Single crystal silicon rod cutting mechanism

By introducing a bracket, a fixing mechanism, and an adjustment mechanism into the monocrystalline silicon rod cutting mechanism, the problems of inaccurate angle adjustment and insufficient fixing in the existing technology are solved, and efficient and stable cutting of monocrystalline silicon rods is achieved.

CN224240015UActive Publication Date: 2026-05-15TIANJIN ZHONGJING SEMICON MATERIALS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
TIANJIN ZHONGJING SEMICON MATERIALS CO LTD
Filing Date
2025-05-06
Publication Date
2026-05-15

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Abstract

The utility model discloses a silicon single crystal rod cut-off mechanism which comprises a bracket, two fixing mechanisms and an adjusting mechanism, the two fixing mechanisms are correspondingly installed at the two ends of the bracket and used for fixing the two ends of a cut-off silicon single crystal rod on the bracket, and the adjusting mechanism is installed at the bottom of the bracket and used for adjusting the two ends of the cut-off silicon single crystal rod on the bracket. The angle adjusting device is used for adjusting the cutting angle of the silicon single crystal rod cut on the bracket. An adjusting mechanism is arranged at the bottom of a bracket on a silicon single crystal rod cutting mechanism, so that a rotating driving piece on the adjusting mechanism is started, a driving gear is driven to rotate, the driving gear rotates along an arc-shaped rack installed on a first sliding rail, and a first sliding block provided with the driving gear moves along the first sliding rail; and meanwhile, a second sliding block mounted on the left side of the bracket synchronously moves along a second sliding rail, so that the cutting angle of the silicon single crystal rods cut off on the bracket is adjusted, the silicon single crystal rods cut at different angles can be cut off by the cutting-off mechanism, and the cutting-off efficiency of the silicon single crystal rods is improved.
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Description

Technical Field

[0001] This utility model relates to the field of single crystal silicon processing technology, specifically to a single crystal silicon rod cutting mechanism. Background Technology

[0002] Monocrystalline silicon rods are silicon single crystal rods formed by zone melting or Czochralski pulling processes in a furnace. These rods need to be cut into several monocrystalline silicon wafers before they can be used.

[0003] The existing monocrystalline silicon rod cutting mechanism (a monocrystalline silicon rod cutting machine with application number 202220200526.4) adjusts the cutting angle of the monocrystalline silicon rod by setting an adjustment mechanism at the bottom of the monocrystalline silicon rod. However, this adjustment method cannot accurately adjust the cutting angle of the monocrystalline silicon rod, nor can it fix the monocrystalline silicon rod on both sides of the cut, thus affecting the cutting quality of the monocrystalline silicon rod. Utility Model Content

[0004] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a single-crystal silicon rod cutting mechanism to solve the technical problems of existing single-crystal silicon rod cutting mechanisms, which cannot accurately adjust the cutting angle of the single-crystal silicon rod, and also cannot fix the single-crystal silicon rods on both sides of the cut, thus affecting the cutting quality of the single-crystal silicon rod.

[0005] According to the technical solution provided in the embodiments of this application, a single crystal silicon rod cutting mechanism includes a bracket, two fixing mechanisms and an adjusting mechanism. The two fixing mechanisms are correspondingly installed at both ends of the bracket for fixing the two ends of the cut single crystal silicon rod on the bracket, and the adjusting mechanism is installed at the bottom of the bracket for adjusting the cutting angle of the cut single crystal silicon rod on the bracket.

[0006] The adjusting mechanism includes a rotation drive, a drive gear, a rack, and a first slide rail. The first slide rail is mounted on the top of the cutting table, and the first slider is slidably mounted on the first slide rail. The first slider is mounted on the bottom right side of the bracket. The rack is installed in the mounting groove at the top of the first slide rail. The rack meshes with the drive gear installed in the first slider. The drive gear is fixedly connected to the output end of the rotation drive, so that the rotation drive drives the first slider with the drive gear mounted to move along the first slide rail, thereby causing the bracket with the first slider mounted to move along the first slide rail, and thus adjusting the cutting angle of the bracket.

[0007] Furthermore, the adjustment mechanism also includes a second slider and a second slide rail. The second slide rail is installed on the top left side of the cutting table, while the second slider is installed on the bottom left side of the bracket and is slidably connected to the second slide rail.

[0008] Furthermore, a rotating column is provided in the middle of the bracket, and the rotating column is rotatably mounted on the rotating seat.

[0009] Furthermore, the second slider is also provided with a locking mechanism, and the locking rod on the locking mechanism abuts against the second slide rail.

[0010] Furthermore, a cutting box is provided at the top center of the cutting platform, and a control panel is provided on the side of the cutting box. The control panel is used to control the movement angle of the adjustment mechanism.

[0011] Furthermore, a marking line is provided on the top of the cutting platform for adjusting the angle marking.

[0012] Furthermore, the two fixing mechanisms are horizontally mounted on the support plates of the bracket.

[0013] Furthermore, the fixing mechanism includes a telescopic drive component, a telescopic rod, and a fixing plate. The fixing plate is installed at the front end of the telescopic rod, and the telescopic rod is fixedly connected to the output end of the telescopic drive component, so that the telescopic drive component drives the fixing plate connected to the telescopic rod to move along the length direction of the bracket.

[0014] Furthermore, the bracket has an arc-shaped internal structure.

[0015] Furthermore, the first slide rail and the second slide rail have an arc-shaped structure.

[0016] In summary, the beneficial effects of this application are as follows:

[0017] 1. By setting an adjustment mechanism at the bottom of the bracket on the single crystal silicon rod cutting mechanism, the rotation drive component on the adjustment mechanism is activated, thereby driving the drive gear to rotate. The drive gear rotates along the arc-shaped rack installed on the first slide rail, thereby causing the first slider with the drive gear installed to move along the first slide rail. At the same time, the second slider installed on the left side of the bracket moves synchronously along the second slide rail, thereby adjusting the cutting angle of the single crystal silicon rod being cut on the bracket. This allows the cutting mechanism to cut single crystal silicon rods cut at different angles, improving the cutting efficiency of the single crystal silicon rod.

[0018] Second, by setting corresponding fixing mechanisms on both sides of the bracket, the fixing mechanisms can fix the two ends of the monocrystalline silicon rod being cut on the bracket, preventing the monocrystalline silicon rod from sliding or moving during the cutting process, thereby improving the processing quality of the monocrystalline silicon rod. Attached Figure Description

[0019] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is an exploded structural diagram of the present invention;

[0022] Figure 3 This is a side-view exploded view of the present invention.

[0023] Figure 4 for Figure 2 Enlarged view of point A in the middle.

[0024] The following components are labeled in the diagram: Bracket-100, Fixing Mechanism-200, Telescopic Drive-210, Telescopic Rod-220, Fixing Plate-230, Adjustment Mechanism-300, Rotation Drive-310, Drive Gear-320, Rack-330, First Slide Rail-340, First Slider-350, Second Slider-360, Second Slide Rail-370, Locking Mechanism-400, Rotating Column-500, Rotating Seat-600, Cutting Table-700, Cutting Box-800, Control Panel-900. Detailed Implementation

[0025] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the relevant utility model and not intended to limit the scope of the utility model. Furthermore, it should be noted that, for ease of description, only the parts relevant to the utility model are shown in the accompanying drawings.

[0026] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0027] A single-crystal silicon rod cutting mechanism, the structure of which is as follows: Figures 1-4As shown, the device includes a bracket 100, two fixing mechanisms 200, and an adjusting mechanism 300. The two fixing mechanisms 200 are correspondingly installed at both ends of the mounting plate on the bracket 100 to fix the two ends of the cut single-crystal silicon rod on the bracket 100. The adjusting mechanism 300 is installed at the bottom of the bracket 100 for adjusting the cutting angle of the cut single-crystal silicon rod on the bracket 100. The adjusting mechanism 300 includes a rotation drive 310, a drive gear 320, a rack 330, and a first slide rail 340. The first slide rail 340 is installed on the top of the cutting stage 700, and a first slider 350 is slidably installed on the first slide rail 340. The first slider 350 is installed on the bracket. At the bottom right side of 100, a rack 330 is installed in the mounting groove at the top of the first slide rail 340. The rack 330 meshes with the drive gear 320 installed in the first slider 350. The drive gear 320 is fixedly connected to the output end of the rotation drive 310, so that the rotation drive 310 drives the fixedly connected drive gear 320 to rotate, thereby causing the drive gear 320 to move along the arc-shaped rack 330, so that the first slider 350 with the drive gear 320 installed moves along the first slide rail 340, thereby causing the bracket 100 with the first slider 350 installed to move along the first slide rail 340, thereby adjusting the cutting angle of the single crystal silicon rod placed on the bracket 100.

[0028] As a preferred embodiment, please refer to Figure 2 and Figure 4 The adjustment mechanism 300 also includes a second slider 360 and a second slide rail 370. The second slide rail 370 is installed on the top left side of the cutting table 700, while the second slider 360 is installed on the bottom left side of the bracket 100 and is slidably connected to the second slide rail 370. When the rotation drive 310 drives the bracket 100 to rotate, the second slider 360 installed on the bottom left side of the bracket 100 moves along the second slide rail 370, thereby improving the cutting efficiency of the cutting mechanism for single crystal silicon rods.

[0029] As a preferred embodiment, please refer to Figure 2 and Figure 4 A rotating column 500 is also provided in the middle of the bracket 100. The rotating column 500 is rotatably mounted on the rotating seat 600 so that when the rotating drive 310 drives the bracket 100 to move, the bracket 100 rotates along the rotating column 500.

[0030] As a preferred embodiment, please refer to Figure 2 and Figure 4 The second slider 360 is also provided with a locking mechanism 400. The locking rod on the locking mechanism 400 abuts against the second slide rail 370, so that the cylinder on the locking mechanism 400 pushes the front end of the locking rod, so that the locking rod abuts against and fixes the second slide rail 370, so that the bracket 100 is locked on the cutting table 700.

[0031] As a preferred embodiment, please refer to Figure 1 The cutting platform 700 is also provided with a cutting box 800 at the top center, and a control panel 900 is provided on the side of the cutting box 800. The control panel 900 is electrically connected to the adjustment mechanism 300 and the locking mechanism 400 so that the control panel 900 can be used for the movement angle control and locking control of the adjustment mechanism 300.

[0032] As a preferred embodiment, please refer to Figure 1 and Figure 2 The top of the cutting table 700 is also equipped with marking lines to indicate the angle after adjustment.

[0033] As a preferred embodiment, please refer to Figure 2 and Figure 4 The fixing mechanism 200 includes a telescopic drive 210, a telescopic rod 220, and a fixing plate 230. The fixing plate 230 is installed at the front end of the telescopic rod 220, and the telescopic rod 220 is fixedly connected to the output end of the telescopic drive 210, so that the telescopic drive 210 drives the fixing plate 230 connected to the telescopic rod 220 to move along the length direction of the bracket 100. During the cutting process of the single crystal silicon, the telescopic drive 210 on the right side of the fixing mechanism 200 drives the telescopic rod 220 to extend, so that the single crystal silicon rod abutting the fixing plate 230 moves forward, while the telescopic drive 210 on the left side of the fixing mechanism 200 drives the telescopic rod 220 to retract, so that the fixing mechanism 200 moves the single crystal silicon rod on the bracket 100 in sequence and cuts it, thereby improving the cutting efficiency and cutting quality of the single crystal silicon rod.

[0034] The working principle of the single-crystal silicon rod cutting mechanism of this utility model is as follows:

[0035] During the cutting process of the single-crystal silicon rod, the single-crystal silicon rod is placed in the arc-shaped structural groove on the bracket 100. Simultaneously, the fixing mechanisms 200 on both sides of the bracket 100 are activated, causing the telescopic drive members 210 on the two fixing mechanisms 200 to activate. This drives the telescopic rods 220 connected to each telescopic drive member 210 to move along the length of the bracket 100, thereby causing the fixing plates 230 connected to each telescopic rod 220 to move inward, thus fixing the single-crystal silicon rod placed on the bracket 100 and preventing the single-crystal silicon rod from sliding or moving during the cutting process, thereby improving the processing quality of the single-crystal silicon rod. At the same time, the adjusting mechanism 300 is activated, causing the rotation drive member 310 on the adjusting mechanism 300 to activate, thereby driving the drive gear 320 to rotate. This causes the drive gear 320 to rotate along the arc-shaped rack 330 installed on the first slide rail 340, causing the first slider 350 with the drive gear 320 installed to move along the first slide rail 340. Simultaneously, the second slide rail 350 installed on the left side of the bracket 100... Block 360 moves synchronously along the second slide rail 370, thereby adjusting the cutting angle of the monocrystalline silicon rod being cut on the bracket 100. Meanwhile, the locking mechanism 400 installed on the second slide rail 360 is activated, causing the cylinder on the locking mechanism 400 to push the front end of the locking rod, causing the locking rod to abut against and fix on the second slide rail 370. This locks the bracket 100 onto the cutting table 700, allowing the cutting mechanism to cut monocrystalline silicon rods at different angles, improving the cutting efficiency of the monocrystalline silicon rod. After adjustment... The cutting line on the cutting box 800 is activated to cut the monocrystalline silicon. Meanwhile, the telescopic drive 210 on the right-side fixing mechanism 200 drives the telescopic rod 220 to extend, so that the monocrystalline silicon rod abutting the fixing plate 230 moves forward. At the same time, the telescopic drive 210 on the left-side fixing mechanism 200 drives the telescopic rod 220 to retract, so that the fixing mechanism 200 moves the monocrystalline silicon rod sequentially on the bracket 100 and cuts it, thereby improving the cutting efficiency and cutting quality of the monocrystalline silicon rod.

[0036] The above description is merely a preferred embodiment of this application and an explanation of the technical principles and solutions employed. Furthermore, the scope of the utility model involved in this application is not limited to the specific combination of the above-described technical features, but should also cover other technical solutions formed by any combination of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A single-crystal silicon rod cutting mechanism, comprising a bracket (100), two fixing mechanisms (200), and an adjusting mechanism (300), wherein the two fixing mechanisms (200) are correspondingly installed at both ends of the bracket (100) for fixing the ends of the cut single-crystal silicon rod on the bracket (100), and the adjusting mechanism (300) is installed at the bottom of the bracket (100) for adjusting the cutting angle of the cut single-crystal silicon rod on the bracket (100), characterized in that: The adjusting mechanism (300) includes a rotation drive (310), a drive gear (320), a rack (330), and a first slide rail (340). The first slide rail (340) is mounted on the top of the cutting table (700), and a first slider (350) is slidably mounted on the first slide rail (340). The first slider (350) is mounted on the bottom right side of the bracket (100), and the rack (330) is installed in the mounting groove at the top of the first slide rail (340). The rack (330) and... The drive gear (320) installed inside the first slider (350) is engaged with the output end of the rotation drive (310), so that the rotation drive (310) drives the first slider (350) with the drive gear (320) installed to move along the first slide rail (340), thereby causing the bracket (100) with the first slider (350) installed to move along the first slide rail (340), thereby adjusting the cut-off angle of the bracket (100).

2. The single-crystal silicon rod cutting mechanism according to claim 1, characterized in that: The adjustment mechanism (300) further includes a second slider (360) and a second slide rail (370). The second slide rail (370) is installed on the top left side of the cutting table (700), while the second slider (360) is installed on the bottom left side of the bracket (100) and is slidably connected to the second slide rail (370).

3. The single-crystal silicon rod cutting mechanism according to claim 1, characterized in that: A rotating column (500) is also provided in the middle of the bracket (100), and the rotating column (500) is rotatably mounted on the rotating seat (600).

4. The single-crystal silicon rod cutting mechanism according to claim 2, characterized in that: The second slider (360) is also provided with a locking mechanism (400), and the locking rod on the locking mechanism (400) abuts against the second slide rail (370).

5. The single-crystal silicon rod cutting mechanism according to claim 1, characterized in that: A cutting box (800) is also provided at the top center of the cutting platform (700), and a control panel (900) is provided on the side of the cutting box (800). The control panel (900) is used to control the movement angle of the adjustment mechanism (300).

6. The single-crystal silicon rod cutting mechanism according to claim 1, characterized in that: The top of the cutting platform (700) is also provided with a marking line for adjusting the angle marking.

7. The single-crystal silicon rod cutting mechanism according to claim 1, characterized in that: The two fixing mechanisms (200) are horizontally mounted on the support plate on the bracket (100).

8. The single-crystal silicon rod cutting mechanism according to claim 1, characterized in that: The fixing mechanism (200) includes a telescopic drive (210), a telescopic rod (220), and a fixing plate (230). The fixing plate (230) is installed at the front end of the telescopic rod (220), and the telescopic rod (220) is fixedly connected to the output end of the telescopic drive (210) so that the telescopic drive (210) drives the fixing plate (230) connected to the telescopic rod (220) to move along the length direction of the bracket (100).