Wafer automatic film covering mechanism

Abstract

The utility model provides an automatic wafer laminating mechanism, which relates to the technical field of laminating mechanisms and comprises a laminating box, a film releasing mechanism is arranged in the laminating box, a protective film is arranged in the film releasing mechanism, a film pasting and girdling mechanism is arranged on the inner top wall of the laminating box, and a purging mechanism is arranged on the inner side wall of the laminating box. According to the utility model, when the movable plate moves downwards, the bottommost end of the semicircular air bag is in contact with the protective film preferentially, the protective film is promoted to be attached to the central position of the wafer firstly, and the contact area between the protective film and the wafer is increased continuously along with the downward movement of the semicircular air bag, so that bubbles generated when the protective film is attached to the wafer are reduced; when a movable plate moves downwards, a pressing plate is promoted to push a movable rod and a semicircular block to move downwards, meanwhile, a cam rod is promoted to rotate, a piston plate is continuously pushed to do reciprocating motion, when the piston plate moves, airflow in a hollow plate is continuously pushed into an air nozzle, and then the surface of a wafer is blown through the airflow jetted by the air nozzle.

Description

Technical Field

[0001] This utility model relates to the field of coating mechanism technology, specifically to an automatic wafer coating mechanism. Background Technology

[0002] With the rapid development of semiconductor technology, wafers, as the core component of integrated circuits, are crucial at every stage of their manufacturing process. Wafer coating, as an important step in protecting wafers and enhancing their functionality, directly affects the performance and market competitiveness of the final product. To reduce the possibility of surface damage during wafer transport, a coating mechanism is needed to cover one side of the wafer surface with a protective film.

[0003] In the prior art, when a coating mechanism coats a wafer, it uses a pressure block to attach the protective film to the wafer. However, when the pressure block pushes the protective film to adhere to the wafer, airflow in the center of the protective film and the wafer can easily remain between them, which can easily lead to the problem of air bubbles being generated during wafer coating.

[0004] This invention proposes an automatic wafer coating mechanism to solve the problem that when a coating mechanism applies a protective film to a wafer using a pressure block, the airflow between the protective film and the center of the wafer can easily remain between them, which can easily lead to air bubbles during wafer coating. Utility Model Content

[0005] The purpose of this invention is to overcome the problem in the above-mentioned background technology that when the coating mechanism applies a protective film to the wafer by pressing a block, the airflow between the protective film and the center of the wafer is easily retained when the block pushes the protective film to adhere to the wafer, which can easily lead to the generation of air bubbles during wafer coating.

[0006] Based on the above technical concept, the technical solution adopted by this utility model is as follows:

[0007] An automated wafer coating mechanism includes a coating box, a film release mechanism inside the coating box, a protective film inside the film release mechanism, a film-applying ring-cutting mechanism on the inner top wall of the coating box, a purging mechanism on the inner side wall of the coating box, and a placement plate movably inserted into the front side of the coating box.

[0008] The protective film application and circumferential cutting mechanism is used to apply the protective film onto the wafer and to perform circumferential cutting on the protective film, while the purging mechanism is used to purify the wafer surface.

[0009] Further defining the above technical solution, the membrane release mechanism includes a take-up drum and an unwinding drum, which are symmetrically arranged on the inner wall of the coating box. A round rod is rotatably arranged inside both the take-up drum and the unwinding drum. The two ends of the protective film are respectively wound around the two round rods. A motor is arranged inside the take-up drum, and the rotating shaft of the motor is fixedly connected to one end of the round rod.

[0010] As a further limitation of the above technical solution, both the take-up drum and the unwind drum are provided with openings for the protective film to pass through.

[0011] Further defining the above technical solution, the film-applying ring-cutting mechanism includes an electric push rod and a movable plate. The electric push rod is fixedly installed on the inner top wall of the film-applying box, and the movable plate is fixedly installed on the extended end of the electric push rod. A ring cutter is fixedly installed on the bottom surface of the movable plate, and a pressure plate is fixedly installed on the top surface of the movable plate.

[0012] Further defining the above technical solution, the bottom surface of the movable plate is provided with a groove, the inner wall of the groove is movably provided with a circular plate, the circular plate is connected to the inner wall of the groove by a first spring, and a semi-circular airbag is fixedly provided on the bottom surface of the circular plate.

[0013] Further defining the above technical solution, the purging mechanism includes a hollow plate and a cam rod. The hollow plate is fixedly installed on the inner wall of the coating box, and the cam rod is rotatably installed inside the hollow plate. Two piston plates are symmetrically arranged on the inner wall of the hollow plate. One side of the piston plate slides against the outer wall of the cam rod, and the other end of the piston plate is connected to the inner wall of the hollow plate through a second spring. Several air nozzles are fixedly inserted into the side of the hollow plate facing the placement plate.

[0014] Further defining the above technical solution, a spiral groove is provided through the cam rod, and a movable rod is movably inserted into the inner wall of the spiral groove. A semi-circular block is fixedly provided at one end of the movable rod inserted into the spiral groove. The semi-circular block slides in cooperation with the inner wall of the spiral groove. The movable rod is connected to the top surface of the hollow plate through a sleeved third spring. The position of the movable rod corresponds to the position of the pressure plate.

[0015] To further define the above technical solution, electrostatic dust-collecting plates are provided on both the left and right sides of the hollow plate.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] As the movable plate moves downward, the bottom of the semi-circular airbag makes initial contact with the protective film, causing the protective film to adhere to the center of the wafer first. As the semi-circular airbag moves downward, the contact area between the protective film and the wafer continuously increases, thereby reducing air bubbles generated when the protective film adheres to the wafer.

[0018] When the movable plate moves down, it causes the pressure plate to push the movable rod and the semi-circular block down, while at the same time it causes the cam rod to rotate and continuously push the piston plate to reciprocate. When the piston plate moves, it continuously pushes the airflow in the hollow plate into the jet nozzle, and then the airflow is sprayed through the jet nozzle to sweep the surface of the wafer. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a three-dimensional structural diagram of an automated wafer coating mechanism according to the present invention;

[0021] Figure 2 This is a partial three-dimensional cross-sectional view of the coating box of an automatic wafer coating mechanism according to this utility model;

[0022] Figure 3 This is a partial three-dimensional cross-sectional view of the blowing mechanism of an automatic wafer coating mechanism according to this utility model;

[0023] Figure 4 This is a partial three-dimensional structural diagram of an automatic wafer coating mechanism according to the present invention.

[0024] The components include: 1. Film coating box; 2. Film release mechanism; 21. Take-up drum; 22. Unwind drum; 23. Round rod; 24. Opening; 3. Protective film; 4. Film wrapping and circumferential cutting mechanism; 41. Electric push rod; 42. Movable plate; 43. Circular cutter; 44. Pressure plate; 45. Groove; 46. Round plate; 47. First spring; 48. Semi-circular airbag; 5. Blowing mechanism; 51. Hollow plate; 52. Cam rod; 53. Piston plate; 54. Second spring; 55. Air nozzle; 56. Spiral groove; 57. Movable rod; 58. Semi-circular block; 59. Third spring; 6. Placement plate; 7. Electrostatic dust collection plate. Detailed Implementation

[0025] The following is in conjunction with the appendix Figures 1-4 The present invention will be described in further detail below.

[0026] Example 1: This example provides an automated wafer coating mechanism, such as... Figure 1As shown, this invention can solve the problem that when a coating mechanism applies a protective film to a wafer using a pressure block, the airflow between the protective film and the center of the wafer can easily remain between them, which can easily lead to air bubbles during wafer coating. The invention includes a coating box 1, a film release mechanism 2 inside the coating box 1, a protective film 3 inside the film release mechanism 2, a film-applying ring-cutting mechanism 4 on the inner top wall of the coating box 1, a blowing mechanism 5 on the inner side wall of the coating box 1, and a placement plate 6 that is movably inserted into the front of the coating box 1.

[0027] The protective film circumferential cutting mechanism 4 is used to attach the protective film 3 onto the wafer and to perform circumferential cutting on the protective film 3, while the purging mechanism 5 is used to purify the wafer surface.

[0028] First, the wafer is placed inside the placement plate 6, and then the placement plate 6 is inserted into the coating box 1. Then, the protective film 3 is released by the film release mechanism 2. When the film-applying ring-cutting mechanism 4 moves down, the blowing mechanism 5 is controlled to continuously spray airflow, thereby blowing the wafer surface through the airflow. The protective film 3 is then applied to the wafer by the operation of the film-applying ring-cutting mechanism 4. Then, the protective film 3 is ring-cut, thereby realizing the wafer coating process.

[0029] Combination Figure 2 In an embodiment of this utility model, the film release mechanism 2 includes a take-up drum 21 and an unwinding drum 22. The take-up drum 21 and the unwinding drum 22 are symmetrically arranged on the inner wall of the film coating box 1. A round rod 23 is rotatably arranged inside both the take-up drum 21 and the unwinding drum 22. The two ends of the protective film 3 are respectively wound around the two round rods 23. A motor is arranged inside the take-up drum 21. The rotating shaft of the motor is fixedly connected to one end of the round rod 23. The motor can easily drive the round rod 23 inside the take-up drum 21 to rotate, thereby winding the protective film 3 through the round rod 23 and causing the round rod 23 inside the unwinding drum 22 to rotate and release the new protective film 3.

[0030] Combination Figure 2 In this embodiment of the present invention, both the take-up drum 21 and the unwinding drum 22 are provided with openings 24 for the protective film 3 to pass through. The protective film 3 can enter the take-up drum 21 and the unwinding drum 22 and be wound around the round rod 23 through the openings 24.

[0031] Example 2: Reference Figure 2 , Figure 3The film-applying ring-cutting mechanism 4 includes an electric push rod 41 and a movable plate 42. The electric push rod 41 is fixedly installed on the inner top wall of the film-applying box 1, and the movable plate 42 is fixedly installed on the extended end of the electric push rod 41. A ring cutter 43 is fixedly installed on the bottom surface of the movable plate 42, and a pressure plate 44 is fixedly installed on the top surface of the movable plate 42. The electric push rod 41 facilitates the synchronous movement of the movable plate 42, the pressure plate 44, and the ring cutter 43. When the pressure plate 44 moves down, it is convenient to control the operation of the blowing mechanism 5, and the ring cutter 43 facilitates the ring-cutting of the protective film 3.

[0032] The bottom surface of the movable plate 42 has a groove 45, and a circular plate 46 is movably disposed on the inner wall of the groove 45. The circular plate 46 is connected to the inner wall of the groove 45 by a first spring 47. A semi-circular airbag 48 is fixedly disposed on the bottom surface of the circular plate 46. The groove 45 facilitates the installation of the circular plate 46 and the semi-circular airbag 48. When the movable plate 42 moves down, the bottom end of the semi-circular airbag 48 first contacts the protective film 3, causing the protective film 3 to first adhere to the center of the wafer. As the semi-circular airbag 48 moves down, the contact area between the protective film 3 and the wafer continuously increases, thereby reducing air bubbles generated when the protective film 3 adheres to the wafer. As the movable plate 42 continues to move down, the semi-circular airbag 48 and the circular plate 46 are housed inside the groove 45, thereby causing the annular cutter 43 to contact the protective film 3, so as to perform annular cutting on the protective film 3. Furthermore, the adhesion of the protective film 3 by the semi-circular airbag 48 can reduce the possibility of wafer damage.

[0033] Example 3: Reference Figure 2 , Figure 3 The purging mechanism 5 includes a hollow plate 51 and a cam rod 52. The hollow plate 51 is fixedly installed on the inner wall of the coating box 1, and the cam rod 52 is rotatably installed inside the hollow plate 51. Two piston plates 53 are symmetrically arranged on the inner wall of the hollow plate 51. One side of the piston plate 53 slides against the outer wall of the cam rod 52, and the other end of the piston plate 53 is connected to the inner wall of the hollow plate 51 by a second spring 54. Several jet nozzles 55 are fixedly inserted into the side of the hollow plate 51 facing the placement plate 6. The second spring 54 facilitates the movement of the piston plate 53 and keeps it in contact with the outer wall of the cam rod 52. When the cam rod 52 rotates, it continuously pushes the piston plate 53 to reciprocate. When the piston plate 53 moves, it continuously pushes the airflow in the hollow plate 51 into the jet nozzles 55, and then the airflow is sprayed through the jet nozzles 55 to purge the surface of the wafer.

[0034] A spiral groove 56 is formed through the cam rod 52. A movable rod 57 is movably inserted into the inner wall of the spiral groove 56. A semi-circular block 58 is fixedly installed at one end of the movable rod 57 inserted into the spiral groove 56. The semi-circular block 58 slides in cooperation with the inner wall of the spiral groove 56. The movable rod 57 is connected to the top surface of the hollow plate 51 through a sleeved third spring 59. The position of the movable rod 57 corresponds to the position of the pressure plate 44. When the movable plate 42 moves down, it causes the pressure plate 44 to move down and come into contact with the movable rod 57, thereby pushing the movable rod 57 and the semi-circular block 58 to move down. At this time, the semi-circular block 58 slides along the inner wall of the spiral groove 56, which facilitates the control of the rotation of the cam rod 52. As the movable rod 57 moves down, it causes the third spring 59 to compress and deform. When the movable plate 42 moves up, the pressure plate 44 separates from the movable rod 57. At this time, the movable rod 57 is pushed back to its original position by the third spring 59.

[0035] Electrostatic dust collection plates 7 are provided on both the left and right sides of the hollow plate 51. The electrostatic dust collection plates 7 can easily adsorb the dust blown on the wafer surface, thereby reducing the possibility of dust spreading around in the coating box 1 and reducing the possibility of dust re-adhering to the wafer surface.

[0036] The above description is a further detailed explanation of the present invention in conjunction with specific preferred embodiments, which is intended to enable those skilled in the art to understand and apply the present invention. However, it should not be assumed that the specific implementation of the present invention is limited to these descriptions.

Claims

1. An automated wafer coating mechanism, comprising a coating box (1), characterized in that, The film-coating box (1) is provided with a film release mechanism (2), the film release mechanism (2) is provided with a protective film (3), the inner top wall of the film-coating box (1) is provided with a film-applying ring-cutting mechanism (4), the inner side wall of the film-coating box (1) is provided with a blowing mechanism (5), and the front side of the film-coating box (1) is movably connected with a placement plate (6). The film-applying ring-cutting mechanism (4) is used to apply the protective film (3) onto the wafer and to perform ring-cutting on the protective film (3). The blowing mechanism (5) is used to blow the wafer surface.

2. The automated wafer coating mechanism according to claim 1, characterized in that, The membrane release mechanism (2) includes a take-up drum (21) and an unwinding drum (22). The take-up drum (21) and the unwinding drum (22) are symmetrically arranged on the inner wall of the film covering box (1). A round rod (23) is rotatably arranged inside both the take-up drum (21) and the unwinding drum (22). The two ends of the protective film (3) are respectively wound around the two round rods (23). A motor is arranged inside the take-up drum (21). The rotating shaft of the motor is fixedly connected to one end of the round rod (23).

3. The automated wafer coating mechanism according to claim 2, characterized in that, Both the take-up drum (21) and the unwinding drum (22) are provided with openings (24) for the protective film (3) to pass through.

4. The automated wafer coating mechanism according to claim 1, characterized in that, The film-applying ring-cutting mechanism (4) includes an electric push rod (41) and a movable plate (42). The electric push rod (41) is fixedly installed on the inner top wall of the film-applying box (1). The movable plate (42) is fixedly installed at the extended end of the electric push rod (41). A ring cutter (43) is fixedly installed on the bottom surface of the movable plate (42). A pressure plate (44) is fixedly installed on the top surface of the movable plate (42).

5. The automated wafer coating mechanism according to claim 4, characterized in that, The bottom surface of the movable plate (42) is provided with a groove (45), and a circular plate (46) is movably provided on the inner wall of the groove (45). The circular plate (46) is connected to the inner wall of the groove (45) by a first spring (47), and a semi-circular airbag (48) is fixedly provided on the bottom surface of the circular plate (46).

6. The automated wafer coating mechanism according to claim 5, characterized in that, The purging mechanism (5) includes a hollow plate (51) and a cam rod (52). The hollow plate (51) is fixedly installed on the inner wall of the film-coating box (1). The cam rod (52) is rotatably installed inside the hollow plate (51). Two piston plates (53) are symmetrically arranged on the inner wall of the hollow plate (51). One side of the piston plate (53) slides against the outer wall of the cam rod (52). The other end of the piston plate (53) is connected to the inner wall of the hollow plate (51) through a second spring (54). Several air nozzles (55) are fixedly inserted into the side of the hollow plate (51) facing the placement plate (6).

7. The automated wafer coating mechanism according to claim 6, characterized in that, A spiral groove (56) is provided through the cam rod (52). A movable rod (57) is movably inserted into the inner wall of the spiral groove (56). A semi-circular block (58) is fixedly provided at one end of the movable rod (57) inserted into the spiral groove (56). The semi-circular block (58) slides in cooperation with the inner wall of the spiral groove (56). The movable rod (57) is connected to the top surface of the hollow plate (51) by a sleeved third spring (59). The position of the movable rod (57) corresponds to the position of the pressure plate (44).

8. The automated wafer coating mechanism according to claim 6, characterized in that, Electrostatic dust collection plates (7) are provided on both the left and right sides of the hollow plate (51).

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