Multi-axis collaborative spraying and cleaning equipment for semiconductor parts

Abstract

The utility model belongs to the technical field of semiconductor part cleaning, and discloses a semiconductor part multi-shaft collaborative spraying cleaning device which comprises a base, a rotary workbench is installed on the top of the base through a first bearing, a lifting mechanism is arranged on the top of the base and located on one side of the rotary workbench, and a first rotating shaft is arranged on the lifting mechanism. The rotary workbench and the lifting mechanism are driven by the linkage transmission mechanism, and the linkage transmission mechanism is located on the base. A hollow spraying arm is installed on the lifting mechanism, a plurality of nozzles are arranged at the bottom of the hollow spraying arm and are arranged at equal intervals along the circumference arc line of the hollow spraying arm, the nozzles are located above the rotary workbench, and a connecting hose is installed at the top of the hollow spraying arm and communicates with the hollow spraying arm; and the hollow spraying arm is communicated with an external cleaning water supply system through a connecting hose. The semiconductor part cleaning device not only can conveniently clean semiconductor parts, but also has the advantages of being high in cleaning uniformity, compact in structure and high in transmission efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor component cleaning technology, and in particular to a multi-axis collaborative spray cleaning device for semiconductor components. Background Technology

[0002] The semiconductor component multi-axis collaborative spray cleaning equipment is a high-precision cleaning device used in semiconductor manufacturing processes. It is mainly used to efficiently remove surface contaminants from key components such as wafers, chip carriers, and reaction chamber components.

[0003] With the continuous advancement of semiconductor manufacturing processes, the requirements for component cleanliness are becoming increasingly stringent. Traditional semiconductor component cleaning equipment mostly employs single-axis spraying or worm gear drive structures, which suffer from numerous cleaning dead zones, low transmission efficiency, and high maintenance costs. In particular, the worm gear structure is prone to metal particle contamination, and its transmission accuracy is significantly affected by wear, making it difficult to meet the cleanliness requirements of high-precision semiconductor manufacturing. In existing technologies, multi-axis collaborative cleaning equipment is often structurally complex and lacks sufficient cleaning uniformity. Therefore, we propose a multi-axis collaborative spray cleaning device for semiconductor components. Utility Model Content

[0004] In view of the problems of complex structure and insufficient cleaning uniformity of existing multi-axis coordinated spray cleaning equipment, this utility model is proposed.

[0005] Therefore, the purpose of this utility model is to provide a multi-axis coordinated spray cleaning device for semiconductor components. The purpose is to provide a multi-axis coordinated spray cleaning device for semiconductor components, which has the advantages of compact structure, high transmission efficiency and high cleaning uniformity.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0007] A multi-axis collaborative spray cleaning device for semiconductor components includes a base, a rotating worktable mounted on the top of the base via a first bearing, a lifting mechanism located on one side of the rotating worktable, the rotating worktable and the lifting mechanism being driven by a linkage transmission mechanism located on the base;

[0008] A hollow spray arm is installed on the lifting mechanism. Several nozzles are provided at the bottom of the hollow spray arm, and the nozzles are equidistantly arranged along the circumferential arc of the hollow spray arm. The nozzles are located above the rotating worktable. A connecting hose is installed at the top of the hollow spray arm, and the connecting hose is connected to the hollow spray arm. The hollow spray arm is connected to an external cleaning water supply system through the connecting hose.

[0009] As a technical solution of the multi-axis collaborative spray cleaning equipment for semiconductor components described in this utility model, the surface of the rotating worktable is provided with a plurality of positioning pins and vacuum adsorption holes for fixing semiconductor components, and the plurality of positioning pins and vacuum adsorption holes are arranged along the axial / circumferential direction of the rotating worktable.

[0010] As a technical solution of the multi-axis collaborative spray cleaning equipment for semiconductor components described in this utility model, the linkage transmission mechanism includes a stepper motor mounted on the base via a fixed seat. A drive gear is fixedly sleeved on the output shaft of the stepper motor, and the extended part of the output shaft is connected to the rotary worktable. A driven gear is arranged parallel to one side of the drive gear. The outer surfaces of the driven gear and the drive gear are meshed with toothed belts, and the drive gear drives the driven gear to rotate through the toothed belts.

[0011] As a technical solution of the multi-axis collaborative spray cleaning equipment for semiconductor components according to this utility model, the lifting mechanism includes a column installed on the top of the base. The column is located on one side of the rotating worktable. A lead screw is vertically and rotatably installed on the slide groove of the column. One end of the lead screw is fixedly installed with the driven gear. A slider is threadedly connected to the outer surface of the lead screw. A connecting rod is installed on the slider and is slidably connected to the column. A moving block is fixedly installed at the end of the connecting rod away from the slider. The hollow spray arm is installed on the moving block.

[0012] As a technical solution of the semiconductor component multi-axis collaborative spray cleaning equipment of this utility model, wherein: a limiting groove corresponding to the connecting rod is opened on one side of the sliding groove on the column, and the limiting groove is adapted to the connecting rod, and the connecting rod is slidably installed on the column through the limiting groove.

[0013] As a technical solution of the multi-axis collaborative spray cleaning equipment for semiconductor components described in this utility model, the hollow spray arm is arranged in an arc shape, and the arc of the hollow spray arm matches the rotation trajectory of the rotating worktable.

[0014] Compared with the prior art, the present invention has at least the following beneficial effects:

[0015] 1. This utility model replaces the traditional worm gear structure with a gear set and toothed belt linkage transmission mechanism, which avoids particulate contamination caused by metal friction, improves transmission efficiency and accuracy, and is more suitable for the high cleanliness requirements of semiconductor manufacturing.

[0016] 2. This utility model, by setting up an arc-shaped hollow spray arm and combining it with a rotating worktable, facilitates repeated cleaning of semiconductor components to eliminate cleaning dead corners and improve cleaning uniformity.

[0017] 3. This utility model, by setting up a lifting mechanism, can adjust the spray height to adapt to the cleaning needs of parts of different sizes, and at the same time enhance the versatility of the equipment. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0019] Figure 1 This is a schematic diagram of the overall main structure of this utility model.

[0020] Figure 2 This is a schematic side view of the overall structure of this utility model.

[0021] Figure 3 This is a bottom view schematic diagram of the linkage transmission mechanism, rotary worktable and lifting mechanism of this utility model.

[0022] Figure 4 This is a top view schematic diagram of the connection structure of the linkage transmission mechanism, rotary worktable and lifting mechanism of this utility model.

[0023] Explanation of reference numerals in the attached figures:

[0024] In the diagram: 1. Base; 2. Rotary worktable; 201. Positioning pin; 202. Vacuum suction hole; 3. Stepper motor; 4. Drive gear; 5. Toothed belt; 6. Driven gear; 7. Column; 701. Limiting groove; 8. Lead screw; 9. Slider; 10. Connecting rod; 11. Moving block; 12. Hollow spray arm; 13. Nozzle; 14. Connecting hose. Detailed Implementation

[0025] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0026] Reference Figures 1-4A multi-axis collaborative spray cleaning device for semiconductor components is provided. This multi-axis collaborative spray cleaning device for semiconductor components includes a base 1. A rotating worktable 2 is mounted on the top of the base 1 via a first bearing. A lifting mechanism is provided on the top of the base 1. The lifting mechanism is located on one side of the rotating worktable 2. The rotating worktable 2 and the lifting mechanism are driven by a linkage transmission mechanism, and the linkage transmission mechanism is located on the base 1.

[0027] A hollow spray arm 12 is installed on the lifting mechanism. Several nozzles 13 are provided at the bottom of the hollow spray arm 12 and are equidistantly arranged along the circumferential arc of the hollow spray arm 12. The nozzles 13 are located above the rotating worktable 2. A connecting hose 14 is installed at the top of the hollow spray arm 12 and is connected to the hollow spray arm 12. The hollow spray arm 12 is connected to the external cleaning water supply system through the connecting hose 14.

[0028] Reference Figure 1 and Figure 4 The surface of the rotary table 2 is provided with a number of positioning pins 201 and vacuum suction holes 202 for fixing semiconductor components, and the number of positioning pins 201 and vacuum suction holes 202 are arranged along the axial / circumferential direction of the rotary table 2 to facilitate fixing semiconductor components.

[0029] Reference Figure 3 and Figure 4 The linkage transmission mechanism includes a stepper motor 3 mounted on a base 1 via a fixed seat. A drive gear 4 is fixedly sleeved on the output shaft of the stepper motor 3, and the extended part of the output shaft is connected to the rotary table 2. A driven gear 6 is arranged parallel to one side of the drive gear 4. The outer surfaces of the driven gear 6 and the drive gear 4 are meshed with toothed belts 5. The drive gear 4 drives the driven gear 6 to rotate through the toothed belts 5. In application, the linkage transmission mechanism of the gear set and the toothed belts 5 replaces the traditional worm gear structure, avoiding particulate contamination caused by metal friction, improving transmission efficiency and accuracy, and is more suitable for the high cleanliness requirements of semiconductor manufacturing.

[0030] Reference Figure 3 and Figure 4 The lifting mechanism includes a column 7 mounted on the top of the base 1. The column 7 is located on one side of the rotating worktable 2. A lead screw 8 is vertically and rotatably mounted on the slide groove of the column 7. One end of the lead screw 8 is fixedly mounted to the driven gear 6. A slider 9 is threadedly connected to the outer surface of the lead screw 8. A connecting rod 10 is mounted on the slider 9 and is slidably connected to the column 7. A moving block 11 is fixedly mounted on the end of the connecting rod 10 away from the slider 9. A hollow spray arm 12 is mounted on the moving block 11 to facilitate adjustment of the spray height and adapt to the cleaning needs of parts of different sizes, thereby enhancing the versatility of the equipment.

[0031] Reference Figure 3and Figure 4 The column 7 has a limiting groove 701 on one side of the sliding groove, which corresponds to the connecting rod 10. The limiting groove 701 is adapted to the connecting rod 10. The connecting rod 10 is slidably installed on the column 7 through the limiting groove 701, so that the slider 9 can drive the connecting rod 10 to move along the inner cavity of the limiting groove 701, and at the same time play a limiting and guiding role.

[0032] Reference Figure 1 , Figure 3 as well as Figure 4 The hollow spray arm 12 is arranged in an arc shape, and the arc of the hollow spray arm 12 matches the rotation trajectory of the rotary worktable 2, so as to repeatedly clean the semiconductor components, eliminate cleaning dead corners, and improve cleaning uniformity.

[0033] The working principle of this utility model is as follows: Semiconductor components are placed on a rotary worktable 2 and fixed using positioning pins 201 and vacuum suction holes 202. Then, a stepper motor 3 is started and rotates forward. The output shaft of the stepper motor 3 drives the rotary worktable 2 to rotate, simultaneously driving the drive gear 4 to rotate. The drive gear 4 drives a toothed belt 5 for transmission, which in turn drives a driven gear 6 to rotate. The driven gear 6 drives a lead screw 8 to rotate, which in turn drives a slider 9 to move threadedly along a groove in the column 7. The slider 9 drives a connecting rod 10 to move along a limiting groove 701, which in turn drives a moving block 11 to move. The moving block 11 then drives the hollow spray arm 12 to move. The hollow spray arm 12 is moved upwards, and at the same time, water is supplied to the connecting hose 14 through the external cleaning water supply system. The cleaning water enters the hollow spray arm 12 through the inner cavity of the connecting hose 14 and is finally sprayed out through the nozzle 13. The nozzle 13 sprays and cleans the semiconductor components. When the moving block 11 moves to the highest position, the stepper motor 3 reverses, the rotating worktable 2 rotates in the opposite direction, and the hollow spray arm 12 moves downwards to reset, spraying and cleaning the semiconductor components. This allows for repeated cleaning of the semiconductor components to eliminate cleaning dead corners and improve cleaning uniformity. This facilitates the cleaning of semiconductor components and provides high cleaning uniformity. It also features a compact structure and high transmission efficiency.

[0034] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A multi-axis collaborative spray cleaning device for semiconductor components, characterized in that: Includes a base (1), on the top of the base (1) a rotating worktable (2) is mounted on the top of the base (1) via a first bearing, the top of the base (1) is provided with a lifting mechanism, the lifting mechanism is located on one side of the rotating worktable (2), the rotating worktable (2) and the lifting mechanism are driven by a linkage transmission mechanism, and the linkage transmission mechanism is located on the base (1); A hollow spray arm (12) is installed on the lifting mechanism. Several nozzles (13) are provided at the bottom of the hollow spray arm (12), and the nozzles (13) are equidistantly arranged along the circumferential arc of the hollow spray arm (12). The nozzles (13) are located above the rotating worktable (2). A connecting hose (14) is installed on the top of the hollow spray arm (12), and the connecting hose (14) is connected to the hollow spray arm (12). The hollow spray arm (12) is connected to the external cleaning water supply system through the connecting hose (14).

2. The semiconductor component multi-axis coordinated spray cleaning equipment according to claim 1, characterized in that: The surface of the rotary table (2) is provided with a plurality of positioning pins (201) and vacuum suction holes (202) for fixing semiconductor components, and the plurality of positioning pins (201) and vacuum suction holes (202) are arranged along the axial / circumferential direction of the rotary table (2).

3. The semiconductor component multi-axis coordinated spray cleaning equipment according to claim 1, characterized in that: The linkage transmission mechanism includes a stepper motor (3) mounted on the base (1) via a fixed seat. A drive gear (4) is fixedly sleeved on the output shaft of the stepper motor (3), and the extended part of the output shaft is connected to the rotary table (2). A driven gear (6) is arranged parallel to one side of the drive gear (4). The outer surfaces of the driven gear (6) and the drive gear (4) are meshed with a toothed belt (5), and the drive gear (4) drives the driven gear (6) to rotate through the toothed belt (5).

4. The semiconductor component multi-axis coordinated spray cleaning equipment according to claim 3, characterized in that: The lifting mechanism includes a column (7) installed on the top of the base (1). The column (7) is located on one side of the rotating worktable (2). A lead screw (8) is vertically and rotatably installed on the slide groove of the column (7). One end of the lead screw (8) is fixedly installed with the driven gear (6). A slider (9) is threadedly connected to the outer surface of the lead screw (8). A connecting rod (10) is installed on the slider (9), and the connecting rod (10) is slidably connected to the column (7). A moving block (11) is fixedly installed on the end of the connecting rod (10) away from the slider (9). The hollow spray arm (12) is installed on the moving block (11).

5. The semiconductor component multi-axis coordinated spray cleaning equipment according to claim 4, characterized in that: The column (7) has a limiting groove (701) on one side of the sliding groove, which corresponds to the connecting rod (10). The limiting groove (701) is adapted to the connecting rod (10), and the connecting rod (10) is slidably installed on the column (7) through the limiting groove (701).

6. The semiconductor component multi-axis coordinated spray cleaning equipment according to claim 1, characterized in that: The hollow spray arm (12) is arranged in an arc shape, and the arc of the hollow spray arm (12) matches the rotation trajectory of the rotating worktable (2).

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