Carrying mechanism and conveying device
By integrating the alignment correction function into the handling mechanism, the problem of increased movement caused by vacuum operation during silicon wafer transport is solved, achieving efficient and stable silicon wafer handling and alignment, and reducing the risk of breakage.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUXI LEAD INTELLIGENT EQUIP CO LTD
- Filing Date
- 2025-04-18
- Publication Date
- 2026-05-12
AI Technical Summary
In existing technologies, the alignment process for silicon wafers during transport requires separate vacuum breaking and vacuum suction, which increases the number of steps, prolongs the time, and increases the risk of breakage.
Design a handling mechanism that integrates a bias correction function during the handling process. By moving the first and second holding components and the driving component along the Y direction, the bias correction of the silicon wafer is achieved, reducing additional actions.
It saves processes, improves efficiency, optimizes the correction station, reduces the risk of silicon wafer breakage, and avoids the impact of vacuum operation on other mechanisms.
Smart Images
Figure CN224234153U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of battery processing equipment technology, and in particular relates to a handling mechanism and conveying device. Background Technology
[0002] In the existing technology, two silicon wafers are transported from one conveyor to another. The alignment process is usually carried out on the other conveyor. Since the other conveyor fixes the silicon wafers by vacuum adsorption, the vacuum needs to be broken separately during alignment, and then vacuumed again after alignment. This process increases the number of actions, greatly prolongs the time required for alignment, and the extra actions will lead to more debris. Utility Model Content
[0003] The purpose of this application is to provide a handling mechanism and a conveying device.
[0004] According to a first aspect of the embodiments of this application, a conveying mechanism is provided, comprising:
[0005] Mounting plate;
[0006] A first holding component and a second holding component are disposed at a distance along the Y direction;
[0007] A first driving component is disposed on the mounting plate and is capable of driving a first holding component to move along the Y direction.
[0008] A second drive component is disposed on the mounting plate, and the second drive component is capable of driving the second holding component to move along the Y direction.
[0009] Optionally, the mounting plate includes a first end face and a second end face opposite each other in the Z direction, the first drive component and the second drive component are disposed on the first end face, and the first holding component and the second holding component are both located on the side of the mounting plate closer to the second end face.
[0010] Optionally, the mounting plate has a first clearance hole that penetrates the first end face and the second end face. The first driving assembly includes a first driving member and a first connecting plate. The first connecting plate passes through the first clearance hole and connects the driving end of the first driving member and the first holding assembly; and / or
[0011] The mounting plate has a second clearance hole that passes through the first end face and the second end face. The second drive assembly includes a second drive member and a second connecting plate. The second connecting plate passes through the second clearance hole and connects the drive end of the second drive member and the second holding assembly.
[0012] Optionally, the conveying mechanism further includes a guide component disposed on the second end face, the first holding component and the guide component being slidably connected along the Y direction, and the second holding component and the guide component being slidably connected along the Y direction.
[0013] Optionally, the first holding component includes a first mounting portion and a first suction cup, the first suction cup being disposed on the first mounting portion, and the first mounting portion being slidably connected to the guide component; and / or
[0014] The second holding component includes a second mounting part and a second suction cup, the second suction cup being disposed on the second mounting part, and the second mounting part being slidably connected to the guide component.
[0015] Optionally, the first driving component and the second driving component are spaced apart along the X direction.
[0016] Optionally, the conveying mechanism further includes a first detection component, which is disposed on the first holding component; and / or
[0017] The conveying mechanism further includes a second detection component, which is disposed on the second holding component.
[0018] Optionally, the conveying mechanism further includes a first rotating component, wherein the first holding component is disposed at the output end of the first rotating component, and the first rotating component is disposed at the driving end of the first driving component, and the first rotating component is capable of driving the first holding component to rotate about an axis in the Z direction; and / or
[0019] The conveying mechanism further includes a second rotating component, the second holding component is disposed at the output end of the second rotating component, and the second rotating component is disposed at the driving end of the second driving component. The second rotating component can drive the second holding component to rotate around the axis in the Z direction.
[0020] According to a second aspect of the embodiments of this application, a conveying device is provided, comprising:
[0021] A first conveying mechanism and a second conveying mechanism are arranged at intervals along the X direction;
[0022] The aforementioned conveying mechanism is located between the first conveying mechanism and the second conveying mechanism.
[0023] Optionally, the conveying device further includes a first driving mechanism and a second driving mechanism, wherein the first driving mechanism is capable of driving the conveying mechanism to move along the X direction, and the second driving mechanism is capable of driving the conveying mechanism to move along the Z direction.
[0024] One technical advantage of this application embodiment is that it can save processes, improve efficiency, optimize the position of the correction station, and the correction action does not affect the operation of other mechanisms.
[0025] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description
[0026] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.
[0027] Figure 1 This is a schematic diagram of the transport mechanism in the embodiments of this application;
[0028] Figure 2 This is a schematic diagram of the transport mechanism in the embodiments of this application;
[0029] Figure 3 This is a schematic diagram of the conveying device in the embodiments of this application.
[0030] Explanation of reference numerals in the attached drawings: conveying mechanism 100; first holding component 1; first suction cup 11; first mounting part 12; second holding component 2; second suction cup 21; second mounting part 22; first driving component 3; first driving member 31; first connecting plate 32; second driving component 4; second driving member 41; second connecting plate 42; mounting plate 5; first end face 51; second end face 52; first clearance hole 53; second clearance hole 54; first detection component 6; second detection component 7; guide component 8; first conveying mechanism 200; second conveying mechanism 300; first driving mechanism 400; second motor 401; driving wheel 402; driven wheel 403; transmission belt 404; second driving mechanism 500; first silicon wafer a; second silicon wafer b. Detailed Implementation
[0031] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the present application.
[0032] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.
[0033] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.
[0034] In all the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.
[0035] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.
[0036] First, it should be noted that the X, Y, and Z directions mentioned in the embodiments of this application are referred to in the appendix. Figure 1 , Figure 2 and Figure 3 The marked directions. Among them, the axes in the X direction, Y direction, and Z direction intersect each other.
[0037] The conveying mechanism 100 of this application is used to correct the deviation of two workpieces during the conveying process. The workpiece can be a shell, a silicon wafer, or a thin sheet of other materials. This application uses a silicon wafer as an example. Specifically, the conveying mechanism 100 is used to simultaneously convey two silicon wafers, namely a first silicon wafer a and a second silicon wafer b. Before conveying, the first silicon wafer a and the second silicon wafer b are placed adjacent to each other.
[0038] like Figure 1 and Figure 2 As shown, according to a first aspect of the embodiments of this application, a conveying mechanism 100 is provided, including a first holding component 1, a second holding component 2, a mounting plate 5, a first driving component 3, and a second driving component 4; the first holding component 1 and the second holding component 2 are spaced apart along the Y direction; the first driving component 3 is disposed on the mounting plate 5, and the first driving component 3 is capable of driving the first holding component 1 to move along the Y direction; the second driving component 4 is disposed on the mounting plate 5, and the second driving component 4 is capable of driving the second holding component 2 to move along the Y direction.
[0039] like Figure 1 and Figure 2 As shown, the conveying mechanism 100 includes a first holding component 1, a second holding component 2, a mounting plate 5, a first driving component 3, and a second driving component 4; wherein, the first holding component 1 and the second holding component 2 are spaced apart along the Y direction, the first holding component 1 is used to hold the first silicon wafer a, and the second holding component 2 is used to hold the second silicon wafer b.
[0040] The first driving component 3 is disposed on the mounting plate 5, and the first holding component 1 is disposed on the driving end of the first driving component 3; the second driving component 4 is disposed on the mounting plate 5, and the second holding component 2 is disposed on the driving end of the second driving component 4; the first driving component 3 can drive the first holding component 1 to move along the Y direction, and the second driving component 4 can drive the second holding component 2 to move along the Y direction. It can be understood that the first driving component 3 can drive the first holding component 1 to move closer to or further away from the second holding component 2, and the second driving component 4 can drive the second holding component 2 to move closer to or further away from the first holding component 1; thereby, the distance between the first silicon wafer a and the second silicon wafer b in the Y direction can be adjusted to achieve the correction of the first silicon wafer a and the second silicon wafer b.
[0041] The conveying mechanism 100 in this application drives the first holding component 1 to move along the Y direction via the first driving component 3 and the second holding component 2 to move along the Y direction via the second driving component 4, thereby enabling the correction of the first silicon wafer a and the second silicon wafer b during the conveying process. Firstly, by integrating the correction structure onto the conveying mechanism 100, the correction work and the conveying work are performed simultaneously, reducing the pick-and-place actions required for correction, eliminating the impact of the correction action on the overall timing, and eliminating the need to move the first silicon wafer a and the second silicon wafer b to a preset position before correction. Firstly, it saves on processes and improves efficiency. Secondly, it optimizes the location of the correction station, ensuring that the correction action does not affect the operation of other mechanisms. Thirdly, in the prior art, the first silicon wafer a and the second silicon wafer b are transported to the second conveying mechanism 300 for correction. Since the second conveying mechanism 300 requires vacuum adsorption, the vacuum needs to be broken separately during correction, and then vacuumed again after correction. This increases the number of actions and greatly prolongs the time required for correction. Moreover, the extra actions will lead to more fragmentation. The conveying mechanism 100 of this application can avoid this problem and reduce the breakage of silicon wafers.
[0042] In one specific embodiment, the mounting plate 5 includes a first end face 51 and a second end face 52 opposite to each other in the Z direction. The first driving component 3 and the second driving component 4 are disposed on the first end face 51, and the first holding component 1 and the second holding component 2 are both located on the side of the mounting plate 5 closer to the second end face 52.
[0043] like Figure 1 and Figure 2As shown, the mounting plate 5 includes a first end face 51 and a second end face 52, which are arranged opposite each other in the Z direction. The first end face 51 faces upward in the Z direction, and the second end face 52 faces downward in the Z direction. The first driving component 3 and the second driving component 4 are located on the first end face 51. It can be understood that the first driving component 3 and the second driving component 4 are both located above the mounting plate 5 in the Z direction. Therefore, the mounting plate 5 can provide support for the first driving component 3 and the second driving component 4, which can reduce the installation difficulty of the first driving component 3 and the second driving component 4, and also improve the structural stability of the handling mechanism 100. The first holding component 1 and the second holding component 2 are both located on the side of the mounting plate 5 close to the second end face 52. That is to say, the first holding component 1 and the second holding component 2 are both located below the mounting plate 5 in the Z direction, which facilitates the first holding component 1 and the second holding component 2 to hold the first silicon wafer a and the second silicon wafer b. In this embodiment, the structural layout of the first drive component 3, the second drive component 4, the first holding component 1, and the second holding component 2 is reasonable, which makes the structure of the conveying mechanism 100 more compact and saves space.
[0044] In another specific embodiment, the first driving component 3 and the second driving component 4 are both disposed on the second end face 52, and the first holding component 1 and the second holding component 2 are both located on the side of the mounting plate 5 close to the second end face 52; it can be understood that the first driving component 3, the second driving component 4, the first holding component 1 and the second holding component 2 are all located on the side of the mounting plate 5 close to the second end face 52.
[0045] In an embodiment where the first driving component 3 is disposed on the first end face 51, the mounting plate 5 has a first clearance hole 53, which penetrates the first end face 51 and the second end face 52. The first driving component 3 includes a first driving member 31 and a first connecting plate 32. The first connecting plate 32 passes through the first clearance hole 53 and connects the driving end of the first driving member 31 and the first holding component 1. Specifically, as shown... Figure 1 and Figure 2As shown, the first driving assembly 3 includes a first driving member 31 and a first connecting plate 32. The first connecting plate 32 is connected to the driving end of the first driving member 31, and the first driving member 31 can drive the first connecting plate 32 to move along the Y direction. Since the first driving assembly 3 is located on the first end face 51 and the first holding assembly 1 is located below the mounting plate 5, a first clearance hole 53 is provided on the mounting plate 5. The first clearance hole 53 penetrates the first end face 51 and the second end face 52. The first connecting plate 32 passes through the first clearance hole 53. One end of the first connecting plate 32 is connected to the driving end of the first driving member 31, and the other end of the first connecting plate 32 is connected to the first holding assembly 1. When the first driving member 31 drives the first connecting plate 32 to move along the Y direction, the first connecting plate 32 can move along the Y direction within the first clearance hole 53, and the first holding assembly 1 will also move along the Y direction. In this embodiment, the transport mechanism 100 has a reasonable structural layout, which makes the structure of the transport mechanism 100 more compact and saves space.
[0046] In an embodiment where the second drive assembly 4 is disposed on the first end face 51, the mounting plate 5 has a second clearance hole 54, which penetrates the first end face 51 and the second end face 52. The second drive assembly 4 includes a second drive member 41 and a second connecting plate 42. The second connecting plate 42 passes through the second clearance hole 54 and connects the drive end of the second drive member 41 and the second holding assembly 2. Specifically, as shown... Figure 1 and Figure 2 As shown, the second driving assembly 4 includes a second driving member 41 and a second connecting plate 42. The second connecting plate 42 is connected to the driving end of the second driving member 41, and the second driving member 41 can drive the second connecting plate 42 to move along the Y direction. Since the second driving assembly 4 is located on the first end face 51 and the second holding assembly 2 is located below the mounting plate 5, a second clearance hole 54 is also provided on the mounting plate 5. One end of the second connecting plate 42 is connected to the driving end of the second driving member 41, and the other end of the second connecting plate 42 is connected to the second holding assembly 2. When the second driving member 41 drives the second connecting plate 42 to move along the Y direction, the second connecting plate 42 can move along the Y direction within the second clearance hole 54, and the second holding assembly 2 will also move along the Y direction. In this embodiment, the layout of the conveying mechanism 100 is reasonable, which makes the structure of the conveying mechanism 100 more compact, thereby saving space.
[0047] The first driving component 31 can be a linear motor; or, the first driving component 31 includes a first motor, a first lead screw and a first nut seat, the first lead screw is connected to the output end of the first motor, the first nut seat is rotatably connected to the first lead screw, the first connecting rod is connected to the first nut seat, the first motor drives the first lead screw to rotate, and the first nut seat can move relative to the first lead screw in the Y direction, thereby driving the first holding assembly 1 to move in the Y direction through the first connecting plate 32.
[0048] The second driving component 41 can be a linear motor; or, the second driving component 41 includes a second motor 401, a second lead screw, and a second nut seat. The second lead screw is connected to the output end of the second motor 401, the second nut seat is rotatably connected to the second lead screw, and the second connecting rod is connected to the second nut seat. The second motor 401 drives the second lead screw to rotate, and the second nut seat can move relative to the second lead screw in the Y direction, thereby driving the second holding assembly 2 to move in the Y direction through the second connecting plate 42.
[0049] In one alternative implementation, such as Figure 1 and Figure 2 As shown, the conveying mechanism 100 further includes a guide component 8, which is disposed on the second end face 52. The first holding component 1 is slidably connected to the guide component 8 along the Y direction, and the second holding component 2 is slidably connected to the guide component 8 along the Y direction. Specifically, the guide component 8 is disposed on the second end face 52 and extends in the Y direction. The first holding component 1 is slidably connected to the guide component 8, and the second holding component 2 is slidably connected to the guide component 8. This can be understood as the first holding component 1 being able to slide relative to the guide component 8 when moving along the Y direction, and the second holding component 2 being able to slide relative to the guide component 8 when moving along the Y direction. The guide component 8 can provide guidance and support for the first holding component 1 and the second holding component 2 to prevent the first holding component 1 and the second holding component 2 from deviating during movement.
[0050] The guide component 8 can be a round rod or a square rod.
[0051] In one alternative implementation, such as Figure 1 and Figure 2 As shown, the first holding component 1 includes a first mounting part 12 and a first suction cup 11. The first suction cup 11 is disposed on the first mounting part 12, and the first mounting part 12 is slidably connected to the guide component 8. Specifically, the first holding component 1 includes a first mounting part 12 and a first suction cup 11. The first suction cup 11 is disposed on the first mounting part 12, and the first mounting part 12 is slidably connected to the guide component 8. The other end of the first connecting rod is connected to the first mounting part 12. When the conveying mechanism 100 is used to convey silicon wafers, the first suction cup 11 adsorbs the silicon wafers, which can reduce damage to the silicon wafers.
[0052] In one alternative implementation, such as Figure 1 and Figure 2 As shown, the second holding component 2 includes a second mounting part 22 and a second suction cup 21. The second suction cup 21 is disposed on the second mounting part 22, and the second mounting part 22 is slidably connected to the guide component 8. Specifically, the second holding component 2 includes a second mounting part 22 and a second suction cup 21. The second suction cup 21 is disposed on the second mounting part 22, and the second mounting part 22 is slidably connected to the guide component 8. The other end of the second connecting rod is connected to the second mounting part 22. When the conveying mechanism 100 is used to convey silicon wafers, the second suction cup 21 adsorbs the silicon wafers, which can reduce damage to the silicon wafers.
[0053] In an alternative embodiment, the first drive component 3 and the second drive component 4 are spaced apart along the X direction; in this embodiment, the structure of the conveying mechanism 100 can be made more compact.
[0054] In one alternative implementation, such as Figure 2 As shown, the conveying mechanism 100 further includes a first detection component 6, which is disposed on the first holding component 1; specifically, the first detection component 6 is used to detect the position of the first holding component 1 in order to determine the position of the first holding component 1.
[0055] In one alternative implementation, such as Figure 2 As shown, the conveying mechanism 100 further includes a second detection component 7, which is disposed on the second holding component 2; specifically, the second detection component 7 is used to detect the position of the second holding component 2 in order to determine the position of the second holding component 2.
[0056] The positions of the first holding component 1 and the second holding component 2 are determined by the first detection component 6 and the second detection component 7, so as to determine whether the first silicon wafer a and the second silicon wafer b are located in the preset positions.
[0057] The first detection component 6 can be a photoelectric sensor; the second detection component 7 can be a photoelectric sensor.
[0058] In an optional embodiment, the conveying mechanism 100 further includes a first rotating component. The first holding component 1 is disposed at the output end of the first rotating component, and the first rotating component is disposed at the driving end of the first driving component 3. The first rotating component can drive the first holding component 1 to rotate around the Z-axis. Specifically, the first rotating component can drive the first holding component 1 to rotate around the Z-axis to adjust the angle of the first silicon wafer a. The first driving component 3 can drive the first rotating component and the first holding component 1 to move together along the Y-axis to adjust the distance between the first holding component 1 and the second holding component 2 in the Y-axis. By setting the first rotating component, the correction accuracy can be further improved.
[0059] In an optional embodiment, the conveying mechanism 100 further includes a second rotating component. The second holding component 2 is disposed at the output end of the second rotating component, and the second rotating component is disposed at the driving end of the second driving component 4. The second rotating component can drive the second holding component 2 to rotate around the Z-axis. Specifically, the second rotating component can drive the second holding component 2 to rotate around the Z-axis to adjust the angle of the second silicon wafer b. The second driving component 4 can drive the second rotating component and the second holding component 2 to move together along the Y-axis to adjust the distance between the second holding component 2 and the first holding component 1 in the Y-axis. By setting the first rotating component, the correction accuracy can be further improved.
[0060] like Figure 3 As shown, according to a second aspect of the embodiments of this application, a conveying device is provided, including a first conveying mechanism 200, a second conveying mechanism 300, and a transport mechanism 100, wherein the first conveying mechanism 200 and the second conveying mechanism 300 are spaced apart along the X direction; and the transport mechanism 100 is located between the first conveying mechanism 200 and the second conveying mechanism 300.
[0061] like Figure 3 As shown, the conveying device includes a first conveying mechanism 200, a second conveying mechanism 300, and a transport mechanism 100; wherein, both the first conveying mechanism 200 and the second conveying mechanism 300 are used to convey a first silicon wafer a and a second silicon wafer b, the first conveying mechanism 200 and the second conveying mechanism 300 are spaced apart along the X direction, and in the X direction, the transport mechanism 100 is located between the first conveying mechanism 200 and the second conveying mechanism 300, the transport mechanism 100 is used to transport the first silicon wafer a and the second silicon wafer b located in the first conveying mechanism 200 to the second conveying mechanism 300; during the transport process, the transport mechanism 100 corrects the deviation of the first silicon wafer a and the second silicon wafer b.
[0062] In an optional embodiment, the conveying device further includes a first drive mechanism 400 and a second drive mechanism 500, wherein the first drive mechanism 400 is capable of driving the conveying mechanism 100 to move in the X direction, and the second drive mechanism 500 is capable of driving the conveying mechanism 100 to move in the Z direction.
[0063] like Figure 3 As shown, the first driving mechanism 400 can drive the conveying mechanism 100 to move along the X direction. That is, the first driving mechanism 400 can drive the conveying mechanism 100 to move along the X direction between the first conveying mechanism 200 and the second conveying mechanism 300 to convey the first silicon wafer a and the second silicon wafer b located in the first conveying mechanism 200 to the second conveying mechanism 300. Furthermore, during the process of driving the conveying mechanism 100 to move along the X direction, the first driving mechanism 400 can adjust the position of the first silicon wafer a and the second silicon wafer b in the X direction, which greatly increases the positioning accuracy of the silicon wafers and reduces the impact of positioning accuracy problems on the production efficiency of the equipment.
[0064] The second driving mechanism 500 can drive the transport mechanism 100 to move along the Z direction. This can be understood as follows: when the transport mechanism 100 needs to hold the first silicon wafer a and the second silicon wafer b on the first conveying mechanism 200, the second driving mechanism 500 drives the transport mechanism 100 to move closer to the first conveying mechanism 200 along the Z direction, so that the first holding component 1 and the second holding component 2 can hold the silicon wafers on the first conveying mechanism 200. After the first holding component 1 and the second holding component 2 have completed holding, the second driving mechanism 500 drives the transport mechanism 100 to move away from the first conveying mechanism 200 along the Z direction, to avoid movement in the X direction. The first conveying mechanism 200 is not allowed to collide with the second conveying mechanism 300. When the conveying mechanism 100 needs to place the first silicon wafer a and the second silicon wafer b on the second conveying mechanism 300, the second driving mechanism 500 drives the conveying mechanism 100 to move closer to the second conveying mechanism 300 along the Z direction, so that the first holding component 1 and the second holding component 2 can place the silicon wafers on the second conveying mechanism 300. After the first holding component 1 and the second holding component 2 have placed the wafers, the second driving mechanism 500 drives the conveying mechanism 100 to move away from the second conveying mechanism 300 along the Z direction, so as to avoid colliding with the second conveying mechanism 300 during the movement along the X direction.
[0065] In one specific embodiment, the first driving mechanism 400 is located at the driving end of the second driving mechanism 500, and the conveying mechanism 100 is located at the driving end of the first driving mechanism 400.
[0066] In another specific embodiment, the second drive mechanism 500 is located at the drive end of the first drive mechanism 400, and the conveying mechanism 100 is located at the drive end of the second drive mechanism 500.
[0067] The first drive mechanism 400 includes a linear motor, a pneumatic cylinder, or a hydraulic cylinder; preferably, such as Figure 3 As shown, the first drive mechanism 400 includes a second motor 401, a drive wheel 402, a driven wheel 403, and a transmission belt 404. The drive wheel 402 and the driven wheel 403 are spaced apart along the X direction. The transmission belt 404 is sleeved on the drive wheel 402 and the driven wheel 403. The output end of the second motor 401 is connected to the drive wheel 402. The second drive mechanism 500 is connected to the transmission belt 404. The second motor 401 drives the drive wheel 402 to rotate, thereby driving the transmission belt 404 to move along the X direction, so as to drive the second drive mechanism 500 to move along the X direction. The conveying mechanism 100 is provided at the drive end of the second drive mechanism 500.
[0068] The second drive mechanism 500 includes a linear motor, a pneumatic cylinder, or a hydraulic cylinder.
[0069] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.
Claims
1. A conveying mechanism, characterized in that, include: Mounting plate; A first holding component and a second holding component are disposed at a distance along the Y direction; A first driving component is disposed on the mounting plate and is capable of driving a first holding component to move along the Y direction. A second drive component is disposed on the mounting plate, and the second drive component is capable of driving the second holding component to move along the Y direction.
2. The conveying mechanism according to claim 1, characterized in that, The mounting plate includes a first end face and a second end face opposite each other in the Z direction. The first drive component and the second drive component are disposed on the first end face, and the first holding component and the second holding component are both located on the side of the mounting plate closer to the second end face.
3. The conveying mechanism according to claim 2, characterized in that, The mounting plate has a first clearance hole that penetrates the first end face and the second end face. The first driving assembly includes a first driving member and a first connecting plate. The first connecting plate passes through the first clearance hole and connects the driving end of the first driving member and the first holding assembly; and / or The mounting plate has a second clearance hole that passes through the first end face and the second end face. The second drive assembly includes a second drive member and a second connecting plate. The second connecting plate passes through the second clearance hole and connects the drive end of the second drive member and the second holding assembly.
4. The conveying mechanism according to claim 2, characterized in that, The conveying mechanism further includes a guide component, which is disposed on the second end face. The first holding component is slidably connected to the guide component along the Y direction, and the second holding component is slidably connected to the guide component along the Y direction.
5. The conveying mechanism according to claim 4, characterized in that, The first holding component includes a first mounting portion and a first suction cup, the first suction cup being disposed on the first mounting portion, and the first mounting portion being slidably connected to the guide component; and / or The second holding component includes a second mounting part and a second suction cup, the second suction cup being disposed on the second mounting part, and the second mounting part being slidably connected to the guide component.
6. The conveying mechanism according to claim 1, characterized in that, The first driving component and the second driving component are spaced apart along the X direction.
7. The conveying mechanism according to claim 1, characterized in that, The conveying mechanism further includes a first detection component, which is disposed on the first holding component; and / or The conveying mechanism further includes a second detection component, which is disposed on the second holding component.
8. The conveying mechanism according to claim 1, characterized in that, The conveying mechanism further includes a first rotating component, wherein the first holding component is disposed at the output end of the first rotating component, and the first rotating component is disposed at the driving end of the first driving component. The first rotating component is capable of driving the first holding component to rotate about an axis in the Z direction; and / or The conveying mechanism further includes a second rotating component, the second holding component is disposed at the output end of the second rotating component, and the second rotating component is disposed at the driving end of the second driving component. The second rotating component can drive the second holding component to rotate around the axis in the Z direction.
9. A conveying device, characterized in that, include: A first conveying mechanism and a second conveying mechanism are arranged at intervals along the X direction; The conveying mechanism as described in any one of claims 1-8, wherein the conveying mechanism is located between the first conveying mechanism and the second conveying mechanism.
10. The conveying device according to claim 9, characterized in that, The conveying device further includes a first driving mechanism and a second driving mechanism. The first driving mechanism can drive the conveying mechanism to move along the X direction, and the second driving mechanism can drive the conveying mechanism to move along the Z direction.