Micro-channel radiator with internal tooth structure

Abstract

The utility model discloses a micro-channel radiator with an internal tooth structure, and relates to the field of high-power heat dissipation technology, the micro-channel radiator comprises a heat dissipation plate and a heat exchanger, the heat dissipation plate is communicated with the heat exchanger through a steam conveying pipe and a condensation return pipe, an evaporation cavity is vertically arranged on the heat dissipation plate, and an inner tooth structure is arranged in the evaporation cavity. The end, close to the heat dissipation plate, of the steam conveying pipe communicates with the evaporation cavity, and the end, close to the heat dissipation plate, of the condensation backflow pipe communicates with the evaporation cavity. A plurality of guide plates are vertically arranged on the inner bottom wall of the evaporation chamber at intervals; the inner bottom wall of the evaporation cavity is further provided with a plurality of heat dissipation pieces used for enhancing contact between the liquid working medium and the hot wall face, and the heat dissipation pieces are arranged in the evaporation cavity at intervals in an array mode. The heat dissipation pieces are arranged on the inner bottom wall of the evaporation cavity at intervals in an array mode, the heat dissipation pieces and the flow guide plates form a synergistic effect, the contact area of the liquid working medium and the hot wall face is effectively increased, the working medium fully absorbs heat in the evaporation cavity and is vaporized, the phase change heat transfer efficiency is improved, and the local thermal resistance effect is reduced.

Description

Technical Field

[0001] This application relates to the field of high-power heat dissipation technology, and in particular to a microchannel heat sink with an internal tooth structure. Background Technology

[0002] With the increasing market demand for high-power semiconductor devices in communications, new energy, rail transportation, smart grids, and medical equipment, high-power semiconductor devices such as GTOs, MCTs, and IGBTs have developed rapidly. However, they now face a challenging situation regarding heat dissipation: First, the packaging density of high-power semiconductor devices is constantly increasing, leading to a continuous increase in their heat flux density; second, due to the continuous improvement in the performance of high-power semiconductor devices, their heat loss is becoming increasingly higher; and third, high-power semiconductor devices have penetrated various fields, and their application environments are constantly expanding, with significant differences in the thermal environments used. These development trends of high-power semiconductor devices make the overheating problem of electronic devices increasingly prominent.

[0003] Currently, gas-liquid two-phase heat dissipation technology is gradually becoming an effective solution for high-power heat dissipation due to its advantages such as high heat transfer efficiency and good temperature uniformity. These systems typically include an evaporator (heat sink) and a condenser (heat exchanger). The evaporator (heat sink) is connected to high-power semiconductor devices to dissipate heat. The evaporator (heat sink) and condenser (heat exchanger) are connected by multiple pipes, achieving efficient heat transfer through the phase change cycle of the liquid working fluid. Currently, evaporator heat sinks often employ an evaporation chamber structure, which typically incorporates baffles and capillary structures to regulate the flow of the liquid working fluid. Parallel or grid-like baffles are placed within the evaporation chamber to form directional flow channels. However, while the baffles physically divide the chamber space and regulate the flow path, they reduce the direct contact area between the liquid working fluid and the hot wall surface, leading to reduced evaporation heat transfer efficiency, increased local thermal resistance, and potentially causing uneven distribution of the liquid working fluid and an increased risk of drying out. Utility Model Content

[0004] To address the aforementioned technical problems and solve issues such as reduced evaporative heat exchange efficiency and increased local thermal resistance, the applicant provides a microchannel radiator with an internal tooth structure.

[0005] This application provides a microchannel heat sink with an internal tooth structure, which adopts the following technical solution:

[0006] A microchannel radiator with an internal toothed structure includes a heat dissipation plate and a heat exchanger. The heat dissipation plate and the heat exchanger are connected by a steam delivery pipe and a condensate return pipe. An evaporation chamber is vertically arranged on the heat dissipation plate. The end of the steam delivery pipe near the heat dissipation plate is connected to the evaporation chamber, and the end of the condensate return pipe near the heat dissipation plate is also connected to the evaporation chamber. Multiple guide plates are vertically spaced on the bottom wall of the evaporation chamber. The bottom wall of the evaporation chamber is also provided with multiple heat dissipation components for enhancing the contact between the liquid working fluid and the hot wall surface. The multiple heat dissipation components are arranged in an array at intervals within the evaporation chamber.

[0007] By adopting the above technical solution, the array structure of the heat sink can effectively increase the contact area between the liquid working fluid and the hot wall surface, compensating for the insufficient contact area caused by the baffle plate dividing the chamber. This allows the working fluid to absorb heat and vaporize more fully in the evaporation chamber, improving phase change heat transfer efficiency and reducing local thermal resistance. The synergistic effect of the baffle plate and the heat sink not only regulates the flow path of the working fluid and prevents local drying, but also enhances heat exchange, achieving a balance between heat dissipation efficiency and temperature uniformity.

[0008] Preferably, the heat sink includes a cover plate and a base plate, the evaporation chamber is vertically disposed on the base plate, the cover plate is located on one side of the evaporation chamber, the cover plate covers the evaporation chamber and is fixedly connected to the base plate.

[0009] By adopting the above technical solution, the separate structure of the substrate and cover plate facilitates the processing and assembly of the evaporation chamber. The fixed connection between the cover plate and the substrate forms a sealed evaporation space, ensuring the airtightness of the working fluid phase change cycle. At the same time, this structural design also facilitates subsequent maintenance and repair of the internal components of the evaporation chamber, reducing equipment maintenance costs.

[0010] Preferably, the heat sink includes multiple fin bodies, each of which is bent back and forth along its width to form a serrated structure, creating a first channel and a second channel that are staggered in sequence. The first and second channels are open structures, and their opening directions are opposite. The cross-sections of the first and second channels are rectangular. The multiple fin bodies are staggered along the flow direction of the liquid working fluid, and adjacent fin bodies are connected. The first channel and the second channel are interconnected.

[0011] By employing the above technical solution, the zigzag structure with its back-and-forth bending creates a complex flow channel network within the fin body. The liquid working fluid needs to constantly change direction during flow, and this change in flow state disrupts the boundary layer between the working fluid and the hot wall surface, reducing thermal resistance and thus improving the efficiency of heat absorption. Simultaneously, the opening directions of the first and second channels are opposite and interconnected, allowing the working fluid to flow alternately between different channels, further increasing the contact opportunities with the hot wall surface and ensuring that heat is more fully absorbed by the working fluid, thereby enhancing the heat exchange process within the evaporation chamber.

[0012] Preferably, the end of the steam delivery pipe away from the heat exchanger passes through the cover plate and is connected to the top of the evaporation chamber, and the end of the condensate return pipe away from the heat exchanger passes through the cover plate and is connected to the bottom of the evaporation chamber.

[0013] By adopting the above technical solution, the steam delivery pipe is connected to the top of the evaporation chamber, allowing the high-temperature steam generated by evaporation to smoothly enter the steam delivery pipe and be transported to the heat exchanger for condensation. Meanwhile, the condensate return pipe is connected to the bottom of the evaporation chamber, enabling the liquid working fluid condensed in the heat exchanger to smoothly return to the bottom of the evaporation chamber by gravity and system pressure difference, ensuring the continuity of the working fluid circulation. This layout optimizes the flow path of the working fluid, reduces flow resistance, and improves the system's circulation efficiency.

[0014] Preferably, the heat exchanger includes a steam chamber, a liquid reflux chamber, and a phase change flat tube. The steam chamber and the liquid reflux chamber are spaced apart. There are multiple phase change flat tubes located between the steam chamber and the liquid reflux chamber. Both ends of the phase change flat tubes are connected to the steam chamber and the liquid reflux chamber, respectively.

[0015] By adopting the above technical solution, the arrangement of multiple phase change flat tubes increases the heat exchange area between steam and the outside air, thereby improving condensation efficiency. The steam chamber receives high-temperature steam from the evaporation chamber. As the steam flows within the phase change flat tubes, it exchanges heat with the outside air through the tube walls, gradually condensing into a liquid state. The liquid reflux chamber collects the condensed liquid working fluid, providing a channel for its return. This structural design makes the steam condensation process more efficient and stable, ensuring the system's heat dissipation effect.

[0016] Preferably, there are two heat exchangers, namely a first heat exchanger and a second heat exchanger. The first heat exchanger and the second heat exchanger are arranged in parallel, and a connecting pipe is provided between the steam chamber and the liquid reflux chamber of the first heat exchanger and the second heat exchanger.

[0017] By adopting the above technical solution, the two parallel heat exchangers increase the system's heat dissipation area, further improving its heat dissipation capacity. When one heat exchanger fails or requires maintenance, the other can still operate normally, ensuring the system's reliability and stability. The connecting pipes allow the steam chamber and liquid reflux chamber of the two heat exchangers to be interconnected, achieving uniform distribution and flow of the working fluid between the two heat exchangers and preventing a single heat exchanger from being overloaded and affecting its heat dissipation performance.

[0018] Preferably, the end of the steam delivery pipe away from the heat sink is connected to the steam chamber on the first heat exchanger, and the end of the condensate return pipe away from the heat sink is connected to the liquid return pipe on the first heat exchanger.

[0019] By adopting the above technical solution, the connection relationship between the steam delivery pipe and the condensate return pipe and the heat exchanger is clarified, making the circulation path of the working fluid clearer. Steam first enters the steam chamber of the first heat exchanger, then enters the steam chamber of the second heat exchanger through a connecting pipe. After condensation by the phase change flat tube, the liquid working fluid enters the liquid return chambers of both the first and second heat exchangers, and then flows back to the evaporation chamber through the condensate return pipe. This connection method ensures the orderly circulation of the working fluid and improves the operational stability of the system.

[0020] Preferably, the evaporation chamber is provided with a plurality of mounting posts, which are all arranged on the bottom wall of the evaporation chamber; each mounting post is provided with a threaded hole for connecting to a high-power semiconductor device, and the threaded hole passes through the mounting post and the substrate.

[0021] By adopting the above technical solution, multiple evenly distributed mounting posts provide stable mounting support for high-power semiconductor devices, ensuring close contact between the devices and the heat sink, reducing thermal resistance, and improving heat conduction efficiency. Threaded holes penetrating both the mounting posts and the substrate allow bolts or screws to securely fix the devices to the mounting posts, while also facilitating device installation and removal, thus simplifying equipment assembly and maintenance.

[0022] Preferably, a valve is provided on the liquid reflux chamber of the first heat exchanger.

[0023] By adopting the above technical solution, the valve installation facilitates system maintenance and working fluid replenishment. After the system has been running for a period of time, the liquid working fluid may decrease due to evaporation, leakage, or other reasons. At this time, the valve can be used to replenish the liquid working fluid into the system to ensure its normal operation. Simultaneously, during system inspection or maintenance, the valve can be used to drain the working fluid from the system, facilitating the cleaning and maintenance of components such as heat exchangers.

[0024] In summary, this application includes at least one of the following beneficial technical effects:

[0025] 1. The array structure of the heat sink effectively increases the contact area between the liquid working fluid and the hot wall surface, compensating for the insufficient contact area caused by the baffle plate dividing the chamber. This allows the working fluid to absorb heat and vaporize more fully within the evaporation chamber, improving phase change heat transfer efficiency and reducing local thermal resistance. The synergistic effect of the baffle plate and heat sink not only regulates the flow path of the working fluid and prevents local drying, but also enhances heat exchange, achieving a balance between heat dissipation efficiency and temperature uniformity.

[0026] 2. The separate structure of the substrate and cover plate facilitates the processing and assembly of the evaporation chamber. The fixed connection between the cover plate and the substrate can form a sealed evaporation space, ensuring the airtightness of the working fluid phase change cycle. At the same time, this structural design also facilitates the subsequent maintenance and repair of the internal components of the evaporation chamber, reducing the maintenance cost of the equipment.

[0027] 3. The use of multiple phase change tubes increases the heat exchange area between the steam and the outside air, improving condensation efficiency. The steam chamber receives high-temperature steam from the evaporation chamber. As the steam flows within the phase change tubes, it exchanges heat with the outside air through the tube walls, gradually condensing into a liquid. The liquid reflux chamber collects the condensed liquid working fluid, providing a channel for its return. This structural design makes the steam condensation process more efficient and stable, ensuring the system's heat dissipation performance. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0029] Figure 2 This is a schematic diagram of the overall structure of this utility model from another perspective;

[0030] Figure 3 This utility model is a schematic diagram illustrating the structure of the evaporation chamber;

[0031] Figure 4 This is a schematic diagram illustrating the structure of a heat sink component.

[0032] Reference numerals: 1. Heat sink plate; 11. Base plate; 12. Cover plate; 2. Heat exchanger; 21. Steam chamber; 22. Liquid reflux chamber; 23. Phase change flat tube; 24. First heat exchanger; 25. Second heat exchanger; 3. Steam delivery pipe; 4. Condensate reflux pipe; 5. Connecting pipe; 6. Valve; 7. Evaporation chamber; 8. Guide plate; 9. Heat sink component; 91. Fin body; 911. First channel; 912. Second channel; 10. Mounting post; 13. Threaded hole. Detailed Implementation

[0033] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0034] This application discloses a microchannel heat sink with an internal tooth structure.

[0035] Reference Figure 1 , Figure 2 and Figure 3 A microchannel heat sink with an internal toothed structure includes a heat sink 1 and two heat exchangers 2. The heat sink 1 is vertically positioned below the two heat exchangers 2. Each heat exchanger 2 has two steam delivery pipes 3 and a condensation return pipe 4, and is connected to the heat sink 1 via these pipes. The heat exchangers 2 act as the condensation end, using forced air cooling to condense the gaseous-liquid working fluid into a liquid state, releasing heat to the environment. The heat sink 1 acts as the evaporation end, absorbing heat from the high-power semiconductor device, causing the liquid working fluid to evaporate into a gaseous state, initiating a phase change cycle.

[0036] Specifically, the heat exchanger 2 includes a steam chamber 21, a liquid reflux chamber 22, and a phase change flat tube 23. The steam chamber 21 and the liquid reflux chamber 22 are arranged in parallel. There are multiple phase change flat tubes 23, which are spaced apart between the steam chamber 21 and the liquid reflux chamber 22. Both ends of the phase change flat tubes 23 are connected to the steam chamber 21 and the liquid reflux chamber 22. The end of the steam delivery pipe 3 away from the heat dissipation plate 1 is connected to the steam chamber 21, and the end of the condensation reflux pipe 4 away from the heat dissipation plate 1 is connected to the liquid reflux chamber 22.

[0037] There are two heat exchangers 2 arranged in parallel, namely the first heat exchanger 24 and the second heat exchanger 25. The end of the steam delivery pipe 3 away from the heat dissipation plate 1 is connected to the steam chamber 21 of the first heat exchanger 24, and the end of the condensation return pipe 4 away from the heat dissipation plate 1 is connected to the liquid return chamber 22 of the first heat exchanger 24. A connecting pipe 5 is provided between the steam chamber 21 and the liquid return chamber 22 of the first heat exchanger 24 and the second heat exchanger 25, respectively. The steam chamber 21 on the first heat exchanger 24 and the second heat exchanger 25 are connected by the connecting pipe 5, and the liquid return chamber 22 on the first heat exchanger 24 and the second heat exchanger 25 are connected by the connecting pipe 5.

[0038] A valve 6 for evacuating the system is installed on the liquid reflux chamber 22 of the first heat exchanger 24. When the liquid working fluid is insufficient, it can be replenished through the valve 6.

[0039] Specifically, the heat sink 1 includes a base plate 11 and a cover plate 12. An evaporation chamber 7 is vertically formed on the base plate 11. The cover plate 12 is located on the side of the base plate 11 closest to the evaporation chamber 7, sealing the evaporation chamber 7 and being welded to the base plate 11. Two steam delivery pipes 3 are located at the top of the heat sink 1 near one end, passing through the cover plate 12 and communicating with the top of the evaporation chamber 7. Two liquid return pipes are located at the bottom of the heat sink 1 near one end, passing through the cover plate 12 and communicating with the top of the evaporation chamber 7. In this embodiment, the cover plate 12 and the base plate 11 are fixed together by vacuum brazing.

[0040] Reference Figure 3 and Figure 4 Furthermore, multiple guide plates 8 are vertically spaced on the bottom wall of the evaporation chamber 7. The guide plates 8 can guide the flow direction of the liquid working fluid, so that it forms a more orderly flow path in the evaporation chamber 7 and avoids local stagnation caused by chaotic flow direction. When the liquid working fluid flows into the evaporation chamber 7 from the return chamber, the guide plates 8 can guide it to diffuse evenly to all parts of the evaporation chamber 7, ensuring that the liquid working fluid is more evenly distributed throughout the evaporation area.

[0041] The inner bottom wall of the evaporation chamber 7 is also provided with multiple heat dissipation components 9, which are arranged in an array at intervals on the bottom wall of the evaporation chamber 7. Each heat dissipation component 9 includes a finned body 91, and there are multiple finned bodies 91. Each finned body 91 is bent back and forth along its width in a sawtooth structure, forming a first channel 911 and a second channel 912 arranged in a staggered manner. Both the first channel 911 and the second channel 912 are open structures with opposite opening directions, and both have rectangular cross-sections. The multiple finned bodies 91 are staggered along the flow direction of the liquid working fluid, so that adjacent finned bodies 91 are fixedly connected; adjacent finned bodies 91 are interconnected, so that the first channel 911 and the second channel 912 are in a connected state. By adjusting the staggered distance, the flow rate of the medium in the first channel 911 and the second channel 912 at the connection point can be adjusted. The zigzag structure's back-and-forth bending forms intersecting first and second channels 911 and 912, forcing the working fluid to continuously change direction during flow, generating a strong turbulent effect. This disturbance can disrupt the thermal boundary layer, reduce heat transfer resistance, and significantly improve heat transfer efficiency during phase change.

[0042] Furthermore, multiple mounting posts 10 are provided on the bottom wall of the evaporation chamber 7, each with a threaded hole 13 that penetrates both the mounting post 10 and the substrate 11. In use, high-power semiconductor devices can be fixedly connected to the threaded holes 13 on the mounting posts 10 using bolts or screws, thereby achieving close contact with the heat sink 1. This mounting method ensures efficient heat conduction between the device and the heat sink 1, and also facilitates disassembly and maintenance.

[0043] The implementation principle of this embodiment is as follows: When a high-power semiconductor device generates heat during operation, the heat is conducted to the substrate 11 of the heat sink 1, and the substrate 11 transfers the heat to the liquid working fluid in the evaporation chamber 7. The guide plate 8 in the evaporation chamber 7 guides the liquid working fluid to flow uniformly, while the heat sink 9 increases the contact area between the liquid working fluid and the hot wall surface, allowing the liquid working fluid to absorb heat more fully and vaporize into steam. The steam enters the steam chamber 21 of the first heat exchanger 24 through the steam delivery pipe 3, and then enters the steam chamber 21 of the second heat exchanger 25 through the connecting pipe 5. In the steam chamber 21, the steam enters the phase change flat tube 23, exchanges heat with the outside air through the wall of the phase change flat tube 23, and gradually condenses into a liquid. The condensed liquid working fluid enters the liquid return chamber 22, collects in the liquid return chamber 22 of the first heat exchanger 24 through the connecting pipe 5, and then, relying on gravity and the system pressure difference, flows back to the bottom of the evaporation chamber 7 through the condensation return pipe 4, completing the phase change cycle of the working fluid. During the circulation process, two parallel heat exchangers 2 achieve uniform distribution and flow of the working fluid through a connecting pipe 5, increasing the heat dissipation area and improving heat dissipation capacity. The valve 6 on the liquid reflux chamber 22 of the first heat exchanger 24 can be used to replenish the liquid working fluid or discharge the working fluid from the system, facilitating system maintenance and repair. The mounting column 10 ensures close contact between the high-power semiconductor device and the heat sink 1, guaranteeing efficient heat conduction. The entire system achieves efficient heat dissipation for the high-power semiconductor device through the phase change circulation of the liquid working fluid.

[0044] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A microchannel radiator with an internal tooth structure, comprising a heat dissipation plate (1) and a heat exchanger (2), wherein the heat dissipation plate (1) and the heat exchanger (2) are connected by a steam delivery pipe (3) and a condensation return pipe (4), wherein an evaporation chamber (7) is vertically arranged on the heat dissipation plate (1), wherein one end of the steam delivery pipe (3) near the heat dissipation plate (1) is connected to the evaporation chamber (7), and one end of the condensation return pipe (4) near the heat dissipation plate (1) is connected to the evaporation chamber (7); wherein a plurality of guide plates (8) are vertically spaced on the bottom wall of the evaporation chamber (7); characterized in that, The bottom wall of the evaporation chamber (7) is also provided with a plurality of heat dissipation components (9), and the plurality of heat dissipation components (9) are arranged in an array at intervals in the evaporation chamber (7).

2. A microchannel heat sink with an internal tooth structure according to claim 1, characterized in that, The heat sink (1) includes a cover plate (12) and a base plate (11). The evaporation chamber (7) is vertically arranged on the base plate (11). The cover plate (12) is located on one side of the evaporation chamber (7). The cover plate (12) covers the evaporation chamber (7) and is fixedly connected to the base plate (11).

3. A microchannel heat sink with an internal tooth structure according to claim 1, characterized in that, The heat sink (9) includes multiple fin bodies (91), each of which is bent back and forth along the width direction to form a sawtooth structure and forms a first channel (911) and a second channel (912) that are staggered in sequence. The first channel (911) and the second channel (912) are open structures, and the opening directions of the first channel (911) and the second channel (912) are opposite. The cross-section of the first channel (911) and the second channel (912) is rectangular. The multiple fin bodies (91) are staggered back and forth along the flow direction of the liquid working fluid, and adjacent fin bodies (91) are connected. The first channel (911) and the second channel (912) are connected.

4. A microchannel heat sink with an internal tooth structure according to claim 2, characterized in that, The end of the steam delivery pipe (3) away from the heat exchanger (2) passes through the cover plate (12) and is connected to the top of the evaporation chamber (7). The end of the condensation return pipe (4) away from the heat exchanger (2) passes through the cover plate (12) and is connected to the bottom of the evaporation chamber (7).

5. A microchannel heat sink with an internal tooth structure according to claim 1, characterized in that, The heat exchanger (2) includes a steam chamber (21), a liquid reflux chamber (22), and a phase change flat tube (23). The steam chamber (21) and the liquid reflux chamber (22) are spaced apart. There are multiple phase change flat tubes (23), which are located between the steam chamber (21) and the liquid reflux chamber (22). The two ends of the phase change flat tube (23) are respectively connected to the steam chamber (21) and the liquid reflux chamber (22).

6. A microchannel heat sink with an internal tooth structure according to claim 5, characterized in that, There are two heat exchangers (2), namely the first heat exchanger (24) and the second heat exchanger (25). The first heat exchanger (24) and the second heat exchanger (25) are arranged in parallel. A connecting pipe (5) is provided between the steam chamber (21) and the liquid return chamber (22) of the first heat exchanger (24) and the second heat exchanger (25).

7. A microchannel heat sink with an internal tooth structure according to claim 6, characterized in that, The end of the steam delivery pipe (3) away from the heat sink (1) is connected to the steam chamber (21) on the first heat exchanger (24), and the end of the condensation return pipe (4) away from the heat sink (1) is connected to the liquid return pipe on the first heat exchanger (24).

8. A microchannel heat sink with an internal tooth structure according to claim 1, characterized in that, The evaporation chamber (7) is provided with a plurality of mounting posts (10), which are arranged on the bottom wall of the evaporation chamber (7). Each mounting post (10) is provided with a threaded hole (13) for connecting to a high-power semiconductor device, and the threaded hole (13) passes through the mounting post (10) and the substrate (11).

9. A microchannel heat sink with an internal tooth structure according to claim 6, characterized in that, A valve (6) is provided on the liquid reflux chamber (22) of the first heat exchanger (24).

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