted on the coolant pipeline 101. The coolant supply source is used to provide coolant from a coolant tank; the coolant can be water or a coolant mixture. The pump body drives the coolant to circulate within the pipeline. The serpentine first section can fully contact the heat-conducting shell 1, improving heat exchange efficiency. The valve body 13 is used to control the flow rate and pressure of the coolant to ensure stable system operation. The recovery source is a recovery tank used to recover the coolant after heat exchange.

[0060] Specifically, the structure also includes a temperature sensing element 10 and a control unit 11. The sensing end of the temperature sensing element 10 is located inside the heat-conducting housing 1 and is used to obtain the temperature inside the heat-conducting housing 1. The control unit 11 is electrically connected to the temperature sensing element 10 and the valve body 13. The temperature sensing element 10 can be a thermocouple thermometer, which can accurately measure the temperature inside the heat-conducting housing 1. The control unit 11 can be a microcontroller. Based on the measurement results of the temperature sensing element 10, the control unit 11 automatically adjusts the opening of the valve body 13, thereby controlling the flow rate of the coolant and realizing intelligent adjustment of heat dissipation efficiency.

[0061] The implementation principle of this embodiment is as follows: This power device 8 mounting structure, through a multi-layer insulation design, significantly improves the withstand voltage between the wiring portion of the power device 8 and the heat-conducting layer 7, solving the problem of insufficient withstand voltage of low-voltage power devices 8 in high-voltage systems. Simultaneously, the heat generated by the power device 8 is effectively dissipated through heat dissipation fins and a coolant circulation system, improving heat dissipation efficiency. The inclusion of temperature detection element 10 and control unit 11 enables intelligent adjustment of the heat dissipation system, ensuring stable operation of the power device 8 under different operating conditions. Compared to traditional power device 8 mounting structures, this structure offers significant improvements in withstand voltage and heat dissipation, better meeting the application requirements of high-voltage systems and high-power devices 8, and improving the reliability and safety of the equipment.

[0062] The implementation principle of this embodiment is as follows: Glass fiber reinforced plastic is used as the material for the insulating limiting component 4 and the insulating pressing component 6. This ensures both insulation and mechanical properties while providing better corrosion resistance and lower cost. This allows the power device 8 mounting structure to maintain stable performance under different operating environments, further improving the product's cost-effectiveness and market competitiveness.

[0063] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A power device mounting structure, characterized in that, include: Thermally conductive housing (1); The first insulating layer (2) is attached to one side surface of the heat-conducting housing (1); Multiple second insulating layers (3) are spaced apart on the side surface of the first insulating layer (2) away from the heat-conducting housing (1). The multiple second insulating layers (3) enclose an installation space, and the first insulating layer (2) is exposed in the installation space. The thermally conductive layer (7) is bonded to the exposed portion of the first insulating layer (2) within the installation space; The power device (8) is located on the side surface of the thermally conductive layer (7) away from the first insulating layer (2).

2. The power device mounting structure according to claim 1, characterized in that, It also includes a third insulating layer (9) located within the mounting space and between the thermally conductive layer (7) and the first insulating layer (2).

3. The power device mounting structure according to claim 2, characterized in that, Also includes: An insulating limiting member (4) extends into the installation space and abuts against a portion of the first insulating layer (2) within the installation space. The insulating limiting member (4) has a first groove and a second groove that are arranged opposite to each other and are connected. The third insulating layer (9) abuts against the inner wall of the first groove, and the heat-conducting layer (7) abuts against the inner wall of the second groove.

4. The power device mounting structure according to claim 3, characterized in that, Also includes: The insulating pressing member (6) is attached to the side surface of the heat-conducting layer (7) away from the third insulating layer (9) and to the side surface of the insulating limiting member (4) away from the first insulating layer (2). The insulating pressing member (6) is fixedly connected to the heat-conducting shell (1) by the first bolt (5).

5. The power device mounting structure according to any one of claims 1-4, characterized in that, The first insulating layer (2) is fixedly connected to the heat-conducting shell (1) by the second bolt.

6. The power device mounting structure according to claim 5, characterized in that, It also includes several heat dissipation fins, which are spaced apart on the inner wall of the heat-conducting housing (1).

7. The power device mounting structure according to claim 6, characterized in that, Also includes: Liquid supply source; The coolant pipe (101) has a first pipe section, which is serpentinely wound inside the heat-conducting shell (1), and one end of the coolant pipe (101) is connected to the liquid supply source; The other end of the coolant pipe (101) is connected to the recovery source; The pump body is installed on the coolant pipe (101); The valve body (13) is installed on the coolant pipe (101).

8. The power device mounting structure according to claim 7, characterized in that, Also includes: A temperature sensing element (10) has its sensing end located inside the heat-conducting housing (1) and is used to obtain the temperature inside the heat-conducting housing (1); The control unit (11) is electrically connected to the temperature detection element (10) and the valve body (13), respectively.

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